Chip test fixture and chip test equipment

Abstract

The utility model provides a chip test fixture and chip test equipment, and relates to the technical field of chip test. The base assembly of the test seat is provided with the bottom plate and the flow guide module, and the flow guide module penetrates through the bottom plate and is connected with the bottom plate. One end of the switching probe is used for being connected with a testing machine, the other end of the switching probe is used for being connected with the flow guide module, a tested chip is placed in the testing seat, the testing seat is provided with a testing module which is in contact with the top of the tested chip and the top of the flow guide module, and the testing seat can move towards the switching probe under external acting force. And the bottom of the diversion module is contacted with the switching probe, so that the test seat is electrically connected with the test machine. According to the technical scheme, the mode that the diversion module is in contact with the switching probe is adopted, the circuit length during chip testing is effectively shortened, stray inductance in a testing loop is reduced, and the chip testing performance is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip testing technical field, especially a kind of chip testing fixture and chip testing equipment. BACKGROUND

[0002] Before chip packaging, unencapsulated chip (bare die) is tested, to avoid the waste and quality risk caused by packaging bare die with quality problems, and this test technology is KGD (Know Good Die) technology. In the test process, test seat is needed, which connects the circuit of chip and test machine to test the chip. The test seat that can be used in automatic equipment is divided into two parts, including the bearing part for fixing the chip and the probe plate part for installing the probe, and the two parts are buckled, and the chip and the test machine are connected by probe and flat cable for testing.

[0003] In the KGD test process, the stray inductance of the test system is inevitable, and the size of the stray inductance is related to the length of the circuit from the probe seat to the test machine. The shorter the line, the smaller the stray inductance. SUMMARY

[0004] One object of the utility model is to provide a chip testing fixture to solve the technical problem of large stray inductance in the chip testing process of the prior art.

[0005] A further object of the utility model is to improve the efficiency and convenience of replacing the test seat.

[0006] Another object of the utility model is to provide a chip testing device with a chip testing fixture.

[0007] In particular, the utility model provides a chip testing fixture for electrical connection with a test machine, which comprises:

[0008] The test seat comprises a base assembly having a bottom plate and a flow guide module, and the flow guide module penetrates through the bottom plate and is connected with the bottom plate.

[0009] The adapter probe has one end for connecting with the test machine and the other end for connecting with the flow guide module.

[0010] The test seat has a test module for cooperating with the tested chip and the flow guide module, and under external force, the test seat can move towards the adapter probe, so that the bottom of the flow guide module contacts with the adapter probe, thereby electrically connecting the test seat with the test machine.

[0011] Optionally, it further comprises:

[0012] a floating assembly, detachably connected with the base assembly, the floating assembly being arranged to be telescopic along the moving direction of the test seat.

[0013] Optionally, the floating assembly comprises:

[0014] a fixed plate;

[0015] a floating plate, located above the fixed plate and connected with the base assembly;

[0016] at least one elastic member, one end of which is connected with the floating plate and the other end of which is connected with the fixed plate, the elastic member being arranged to drive the floating plate to reset when the external force applied on the test seat is removed.

[0017] Optionally, the floating assembly further comprises:

[0018] at least one sliding component, the floating plate being in sliding cooperation with the sliding component.

[0019] Optionally, the test seat further comprises:

[0020] a quick-change assembly, comprising a first quick-change member installed at the bottom of the test seat and a second quick-change member installed at the top of the floating assembly, the first quick-change member and the second quick-change member having a connected state and a separated state.

[0021] Optionally, the base assembly has a carrier for placing the chip to be tested, and the test seat further comprises:

[0022] a cover assembly, rotationally connected with the base assembly and having the test module, the cover assembly being capable of rotating relative to the base assembly to a closed state under the external force, so that the test module can be in contact with the chip to be tested and the flow guide module respectively.

[0023] Optionally, the test module comprises:

[0024] a second PCB board;

[0025] a probe board, provided with test probes and flow guide probes and connected with the second PCB board, the test probes being in contact with the chip to be tested and the flow guide probes being in contact with the flow guide module when the cover assembly is closed with the base assembly.

