Composite floor

Abstract

The utility model discloses a composite floor, in the scheme, a covering part is covered above a foaming base plate so as to play a role in wear resistance and the like, and the covering part and the base plate are generally bonded through an adhesive so as to ensure the use strength, so that the roughness of a target surface is effectively improved through a concave pit formed in the foaming base plate, and the service life of the composite floor is prolonged. The contact area between the adhesive and the bonding surface can be increased, and the covering part and the substrate can be bonded with high strength through the adhesive. Furthermore, the covering part and the base plate are bonded together in a high-strength mode, the covering part and the base plate are combined into a whole to the maximum extent, if the strength of the covering part is insufficient, the base plate can make up the strength of the covering part, and the composite floor with the thickness of 6-15 mm can meet the use requirement under any condition. In addition, the adjacent base plates are connected through the interlocked connecting components, so that paving of the composite floor is more convenient.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of decoration and decoration building materials, more particularly to a composite floor. BACKGROUND

[0002] In the field of building decoration materials, the surface of the decoration material usually has a covering, such as ceramic tiles, leather or wood veneer, etc. Ceramic tiles are widely used in home and commercial decoration due to their durability and aesthetic properties. However, with the acceleration of modern life pace and the improvement of environmental awareness, the installation complexity and environmental friendliness of traditional ceramic tiles have become increasingly prominent. The installation process of traditional ceramic tiles is complicated and requires professional technicians to operate, which not only increases the construction cost but also prolongs the decoration period. At the same time, the installation of traditional ceramic tiles relies on cement mortar and other materials, which can easily produce a large amount of dust and noise during construction, causing adverse effects on the construction site and the surrounding environment, which does not meet the modern green and environmentally friendly construction concept. Secondly, the weight of traditional ceramic tiles is relatively large, which undoubtedly increases the load bearing burden of the floor slab and increases the difficulty and cost of structural design for high-rise buildings or places that require lightweight decoration.

[0003] In addition, the laying of traditional ceramic tiles requires high requirements for the base layer, precise leveling and waterproof treatment, which also increases the construction difficulty and cost. In addition, the thick and heavy characteristics of ceramic tiles not only increase the difficulty of transportation and installation, but also limit their application in certain spaces (such as thin walls or narrow areas). Furthermore, traditional ceramic tiles have the problems of easy falling off and cracking during use, which not only affects the aesthetic appearance but also may pose a threat to personnel safety. These problems make consumers have many concerns when using traditional ceramic tiles. SUMMARY

[0004] To solve at least some of the problems in the prior art, the utility model provides a composite floor, which has high bonding strength as a whole, can be conveniently installed during paving, the connection between each part is more firm, and meets the ground use requirements.

[0005] To achieve the above-mentioned purpose, the technical scheme provided by the utility model is as follows:

[0006] A composite floor, comprising a foamed vinyl board with a thickness of 3-12mm and a density of 0.6-3.0g / cm 3 A covering, the surface of the covering is connected to the base plate through an adhesive to form a composite floor with a thickness of 6-15mm;

[0007] The density of the base plate is 0.65-1.4g / cm 3, the substrate having two opposite target faces and side faces formed around the target faces, a coupling member interlocking with an adjacent substrate being formed on at least one side face;

[0008] The substrate has a plurality of spaced recesses on at least one target face; the adhesive can flow into at least some of the recesses and bond the substrate and the cover, so that the bonding strength of the substrate and the cover is such that they cannot be peeled apart.

[0009] The inability to peel apart means that if the substrate and the cover are peeled apart, the surface of the substrate will be damaged, so that the substrate cannot be used again. Therefore, the recesses make the bonding strength of the substrate and the cover such that they cannot be peeled apart.

[0010] In this scheme, the cover is covered on the foamed substrate to play the role of wear resistance, etc. The cover and the substrate are generally bonded by an adhesive to ensure the strength of use. Therefore, the utility model discloses a plurality of spaced recesses arranged on the foamed substrate (the surface is relatively smooth), which effectively improves the roughness of the target face, can increase the contact area between the adhesive and the target face, and the adhesive can high-strength bond the cover and the substrate. Furthermore, the cover and the substrate are high-strength bonded together, so that the cover and the substrate are combined into one whole to the greatest extent. If the strength of the cover is insufficient, the substrate can compensate for the strength of the cover, so that the composite floor of 6-15mm thickness meets the use requirements under the premise of reducing the weight of the composite floor. In addition, the adjacent substrates are connected by the interlocking coupling member, so that the laying of the composite floor is more convenient.

