High-strength modularized photovoltaic module bypass module

Abstract

The utility model provides a high-strength modularized photovoltaic assembly bypass module, which comprises a first conductive terminal, a second conductive terminal and an insulation packaging module, wherein the first conductive terminal and the second conductive terminal are oppositely arranged; the opposite ends of the first conductive terminal and the second conductive terminal are crossed and matched in the insulation packaging module; the insulation packaging module comprises an upper cover and a lower cover, at least one of the upper cover and the lower cover is of a stepped structure, the insulation packaging module comprises a first packaging structure and second packaging structures, and the second packaging structures are arranged on the two sides of the first packaging structure. According to the utility model, the parts of the first conductive terminal and the second conductive terminal in the insulation packaging module are arranged to be crossed and matched, so that transverse force can be effectively dispersed to the first conductive terminal and the second conductive terminal instead of directly acting in a gap between the first conductive terminal and the second conductive terminal when bearing the transverse force, and the transverse stress condition of the bypass module is good; meanwhile, the insulation packaging module is arranged to be of a stepped structure, transverse stress can be further dispersed to the whole bypass module, and therefore the situation of transverse breakage is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to solar photovoltaic power generation technical field especially relates to a high strength modularization photovoltaic module bypass module. BACKGROUND

[0002] Solar photovoltaic module is the device of converting solar energy into electric energy, in the photovoltaic module production process, the terminal box plays the important role of photovoltaic electric energy effective output, and its main function is the current output generated by photovoltaic module and protects solar photovoltaic module. The terminal box is composed of the box body outside and the bypass module in the box body, and it is used in parallel with solar photovoltaic panel to ensure that solar photovoltaic panel can still be conducted through the breakdown of bypass module when hot spot effect occurs.

[0003] The current bypass module is usually composed of a first conductive terminal, a second conductive terminal and an insulating packaging module, which is packaged and combined with the opposite side of the first conductive terminal and the second conductive terminal by the insulating packaging module. However, since the first conductive terminal and the second conductive terminal are only arranged by the opposite arrangement, the insulating packaging module itself provides mechanical support for the connection between the two, and it is difficult to withstand the pressing process during the installation of the bypass module into the box body, and it is easy to break, so the mechanical strength of the connection needs to be enhanced to prevent the above situation. UTILITY MODEL CONTENTS

[0004] The utility model solves the technical problem of overcoming the defects of prior art, and provides a high-strength modular photovoltaic module bypass module to improve the mechanical strength of the connection between the first conductive terminal and the second conductive terminal of the bypass module.

[0005] To solve the above technical problems, the utility model adopts the technical scheme of a high-strength modular photovoltaic module bypass module, which comprises a first conductive terminal and a second conductive terminal arranged opposite to each other, the opposite ends of the first conductive terminal and the second conductive terminal extend into an insulating packaging module, and a bypass protection device is packaged in the insulating packaging module and is configured to be connected with the first conductive terminal and the second conductive terminal, characterized in that,

[0006] The opposite ends of the first conductive terminal and the second conductive terminal are cross matched in the insulating packaging module, and a first bus bar slot hole and a second bus bar slot hole are respectively formed in the first conductive terminal and the second conductive terminal;

[0007] The insulating packaging module comprises an upper cover and a lower cover, at least one of which is a stepped structure comprising a first packaging structure and a second packaging structure, the second packaging structure being arranged on both sides of the first packaging structure, and a through hole being arranged in the second packaging structure through the thickness direction of the second packaging structure, the through hole being in the same shape as the first bus bar slot hole and the second bus bar slot hole.

[0008] Further, the height of the first packaging structure is higher than the height of the second packaging structure.

[0009] Further, a plurality of reinforcing ribs are arranged in parallel along the length direction of the first packaging structure.

[0010] Further, the width of the first packaging structure is greater than the width of the first conductive terminal or the second conductive terminal, and the width of the second packaging structure is less than the width of the first conductive terminal or the second conductive terminal.

