Visual inspection device for eight-inch epitaxial silicon wafer

By designing a silicon wafer inspection device that includes an inspection stage, a visual inspection stage, and a robotic arm, the problem of unstable clamping during visual inspection of 8-inch epitaxial silicon wafers was solved, enabling all-round, multi-angle display of silicon wafers, reducing the risk of silicon wafer scratches, and improving inspection accuracy.

CN224052001UActive Publication Date: 2026-03-27MCL ELECTRONICS MATERIALS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-27
Publication Date
2026-03-27

AI Technical Summary

Technical Problem

In visual inspection of 8-inch epitaxial silicon wafers, the traditional tweezers gripping method leads to unstable holding, which can easily cause the silicon wafer to be scratched and fall off, and the operation is difficult for the inspectors.

Method used

The device employs a visual inspection system, which includes an inspection table, a visual inspection table, a silicon wafer holder, and a robotic arm. The robotic arm is used to transfer the silicon wafers, and the combination of a tilting plate and a turntable enables the silicon wafers to be displayed from all angles, reducing the risk of unstable clamping.

Benefits of technology

This effectively prevents silicon wafers from being scratched or falling off during transport, improving the accuracy of testing and the convenience of operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The visual inspection detection device comprises a detection table, and a visual inspection table, a first silicon wafer rack, a second silicon wafer rack and a mechanical arm which are arranged on the detection table, the first silicon wafer frame is used for containing silicon wafers to be detected, the second silicon wafer frame is used for containing detected silicon wafers, and the mechanical arm is used for placing the silicon wafers to be detected on the first silicon wafer frame on the visual inspection table and placing the detected silicon wafers on the visual inspection table on the second silicon wafer frame; the visual inspection table comprises a pitching disc and a rotary disc, the pitching disc is hinged to the visual inspection table and can swing back and forth in a pitching mode under the driving of external force, the rotary disc is rotationally arranged on the pitching disc and can rotate under the driving of the external force, and a wafer groove used for containing a silicon wafer is formed in the rotary disc. According to the utility model, visual inspection of detection personnel is facilitated, and the risk of silicon wafer scratch is reduced.
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Description

Technical Field

[0001] This utility model relates to the field of epitaxial silicon wafer inspection technology, specifically to a visual inspection device for eight-inch epitaxial silicon wafers. Background Technology

[0002] After the epitaxial growth process of silicon wafers, visual inspection is required to detect defects. For small silicon wafers such as two-inch wafers, inspectors can simply use tweezers to hold the wafer under an inspection lamp for observation. However, because the area of ​​a silicon wafer increases with the square of its size (e.g., a twelve-inch wafer is 2.25 times the area of ​​an eight-inch wafer), a single lithography and process step can produce more chips. The existing silicon wafer standards have evolved from two-inch and four-inch to eight-inch, twelve-inch (and even eighteen-inch in the future), a natural result of the semiconductor industry's pursuit of cost reduction, efficiency improvement, and technological upgrading.

[0003] In visual inspection of large-sized silicon wafers such as eight-inch wafers, due to their large size and weight, using tweezers to handle them for visual inspection will undoubtedly lead to unstable holding or scratches on the surface of the silicon wafer by the tweezers, which puts forward higher skill requirements for the inspectors. Utility Model Content

[0004] The present invention aims to provide a visual inspection device for eight-inch epitaxial silicon wafers, which facilitates visual inspection by inspectors and reduces the risk of scratches on the silicon wafers.

[0005] To solve the above technical problems, the specific solution adopted by this utility model is as follows: a visual inspection device for eight-inch epitaxial silicon wafers, including an inspection table and a visual inspection table, a first silicon wafer holder, a second silicon wafer holder, and a robotic arm disposed on the inspection table; the first silicon wafer holder is used to hold silicon wafers to be inspected, the second silicon wafer holder is used to hold silicon wafers after inspection, and the robotic arm is used to place the silicon wafers to be inspected on the first silicon wafer holder onto the visual inspection table and place the silicon wafers after inspection on the visual inspection table onto the second silicon wafer holder; the visual inspection table includes a tilting plate and a turntable, the tilting plate is hinged to the visual inspection table and can tilt back and forth under external force, the turntable is rotatably disposed on the tilting plate and can rotate under external force, and a wafer slot for placing silicon wafers is opened on the turntable.