[0011] The cover can be composed of materials selected from the group consisting of natural stone, marble, granite, slate, glass, ceramic, leather and wood, wherein the density of the natural stone, marble, granite, slate, glass and ceramic is 2.0-3.0g / cm 3 ; the density of the leather is 0.6-0.8g / cm 3 ; the density of the wood is 0.8-1.2g / cm 3 ; and the density of other materials that can be used is 1.2-2.0g / cm 3 .

[0012] As a further improvement, the thickness of the substrate is 3-5mm.

[0013] As a further improvement, the thickness of the composite floor is 7-12mm.

[0014] As a further improvement, the thickness of the composite floor is 8-10mm.

[0015] As a further improvement, the density of the cover is 2.0g / cm 3 Above. The cover in the density range is usually a tile, when the cover is below 6mm, the cover is an ultra-thin tile, in this case, the cover is more dependent on the high viscosity combination with the substrate, and the strength of the cover is compensated by the substrate. Moreover, in this case, the foamed substrate has a higher elastic modulus, therefore, the foot feeling of the composite floor is comfortable, and at the same time, the base body of the substrate can compensate the assembled gap for the change of the environment (especially in high temperature and high humidity environment), so that the composite floor is more stable.

[0016] As a further improvement, the foaming ratio of the substrate is 0.6-1.34. The density of the foamed substrate is 0.65-1.4g / cm 3 It can be any known foamed substrate currently on the market (including PVC foamed substrate, polystyrene (EPS) foamed substrate, polyurethane (PU) foamed substrate and polypropylene (PP) foamed substrate, and polyethylene (PE) foamed substrate). The foaming ratio of the foamed substrate is 0.6-1.34, for example, the foaming ratio can be 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.34, etc., or in the range between any two of the above values. If the foaming ratio is too small, the foaming degree is low, and there are few closed pores formed in the substrate; if the foaming ratio is too large, the foaming degree is high, and the closed pores formed in the substrate are too large.

[0017] As a further improvement, the connecting component includes a locking tongue protruding at at least one side edge of the substrate, and a locking groove recessed at at least one side edge of the substrate; when the substrates are spliced, the locking tongue and the locking groove on the adjacent substrates are connected in cooperation. Further improve the convenience of splicing between the substrates.

[0018] As a further improvement, the recess covers 5%-100% of the target surface area. It should be noted that the substrate of the utility model can be placed on site by bonding, or it can be bonded after transportation, therefore, the recess is designed by analyzing the bonding strength, in order to ensure the required bonding strength, the recess covers 5% of the target surface area, if it is lower than this value, the bonding strength may not reach the ideal result, and the service life of the cover is shorter; the best way is that the recess covers 100% of the target surface area, in actual production, due to some objective reasons, it is difficult to reach 100% coverage, under the premise of ensuring the strength, at the same time, it can be stably transported, and the cover and the foamed substrate do not crack or separate.

[0019] The pits cover 5-100% of the target surface area. Specifically, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 71%, 72%, 73%, 74%, 75%, 76%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, 100%.

[0020] As a further improvement, the pits cover at least the four peripheral edges and the central part of the target surface. Thus, the pits cover 50-100% of the target surface area, specifically 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 71%, 72%, 73%, 74%, 75%, 76%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, 100%. The edge contact surface between the cover and the substrate can be filled with adhesive, and the adhesive strength is high, which can prevent the edge of the cover from warping.

[0021] As a further improvement, the pits fully cover the adhesive, which is uniformly laid on the target surface where the pits are arranged and forms an adhesive layer.

[0022] As a further improvement, the two opposite target surfaces of the substrate are target surface one and target surface two, respectively, wherein target surface one is a connecting surface, and target surface two is a laying surface; at least one end of the laying surface is provided with a chamfer or a transition arc at the connection with the side surface of the substrate where the lock tongue or lock groove is arranged.

[0023] As a further improvement, the lock tongue is arc-shaped at the end away from the substrate.

