Adjustable electrifying contact structure for manual test of semiconductor module

Abstract

The utility model provides an adjustable energizing contact structure for a manual test of a semiconductor module, and the structure comprises an adjustable support which is adjustable in position in a first direction and a second direction; the push-pull type clamp forceps device is arranged on the adjustable bracket; the movable frame is connected to the push-pull type clamp and is driven by the push-pull type clamp to move up and down; a plurality of electrode assemblies, wherein each electrode assembly comprises an electrode bearing table and an electrifying contact; an adjusting kidney-shaped hole extending in the first direction is formed in the electrode bearing table, the electrode bearing table is connected to the movable frame through a penetrating screw, and the electrifying contact moves downwards through downward movement of the movable frame so as to make contact with an electrode pin of a semiconductor module to be detected. The problems that in the prior art, in the electrifying process, electrode pins of semiconductor modules are clamped one by one, efficiency is low, and clamping mistakes are likely to happen are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor module detection, and more particularly to an adjustable power-on contact structure for manual testing of a semiconductor module. BACKGROUND

[0002] A power semiconductor module is a combination of certain functions and modes, and is a large power electronic power device that is encapsulated into one body according to certain functions. The power semiconductor module can realize different functions according to different encapsulated components, such as a semiconductor field effect transistor, an insulated gate bipolar transistor, and a power integrated circuit. The power semiconductor module has various shapes, and one commonly used module has conductive pins parallel to the bottom plate.

[0003] When the existing module test fixture measures the power semiconductor module, power supply is usually required for the semiconductor module, and two electrodes are usually provided at one end of the electrode pin, and four electrodes are provided at the other end. Therefore, when the operator manually operates, different electrode clamps are clamped on the multiple electrode pins of the semiconductor module, and the process of clamping the electrode pins of the semiconductor module one by one is not only low in efficiency, but also prone to clamping errors, resulting in low efficiency of the entire semiconductor module detection process.

[0004] Therefore, the prior art still needs to be improved and developed. CONTENT OF THE INVENTION

[0005] The present application aims to provide an adjustable power-on contact structure for manual testing of a semiconductor module, which solves the problem of low efficiency and easy clamping error in the process of clamping the electrode pins of the semiconductor module one by one in the power-on process of the prior art.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present application is:

[0007] The present application provides an adjustable power-on contact structure for manual testing of a semiconductor module, comprising: an adjustable support, the position of the adjustable support in a first direction and a second direction is adjustable;

[0008] A push-pull type clamp device is provided on the adjustable support;

[0009] A movable frame is connected to the push-pull type clamp device and moves up and down through the driving of the push-pull type clamp device;

[0010] A plurality of electrode assemblies, each of which comprises an electrode support platform and a power-on contact;

[0011] The adjusting waist-shaped hole is arranged on the electrode carrier platform and extends along the first direction, and the adjusting waist-shaped hole is connected to the movable frame through a screw; the power supply contact moves downward to contact the electrode pin of the semiconductor module to be detected through the downward movement of the movable frame.

[0012] In an optional embodiment, the electrode carrier platform comprises a carrier connecting plate, and the adjusting waist-shaped hole is arranged on the carrier connecting plate so that the carrier connecting plate is adjustably arranged on the movable frame.

[0013] The adjusting waist-shaped hole on the carrier connecting plate is arranged in two, and the two adjusting waist-shaped holes are arranged in the up-down direction.

[0014] In an optional embodiment, the movable frame is provided with a guide strip extending along the first direction.

[0015] The side of the carrier connecting plate facing the movable frame is provided with a guide groove, and the carrier connecting plate is sleeved on the guide strip and slides through the guide groove.

[0016] In an optional embodiment, the electrode carrier platform further comprises a carrier mounting plate, and the carrier mounting plate is arranged perpendicularly to the carrier connecting plate.

[0017] The power supply contact is provided with a connecting flange, the power supply contact penetrates the carrier mounting plate and the connecting flange is located below the carrier mounting plate, and the power supply contact is fixedly connected to the carrier mounting plate through the connecting flange.

[0018] In an optional embodiment, the adjustable support is provided with a guide rail in the up-down direction, the side of the movable frame away from the electrode assembly is provided with a sliding table, and the movable frame is matched with the guide rail through the sliding table and moves in the up-down direction.

[0019] In an optional embodiment, the adjustable support comprises a first adjusting seat, and the first adjusting seat is provided with a first waist-shaped hole extending along the first direction.

[0020] The second adjusting seat comprises a base horizontal plate and a base vertical plate, the base horizontal plate is provided with a second waist-shaped hole extending along the second direction, and the second adjusting seat is connected to the first adjusting seat through the screw penetrating the second waist-shaped hole.

