Wafer box placing platform

Abstract

The utility model relates to the technical field of semiconductors, in particular to a wafer box placing platform, which comprises a base, a transportation frame in sliding connection with the base and a translation driving unit for driving the transportation frame to be close to or far away from the base, a plurality of processing grooves are formed in the base; the conveying frame is provided with a taking and placing opening corresponding to the machining groove so as to penetrate through a notch of the conveying frame, and the taking and placing opening communicates with the notch. According to the utility model, the picking and placing of the wafer box and the wafer processing can be synchronously carried out, so that the wafer can be accurately and stably processed, and the quality and the performance of the wafer are guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially a wafer box placing platform. BACKGROUND

[0002] In the wafer processing process, the wafer box as wafer carrier can play the role of placing and conveying wafers. Usually, a wafer box can contain many wafers, and the inside of the wafer box is designed with symmetrical grooves of uniform size for supporting and fixing the two sides of the wafer.

[0003] In the wafer manufacturing process, the taking and placing of the wafer box involves multiple key steps, including wafer supply, processing, and discharging after processing. Wafer processing is usually carried out at designated processing stations to facilitate the smooth completion of oxidation, LPCVD (low pressure chemical vapor deposition), diffusion doping, ion implantation annealing, dopant diffusion, alloy heat treatment, and other heat treatment processes, as well as etching, cleaning, and other steps. These processes need to be carried out in specific equipment and environment to ensure the quality and performance of the wafer.

[0004] However, due to the inconvenience of separating the wafer box taking and placing station from the wafer processing station, the wafer box taking and placing is completed in the wafer processing area, and the wafer box taking and placing and wafer processing cannot work in parallel, which is not conducive to ensuring that the wafer can be accurately and stably processed, affecting the quality and performance of the wafer. SUMMARY

[0005] The utility model provides a wafer box placing platform to make the wafer box taking and placing and wafer processing work in parallel, which is conducive to ensuring that the wafer can be accurately and stably processed, and guarantees the quality and performance of the wafer.

[0006] To solve the above technical problems, the utility model adopts the following technical scheme:

[0007] The utility model provides a wafer box placing platform, which comprises a base, a transport frame in sliding connection with the base, and a translation driving unit for driving the transport frame to approach or move away from the base.

[0008] The base is provided with a plurality of processing grooves; the transport frame is provided with a taking and placing opening corresponding to the processing grooves to form a gap through the transport frame, and the taking and placing opening is in communication with the gap.

[0009] When the wafer needs to be processed, the wafer box containing the wafer is placed on the transport frame, so that the bottom opening of the wafer box corresponds to the taking and placing opening. The translation driving unit drives the transport frame to approach the base, so that the taking and placing opening is located above the corresponding processing groove. This facilitates the related equipment for processing the wafer to smoothly process the wafer on the wafer box through the taking and placing opening and the processing groove.

[0010] When it is needed to place the wafer box on the transport frame, the translation drive unit drives the transport frame away from the base, so that the taking and placing opening is located at one side of the processing groove, and the equipment carrying the wafer box is extended into the taking and placing opening through the gap, so that the wafer box is placed on the transport frame.

[0011] When it is needed to take the wafer box from the transport frame, the translation drive unit drives the transport frame away from the base, so that the taking and placing opening is located at one side of the processing groove, and the equipment for carrying the wafer box is extended into the taking and placing opening through the gap and carries the wafer box, and then the wafer box is taken out along the gap.

[0012] The base is driven to be connected with a lifting mechanism, and the lifting mechanism is used to drive the base to move up and down.

[0013] The base is connected with at least two parallel arranged slide rails, the transport frame is connected with at least two slide blocks, the slide blocks are matched with the slide rails, and the translation drive unit drives the transport frame to move, so that the transport frame approaches or moves away from the base along the slide rails.

[0014] The width L of the gap and the width M of the taking and placing opening satisfy L < M.

[0015] The side of the taking and placing opening corresponding to the gap is provided with a letting opening.

[0016] The width H of the letting opening satisfies H = L.

[0017] The top of the transport frame is provided with a positioning block located at the periphery of each taking and placing opening, the positioning block is provided with a positioning groove, and the four positioning grooves one-to-one correspond to the four supporting feet at the bottom of the wafer box.