[0011] Further, a bonding area is arranged on one of the first conductive terminal and the second conductive terminal, and a slide glass island is arranged on the other, and the bypass protection device is fixedly arranged on the slide glass island to connect the bonding area and the bypass protection device by a jumper wire.

[0012] Further, the bonding area and the slide glass island are distributed based on the width direction of the insulating packaging module, and the area of the bonding area is less than the area of the slide glass island.

[0013] Further, a partition structure is further included, the partition structure being of insulating material and being fixedly arranged between the opposite sides of the first conductive terminal and the second conductive terminal.

[0014] Further, a bus bar guide slot is arranged on the first bus bar slot hole facing any one of the slide glass island and the bonding area, and a bus bar guide slot is also arranged on the second bus bar slot hole facing the remaining one of the slide glass island and the bonding area.

[0015] Further, a first bus bar welding area and a second bus bar welding area are respectively arranged on the first conductive terminal and the second conductive terminal, the first bus bar welding area being located on the side of the first bus bar slot hole away from the insulating packaging module, and the second bus bar welding area being located on the side of the second bus bar slot hole away from the insulating packaging module.

[0016] Further, a wire fixing sheet is further included, the wire fixing sheet being arranged at the end of at least one of the first conductive terminal and the second conductive terminal, and the wire fixing sheet being of a bendable structure.

[0017] Compared with the prior art, the beneficial effects of the present application include:

[0018] 1) through the first conductive terminal and the second conductive terminal are located in the insulating packaging module part is set as cross matching, when bearing lateral force, can effectively disperse to the two, rather than directly acting on the gap between the two, so that the bypass module lateral force condition is good; At the same time, the insulating packaging module is set to a stepped structure, which can further disperse the lateral force to the whole bypass module, thereby avoiding the occurrence of lateral fracture;

[0019] 2) by setting the reinforcing rib inside the first packaging structure along the length direction, the strength of the insulating packaging module can be effectively improved, the external lateral force is directly applied to the connection between the first conductive terminal and the second conductive terminal, and the gradient transmission of the force is completed through the stepped structure of the insulating packaging module;

[0020] 3) by setting the first bus bar slot hole and the second bus bar slot hole cooperating with the bus bar guide groove, the bus bar used for wiring on the bonding area and the slide island can be easily guided out, and the through hole with the same shape as the first bus bar slot hole and the second bus bar slot hole is arranged on the second packaging structure, which provides sufficient conditions for the lead-out and welding of the bus bar. BRIEF DESCRIPTION OF DRAWINGS

[0021] The disclosure of the present application will be described with reference to the accompanying drawings. It should be understood that the drawings are only for illustrative purposes, and are not intended to limit the scope of protection of the present application. In the drawings, the same reference numerals are used to refer to the same parts. Among them:

[0022] Figure 1 The schematic view shows the top view structure of the high-strength modular photovoltaic module bypass module (the wire fixing sheet 9 has been bent in the drawing);

[0023] Figure 2 The schematic view shows the internal top view structure of the high-strength modular photovoltaic module bypass module;

[0024] Figure 3 The schematic view shows the front view structure of one embodiment of the high-strength modular photovoltaic module bypass module;

[0025] Figure 4 The schematic view shows the front view structure of another embodiment of the high-strength modular photovoltaic module bypass module;

[0026] Figure 5 The schematic view shows the internal top view structure of the high-strength modular photovoltaic module bypass module after the wire fixing sheet is bent.

[0027] The following numbers are used in the diagram: 1-First conductive terminal, 11-First busbar slot, 12-First busbar soldering area, 13-Bonding area, 2-Second conductive terminal, 21-Second busbar slot, 22-Second busbar soldering area, 23-Carrier island, 3-Insulating encapsulation module, 31-First encapsulation structure, 32-Second encapsulation structure, 4-Bypass protection device, 5-Jumper wire, 6-Through hole, 7-Isolation structure, 8-Busbar guide groove, 9-Wire fixing piece. Detailed Implementation

[0028] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.