[0024] As a further improvement, the substrate is a target face full-foamed vinyl substrate, and the substrate has a static bending strength greater than 20 MPa. The skins on both sides of the substrate are very thin, and at least part of the pit structure can communicate with the closed cells of the internal foam of the substrate and form capillary channels. Surprisingly, the inventors have found through extensive experiments that, after the pit structure communicates with the closed cells inside the substrate, internal pore channels are formed, and the capillary action of these pore channels can more quickly achieve the tiling of the adhesive. In addition, part of the pit structure that is not filled with adhesive or the bare pit structure can generate adsorption force on the cover when the cover is placed on the substrate under the action of gravity, thereby further enhancing the bonding force between the substrate and the cover.

[0025] As a further improvement, the thickness center line of the locking tongue and the locking groove deviates from the thickness center line of the substrate by less than 20% of the total thickness of the substrate, and the thickness of the locking tongue and the locking groove accounts for 30% to 60% of the thickness of the substrate.

[0026] As a further improvement, the width of the locking tongue protrusion and the depth of the locking groove recess are 3 to 8 mm.

[0027] The technical scheme provided by the utility model has the following beneficial effects compared with the prior art:

[0028] (1) The composite floor of the utility model, the interval distribution pit arranged on the substrate effectively improves the roughness of the target face, can increase the contact area between the adhesive and the bonding surface, and the adhesive can high-strength bond the cover and the substrate. Further, the cover and the substrate are high-strength bonded together, which maximizes the integration of the cover and the substrate into one whole, and if the strength of the cover is insufficient, the substrate can compensate for the strength of the cover, so that the 6-15mm thick composite floor meets the use requirements in any case.

[0029] (2) The composite floor of the utility model, the adjacent substrates are connected through the interlocking connecting parts, which makes the laying of the composite floor more convenient.

[0030] (3) The composite floor of the utility model, the density of the cover is 2.0g / cm 3 The density range of the cover is usually a ceramic tile, and when the cover is less than 6mm, the cover is an ultra-thin ceramic tile, which relies more on high-viscosity bonding with the substrate, and the substrate compensates for the strength of the cover through the scheme.

[0031] (4) The composite floor of the utility model, the target face skin full foaming vinyl board of the base plate, the skin of the two sides of the base plate is very thin, at least part of the pit structure can connect and communicate the foaming closed pore inside the foaming base plate, and form capillary channel, utilize the capillary action of these pore channels, can relatively rapidly realize the paving of the bonding agent, enhance the bonding strength between the base plate and the cover. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 It is the schematic view of ceramic tile assembly structure;

[0033] Figure 2 It is the schematic view of base plate along its thickness direction section;

[0034] Figure 3 It is Figure 2 It is the enlarged structure schematic view of A in the middle;

[0035] Figure 4 It is Figure 2 It is the enlarged schematic view of pit formed by electric pulse mode on the connecting surface of B in the middle;

[0036] Figure 5 It is the schematic view of adjacent base plate splicing state in actual situation;

[0037] Figure 6 It is the schematic view of chamfer setting of the connecting place of laying surface and the side surface of base plate near the side of lock tongue;

[0038] Figure 7 It is the schematic view of chamfer setting of the connecting place of laying surface and the side surface of base plate near the side of lock slot;

[0039] Figure 8 It is the structure schematic view of arc setting of the end of lock tongue away from base plate.

[0040] Label explanation: 1, base plate;10, connecting surface;100, chamfer;101, pit;11, lock tongue;111, lock tongue connecting surface;12, lock slot;121, lock slot connecting surface;13, groove hole;2, cover;3, bonding glue layer;4, diaphragm. DETAILED DESCRIPTION

[0041] In order to further understand the content of the utility model, the utility model is described in detail in conjunction with the drawings and examples.

[0042] The structure, proportion, size and the like shown in the drawings of the specification are only used to cooperate with the content disclosed in the specification, to be understood and read by those skilled in the art, and do not have technical substantive significance, and any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application.

[0043] Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and the like cited in the specification are only for the convenience of clear description, and are not used to limit the implementable range, and the change or adjustment of the relative relationship, without substantially changing the technical content, is also considered as the implementable scope of the present application. Moreover, in addition to being used to represent the orientation or position relationship, the above-mentioned part of the terms can also be used to represent other meanings, for example, the term "upper" can also be used to represent a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present application can be understood according to the specific circumstances.