[0018] Two of the positioning blocks are located at the corners of the gap and the taking and placing opening respectively, and the other two positioning blocks are located at the corners of the letting opening and the taking and placing opening respectively.

[0019] The side of the transport frame corresponding to the gap is provided with a merging groove, and one side of the lifting mechanism extends into the merging groove.

[0020] The bottom of the base is vertically provided with a side plate on both sides, the slide rail is installed on the side plate, the support plate is connected to the both sides of the transport frame, the support plate corresponds to the side plate one-to-one, and the slide block is installed on the support plate.

[0021] The translation drive unit adopts a pneumatic cylinder, the translation drive unit is installed on one of the side plates, and the output end of the translation drive unit is drivingly connected with the corresponding support plate.

[0022] The utility model discloses the beneficial effect:

[0023] The wafer box can be placed or taken out of the transport frame smoothly, and the wafer processing can be smoothly realized, so that the wafer box taking and placing and wafer processing can be synchronized and parallel, which is beneficial to ensure that the wafer can be accurately and stably processed, and the quality and performance of the wafer are guaranteed. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the wafer box placing platform.

[0025] Figure 2 It is a schematic diagram of the structure of the transport frame.

[0026] Figure 3 It is a schematic diagram of the three-dimensional structure of the transport frame when it is located at the required position away from the base, and the base, the translation driving unit and the lifting mechanism.

[0027] Figure 4 It is an exploded three-dimensional view of the transport frame and the base.

[0028] Figure 5 It is a three-dimensional view of the transport frame and the base when the transport frame is located at the required position close to the base.

[0029] 1, base; 11, side plate;

[0030] 101, processing groove;

[0031] 2, transport frame;

[0032] 21, positioning block; 22, positioning groove;

[0033] 23, merging groove; 24, support plate;

[0034] 201, taking and placing opening; 202, notch; 203, accommodation opening;

[0035] 3, translation driving unit;

[0036] 4, lifting mechanism;

[0037] 5, slide rail; 6, slide block. DETAILED DESCRIPTION

[0038] In order to facilitate the understanding of those skilled in the art, the present application will be further described below in conjunction with the embodiments and the drawings. The specific embodiments of the present application will be described below, and it should be pointed out that, in the specific description of these embodiments, the present specification cannot describe all the features of the actual embodiments in detail for the purpose of concise and brief description.

[0039] REFERENCE Figures 1 to 5As shown in the utility model provides a wafer box placing platform, including base 1, with base 1 sliding connection's transport frame 2 and for driving transport frame 2 to be close to or away from base 1's translation drive unit 3;

[0040] The base 1 is provided with a plurality of processing grooves 101; the transport frame 2 is provided with a taking and placing opening 201 corresponding to the processing groove 101 to penetrate the gap 202 of the transport frame 2, and the taking and placing opening 201 is communicated with the gap 202.

[0041] Reference Figure 1 、 2 As shown, in actual application, when the wafer needs to be processed, the wafer box loaded with the wafer is placed on the transport frame 2, so that the bottom opening of the wafer box corresponds to the taking and placing opening 201, the translation drive unit 3 drives the transport frame 2 to be close to the base 1, so that the taking and placing opening 201 is located above the corresponding processing groove 101, and the related equipment for processing the wafer is convenient for smoothly processing the wafer on the wafer box through the taking and placing opening 201 and the processing groove 101; when the wafer box needs to be placed on the transport frame 2, the translation drive unit 3 drives the transport frame 2 to be away from the base 1, so that the taking and placing opening 201 is located on one side of the processing groove 101, and the equipment for carrying the wafer box is inserted into the taking and placing opening 201 through the gap 202, so that the wafer box is placed on the transport frame 2; when the wafer box needs to be taken away from the transport frame 2, the translation drive unit 3 drives the transport frame 2 to be away from the base 1, so that the taking and placing opening 201 is located on one side of the processing groove 101, and the equipment for carrying the wafer box is inserted into the taking and placing opening 201 through the gap 202 and carries the wafer box, and then the wafer box is taken out along the gap 202, so that the wafer box can be smoothly placed or taken away from the transport frame 2, and the wafer processing can be smoothly realized, so that the wafer box taking and placing and wafer processing can be synchronized and parallel, which is beneficial to ensure that the wafer can be accurately and stably processed, and the quality and performance of the wafer are guaranteed.