[0026] Optionally, the base assembly further comprises:

[0027] a heating component, arranged between the bottom plate and the carrier and used for heating the chip to be tested.

[0028] Optionally, the bottom plate further comprises a protective gas interface, a vacuum interface, a protective gas channel connected with the protective gas interface, and a vacuum channel connected with the vacuum interface, the vacuum channel being used for adsorbing the chip under test, and the protective gas channel being used for inputting protective gas into the test seat.

[0029] In particular, the utility model further provides a chip testing device, including:

[0030] The test machine has a first PCB board.

[0031] The chip testing fixture is as above;

[0032] One end of the adapter probe is used for connecting with the test machine, and the other end of the adapter probe is used for connecting with the flow guide module.

[0033] The base assembly of the test seat has a bottom plate and a flow guide module, the flow guide module penetrates through the bottom plate and is connected with the bottom plate. One end of the adapter probe is used for connecting with the test machine, and the other end of the adapter probe is used for connecting with the flow guide module. The chip under test is placed in the test seat and has a test module which is in contact with the top of the chip under test and the top of the flow guide module. Under the action of external force, the test seat can move towards the adapter probe, so that the bottom of the flow guide module is in contact with the adapter probe, thereby realizing the electrical connection between the test seat and the test machine. The above technical scheme adopts the mode that the flow guide module is in contact with the adapter probe, effectively shortens the circuit length during chip testing, reduces the stray inductance in the test circuit, and improves the chip testing performance.

[0034] Further, the chip testing fixture further comprises a quick-change assembly, the quick-change assembly comprises a first quick-change piece installed at the bottom of the test seat and a second quick-change piece installed at the top of the floating assembly, and the first quick-change piece and the second quick-change piece have a connected state of mutual cooperation and a separated state of mutual separation. The above technical scheme can improve the efficiency and convenience of replacing the test seat by installing the quick-change assembly between the floating assembly and the test seat.

[0035] The above and other objects, advantages and features of the present utility model will become more apparent from the following detailed description of some embodiments thereof, when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0036] Some specific embodiments of the present utility model will be described in detail hereinafter with reference to the accompanying drawings in an exemplary and non-limiting manner. The same reference signs in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0037] Figure 1 is a schematic structural view of a chip testing fixture according to one embodiment of the present utility model;

[0038] Figure 2 is Figure 1 a schematic structural view of a test seat of a chip test fixture shown in

[0039] Figure 3 a schematic structural view of a chip test fixture and a conversion probe according to an embodiment of the present application;

[0040] Figure 4 is Figure 1 a schematic structural view of a floating assembly of a chip test fixture shown in

[0041] Figure 5 is Figure 2 a schematic structural view of a heating component in a base assembly shown in

[0042] Reference signs:

[0043] 100-chip test fixture, 200-first PCB board, 10-test seat, 20-base assembly, 30-cover plate assembly, 40-floating assembly, 50-fast replacement assembly, 60-conversion probe, 21-bottom plate, 22-flow guide module, 23-carriage, 24-buckle, 25-vacuum interface, 26-protective gas interface, 27-heating component, 271-heating sheet, 31-test module, 311-second PCB board, 312-probe board, 313-test probe, 314-flow guide probe, 41-floating plate, 42-fixing plate, 43-sliding component, 44-elastic member, 45-first limiting block, 46-second limiting block, 47-first mounting member, 48-second mounting member, 49-stand column, 471-protruding rod, 481-groove, 51-first fast replacement member, 52-second fast replacement member. DETAILED DESCRIPTION

[0044] The embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0045] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0046] The terms "first", "second", "third", etc. are used only for descriptive purposes and should not be construed as implying or suggesting relative importance or an indicated number of technical features. Thus, features defined with "first", "second", etc. can explicitly or implicitly include at least one of the features, i.e. one or more of the features. In the description of the present application, "a plurality of" means at least two, for example two, three, etc., unless otherwise explicitly specified. When a certain feature "includes or contains" a certain feature or features, unless otherwise specifically described, it indicates that other features are not excluded and other features can be further included.