[0044] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein.

[0045] In combination with Figure 1 , Figure 2 and Figure 4 , the present embodiment provides a composite floor, which comprises a substrate 1 with a thickness of 3-12mm and a cover 2 with a density of 0.6-3.0g / cm 3 The surface of the cover 2 is connected with the substrate by an adhesive to form a composite floor with a thickness of 6-15mm; the density of the foamed substrate is 0.65-1.4g / cm 3 The foamed substrate has two opposite target surfaces and side surfaces formed around the target surfaces, and a connecting part for interlocking with an adjacent substrate is formed on at least one side surface; the foamed substrate has a plurality of spaced recesses 101 on at least one target surface, and the adhesive can flow into at least part of the recesses and bond the substrate 1 and the cover 2, so that the bonding strength of the substrate 1 and the cover 2 after bonding reaches the requirement of being unable to be peeled off.

[0046] It should be noted that the term "unable to be peeled off" means that if the substrate 1 and the cover 2 are bonded and then peeled off, the surface of the substrate will be damaged after peeling off, so that the substrate cannot be used again, and therefore the recesses make the bonding strength of the substrate 1 and the cover 2 after bonding reach the requirement of being unable to be peeled off.

[0047] Specifically, the test method that cannot be peeled off is that the composite floor obtained above is tested for bonding strength, referring to the test method for bonding strength of flexible substrate composite floor in GBT 29059-2012 Ultra-thin stone composite floor. For example:

[0048] 1) The size of the composite floor sample is 100 mm ± 1 mm in length, 100 mm ± 1 mm in width, and the actual thickness, and there are 5 composite floor samples in each group;

[0049] 2) The bonding surface of the mold is roughened on the upper and lower surfaces of the composite floor sample, and the dirt is removed to keep the surface clean and dry. The mold is bonded to the composite floor sample with an adhesive, and the bonded composite floor sample is cured at room temperature for more than 24 hours.

[0050] Specific operation steps: place the composite floor sample on the test platform, clamp the fixture, and pass the tension rod through the center point of the fixture. Apply a load to the composite floor sample at a rate of 0.5 mm / min until the foamed substrate or ceramic tile body is damaged. Record the result as unpeeling.

[0051] The bonding agent can use any known bonding agent or adhesive that can bond the substrate 1 and the cover 2 together, such as polyurethane (PU), epoxy resin, polyacrylate, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, etc., which will not be repeated here, has high bonding strength and meets the needs of use.

[0052] In this scheme, the cover 2 is covered on the foamed substrate, thereby playing the role of wear resistance, etc. The cover 2 and the substrate 1 are generally bonded by an adhesive to ensure the strength of use. Therefore, by providing a large number of spaced recesses 101 on the foamed substrate (the surface is relatively smooth), the recess 101 is a surrounding structure recessed towards the substrate, effectively improving the roughness of the target surface, increasing the contact area between the adhesive and the bonding surface, and the adhesive can high-strength bond the cover 2 and the substrate 2. Further, the cover 2 and the substrate 1 are bonded together with high strength, which maximizes the integration of the cover 2 and the substrate 1. If the strength of the cover 2 is insufficient, the substrate 1 can compensate for the strength of the cover 2, so that the 6-15 mm thick composite floor meets the use requirements in any case. In addition, adjacent substrates 1 are connected by interlocking connecting parts, making the laying of the composite floor more convenient.

[0053] Furthermore, the substrate 1 in the present solution is a foamed vinyl substrate, which has a large number of closed cells formed by foaming inside, and the pits 101 distributed on the target surface of the substrate, at least part of the pits 101 can connect and communicate with the closed cells inside the foamed substrate, and form capillary channels. After the pit structure communicates with the closed cells inside the foamed substrate, the internal pore channels are formed, and the capillary action of these pore channels can make the adhesive more rapidly and evenly spread; in addition, part of the pit structure filled with adhesive or the bare pit structure can generate adsorption force on the cover when the cover is placed on the substrate under the action of gravity, thereby further enhancing the bonding force between the substrate and the cover.

[0054] As a further improvement, the thickness of the substrate 1 is 3-5mm, for example, the thickness of the substrate 1 can be 3mm, 3.5mm, 4mm, 4.5mm or 5mm, or a range between any two of the above values.