[0042] Reference Figure 1 As shown in the embodiment, the base 1 is drivingly connected with a lifting mechanism 4, and the lifting mechanism 4 is used for driving the base 1 to move up and down; the lifting mechanism 4 adopts a screw motor module, an oil cylinder or an electric cylinder, so as to meet the use requirements of the base 1 at different heights, and be suitable for wafer box transportation at various heights.

[0043] Reference Figure 4 As shown in the embodiment, the base 1 is connected with at least two parallel arranged slide rails 5, the transport frame 2 is connected with at least two slide blocks 6, the slide block 6 is matched with the slide rail 5, and the translation drive unit 3 drives the transport frame 2 to move, so that the transport frame 2 is close to or away from the base 1 along the slide rail 5, and the relative movement of the transport frame 2 and the base 1 can be smoothly guided.

[0044] Reference Figure 1 、 2As shown, in the embodiment, the width L of the gap 202 and the width M of the taking and placing opening 201 satisfy L < M, the device carrying the wafer box carries the wafer box through a carrier, the size of the carrier is matched with the size of the gap 202, the carrier can smoothly extend into the taking and placing opening 201 after passing through the gap 202, and the carrier moves up and down in the taking and placing opening 201, so as to realize the placing or disengaging of the wafer box from the transport frame 2.

[0045] Reference Figure 1 , 2 As shown, in the embodiment, the side of the taking and placing opening 201 corresponding to the gap 202 is provided with a letting-in opening 203, the width H of the letting-in opening 203 satisfies H = L; in actual application, the device carrying the wafer box carries the wafer box through a carrier, two bottom supporting feet of the wafer box are located at the connection between the taking and placing opening 201 and the letting-in opening 203, the size of the carrier is matched with the size of the gap 202 and the letting-in opening 203, one end of the carrier can smoothly extend into the letting-in opening 203 and be located below the wafer box, and when the device drives the carrier to push the wafer box upward, the carrier can stably support the two ends of the bottom of the wafer box, so as to facilitate the stable support of the carrier to the wafer box.

[0046] Reference Figure 5 As shown, in the embodiment, the top of the transport frame 2 is provided with a positioning block 21 located around each taking and placing opening 201, the positioning block 21 is provided with a positioning groove 22, four positioning grooves 22 are matched with four supporting feet at the bottom of the wafer box one by one, and the supporting feet at the bottom of the wafer box are inserted into the positioning grooves 22 to realize the accurate positioning of the wafer box; two positioning blocks 21 are located at the corners of the gap 202 and the taking and placing opening 201 respectively, and the other two positioning blocks 21 are located at the corners of the letting-in opening 203 and the taking and placing opening 201 respectively, so as to effectively utilize the area of the transport frame 2 located at the connection between the letting-in opening 203 and the taking and placing opening 201, and realize compact structure arrangement.

[0047] Reference Figure 2 As shown, in the embodiment, the side of the transport frame 2 corresponding to the gap 202 is provided with a merging groove 23, one side of the lifting mechanism 4 extends into the merging groove 23, and part of the structure of the lifting mechanism 4 is hidden in the transport frame 2, so as to save space occupation.

[0048] Reference Figure 1 , 4As shown, in the embodiment, the two side portions of the base 1 are vertically provided with side plates 11, the slide rails 5 are installed on the side plates 11, the two sides of the transport frame 2 are connected with support plates 24, the support plates 24 correspond to the side plates 11 one by one, the slide blocks 6 are installed on the support plates 24, the slide rails 5 and the slide blocks 6 are installed in the side area of the base 1 and the transport frame 2, the slide rails 5 and the slide blocks 6 do not occupy the longitudinal space between the base 1 and the transport frame 2, the distance between the base 1 and the transport frame 2 is shortened, and the wafer box transportation efficiency is improved.

[0049] Reference Figure 1 As shown, in the embodiment, the translation driving unit 3 is a cylinder, the translation driving unit 3 is installed on one of the side plates 11, and the output end of the translation driving unit 3 is drivingly connected with the corresponding support plate 24; in actual application, the translation driving unit 3 drives the support plate 24 and the transport frame 2 to move, so that the transport frame 2 is conveniently driven to approach or move away from the base 1.