[0006] Preferably, the bottom of the turntable is provided with vertically distributed rotating cylinders, and the tilting plate is provided with a central hole for rotational insertion and rotational engagement.

[0007] Preferably, the bottom of the tilting plate is provided with a rotating shaft distributed in the horizontal direction, and the rotating shaft is rotatably engaged with a bearing fixed on the inspection table.

[0008] Preferably, a torsion spring is fitted on the rotating shaft to maintain the horizontal distribution of the turntable.

[0009] Preferably, the outer diameter of the rotating disc is larger than that of the tilting disc, and the outer edge of the rotating disc forms a holding portion for a person to hold and rotate the rotating disc, and one side of the tilting disc is provided with a handle for a person to push the tilting disc to tilt and swing, and the outer end of the handle is distributed beyond the outer edge of the rotating disc.

[0010] Preferably, the second wafer rack is used for containing the post-inspection wafers that pass the visual inspection, and the visual inspection device further comprises a third wafer rack used for containing the post-inspection wafers that fail the visual inspection.

[0011] Preferably, the mechanical arm comprises a vertical telescopic rod fixed at the bottom of the visual inspection table, a horizontal telescopic rod fixed at one end of the vertical telescopic rod, and a suction disc fixed at the other end of the horizontal telescopic rod, and a driving assembly is arranged at the upper end of the vertical telescopic rod and used for driving the horizontal telescopic rod to rotate around the vertical telescopic rod as the center; the first wafer rack and the second wafer rack each comprise a vertical plate and a plurality of U-shaped horizontal plates fixed at the vertical plate in a vertical direction, and the U-shaped horizontal plates have U-shaped grooves for the suction disc to pass through.

[0012] Preferably, the first wafer rack, the second wafer rack and the visual inspection table are distributed in a ring shape around the vertical telescopic rod as the center.

[0013] Preferably, the visual inspection table is provided with positioning grooves for positioning and cooperating with the first wafer rack and the second wafer rack.

[0014] The visual inspection device has a visual inspection table, a mechanical arm, a first wafer rack used for containing wafers to be inspected, and a second wafer rack used for containing post-inspection wafers, the mechanical arm can sequentially send the wafers from the first wafer rack to the visual inspection table, and then place the post-inspection wafers on the visual inspection table into the second wafer rack, thereby replacing the step of using tweezers to clamp and transport the wafers in the traditional visual inspection method, and effectively avoiding the dropping and cracking caused by unstable clamping or the wafer scratching caused by excessive clamping force during the transportation.

[0015] The visual inspection table has a tilting disc and a rotating disc, after the wafer is placed in a wafer groove arranged on the rotating disc, the detection personnel can tilt and swing the tilting disc by pushing and pulling it with one hand, and rotate the rotating disc by rotating it with the other hand, not only avoiding the unstable clamping and dropping or scratching that may occur in the visual inspection by using tweezers, but also being able to display the wafer to the detection personnel in a full range and multiple angles, thereby improving the detection accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a structural schematic view of the front view of the visual inspection device;

[0017] Figure 2 It is a structural schematic view of the top view of the visual inspection device;

[0018] Marked in the figure: 1, the first silicon wafer rack, 101, the vertical plate, 102, the U-shaped transverse plate, 2, the visual inspection table, 201, the handle, 202, the shaft seat, 203, the tilting disc, 204, the rotating shaft, 205, the central hole, 206, the wafer slot, 207, the rotating drum, 208, the rotating disc, 209, the bulging ring, 3, the detection table, 4, the second silicon wafer rack, 5, the mechanical arm, 501, the vertical telescopic rod, 502, the horizontal telescopic rod, 503, the suction cup, 6, the silicon wafer, 7, the third silicon wafer rack. DETAILED DESCRIPTION

[0019] As shown in Figure 1 and Figure 2 The utility model discloses a eight inch epitaxial silicon wafer's visual inspection detection device, including detection table 3 and setting on detection table 3 visual inspection table 2, first silicon wafer rack 1, second silicon wafer rack 4, third silicon wafer rack 7 and mechanical arm 5. Detection table 3 horizontal distribution, visual inspection table 2, first silicon wafer rack 1, second silicon wafer rack 4 and third silicon wafer rack 7 with mechanical arm 5 as the center ring distribution. Visual inspection table 2 has the wafer slot 206 of placing the silicon wafer 6 of being detected, and the visual inspection of the silicon wafer 6 is completed by the detection personnel after being placed in the wafer slot 206. First silicon wafer rack 1 is used for the centralized placement of the silicon wafer 6 to be detected, second silicon wafer rack 4 is used for the centralized placement of the silicon wafer 6 after detection, and third silicon wafer rack 7 is used for the centralized placement of the silicon wafer 6 after detection. The mechanical arm 5 is used for placing the silicon wafer 6 to be detected in the wafer slot 206, and placing the silicon wafer 6 after detection on the second silicon wafer rack 4 or the third silicon wafer rack 7.