[0055] As a further improvement, the thickness of the composite floor is 7-12mm, for example, the thickness of the composite floor can be 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, 10mm, 10.5mm, 11mm, 11.5mm or 12mm, or a range between any two of the above values.

[0056] As a further improvement, the thickness of the composite floor is 8-10mm, for example, the thickness of the composite floor can be 8.1mm, 8.2mm, 8.3mm, 8.4mm, 8.6mm, 8.7mm, 8.8mm, 8.9mm, 9.1mm, 9.2mm, 9.3mm, 9.4mm, 9.6mm, 9.7mm, 9.8mm or 9.9mm.

[0057] As a further improvement, the density of the cover 2 is 2.0g / cm 3 Above. The cover 2 in this density range is usually a tile, when the cover 2 is below 6mm, the cover 2 is an ultra-thin tile, in this case the cover 2 relies more on the high viscosity bonding with the substrate 1, and the strength of the cover 2 is compensated by the substrate 1. Moreover, in this case, the foamed substrate 1 has a higher elastic modulus, therefore, the composite floor has a comfortable foot feeling, and at the same time, the matrix of the substrate 1 can compensate for the gap between the assembled parts, making the composite floor more stable. In addition, the foamed substrate is also suitable for floors equipped with floor heating, when the temperature is not higher than 65℃, the closed cells inside the substrate 1 have a heat insulation effect on one hand, and on the other hand can compensate for the expansion, so that the thermal expansion coefficient is very small and can be ignored, thereby not affecting the use of the composite floor.

[0058] As a further improvement, the foaming ratio of the substrate 1 is 0.6-1.34. The density of the foamed substrate described above is 0.65-1.4 g / cm 3 may be any known foamed substrate currently available on the market (including PVC foamed substrate, polystyrene (EPS) foamed substrate, polyurethane (PU) foamed substrate and polypropylene (PP) foamed substrate, and polyethylene (PE) foamed substrate). The foaming ratio of the foamed substrate is 0.6-1.34, for example, the foaming ratio can be 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.34, etc., or in the range between any two of the above values. If the foaming ratio is too small, the foaming degree is low, and few closed pores are formed in the substrate 1; if the foaming ratio is too large, the foaming degree is high, and the closed pores formed in the substrate 1 are too large.

[0059] As a further improvement, all the pits 101 cover 5%-100% of the target surface area. It should be noted that the substrate of the utility model can be bonded and placed on site with the cover, or it can be bonded after transportation. Therefore, through the analysis of the bonding strength, the pits 101 are designed, in order to ensure the required bonding strength, the pits 101 cover 5% of the target surface area, if it is lower than this value, the bonding strength may not reach the ideal result, and the service life of the cover is shorter; the best way is that the pits 101 cover 100% of the target surface area, in actual production, due to some objective reasons, it is difficult to reach 100% coverage, under the premise of ensuring the strength, at the same time, it can be stably transported, and the cover and the foamed substrate do not crack or separate.

[0060] In combination with Figure 2 and Figure 4 As shown, the pits 101 cover 5%-100% of the target surface area. Specifically, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 71%, 72%, 73%, 74%, 75%, 76%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, 100%.

[0061] As a further improvement, the recess 101 covers at least the four peripheral edges and the central part of the target surface. Thus, the recess 101 covers 50-100%, in particular 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 71%, 72%, 73%, 74%, 75%, 76%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, 100% of the area of the target surface. The edge contact surface between the cover 2 and the substrate 1 can be filled with an adhesive, and the adhesive strength is high, which can prevent the edge of the cover from warping.

[0062] The above-mentioned forming method of the recess of the utility model comprises the following:

[0063] The first method is to perform corona pulse treatment on the target surface of the foamed substrate. The specific corona pulse parameters are as follows: pulse frequency is 150-200 pps, pulse voltage is 20-25 kv, electrode spacing is 1-3 mm, and treatment time is 2-5 s. The recess formed by this method is relatively regular and has good consistency.

[0064] The second method is to perform laser irradiation treatment on the target surface of the foamed substrate. The laser irradiation can use existing technology, which is not described here.