[0047] Unless otherwise explicitly specified and limited, the terms "connection", "installation", etc. should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through an intermediate medium; it can be internal communication of two elements or interaction relationship between two elements, unless otherwise explicitly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in the present application according to the specific circumstances.

[0048] Unless otherwise limited, all terms (including technical terms and scientific terms) used in the description of the embodiments have the same meaning as generally understood by those skilled in the art to which the present application belongs.

[0049] Figure 1 is a schematic structural diagram of a chip test fixture 100 according to an embodiment of the present application, Figure 2 is Figure 1 is a schematic structural diagram of a test seat 10 of the chip test fixture 100 shown in Figure 3 is a schematic structural diagram of a chip test fixture 100 and a conversion probe 60 according to an embodiment of the present application, wherein the arrow direction is the current direction.

[0050] As Figures 1 to 3 shown, in a specific embodiment, the chip test fixture 100 is used for electrical connection with a test machine, the chip test fixture 100 includes a test seat 10 and a conversion probe 60, the test seat 10 includes a base assembly 20, the base assembly 20 has a bottom plate 21 and a flow guide module 22, the flow guide module 22 penetrates through the bottom plate 21 and is connected with the bottom plate 21; one end of the conversion probe 60 is used for connection with the test machine, the other end of the conversion probe 60 is used for connection with the flow guide module 22; a measured chip is placed in the test seat 10, and the test seat 10 has a test module 31 used for cooperation with the measured chip and the flow guide module 22, under external force, the test seat 10 can move towards the conversion probe 60, so that the bottom of the flow guide module 22 is in contact with the conversion probe 60, thereby the test seat 10 is electrically connected with the test machine.

[0051] Specifically, the test seat 10 is arranged above the adapter probe 60. Under the action of an external force, the test seat 10 moves downward towards the adapter probe 60, so that the bottom of the flow guide module 22 is in contact with the adapter probe 60, thereby realizing the electrical connection between the test seat 10 and the test machine.

[0052] In this embodiment, the flow guide module 22 is in contact with the adapter probe 60, which effectively shortens the circuit length during chip testing, reduces the stray inductance in the test circuit, and improves the chip testing performance. Compared with the conventional FPC connection mode, about 5nH can be reduced. Since the stray inductance of the entire test circuit is usually controlled to be 40nH, the improvement rate is about 12%.

[0053] In some embodiments, the top of the test seat 10 is provided with a driving device. The driving device drives the test seat 10 to move downward, so that the flow guide module 22 of the test seat 10 is in contact with the adapter probe 60, thereby realizing the electrical connection between the test seat 10 and the test machine. First, the test seat 10 is clamped at the clamping station. After clamping, the test seat 10 is moved to the test station. The driving device is arranged at the test station. When the test seat 10 moves to the test station, the driving device drives the test seat 10 to move downward as a whole, so that the flow guide module 22 is in contact with the adapter probe 60.

[0054] Figure 4 is Figure 1 a schematic structural view of the floating assembly 40 of the chip testing fixture 100. As Figure 4 shown, and referring to Figure 1 In some embodiments, the chip testing fixture 100 further comprises a floating assembly 40. The floating assembly 40 is arranged to be detachably connected with the base assembly 20 and is arranged to be telescopic along the moving direction of the test seat 10.

[0055] In some embodiments, the floating assembly 40 is arranged below the base assembly 20. Under the action of the floating assembly 40, the test seat 10 can move up and down more stably.

[0056] In some embodiments, the floating assembly 40 comprises a fixed plate 42, a floating plate 41 and at least one elastic member 44. One end of the elastic member 44 is connected with the floating plate 41, and the other end is connected with the fixed plate 42. The elastic member 44 is arranged to drive the floating plate 41 to reset when the external force acting on the test seat 10 is removed. That is, when the tested chip is completed, the test seat 10 is automatically reset through the elastic member 44, so that the test seat 10 is separated from the adapter probe 60 and can be moved to the next station. In this embodiment, the number of elastic members 44 is two, and the two elastic members 44 are arranged in a spaced manner. In other embodiments, the number of elastic members 44 can also be determined according to specific design requirements.