[0021] The base vertical plate is arranged in the up-down direction, and the push-pull clamp device is located at the top of the base vertical plate.

[0022] In an optional embodiment, the top of the base vertical plate is provided with an upper support plate, and the upper support plate extends away from the base horizontal plate.

[0023] The push-pull clamp device is fixedly arranged on the upper support plate, and the pressing rod of the push-pull clamp device penetrates the upper support plate and connects the movable frame.

[0024] In an alternative embodiment, an insulating plate is arranged between the two live contacts to separate the two live contacts.

[0025] In an alternative embodiment, an empty window is arranged on the adjustable support;

[0026] A fixing block is arranged on the adjustable support, the fixing block protrudes towards one side of the electrode assembly through the empty window, and the insulating plate is fixed on the fixing block.

[0027] In an alternative embodiment, a wire connector is connected to the live contact, the wire connector extends towards the adjustable support and passes through the empty window.

[0028] The adjustable live contact structure for manual testing of a semiconductor module provided by the present application has at least the following beneficial effects: by arranging a push-pull clamp on the adjustable support, arranging a movable frame on the push-pull clamp, and arranging an electrode assembly on the movable frame. When it is necessary to connect the electrode pins of the semiconductor module, only the push-pull clamp needs to be pulled, the movable frame moves downward under the drive of the push-pull clamp, and the electrode assembly on the movable frame also moves downward, so that the live contact of the electrode assembly moves downward and presses on the electrode pin of the semiconductor module below, thereby realizing the butt joint and power supply to the electrode pin. In this way, multiple electrode pins of the semiconductor module can be powered by one operation, greatly improving the butt joint efficiency. Moreover, the position of the live contact on the electrode assembly is relatively fixed during the butt joint process, and can only be butt jointed to the correct electrode pin of the semiconductor module, so that misplacement does not occur. Moreover, the adjustment waist-shaped hole extending in the first direction is arranged on the electrode carrier, the relative position of the electrode carrier on the movable frame can be adjusted by adjusting the position of the adjustment waist-shaped hole and the screw, and then the relative position of the two electrode assemblies can be adjusted, so that the adjustable live contact structure can be adapted to power the semiconductor module with different distance electrode pins, thereby improving the versatility of the adjustable live contact structure. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0030] Figure 1 A structural schematic diagram of the adjustable live contact structure for manual testing of a semiconductor module provided by the present application;

[0031] Figure 2 An exploded view of the adjustable live contact structure for manual testing of a semiconductor module provided by the present application;

[0032] Figure 3 Another perspective view of the structure of the adjustable energizing contact structure of the manual test of the semiconductor module provided by the embodiment of the present application.

[0033] In the drawings, various elements are labeled the same as follows:

[0034] 100, adjustable support; 110, first adjusting seat; 111, first waist-shaped hole; 120, second adjusting seat; 121, base horizontal plate; 122, base vertical plate; 123, second waist-shaped hole; 124, upper support plate; 130, guide rail; 140, clearance window; 200, push-pull clamp device; 300, movable frame; 310, guide strip; 320, sliding table; 400, electrode assembly; 410, electrode bearing table; 411, adjusting waist-shaped hole; 412, bearing connecting plate; 413, guide groove; 414, bearing mounting plate; 420, energizing contact; 421, wire joint; 422, connecting flange; 500, insulating plate; 510, fixed block. DETAILED DESCRIPTION