[0065] The third method is to perform chemical etching treatment on the target surface of the foamed substrate 1. The electrochemical etching can use existing technology, which is not described here.

[0066] The recesses formed by the second and third methods have poor consistency and are not controllable.

[0067] In combination with Figure 2 , Figure 3 and Figure 4 , the connecting component includes a locking tongue protruding at at least one side edge of the substrate, and a locking groove recessed at at least one side edge of the substrate; when the substrates are spliced, the locking tongue and the locking groove on the adjacent substrates are connected in cooperation. Further improve the convenience of splicing between the substrates. Specifically, in combination with Figure 2As shown, the substrate 1 has two opposite target surfaces as large surfaces, wherein the target surface for connecting with the cover as target surface one is the connecting surface 10. The target surface opposite to the connecting surface 10 is target surface two as the laying surface. The side surface adjacent to the target surface includes two opposite side surface one 101 and two opposite side surface two 102. Among them, the adjacent one side surface one 101 and one side surface two 102 are provided with the lock tongue 11 in protrusion, and the adjacent other side surface one 101 and other side surface two 102 are provided with the lock groove 12 in recess. When two-by-two substrates 1 are spliced, the lock tongue 11 and the lock groove 12 on the adjacent substrate 1 are connected in cooperation; the two opposite sides of the lock tongue 11 in cooperation with the lock groove 12 are the lock tongue connecting surface 111, and the two opposite sides of the lock groove 12 in cooperation with the lock tongue 11 are the lock groove connecting surface 121.

[0068] It should be noted that in some cases, only one of the two opposite side surface one 101 is provided with the lock tongue 11 or the lock groove 12, and only one of the two opposite side surface two 102 is provided with the lock tongue 11 or the lock groove 12.

[0069] Generally, the substrate 1 is a complete square, and the lock tongue 11 and the lock groove 12 are formed by milling on the substrate 1, so that the lock tongue 11 and the lock groove 12 are integrally formed on the substrate 1, and the substrate 1 has good integrity.

[0070] As a preferred embodiment, the substrate 1 is a full foaming vinyl substrate, and a large number of closed pores are formed in the substrate 1 after foaming. After the lock tongue 11 and the lock groove 12 are processed and formed on the substrate 1, the closed pores are exposed on the lock tongue connecting surface 111 and the lock groove connecting surface 121 to form groove holes 13 with different depths, and when the lock tongue connecting surface 111 and the lock groove connecting surface 121 are connected in cooperation, the roughness between the lock tongue 11 and the lock groove 12 is increased. Specifically, as shown in Figure 3 As shown, the substrate 1 has a large number of closed pores inside, and the substrate 1 forms the lock tongue 11 and the lock groove 12 by milling to remove material, and part of the closed pores at the lock tongue connecting surface 111 and the lock groove connecting surface 121 become open holes, i.e. groove holes 13.

[0071] In combination with Figure 5 and Figure 6As shown, at least one end of the laying surface of the substrate 1 is provided with a chamfer 100 or a transition arc at the junction with the side surface of the substrate 1 on which the locking tongue 11 or the locking groove 12 is arranged. The chamfer 100 or the transition arc is arranged at the junction of the end of the laying surface and the side surface of the substrate 1 on which the locking tongue 11 is arranged. On the one hand, when the adjacent substrates are spliced, for example, after the laying of the first substrate is completed, the locking groove 12 of the first substrate is waiting for splicing, the second substrate is held close to the first substrate for splicing, and the locking tongue 11 of the second substrate is waiting for splicing. During this process, the second substrate is held and has a certain inclination, and during splicing, the locking tongue 11 enters the locking groove 12, and at the same time, the second substrate is gradually flattened. The chamfer is arranged at the junction of the laying surface and the side surface of the substrate on which the locking tongue 11 is arranged, or the transition arc is arranged, to avoid the laying surface of the second substrate from being stuck when the second substrate is flattened during the splicing of the locking tongue 11 and the locking groove 12. On the other hand, in some cases, after the second substrate is flattened, the second substrate is pushed so that the locking tongue 11 of the second substrate is completely matched with the locking groove 12 of the first substrate. The chamfer or the transition arc is arranged to make the second substrate more easily pushed. In addition, the chamfer 100 or the transition arc can more effectively avoid damage caused by debris on the ground during substrate laying. Compared with the case where no chamfer or transition arc is arranged, the junction of the substrate 1 is a right angle, and if there is debris on the ground during substrate laying, the right angle is easily damaged or scratched by the debris, forming a stress concentration point. In the process of using the substrate, if a sudden external force occurs, such as a heavy object falling; or in the case of heating, cracks are easily generated at the stress concentration point, affecting the service life of the substrate.