[0057] In some embodiments, the floating assembly 40 further comprises at least one sliding component 43, and the floating plate 41 is in sliding cooperation with the sliding assembly 43.

[0058] Specifically, the floating plate 41 is located above the fixed plate 42 and connected with the base assembly 20. Each sliding component 43 is connected with the floating plate 41 and the fixed plate 42 and arranged to guide the floating plate 41 when the test socket 10 is subjected to a downward force. In this embodiment, the number of sliding components 43 is two, and the two sliding components 43 are arranged on both sides of the fixed plate 42, which can improve the stability of the floating plate 41 during movement. In other embodiments, the number of sliding components 43 can also be determined according to specific design requirements.

[0059] In some embodiments, the floating assembly 40 further comprises a column 49, at least one first limiting block 45 and at least one second limiting block 46, and the first limiting block 45 and the second limiting block 46 are arranged one by one. The column 49 is arranged vertically, and the first limiting block 45 and the second limiting block 46 are both mounted on the column 49. The first limiting block 45 is arranged above the floating plate 41, and the second limiting block 46 is arranged below the floating plate 41 to limit the floating plate 41. The distance between the first limiting block 45 and the second limiting block 46 is the distance that the floating plate 41 can move in the vertical direction, which avoids the situation that the floating plate 41 moves too far and causes the adapter probe 60 to be damaged by the flow guide module 22.

[0060] In some embodiments, the number of first limiting blocks 45 and second limiting blocks 46 is two, and the two first limiting blocks 45 are arranged on opposite sides of the floating plate 41, and the two second limiting blocks 46 are arranged below the two first limiting blocks 45.

[0061] In some embodiments, the floating assembly 40 further comprises a sensor, and the sensor comprises a first mounting member 47 and a second mounting member 48. The first mounting member 47 is mounted on the floating plate 41, and the second mounting member 48 is mounted on the fixed plate 42. The first mounting member 47 has a protruding rod 471, and the second mounting member 48 has a recess 481. When the floating plate 41 moves downward to a preset distance where the protruding rod 471 extends into the recess 481, the sensor will generate a disconnection signal and transmit it to the driving device located at the top of the test socket 10, and the driving device will stop moving downward, which avoids the situation that the floating plate 41 moves too far and causes the adapter probe 60 to be damaged by the flow guide module 22.

[0062] This embodiment not only limits the movement distance of the floating plate 41 by physical components, but also limits the movement distance of the floating plate 41 by sensors, which is a double limiting process. This can effectively control the movement distance of the floating plate 41, thereby avoiding the situation that the adapter probe 60 is damaged by the flow guide module 22.

[0063] In some embodiments, the chip testing fixture 100 further comprises a quick-change assembly 50, the quick-change assembly 50 comprising a first quick-change piece 51 mounted on the bottom of the testing seat 10 and a second quick-change piece 52 mounted on the top of the floating assembly 40, the first quick-change piece 51 and the second quick-change piece 52 having a connected state and a separated state. This embodiment can meet the requirement of quick replacement of the testing seat 10 damaged due to die explosion in the testing process by installing the quick-change assembly 50 between the floating assembly 40 and the testing seat 10, can improve the efficiency and convenience of replacement of the testing seat 10, and shorten the online processing time when the testing seat 10 is abnormal. Moreover, according to different chip designs, the testing seat 10 can be disassembled and assembled as a whole, which is convenient for replacement. Generally, the damage recovery of the testing seat 10 caused by testing requires operations such as confirming the state of the testing seat 10, polishing and cleaning the platform 23, and replacing the testing probe 313. Even if the spare parts are replaced offline by manual operation, at least 10 minutes are required. The testing seat 10 of this embodiment can automatically replace the entire testing seat 10, and the replacement time is within 1 minute, which greatly shortens the replacement time.

