Buckle type power module

Abstract

The utility model discloses a buckle type power module. The buckle type power module comprises a heat dissipation bottom plate, a chip assembly and a shell assembly. The shell assembly comprises a shell, a buckle, a positive power terminal, a negative power terminal, a signal pin and a cover plate. The two ends of the shell are provided with a plurality of buckles, and the cover plate is provided with a plurality of bayonets corresponding to the buckles in position. When installation is needed, the cover plate is directly pressed to enable the buckles to be connected with the bayonets, and connection is more convenient and faster. The positive power terminal, the negative power terminal and the signal pin are arranged in the shell in advance, so that the positive power terminal, the negative power terminal and the signal pin are integrally formed with the shell. The positions of the electronic elements are set in advance, after the shell is connected with the heat dissipation bottom plate, the positive power terminal, the negative power terminal and the signal pin can be directly welded and connected with the chip after the positions of the positive power terminal, the negative power terminal and the signal pin are directly positioned, rapid positioning of the connection positions is achieved, and the strength is higher.

Description

TECHNICAL FIELD

[0001] The utility model relates to power module technical field, especially a buckle type power module. BACKGROUND

[0002] Power module is the advanced hybrid integrated power component with IGBT as the core, which is composed of high-speed low-power tube core (IGBT) and optimized gate drive circuit, and fast protection circuit. Power semiconductor module is more and more widely used in today's society, involves many fields, especially in the new energy field, occupies the position of core parts. The cover plate of the power module in the prior art is generally connected with the shell through fasteners or welding, which leads to complex connection mode and is not convenient to install. In addition, for electronic components such as signal pins, input and output terminals in the power module, the prior art is generally directly welded with the chip, so that manual positioning of the installation position is required, which is time-consuming and low in precision. Moreover, the connection strength of the electronic components after connection is low, and it is easy to loosen when the power module shakes. SUMMARY

[0003] Therefore, the utility model provides a buckle type power module to solve the above technical problems.

[0004] A buckle type power module, comprising a heat dissipation bottom plate, a plurality of chip assemblies arranged on the heat dissipation bottom plate, and a shell assembly arranged on the heat dissipation bottom plate, the shell assembly comprising a shell arranged on the heat dissipation bottom plate, a plurality of buckles arranged on the shell, a plurality of positive power terminals arranged on the shell, a plurality of negative power terminals arranged on the shell, a plurality of signal pins arranged on the shell, and a cover plate arranged on the shell and engaged with the buckles, the buckles are arranged at both ends of the shell respectively, the buckles are integrally formed with the shell, one end of the positive power terminals, the negative power terminals, and the signal pins is welded with the chip assemblies respectively, the positive power terminals, the negative power terminals, and the signal pins are integrally formed with the shell, and the cover plate is provided with a plurality of buckling ports corresponding to the positions of the buckles.

[0005] Further, the heat dissipation bottom plate is arranged with a plurality of heat dissipation fins on the side opposite to the chip assemblies, and the transverse section of the heat dissipation fins is elliptical.

[0006] Further, the chip assembly comprises a DBC plate arranged on the heat dissipation bottom plate, and a plurality of chips arranged on the DBC plate, and the DBC plate is composed of a ceramic layer in the middle and copper layers on the upper and lower layers.

[0007] Further, the shell assembly further comprises a plurality of lightening grooves arranged on the shell body, and the lightening grooves are arranged on the top end face of the shell body.

[0008] Further, the shell body is in a hollow frame structure and is formed by injection molding.

[0009] Further, the shell body is provided with two reinforcing ribs for separating the hollow part of the shell body, and the buckles are arranged on the reinforcing ribs.

[0010] Further, the buckle type power module further comprises a plurality of current sensors arranged on the shell assembly.

[0011] Further, a detection hole is arranged on the negative power terminal, the current sensor is arranged on the shell body and vertically inserted into the detection hole, and the current sensor is arranged in a spaced manner with the hole wall of the detection hole.

[0012] Compared with the prior art, the buckle type power module provided by the utility model is provided with a plurality of buckles arranged at both ends of the shell body, and the cover plate is provided with a plurality of buckling holes corresponding to the positions of the buckles. When installation is required, the buckles are connected with the buckling holes by directly pressing the cover plate, so that the connection is more convenient and faster. When the shell body is injection molded, the positive power terminal, the negative power terminal and the signal pin are arranged in the shell body in advance, so that the positive power terminal, the negative power terminal and the signal pin are integrally formed with the shell body. The positions of the electronic elements are arranged in advance, and when the shell body is connected with the heat dissipation bottom plate, the positions of the positive power terminal, the negative power terminal and the signal pin are directly positioned and can be directly welded with the chip, so that the rapid positioning of the connection position is realized and the strength is higher. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 The utility model provides a buckle type power module structure schematic view.