[0020] Visual inspection table 2 includes tilting disc 203 and rotating disc 208 arranged in sequence from bottom to top. The bottom of the left and right sides of tilting disc 203 is respectively provided with a protrusion, a rotating shaft 204 distributed along the horizontal direction is penetrated through the protrusion, and the two rotating shafts 204 on the left and right sides are concentrically distributed. The position corresponding to the rotating shaft 204 on the detection table 3 is respectively provided with a shaft seat 202, and the shaft seat 202 is used for rotating cooperation with the rotating shaft 204 at the corresponding position to hingedly connect the tilting disc 203 on the detection table 3. In order to facilitate the operation of the detection personnel, a handle 201 is connected to the left side of the tilting disc 203, and the detection personnel can hold the handle 201 and push and pull forward and backward, so that the tilting disc 203 swings up and down along the front and back directions.

[0021] The bottom of the rotating disc 208 is concentrically fixed with a rotating drum 207, and the lower end of the rotating drum 207 is rotationally connected with a central hole 205 opened on the tilting disc 203 through a bearing, so that the rotating disc 208 can rotate around the rotating drum 207 under the driving action of external force. In order to facilitate the operation of the detection personnel, the outer edge of the rotating disc 208 is provided with a bulging ring 209, so that the detection personnel can conveniently hold and rotate the rotating disc 208.

[0022] Based on the above objective inspection platform 2 structure, the detection personnel can hold the handle 201 with the left hand, hold the bulging ring 209 with the right hand, continuously swing and rotate the wafer 6 through the cooperation of both hands, and realize omnidirectional multi-angle visual inspection of the epitaxial surface of the wafer 6. It should be pointed out that, in order to avoid interference, the handle 201 should be arranged outside the outer edge of the turntable 208.

[0023] The first wafer rack 1, the second wafer rack 4 and the third wafer rack 7 in the utility model have the same structure, and only the first wafer rack 1 will be described below. The first wafer rack 1 comprises a vertical plate 101 and a plurality of U-shaped horizontal plates 102. The lower end of the vertical plate 101 is connected with a seat plate to be stably placed on the detection platform 3. In order to facilitate the positioning and placement of the first wafer rack 1 on the detection platform 3, so that the mechanical arm 5 can accurately transfer the wafer 6 from the first wafer rack 1, the utility model is provided with a positioning groove on the detection platform 3 for the clamping cooperation of the lower end of the vertical plate 101 and the seat plate. A plurality of U-shaped horizontal plates 102 are uniformly and vertically spaced on the same side of the vertical plate 101 to support the wafer 6. The U-shaped horizontal plate 102 has a U-shaped groove, so that the mechanical arm 5 can take out the wafer 6 on the first wafer rack 1 from top to bottom in sequence.

[0024] The mechanical arm 5 mainly comprises a vertical telescopic rod 501 and a horizontal telescopic rod 502. The lower end of the vertical telescopic rod 501 is fixed to the detection platform 3, one end of the horizontal telescopic rod 502 is rotatably arranged at the upper end of the vertical telescopic rod 501, and a driving assembly for driving the rotation of the horizontal telescopic rod 502 is arranged at the upper end of the vertical telescopic rod 501. The driving assembly can be a servo motor or other conventional driving mode in the art. The bottom of the end of the horizontal telescopic rod 502 away from the vertical telescopic rod 501 is provided with a suction cup 503, the suction cup 503 is connected with a negative pressure device (not shown in the figure) through a pipeline, and can adsorb the wafer 6 and transfer the wafer 6 on the first wafer rack 1, the visual inspection platform 2, the second wafer rack 4 and the third wafer rack 7 by the telescopic cooperation of the vertical telescopic rod 501 and the horizontal telescopic rod 502 and the rotary cooperation of the driving assembly. In order to facilitate the transfer of the wafer 6, a torsional spring is sleeved on the above-mentioned rotating shaft 204, and the torsional spring keeps the tilting disc 203 and the rotating disc 208 in a horizontal state without external force applied by the detection personnel to the tilting disc 203 and the rotating disc 208.