[0064] In some embodiments, the base assembly 20 has a platform 23 for placing the chip to be tested, and the chip testing seat 10 further comprises a cover plate assembly 30 rotationally connected with the base assembly 20 and having a testing module 31. Under the action of external force, the cover plate assembly 30 can rotate relative to the base assembly 20 to a closed state, so that the testing module 31 can be in contact with the chip to be tested and the flow guide module 22, respectively. It can be understood that the testing seat 10 in this embodiment is an L-shaped testing seat that can be closed, and the closing of the testing seat 10 is realized by rotation of the cover plate assembly 30. In addition, the cover plate assembly 30 is further provided with a positioning column, and the base assembly 20 is provided with a positioning sleeve. When closed, the positioning column of the cover plate assembly 30 is matched with the positioning sleeve of the base assembly 20 to ensure the contact precision of the testing probe 313 and the chip to be tested, and improve the accuracy of the buckling of the cover plate assembly 30 and the base assembly 20.

[0065] In some embodiments, the base assembly 20 is further provided with a buckle 24, and the cover plate assembly 30 is rotated relative to the base assembly 20 to be buckled with the buckle 24, thereby realizing the buckling of the cover plate assembly 30 and the base assembly 20, i.e. the closing of the testing seat 10. When it is necessary to open the cover plate assembly 30, the buckle 24 can be pressed downward to make the cover plate assembly 30 flip upwards, thereby unlocking the cover plate assembly 30 and the base assembly 20.

[0066] In some embodiments, the test module 31 comprises a second PCB board 311 and a probe board 312, the probe board 312 is connected with the second PCB board 311, the probe board 312 is provided with test probes 313 and flow guide probes 314, and both are connected with the second PCB board 311. When the cover assembly 30 is covered with the base assembly 20, the test probes 313 are in contact with the tested chip, and the flow guide probes 314 are in contact with the flow guide module 22. When the test seat 10 is lowered to make the bottom of the flow guide module 22 in contact with the adapter probe 60, a test path is formed, see Figure 3 the arrow direction.

[0067] Figure 5 is Figure 2 a schematic structural view of the heating component in the base assembly. As Figure 5 shown, in some embodiments, the base assembly 20 further comprises a heating component 27, which is arranged between the bottom plate 21 and the carrier 23, and is used for heating the tested chip. The heating component 27 comprises at least one heating sheet 271. In addition, the temperature control of the test seat 10 is crucial to the effectiveness of the chip test result. Therefore, the embodiment further comprises a thermocouple, through which the heating temperature of the heating sheet 27 can be detected in real time. In addition, the carrier 23 and the heating component 27 are designed separately, which can be quickly replaced and is convenient for maintenance. The test seat 10 of the embodiment supports normal temperature and high temperature tests.

[0068] In some embodiments, the bottom plate 21 further comprises a protective gas interface 26, a vacuum interface 25, a protective gas channel connected with the protective gas interface 26, and a vacuum channel connected with the vacuum interface 25, the vacuum channel is used for adsorbing the tested chip, and the protective gas channel is used for inputting protective gas into the test seat 10. The embodiment can fill protective gas into the test seat 10 through the protective gas interface 26 to protect the chip. The protective gas can be nitrogen, and can also be other inert gases. In addition, the embodiment can also perform vacuumization through the vacuum interface 25 to adsorb the tested chip and avoid the movement of the tested chip. The test seat 10 can perform the input of protective gas and the operation of vacuumizing the chip during the running to the test station, which can effectively reduce the beat of the test station and improve the test efficiency. The test seat 10 of the embodiment can save the protective gas pressurization time, and the vacuum on-off time is about 0.4s, which can improve the efficiency by more than 30% compared with the current ordinary 1s test time.

[0069] In some embodiments, the inside of the quick-change assembly 50 is provided with the connection of the circuit and the gas circuit, the protective gas channel and the vacuum channel on the test seat 10 are conducted through the quick-change assembly 50, and the quick-change assembly 50 can be unlocked and locked through compressed air, which is convenient for the requirement of quick replacement of the test seat 10 in abnormal conditions.