[0035] In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0036] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly or indirectly on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component. The terms "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or position based on the orientation or position shown in the drawings, and are only for convenience of description, and cannot be understood as a limitation on the technical solutions. The terms "first", "second" are only for the purpose of convenient description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0037] As Figure 1 , Figure 2As shown, the embodiment proposes an adjustable energizing contact 420 structure for manual testing of a semiconductor module, specifically comprising: an adjustable support 100, a push-pull clamp 200, a movable frame 300, and two electrode assemblies 400. When testing the semiconductor module, the left-right direction is the first direction, and the front-back direction is the second direction. The adjustable support 100 is vertically arranged in the up-down direction, and the position of the adjustable support 100 in the first direction and the second direction is adjustable, so that the parts mounted on the adjustable support 100 can be adjusted in position in the horizontal plane. The push-pull clamp 200 is arranged on the adjustable support 100, the movable frame 300 is connected to the push-pull clamp 200 and moves up and down through the driving of the push-pull clamp 200, and the plurality of electrode assemblies 400 are arranged on the movable frame 300. When the movable frame 300 moves up and down, it drives the plurality of electrode assemblies 400 to move up and down synchronously. The electrode assembly 400 of the embodiment can be provided with two, and each electrode assembly 400 comprises an electrode carrier 410 and an energizing contact 420. When it is necessary to detect the semiconductor module below, the push-pull clamp 200 is pressed down to move the movable frame 300 downward, and the energizing contact 420 moves downward through the downward movement of the movable frame 300 to contact the electrode pins of the semiconductor module to be detected. Thus, a plurality of energizing contacts 420 can be simultaneously connected to a plurality of electrode pins on the semiconductor module, respectively, to achieve efficient energizing connection. The electrode carrier 410 is provided with an adjustment waist-shaped hole 411 extending in the first direction, and is connected to the movable frame 300 by screwing. The electrode carrier 410 is connected to the movable frame 300 by screwing through the adjustment waist-shaped hole 411, so that the left-right position of the electrode carrier 410 on the movable frame 300 is adjustable. Therefore, when the distance between the electrode pins of the semiconductor module is different, the distance between the two electrode carriers 410 can be adjusted, so that the distance between the energizing contacts 420 is adjusted to adapt to different models of semiconductor modules.

[0038] As Figure 1 , Figure 2As shown, the adjustable power contact 420 structure of the manual test of the semiconductor module of the embodiment is constructed by setting the push-pull clamp 200 on the adjustable support 100, setting the movable frame 300 on the push-pull clamp 200, and setting the electrode assembly 400 on the movable frame 300. When it is needed to connect the electrode pins of the semiconductor module, only the push-pull clamp 200 needs to be pulled, and the movable frame 300 is driven by the push-pull clamp 200 to move downward, so that the electrode assembly 400 on the movable frame 300 also moves downward, so that the power contact 420 of the electrode assembly 400 moves downward and presses on the electrode pin of the semiconductor module below, thereby realizing the butt joint of the electrode pin and the power supply thereof. Thus, the multiple electrode pins of the semiconductor module can be powered by one operation, greatly improving the butt joint efficiency. Moreover, the position of the power contact 420 on the electrode assembly 400 is relatively fixed during the butt joint process, and can only be butt joint to the correct electrode pin of the semiconductor module, and the clamping error cannot occur. Moreover, the adjustment waist-shaped hole 411 extending along the first direction is set on the electrode carrier 410, the relative position of the electrode carrier 410 on the movable frame 300 can be adjusted by adjusting the position of the adjustment waist-shaped hole 411 and the screw, and then the relative position of the two electrode assemblies 400 can be adjusted, so that the semiconductor module with different distance electrode pins can be powered, and the versatility of the adjustable power contact 420 structure is improved.

[0039] As shown in Figure 1 , Figure 2 Further, the electrode carrier 410 of the embodiment specifically comprises: a carrier connecting plate 412, the adjustment waist-shaped hole 411 is set on the carrier connecting plate 412, so that the carrier connecting plate 412 can be adjustably set on the movable frame 300. The back of the carrier connecting plate 412 is abutted on the movable frame 300 and is fixed by the screw threaded in the adjustment waist-shaped hole 411. The adjustment waist-shaped hole 411 on the carrier connecting plate 412 is provided with two adjustment waist-shaped holes 411, and the two adjustment waist-shaped holes 411 are arranged in the up-down direction. The movable frame 300 is provided with a threaded hole at the position corresponding to the adjustment waist-shaped hole 411, and the two adjustment waist-shaped holes 411 arranged in the up-down direction are connected by two screws in the up-down direction, so that the electrode carrier 410 is limited to move only in the left-right direction.

[0040] As shown in Figure 1 , Figure 2As shown, further, the movable frame 300 of the embodiment is provided with a guide strip 310 extending in the first direction; the guide strip 310 extends in the left-right direction as a whole, and the carrying connecting plate 412 is provided with a guide groove 413 towards one side of the movable frame 300, and the carrying connecting plate 412 is sleeved on the guide strip 310 to slide through the guide groove 413. The carrying connecting plates 412 of the plurality of electrode assemblies 400 are located on the left and right sides of the guide strip 310 and matched with the guide strip 310 through the guide grooves 413, so that when the positions of the electrode assemblies 400 are adjusted, the carrying connecting plates 412 can only move and adjust in the left-right direction, ensuring that the up-down position and the front-rear position of the carrying connecting plates 412 do not change during adjustment, facilitating the position adjustment of the electrode assemblies 400. In addition, a spacing block is protruded in the middle of the guide strip 310, the spacing block divides the guide strip 310 into left and right parts, and forms a step between the left and right parts, and the adjustment positions of the carrying connecting plates 412 on the left and right sides are separated through the spacing block, which is helpful for directly positioning the electrode assemblies 400 on the left and right sides and facilitating installation.