Claims

1. A visual inspection device for eight-inch epitaxial silicon wafers, characterized in that: The utility model relates to a silicon wafer detection device, including detection platform (3) and the setting on detection platform (3) visual inspection platform (2), first silicon wafer rack (1), second silicon wafer rack (4) and mechanical arm (5), first silicon wafer rack (1) is used to hold the silicon wafer (6) of detection, second silicon wafer rack (4) is used to hold the silicon wafer (6) of detection, and mechanical arm (5) is used to place the silicon wafer (6) of first silicon wafer rack (1) on visual inspection platform (2) and place the silicon wafer (6) of detection on visual inspection platform (2) on second silicon wafer rack (4), visual inspection platform (2) includes tilt plate (203) and turntable (208), tilt plate (203) is hingedly connected on visual inspection platform (2) and can swing back and forth under the drive of external force, and turntable (208) is rotatably arranged on tilt plate (203) and can rotate under the drive of external force, and the wafer slot (206) for placing the silicon wafer (6) is formed on turntable (208).

2. An apparatus for visual inspection of eight inch epitaxial silicon wafers as claimed in claim 1 wherein: The bottom of the turntable (208) is provided with a rotating cylinder (207) distributed vertically, and the tilt plate (203) is provided with a central hole (205) for rotating insertion and rotating cooperation.

3. An apparatus for visual inspection of eight inch epitaxial silicon wafers as recited in claim 1, wherein: The bottom of the tilt plate (203) is provided with a rotating shaft (204) distributed horizontally, and the rotating shaft (204) is in rotating cooperation with a shaft seat (202) fixed on the visual inspection platform (2).

4. An apparatus for visual inspection of eight inch epitaxial silicon wafers as recited in claim 3, wherein: A torsion spring is sleeved on the rotating shaft (204) for maintaining the horizontal distribution of the turntable (208).

5. The visual inspection device for an eight-inch epitaxial silicon wafer as described in claim 1, characterized in that: The outer diameter of the turntable (208) is greater than the outer diameter of the tilt plate (203), and the outer edge of the turntable (208) forms a holding portion for a person to hold and rotate the turntable (208), and one side of the tilt plate (203) is provided with a handle (201) for a person to push the tilt plate (203) to swing back and forth, and the outer end of the handle (201) is distributed beyond the outer edge of the turntable (208).

6. An apparatus for visual inspection of eight inch epitaxial silicon wafers as recited in claim 1, further comprising: The second silicon wafer rack (4) is used to hold the silicon wafer (6) after detection, and a third silicon wafer rack (7) is further included, and the third silicon wafer rack (7) is used to hold the silicon wafer (6) after detection which is not qualified for visual inspection.

7. An apparatus for visual inspection of an eight inch epitaxial silicon wafer as recited in claim 1, further comprising: The mechanical arm (5) includes a vertical telescopic rod (501) fixed on the visual inspection platform (2), a horizontal telescopic rod (502) fixed at one end of the vertical telescopic rod (501), and a suction cup (503) fixed at the other end of the horizontal telescopic rod (502), and a driving assembly is arranged at the upper end of the vertical telescopic rod (501) for driving the horizontal telescopic rod (502) to rotate around the vertical telescopic rod (501) as the center, the first silicon wafer rack (1) and the second silicon wafer rack (4) each include a vertical plate (101) and a plurality of U-shaped horizontal plates (102) fixed on the vertical plate (101) in a vertical direction, and the U-shaped horizontal plate (102) has a U-shaped groove for the suction cup (503) to pass through.

8. An apparatus for visual inspection of an eight inch epitaxial silicon wafer as set forth in claim 7, further comprising: The first silicon wafer rack (1), the second silicon wafer rack (4), and the visual inspection platform (2) are distributed in a ring shape around the vertical telescopic rod (501) as the center.

9. An apparatus for visual inspection of eight inch epitaxial silicon wafers as recited in claim 1, wherein: A positioning groove is arranged on the visual inspection platform (2) for positioning and cooperation of the first silicon wafer rack (1) and the second silicon wafer rack (4).