[0029] like Figure 1 As shown, a high-strength modular photovoltaic module bypass module includes a first conductive terminal 1 and a second conductive terminal 2 arranged opposite to each other, wherein one end of the first conductive terminal 1 and the second conductive terminal 2 extends into an insulating encapsulation module 3, and a bypass protection device 4 is encapsulated in the insulating encapsulation module 3 and connected to the first conductive terminal 1 and the second conductive terminal 2.

[0030] like Figure 2 As shown, the first conductive terminal 1 and the second conductive terminal 2 are cross-fitted in the insulating encapsulation module 3, and a first busbar slot 11 and a second busbar slot 21 are respectively opened on the first conductive terminal 1 and the second conductive terminal 2.

[0031] For ease of explanation, the aforementioned first busbar slot 11 is disposed on the first conductive terminal 1, and the second busbar slot 21 is disposed on the second conductive terminal 2. The following is a detailed description of the cross-fitting of the first conductive terminal 1 and the second conductive terminal 2. A bonding area 13 is disposed on the aforementioned first conductive terminal 1, and a wafer island 23 is disposed on the second conductive terminal 2. A bypass protection device 4 is fixedly disposed on the aforementioned wafer island 23, and a jumper wire 5 connects the bonding area 13 and the bypass protection device 4. The bonding area 13 and the wafer island 23 are distributed based on the width direction of the insulating encapsulation module 3. For example, the bonding area 13 is distributed on one side of the width direction of the insulating encapsulation module 3, while the wafer island 23 is distributed on the other side of the width direction of the insulating encapsulation module 3. The bonding area 13 and the wafer island 23 have the same length, but the width of the bonding area 13 is smaller than the width of the wafer island 23, so that the area occupied by the bonding area 13 is smaller than the area occupied by the wafer island 23.

[0032] Through the aforementioned cross-cooperation of the bonding area 13 and the wafer island 23, when the bonding area 13 located on the first conductive terminal 1 and the wafer island 23 located on the second conductive terminal 2 are encapsulated by the insulating encapsulation module 3, when subjected to external lateral pressure, both the bonding area 13 and the wafer island 23 can provide rigid support, and there is no gap between them along the width direction of the first conductive terminal 1 or the second conductive terminal 2. Firstly, the pressure is dispersed to the first conductive terminal 1 and the second conductive terminal 2 by the insulating encapsulation module 3. Furthermore, the cross-cooperation of the bonding area 13 and the wafer island 23 can further disperse the pressure to the first conductive terminal 1 and the second conductive terminal 2, thereby reducing or avoiding lateral breakage at the encapsulation position when subjected to force.

[0033] It should be understood that the designation of the left conductive terminal of the high-strength modular photovoltaic module bypass module in the accompanying drawings as the first conductive terminal 1 and the right conductive terminal as the second conductive terminal 2 is merely for the purpose of clearly describing the implementation of the present invention and is not intended to limit the location of the bypass protection device 4. In specific implementations, users may also designate the right conductive terminal as the first conductive terminal 1 and the right conductive terminal as the second conductive terminal 2 in the above embodiments, and the arrangement of the bonding region 13 and the carrier island 23 is the same as that of the first conductive terminal 1 and the second conductive terminal 2. This should be considered as an equivalent implementation of the above embodiments, as long as the bypass protection device 4 is placed on the carrier island 23.

[0034] like Figure 3 As shown, to further improve the performance of the modular photovoltaic module bypass module in resisting lateral forces, the insulating encapsulation module 3 in this invention includes an upper cover and a lower cover. The encapsulation process is completed by pressing and fixing the upper cover and the lower cover to the bonding area 13 and the carrier island 23. Among the upper and lower covers, the upper cover has a stepped structure, while the lower cover has a conventional uniform cover structure. The upper cover includes a first encapsulation structure 31 and a second encapsulation structure 32. The second encapsulation structure 32 is disposed on both sides of the first encapsulation structure 31, and a through hole 6 with the same shape as the first busbar slot 11 and the second busbar slot 21 is opened in the thickness direction of the second encapsulation structure 32.