[0050] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as above, it is not intended to limit the utility model. Any skilled person in the art can make some changes or modifications to the above disclosed technical content without departing from the technical solution of the utility model, and the equivalent embodiments with equivalent changes are equivalent. Any simple modification, equivalent change and modification of the above embodiments within the scope of the technical solution of the utility model are within the scope of the technical solution of the utility model.

Claims

1. A wafer boat placement platform, comprising: The base (1) is provided with a plurality of processing grooves (101); the transport frame (2) is provided with a taking and placing opening (201) corresponding to the processing grooves (101) to penetrate the gap (202) of the transport frame (2), and the taking and placing opening (201) is in communication with the gap (202); When the wafer needs to be processed, the wafer box loaded with the wafer is placed on the transport frame (2), so that the bottom opening of the wafer box corresponds to the taking and placing opening (201), the transport frame (2) is driven by the translation driving unit (3) to approach the base (1), so that the taking and placing opening (201) is located above the corresponding processing groove (101), and the related equipment for processing the wafer is facilitated to smoothly process the wafer on the wafer box through the taking and placing opening (201) and the processing groove (101); When the wafer needs to be processed, the wafer box loaded with the wafer is placed on the transport frame (2), so that the bottom opening of the wafer box corresponds to the taking and placing opening (201), the transport frame (2) is driven by the translation driving unit (3) to approach the base (1), so that the taking and placing opening (201) is located above the corresponding processing groove (101), and the related equipment for processing the wafer is facilitated to smoothly process the wafer on the wafer box through the taking and placing opening (201) and the processing groove (101); When the wafer needs to be processed, the wafer box loaded with the wafer is placed on the transport frame (2), so that the bottom opening of the wafer box corresponds to the taking and placing opening (201), the transport frame (2) is driven by the translation driving unit (3) to approach the base (1), so that the taking and placing opening (201) is located above the corresponding processing groove (101), and the related equipment for processing the wafer is facilitated to smoothly process the wafer on the wafer box through the taking and placing opening (201) and the processing groove (101); The base (1) is drivenly connected with a lifting mechanism (4), and the lifting mechanism (4) is used to drive the base (1) to move up and down.

2. The FOUP placement platform of claim 1, wherein, The base (1) is connected with at least two parallelly arranged slide rails (5), the transport frame (2) is connected with at least two slide blocks (6), the slide blocks (6) are matched with the slide rails (5), and the transport frame (2) is driven by the translation driving unit (3) to move, so that the transport frame (2) approaches or moves away from the base (1) along the slide rails (5).

3. The FOUP placement platform of claim 1, wherein, The width L of the gap (202) and the width M of the taking and placing opening (201) satisfy L 4. The FOUP placement platform of claim 1, wherein, A side of the taking and placing opening (201) corresponding to the gap (202) is provided with a giving-up opening (203).

5. The FOUP placement platform of claim 4, wherein, The width H of the giving-up opening (203) satisfies H=L.

6. The FOUP placement platform of claim 5, wherein, The top of the transport frame (2) is provided with a positioning block (21) located at the periphery of each taking and placing opening (201), the positioning block (21) is provided with a positioning groove (22), and four positioning grooves (22) one-to-one correspond to four supporting feet at the bottom of the wafer box.

7. The FOUP placement platform of claim 5, wherein, Two positioning blocks (21) are respectively located at the corners of the gap (202) and the taking and placing opening (201), and the other two positioning blocks (21) are respectively located at the corners of the giving-up opening (203) and the taking and placing opening (201). ​ 8. The FOUP placement platform of claim 2, wherein, The side of the conveying frame (2) corresponding to the setting of the notch (202) is provided with a merging groove (23), and one side of the lifting mechanism (4) extends into the merging groove (23).

9. The FOUP placement platform of claim 3, wherein, Both sides of the base (1) are vertically provided with side plates (11), the slide rails (5) are installed on the side plates (11), both sides of the conveying frame (2) are connected with support plates (24), the support plates (24) correspond to the side plates (11) one by one, and the sliding blocks (6) are installed on the support plates (24).

10. The FOUP placement platform of claim 9, wherein, The translation driving unit (3) is a gas cylinder, the translation driving unit (3) is installed on one of the side plates (11), and the output end of the translation driving unit (3) is in driving connection with the corresponding support plate (24).

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