[0041] As shown in Figure 1 , Figure 2 , further, the electrode carrying table 410 of the embodiment further comprises a carrying mounting plate 414, which is arranged perpendicularly to the carrying connecting plate 412. The power supply contact 420 is provided with a connecting flange 422, the power supply contact 420 penetrates the carrying mounting plate 414 and makes the connecting flange 422 located below the carrying mounting plate 414, and the power supply contact 420 is fixedly connected to the carrying mounting plate 414 through the connecting flange 422. The carrying mounting plate 414 provides a mounting position for the power supply contact 420, and in the specific process, the carrying mounting plate 414 is arranged horizontally and extends towards the electrode assembly 400 on the other side by a predetermined length, and a through hole is formed on one end of the carrying mounting plate 414 towards the electrode assembly 400 on the other side, and the power supply contact 420 is inserted into the through hole from bottom to top, and can be stably fixed on the lower surface of the carrying mounting plate 414 through the connecting flange below.

[0042] As shown in Figure 1 , Figure 2 , further, the adjustable support 100 of the embodiment is provided with guide rails 130 in the up-down direction, and the movable frame 300 is provided with a sliding table 320 away from the electrode assembly 400, and the movable frame 300 is matched with the guide rails 130 through the sliding table 320 to move in the up-down direction. In the specific structure, two guide rails 130 are arranged in the left-right direction, and the sliding tables 320 are arranged on the left and right sides of the back of the movable frame 300, and the sliding tables 320 slide on the guide rails 130, so that the movable frame 300 can stably move up and down under the drive of the push-pull type clamp 200.

[0043] As shown in Figure 2 , Figure 3As shown, further, the adjustable support 100 of the embodiment specifically comprises: a first adjusting seat 110, a first waist-shaped hole 111 being formed in the first adjusting seat 110 and extending in a first direction, and a screw being threaded in the first waist-shaped hole 111 to connect the first adjusting seat 110 to a rack, so that the position of the first adjusting seat 110 on the rack can be adjusted in a left-right direction, and the plurality of electrode assemblies 400 can be synchronously adjusted in the left-right direction of the rack. The second adjusting seat 120 comprises a base horizontal plate 121 and a base vertical plate 122, the base horizontal plate 121 comprises a second waist-shaped hole 123 formed therein and extending in a second direction, and the base horizontal plate 121 is connected to the first adjusting seat 110 by threading a screw through the second waist-shaped hole 123; the base horizontal plate 121 is arranged on the first adjusting seat 110 in a horizontal direction through the second waist-shaped hole 123, so that the position of the second adjusting seat 120 on the first adjusting seat 110 can be adjusted in a front-rear direction, thereby realizing the synchronous adjustment of the positions of the plurality of electrode assemblies 400 in the front-rear direction. The base vertical plate 122 is arranged in an up-down direction, and the push-pull clamp 200 is located at the top of the base vertical plate 122. By arranging the push-pull clamp 200 at the top of the base vertical plate 122, the push-pull clamp 200 can drive the movable frame 300 to move in the up-down direction.

[0044] As shown in Figure 1 , Figure 2 , further, the top of the base vertical plate 122 of the embodiment is provided with an upper support plate 124 extending away from the base horizontal plate 121, and the push-pull clamp 200 is fixedly arranged on the upper support plate 124, and the pressing rod of the push-pull clamp 200 penetrates the upper support plate 124 to connect the movable frame 300. The push-pull clamp 200 of the embodiment can adopt a WDC36202M type push-pull clamp. The upper support plate 124 can stably support the push-pull clamp 200, and the movable frame 300 located below the upper support plate 124 can stably move up and down.

[0045] As shown in Figure 1 , Figure 2 , further, the two energized contacts 420 of the embodiment are provided with an insulating plate 500 to separate the two energized contacts 420. The plurality of (two) electrode assemblies 400 are separated by the insulating plate 500, avoiding mutual interference between the arcs of the respective energized contacts 420, and ensuring the stability and safety of electricity use.