[0072] As shown in the drawings, Figure 8 The end of the locking tongue 11 away from the substrate is arc-shaped. Because the roughness between the locking tongue connecting surface 111 and the locking groove connecting surface 121 of the substrate in this scheme is large, the arrangement of the arc can provide a certain guide when the locking tongue 11 is inserted into the locking groove 12, making the locking tongue 11 and the locking groove 12 easier to assemble.

[0073] As a further improvement, the substrate 1 is a target surface cold skin full-frothed vinyl substrate, and the static bending strength of the substrate 1 is greater than 20 megapascals, meeting the requirements of floor laying on the ground. The skin on both sides of the substrate 1 is very thin, which enables more pit 101 structures to be connected to the closed pores inside the frothed substrate and form capillary channels. Here, when the substrate 1 is a target surface skin full-frothed vinyl substrate, the pit 101 enables the bonding strength between the substrate 1 and the cover 2 to be unpeelable. If peeling is performed after the substrate 1 and the cover 2 are bonded, the skin on the surface of the substrate 1 will be damaged after peeling, and the substrate 1 will be destroyed.

[0074] The static bending strength is the ratio of the bending moment and the bending section modulus of the test piece under the maximum load. As for the static bending strength of the substrate 1, when the substrate is stressed, it will cause a certain bending. This is called "static bending", and the "static bending strength" is the pressure strength that the substrate can withstand when it is bent to break under stress. The test standard of the static bending strength can refer to GB / T 17657-2013 "Test methods of physical and mechanical properties of wood-based panels and laminated flooring". In this scheme, the static bending strength of the substrate 1 is greater than 20 MPa, which meets the strength use requirements of floor tiles in various occasions, such as some factory floors and other occasions with high ground bearing requirements.

[0075] Preferably, the concave pits 101 are fully covered with adhesive, and the adhesive is uniformly laid on the target surface where the concave pits are arranged and forms an adhesive layer 3. For some large-size composite floor tiles, such as 1000mm*1000mm, the adhesive is uniformly laid and combined with the concave pits, effectively avoiding the occurrence of unadhered parts between the substrate 1 and the cover 2.

[0076] In another specific embodiment, in order to ensure that the strength of the lock tongue 11 and the lock groove 12 of the foamed substrate meets the paving requirements, preferably, the thickness of the lock tongue 11 and the lock groove 12 accounts for 30%~60% of the thickness of the substrate, and the center line of the thickness of the lock tongue and the lock groove deviates from the center line of the thickness of the substrate by less than 20% of the total thickness of the substrate, for example, the thickness of the lock tongue 11 and the lock groove 12 accounts for 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59% or 60% of the thickness of the substrate 1. The protruding width of the lock tongue 11 and the depth of the recess of the lock groove 12 are 3~8mm, for example, the depth can be selected as 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm or 8mm, and the protruding width of the lock tongue 11 and the depth of the recess of the lock groove 12 can be the same or different. On the one hand, it meets the requirements of the elasticity and the number of closed pores of the substrate 1, and on the other hand, it is necessary to make the substrate 1 reach a certain strength requirement, for example, the lock tongue 11 and the lock groove 12 are not damaged when they are matched.

[0077] The cover 2 is adhered to the substrate 1. Taking the cover 2 as an ultra-thin ceramic tile as an example, after the ceramic tile and the substrate 1 are connected, the relative position between the edge of the ceramic tile and the edge of the substrate 1 also determines whether there is a gap between adjacent ceramic tiles after paving.

[0078] For example, in one case, the size of the ceramic tile is relatively small compared to the size of the substrate, and after paving, the edges of adjacent substrates are in close contact with each other. In this case, there is a certain gap between adjacent ceramic tiles, and the gap can be coated with a sealant.

[0079] In another case, the size of the substrate is relatively small compared to the size of the tiles, and the edges of the adjacent tiles are in close contact with each other after the tiles are laid. In this case, a seamless tile laying is formed after the tiles are laid.