[0014] Figure 2 The utility model provides a buckle type power module structure schematic view. Figure 1 The utility model provides a buckle type power module structure schematic view.

[0015] Figure 3 The utility model provides a buckle type power module structure schematic view. Figure 1 The utility model provides a buckle type power module structure schematic view.

[0016] Figure 4 The utility model provides a buckle type power module structure schematic view. Figure 1 The utility model provides a buckle type power module structure schematic view. DETAILED DESCRIPTION

[0017] The specific embodiments of the utility model are further described in detail below. It should be understood that the description of the utility model embodiments herein does not limit the protection scope of the utility model.

[0018] As Figures 1 to 4 The buckle type power module comprises a heat dissipation bottom plate 10, a plurality of chip assemblies 20 arranged on the heat dissipation bottom plate 10, a shell assembly 30 arranged on the heat dissipation bottom plate 10, and a plurality of current sensors 40 arranged on the shell assembly 30. It is conceivable that the buckle type power module also comprises other functional modules, such as a connecting assembly, an installation assembly and the like, which are known to those skilled in the art and will not be described here.

[0019] The heat dissipation bottom plate 10 is provided with a plurality of heat dissipation fins 11 on the side opposite to the chip assemblies 20, and the transverse section of the heat dissipation fin 11 is oval. The heat dissipation fin 11 is arranged corresponding to the chip assembly 20, so as to conduct the heat generated by the chip assembly 20 during operation to the heat dissipation fin 11. The heat dissipation fin 11 cooperates with a heat dissipation base (not shown) provided with water channels, so as to provide the chip 40 with heat dissipation function, and the heat dissipation fin 11 is immersed in the cooling liquid in the water channel, so as to exchange heat with the flowing cooling liquid to carry away the heat of the chip, which should be the prior art and will not be described here.

[0020] In the embodiment, the chip assembly 20 has three. The three chip assemblies 20 have the same structure, and one is described here. The chip assembly 20 comprises a DBC plate 21 arranged on the heat dissipation bottom plate 10 and a plurality of chips 22 arranged on the DBC plate 21. The DBC plate 21 is a direct copper clad ceramic substrate (DBC), which is formed by co-crystallizing sintering of a ceramic substrate and a copper foil at high temperature, and the middle of the DBC plate 21 is a ceramic layer, and the upper and lower layers are copper layers, which are mainly used in power electronic modules and have excellent heat conduction and insulation performance. The DBC plate 21 should be the prior art and will not be described here. The chip 22 is arranged on the upper copper layer of the DBC plate 21 by sintering process. The chip 22 itself should be the prior art, and its structure and working principle will not be described here.

[0021] The shell assembly 30 comprises a shell 31 arranged on the heat dissipation base plate 10, a plurality of buckles 32 arranged on the shell 31, a plurality of weight reduction grooves 33 arranged on the shell 31, a plurality of positive power terminals 34 arranged on the shell 31, a plurality of negative power terminals 35 arranged on the shell 31, a plurality of signal pins 36 arranged on the shell 31, and a cover plate 37 arranged on the shell 31 and connected with the buckles 32.

[0022] The shell 31 is in a hollow frame structure and is formed by injection molding. The shell 31 is connected with the heat dissipation base plate 10 by arranging fasteners. Since there are three chip assemblies 20 in the embodiment, the shell 31 is provided with two reinforcing ribs 38 separating the hollow part of the shell 31, which are used to improve the strength of the shell 31 and separate the plurality of chip assemblies 20 to avoid interference with each other.

[0023] The buckles 32 are arranged at both ends of the shell 31 respectively. The buckles 32 are integrally formed with the shell 31 and are formed at the same time when the shell 31 is injection molded. The buckles 32 are used to connect with the cover plate 37, thereby quickly connecting the cover plate 37. When the reinforcing ribs 38 are arranged, the buckles 32 are also arranged on the reinforcing ribs 38 to ensure the connection strength of the middle part of the cover plate 37. The weight reduction grooves 33 are arranged on the top end face of the shell 31. The weight reduction grooves 33 are used to reduce the overall weight of the power module and design for lightness.