[0070] The embodiment also provides a chip testing device, which comprises a testing machine and the chip testing fixture 100 as described above. The adapter probe 60 of the chip testing fixture 100 is used to be connected with the first PCB board 200. Specifically, the adapter probe 60 is mounted on the first PCB board 200. The chip testing fixture 100 comprises the testing seat 10, which is arranged to move downward under external force, so that the bottom of the current guide module 22 of the testing seat 10 is in contact with the adapter probe 60, thereby making the testing seat 10 electrically connected with the testing machine. For the chip testing fixture 100, details are not described herein.

[0071] The chip testing fixture 100 of the embodiment can effectively reduce the stray inductance of the chip testing circuit, and has the functions of gas inflation and heating temperature, so that the effectiveness of the chip testing result can be effectively improved, and the chip testing fixture 100 can be used for high-speed testing equipment.

[0072] Up to now, those skilled in the art should recognize that, although the plurality of exemplary embodiments of the utility model have been shown and described in detail herein, many other variants or modifications conforming to the principles of the utility model can be directly determined or deduced according to the contents disclosed by the utility model without departing from the spirit and scope of the utility model. Therefore, the scope of the utility model should be understood and recognized as covering all these other variants or modifications.

Claims

1. A chip testing fixture for electrical connection with a testing machine, characterized by, The chip testing fixture comprises: a testing seat comprising a base assembly having a base plate and a flow guide module penetrating through and connected with the base plate; an adapter probe, one end of which is used to be connected with a testing machine, and the other end of which is used to be connected with the flow guide module; the testing seat is placed with a chip under test and has a testing module used to cooperate with the chip under test and the flow guide module, under external force, the testing seat can move towards the adapter probe, so that the bottom of the flow guide module is in contact with the adapter probe, thereby making the testing seat electrically connected with the testing machine.

2. The chip testing fixture of claim 1, wherein Further comprising: a floating assembly used to be detachably connected with the base assembly, the floating assembly is arranged to be telescopic along the moving direction of the testing seat.

3. The chip testing fixture of claim 2, wherein, The floating assembly comprises: a fixed plate; a floating plate above the fixed plate and connected with the base assembly; at least one elastic member, one end of which is connected with the floating plate, and the other end of which is connected with the fixed plate, the elastic member is arranged to drive the floating plate to reset when the external force applied on the testing seat is removed.

4. The chip testing fixture of claim 3, wherein The floating assembly further comprises: at least one sliding component, the floating plate is in sliding cooperation with the sliding component.

5. The chip testing fixture according to any one of claims 2-4, wherein, Further comprising: a quick-change assembly comprising a first quick-change member installed at the bottom of the testing seat and a second quick-change member installed at the top of the floating assembly, the first quick-change member and the second quick-change member have a connected state and a separated state.

6. The chip testing fixture according to any one of claims 1-4, wherein, The base assembly has a stage used to place the chip under test, and the chip testing seat further comprises: a cover plate assembly rotatably connected with the base assembly and having the testing module, under external force, the cover plate assembly can be rotated relative to the base assembly to a closed state, so that the testing module can be in contact with the chip under test and the flow guide module respectively.

7. The chip testing fixture of claim 6, wherein, The testing module comprises: a second PCB board; a probe plate provided with testing probes and flow guide probes and connected with the second PCB board; when the cover plate assembly is closed with the base assembly, the testing probes are in contact with the chip under test, and the flow guide probes are in contact with the flow guide module.

8. The chip testing fixture of claim 7, wherein, The base assembly further comprises: a heating component arranged between the base plate and the stage and used to heat the chip under test.

9. The chip testing fixture according to claim 7, wherein the base plate further comprises a protective gas interface, a vacuum interface, a protective gas channel connected with the protective gas interface, and a vacuum channel connected with the vacuum interface, the vacuum channel is used to adsorb the chip under test, and the protective gas channel is used to input protective gas into the testing seat.

10. A chip testing apparatus characterized by comprising: comprising: a testing machine having a first PCB board; the chip testing fixture according to any one of claims 1-9; the adapter probe of the chip testing fixture is used to be connected with the first PCB board.

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