[0035] In other implementations, such as Figure 3 As shown, the lower cover can be designed as a stepped structure while the upper cover can be designed as a standard structure, such as... Figure 4 As shown, both the upper and lower covers can be configured as stepped structures, and both can be applied to this utility model.

[0036] The height of the first encapsulation structure 31 is higher than the height of the second encapsulation structure 32, the first encapsulation structure 31 covers the bonding area 13 and the area of the wafer island 23, and the second encapsulation structure 32 covers the position of the first busbar slot hole 11 and the second busbar slot hole 21; by setting the stepped cover formed by the first encapsulation structure 31 and the second encapsulation structure 32, when the first encapsulation structure 31 is subjected to a transverse external force, the stepped structure can uniformly transmit the force to the first conductive terminal 1 and the second conductive terminal 2 through the gradient of the force, has excellent pressure bearing performance, and can realize the light weight of the insulating encapsulation module 3 by matching the light weight of the insulating material.

[0037] To further improve the pressure bearing capacity of the insulating encapsulation structure, a plurality of reinforcing ribs can be arranged in the first encapsulation structure 31 which is the main stress part along the length direction, which can improve the pressure bearing capacity of the first encapsulation structure 31 while matching the cross-arranged bonding area 13 and wafer island 23, and has obvious specificity and pertinence.

[0038] As shown in Figure 2 , a partition structure 7 is arranged between the first conductive terminal 1 and the second conductive terminal 2, the partition structure 7 is made of insulating material, and is fixedly arranged between the opposite sides of the first conductive terminal 1 and the second conductive terminal 2, i.e. between the bonding area 13 and the wafer island 23; a groove matching the edge of the wafer island 23 of the bonding area 13 can be arranged on the two sides of the partition structure 7 facing the bonding area 13 and the wafer island 23; by arranging the partition structure 7 between the bonding area 13 and the wafer island 23, on the one hand, the gap filling requirement between the two can be met, on the other hand, the alignment of the two can be ensured, and at the same time, the first conductive terminal 1 and the second conductive terminal 2 can be effectively contacted to facilitate the transmission of pressure to the entire modular photovoltaic component bypass module.

[0039] It is worth noting that, in order to ensure the encapsulation effect of the insulating encapsulation structure, as shown in Figure 1 , the width of the first encapsulation structure 31 is greater than the width of the first conductive terminal 1 or the second conductive terminal 2, and the width of the second encapsulation structure 32 is less than the width of the first conductive terminal 1 or the second conductive terminal 2.

[0040] The first busbar slot hole 11 is provided with a busbar guide slot 8 facing the bonding area 13, and the second busbar slot hole 21 is provided with a busbar guide slot 8 facing the slide 23, and the busbar is communicated with the first conductive terminal 1 and the second conductive terminal 2 through the busbar, and the busbar is embedded in the busbar guide slot 8, and then extends to the outer edge of the modular photovoltaic bypass module through the first busbar slot hole 11 and the second busbar slot hole 21 and the through hole 6 above the second packaging structure 32. As to how to connect the busbar with the first conductive terminal 1 and the second conductive terminal 2, the first busbar welding area 12 is arranged on the first conductive terminal 1, the first busbar welding area 12 is located on the side of the first busbar slot hole 11 away from the insulating packaging module 3, the second busbar welding area 22 is arranged on the second conductive terminal 2, the second busbar welding area 22 is located on the side of the second busbar slot hole 21 away from the insulating packaging module 3, and the other end of the busbar is welded and fixed with the first busbar welding area 12 and the second busbar welding area 22 respectively.