[0024] One end of the positive power terminal 34, the negative power terminal 35, and the signal pin 36 is respectively welded with the chip assembly 20, and the other end is connected with external electronic devices. The negative power terminal 35 and the positive power terminal 34 are respectively used for current outflow and inflow, and the signal pin 36 plays a role in transmitting signals and control instructions. The positive power terminal 34, the negative power terminal 35, and the signal pin 36 are integrally formed with the shell 31. The positive power terminal 34, the negative power terminal 35, and the signal pin 36 are arranged in the shell 31 in advance when the shell 31 is injection molded, thereby fixing the position of the electronic components in advance. After the shell 31 is connected with the heat dissipation base plate 10, the positive power terminal 34, the negative power terminal 35, and the signal pin 36 can be directly welded with the chip 22, thereby realizing quick positioning of the connection position.

[0025] The cover plate 37 is provided with a plurality of buckling ports 39 corresponding to the positions of the buckles 32. When installation is needed, the buckles 32 are connected with the buckling ports 39 by directly pressing the cover plate 37, thereby making the connection more convenient and fast.

[0026] The negative power terminal 35 is provided with a detection hole 41, and the current sensor 40 is arranged on the shell 31 and vertically inserted into the detection hole 41.

[0027] The current sensor 40 is a magnetic field sensor such as a Hall current sensor. The current sensor 40 is arranged in the negative power terminal 35 in a direct insertion manner and spaced from the hole wall of the detection hole 41, thereby avoiding the use of a connecting copper bar and reducing the number of circuit connecting members, so that the overall structure is more portable and convenient to install. The detection principle of the current sensor 61 should be the prior art, which converts the size and direction of the magnetic field into the size and direction of the voltage, thereby measuring the current.

[0028] Compared with the prior art, the shell 31 of the buckle type power module is provided with a plurality of buckles 32 at both ends, and the cover plate 37 is provided with a plurality of buckle openings 39 corresponding to the positions of the buckles 32. When installation is required, the buckles 32 are connected with the buckle openings 39 by directly pressing the cover plate 37, which is more convenient and fast. The positive power terminal 34, the negative power terminal 35 and the signal pin 36 are pre-arranged in the shell 31 when the shell 31 is injection molded, so that the positive power terminal 34, the negative power terminal 35 and the signal pin 36 are integrally formed with the shell 31. The positions of the electronic elements are set in advance, and when the shell 31 is connected with the heat dissipation bottom plate 10, the positions of the positive power terminal 34, the negative power terminal 35 and the signal pin 36 are directly positioned and can be directly welded with the chip 22, so that the connection position is quickly positioned and has higher strength.

[0029] The above is only a preferred embodiment of the utility model and is not used to limit the protection scope of the utility model, and any modification, equivalent replacement or improvement within the spirit of the utility model is covered in the claim scope of the utility model.

Claims

1. A snap-fit ​​power module, characterized in that: The snap-fit ​​power module includes a heat sink base plate, multiple chip assemblies disposed on the heat sink base plate, and a housing assembly disposed on the heat sink base plate. The housing assembly includes a shell disposed on the heat sink base plate, multiple snaps disposed on the shell, multiple positive power terminals disposed on the shell, multiple negative power terminals disposed on the shell, multiple signal pins disposed on the shell, and a cover plate disposed on the shell and engaging with the snaps. The snaps are respectively disposed at both ends of the shell and are integrally formed with the shell. One end of each of the positive power terminals, negative power terminals, and signal pins is welded to the chip assemblies. The positive power terminals, negative power terminals, and signal pins are integrally formed with the shell. The cover plate has multiple slots corresponding to the positions of the snaps.

2. The snap-on power module as described in claim 1, characterized in that: The heat dissipation base plate has a plurality of heat dissipation fins arranged in an array on the side facing away from the chip assembly, and the transverse cross-section of the heat dissipation fins is elliptical.

3. The snap-on power module as described in claim 1, characterized in that: The chip assembly includes a DBC board disposed on the heat sink base plate, and a plurality of chips disposed on the DBC board. The DBC board has a ceramic layer in the middle and copper layers on the top and bottom.

4. The snap-on power module as described in claim 1, characterized in that: The housing assembly also includes a plurality of weight-reducing grooves disposed on the housing, the weight-reducing grooves being disposed on the top end face of the housing.

5. The snap-on power module as described in claim 1, characterized in that: The shell has a hollow frame structure and is formed by injection molding.

6. The snap-on power module as described in claim 1, characterized in that: The housing is provided with two reinforcing ribs that separate the hollow parts of the housing, and the buckles are provided on the reinforcing ribs.

7. The snap-on power module as described in claim 1, characterized in that: The snap-on power module also includes multiple current sensors mounted on the housing assembly.

8. The snap-on power module as described in claim 7, characterized in that: A detection hole is provided on the negative power terminal, and the current sensor is disposed on the housing and vertically inserted into the detection hole. The current sensor is spaced apart from the hole wall of the detection hole.

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