[0046] As shown in Figure 2 , Figure 3As shown, further, the adjustable support 100 of the embodiment is provided with an empty window 140; the adjustable support 100 is provided with a fixing block 510, the fixing block 510 penetrates through the empty window 140 and protrudes towards one side of the electrode assembly 400, and the insulating plate 500 is fixed on the fixing block 510. In the specific structure, the adjustable support 100 is hollowed by the empty window, which can reduce the weight and save the cost while ensuring the structural strength of the adjustable support 100. In addition, the inner wall of the empty window 140 provides a mounting position for the fixing block 510, the fixing block 510 can extend a certain length in the front-rear direction and be mounted on the inner wall of the empty window 140, so that the fixing block 510 has sufficient support length and mounting position, ensuring the connection stability of the insulating plate 500.

[0047] As shown in Figure 2 , Figure 3 As shown, further, the power-on contact 420 of the embodiment is connected with a wire joint 421, the wire joint 421 extends towards the adjustable support 100 and penetrates through the empty window 140. The wire joint 421 penetrates through the empty window 140 to supply power for the power-on contact 420, the empty window 140 can limit multiple wire joints 421 in the empty window 140, avoiding the problem of disorder after wiring of the wire joint 421, optimizing the structure and also ensuring the safety of electricity use.

[0048] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An adjustable power contact structure for manual testing of a semiconductor module, characterized by The utility model provides a kind of adjustable support, adjustable support is adjustable in the position of first direction and second direction;Push-pull clamp ware is arranged on the adjustable support;Movable frame is connected on the push-pull clamp ware, and it is moved up and down by the drive of push-pull clamp ware;Multiple electrode assemblies, multiple electrode assemblies include electrode carrier platform and energized contact;The electrode carrier platform is opened in the first direction and is connected on the movable frame by the screw passing, and the energized contact is moved down to contact the electrode pin of the semiconductor module to be detected by the movable frame moving down. The electrode carrier platform includes: bearing connecting plate, the adjustment waist-shaped hole is arranged on bearing connecting plate, so that bearing connecting plate can be adjusted and arranged on the movable frame, The adjustment waist-shaped hole on the bearing connecting plate is provided with two, and the two adjustment waist-shaped holes are arranged in the up-down direction. The movable frame is provided with a guide bar in the first direction; The bearing connecting plate is opened with a guide groove towards one side of the movable frame, and the bearing connecting plate is sleeved on the guide bar and slides through the guide groove. The electrode carrier platform further includes: a bearing mounting plate, the bearing mounting plate is arranged perpendicular to the bearing connecting plate; 2. The manually testable, adjustable power contact structure for a semiconductor module of claim 1, wherein, The energized contact is provided with a connecting flange, the energized contact penetrates the bearing mounting plate and makes the connecting flange below the bearing mounting plate, and the energized contact is fixedly connected with the bearing mounting plate through the connecting flange. The adjustable support is provided with a guide rail in the up-down direction, and the movable frame is provided with a sliding table on the side away from the electrode assembly, and the movable frame is matched with the guide rail through the sliding table to move in the up-down direction.

3. The manually testable, adjustable power contact structure for a semiconductor module of claim 2, wherein, The adjustable support includes: a first adjusting seat, the first adjusting seat is opened with a first waist-shaped hole arranged in the first direction; A second adjusting seat includes a base horizontal plate and a base vertical plate, the base horizontal plate is opened with a second waist-shaped hole arranged in the second direction, and is connected on the first adjusting seat by screwing the second waist-shaped hole; 4. The manually testable, adjustable power contact structure for a semiconductor module of claim 2, wherein, The base vertical plate is arranged in the up-down direction, and the push-pull clamp ware is located at the top of the base vertical plate. The top of the base vertical plate is provided with an upper support plate, and the upper support plate extends towards the direction away from the base horizontal plate; 5. The manually testable, adjustable power contact structure for a semiconductor module of claim 1, wherein, The push-pull clamp ware is fixedly arranged on the upper support plate, and the push-pull clamp ware is connected with the movable frame by penetrating the upper support plate.

6. The manually testable, adjustable power contact structure for a semiconductor module of claim 1, wherein, An insulating plate is arranged between the two energized contacts to separate the two energized contacts. An empty window is opened on the adjustable support; A fixed block is arranged on the adjustable support, the fixed block penetrates the empty window and protrudes towards one side of the electrode assembly, and the insulating plate is fixed on the fixed block.

7. The manually testable, adjustable power contact structure for a semiconductor module of claim 6, wherein, A wire connector is connected to the energized contact, and the wire connector extends towards the adjustable support and penetrates the empty window. ​ 8. A manually testable adjustable power contact structure for a semiconductor module as defined in any of claims 1-7, characterized in that ​ 9. A manually testable adjustable power contact structure for a semiconductor module as recited in claim 8, wherein, ​ ​ 10. The manually testable, adjustable power contact structure for a semiconductor module of claim 9, wherein, ​

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