[0080] The relative position between the edges of the tiles and the edges of the substrate 1 can be set according to the requirements of the customers.

[0081] In another case, a film 4 with a thickness of 1-3 mm containing an anti-mildew agent is compounded on the laying surface of the substrate. Specifically, a film 4 is compounded on the laying surface of the substrate, and the film 4 can be one of IXPE (electron cross-linked polyethylene foam or radiation cross-linked polyethylene foam), EVA (ethylene-vinyl acetate copolymer) or softwood material, which can improve the soundproofing or sound insulation effect of the product and increase the elasticity of the substrate.

[0082] The above description of the present application and its embodiments is illustrative and not restrictive, and the embodiments shown in the drawings are only one of the embodiments of the present application, and the actual structure is not limited thereto. Therefore, if a person skilled in the art is inspired by this, without departing from the spirit of the present application, similar structural modes and embodiments can be designed without creative design, which should belong to the protection scope of the present application.

Claims

1. A composite floor, characterized by: A foamed vinyl board (1) having a thickness of 3-12 mm and a density of 0.6-3.0 g / cm 3 A cover (2) having a thickness of 6-15 mm, the cover (2) being connected to the board (1) by an adhesive on the surface of the cover (2). The density of the substrate is 0.65-1.4 g / cm 3 The substrate has two opposing target faces and side faces formed around the target faces, a coupling member interlocking with an adjacent substrate being formed at at least one side face; The at least one target surface of the substrate has a plurality of spaced recesses (101), and the adhesive can flow into at least part of the recesses (101) and bond the substrate (1) and the cover (2), so that the bonding strength of the substrate (1) and the cover (2) cannot be peeled off.

2. The composite floor panel according to claim 1, characterized in that: The thickness of the substrate (1) is 3-5 mm.

3. The composite floorboard of claim 1, wherein: The thickness of the composite floor is 7-12 mm.

4. The composite floorboard of claim 3, wherein: The thickness of the composite floor is 8-10 mm.

5. The composite floorboard of claim 1, wherein: The density of the cover (2) is 2.0 g / cm 3 The thickness is 6 mm or less.

6. The composite floorboard of claim 1, wherein: The foaming ratio of the substrate (1) is 0.6-1.

34.

7. The composite floorboard of claim 1, wherein: The connecting component includes a locking tongue (11) protruding at at least one side edge of the substrate (1), and a locking groove (12) recessed at at least one side edge of the substrate (1); when the substrates (1) are spliced, the locking tongue (11) and the locking groove (12) on adjacent substrates (1) are connected.

8. The composite floor panel according to any of the claims 1-7, characterized in that: All the recesses (101) cover 5%-100% of the target surface area.

9. The composite floorboard of claim 8, wherein: The recesses (101) cover at least the four peripheral edges and the central part of the target surface.

10. The composite floorboard of claim 9, wherein, The recesses (101) are fully covered by the adhesive, which is uniformly laid on the target surface where the recesses are arranged and forms a bonding glue layer (3).

11. The composite floorboard of claim 7, wherein: The two opposite target surfaces of the substrate (1) are target surface one and target surface two respectively, wherein the target surface one is the connecting surface (10), and the target surface two is the laying surface; at least one end of the laying surface is connected with the side surface of the substrate (1) where the locking tongue (11) or the locking groove (12) is arranged, and a chamfer (100) or a transition arc is arranged.

12. The composite floorboard of claim 11, wherein: The end of the locking tongue (11) away from the substrate (1) is arc-shaped.

13. The composite floorboard of claim 7, wherein: The substrate (1) is a target surface skin full foaming vinyl substrate, and the modulus of rupture of the substrate (1) is greater than 20 MPa.

14. The composite floorboard of claim 13, wherein: The thickness center line of the locking tongue (11) and the locking groove (12) deviates from the thickness center line of the substrate (1) by less than 20% of the total thickness of the substrate (1), and the thickness of the locking tongue (11) and the locking groove (12) accounts for 30%-60% of the thickness of the substrate (1).

15. The composite floorboard of claim 13, wherein: The protruding width of the locking tongue (11) and the depth of the recess of the locking groove (12) are 3-8 mm.

Images