[0041] The wire fixing sheet 9 is further included for riveting with the cable, the wire fixing sheet 9 is arranged at the end of the first conductive terminal 1, and the wire fixing sheet 9 can be riveted with the cable by being bent into a U-shaped structure (as shown in Figure 5 The wire fixing sheet 9 can also be arranged at the end of the second conductive terminal 2. In other embodiments, the wire fixing sheet 9 can also be arranged at the end of the first conductive terminal 1 and the second conductive terminal 2.

[0042] The positioning hole is arranged at the edge of the first conductive terminal 1 and the second conductive terminal 2, which is convenient for embedding and fixing the high-strength modular photovoltaic bypass module in the box body, and the positive and negative symbols can be arranged on the surface of the first conductive terminal 1 and the second conductive terminal 2 in order to directly judge the positive and negative directions.

[0043] The technical scope of the utility model is not limited to the content in the above description, and those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical thought of the utility model, and these deformations and modifications should all belong to the protection scope of the utility model.

Claims

1. A high-strength modular photovoltaic module bypass module, comprising oppositely arranged first and second conductive terminals (1) and (2), opposite ends of the first and second conductive terminals (1) and (2) extending into an insulating packaging module (3), a bypass protection device (4) being packaged in the insulating packaging module (3) and being configured to be connected with the first and second conductive terminals (1) and (2), characterized in that, opposite ends of the first and second conductive terminals (1) and (2) are cross-fitted in the insulating packaging module (3), and first and second bus bar slot holes (11) and (21) are respectively formed on the first and second conductive terminals (1) and (2); the insulating packaging module (3) comprises an upper cover and a lower cover, at least one of the upper cover and the lower cover is a stepped structure comprising a first packaging structure (31) and a second packaging structure (32), the second packaging structure (32) is arranged on both sides of the first packaging structure (31), and a through hole (6) with the same shape as the first and second bus bar slot holes (11) and (21) is formed through the thickness direction of the second packaging structure (32).

2. The high strength modular photovoltaic assembly bypass module of claim 1, wherein, The height of the first packaging structure (31) is higher than the height of the second packaging structure (32).

3. The high strength modular photovoltaic assembly bypass module of claim 2, wherein, A plurality of reinforcing ribs are arranged in parallel along the length direction inside the first packaging structure (31).

4. The high strength modular photovoltaic assembly bypass module of claim 2, wherein, The width of the first packaging structure (31) is greater than the width of the first or second conductive terminal (1) or (2), and the width of the second packaging structure (32) is less than the width of the first or second conductive terminal (1) or (2).

5. The high strength modular photovoltaic assembly bypass module of claim 1, wherein, A bonding area (13) is arranged on one of the first and second conductive terminals (1) and (2), and a slide glass island (23) is arranged on the other, the bypass protection device (4) is fixedly arranged on the slide glass island (23), and a jumper (5) is connected between the bonding area (13) and the bypass protection device (4).

6. The high strength modular photovoltaic assembly bypass module of claim 5, wherein, The bonding area (13) and the slide glass island (23) are distributed based on the width direction of the insulating packaging module (3), and the area of the bonding area (13) is less than the area of the slide glass island (23).

7. The high strength modular photovoltaic assembly bypass module of claim 6, wherein, A partition structure (7) is further included, which is made of insulating material and is fixedly arranged between the opposite sides of the first and second conductive terminals (1) and (2).

8. The high strength modular photovoltaic assembly bypass module of claim 5, wherein, A bus bar guide slot (8) is formed on the first bus bar slot hole (11) facing any one of the slide glass island (23) and the bonding area (13), and a bus bar guide slot (8) is also formed on the second bus bar slot hole (21) facing the remaining one of the slide glass island (23) and the bonding area (13).

9. The high strength modular photovoltaic assembly bypass module of claim 1, wherein, A first bus bar welding area (12) and a second bus bar welding area (22) are respectively arranged on the first conductive terminal (1) and the second conductive terminal (2), the first bus bar welding area (12) is located on the side of the first bus bar slot hole (11) away from the insulating packaging module (3), and the second bus bar welding area (22) is located on the side of the second bus bar slot hole (21) away from the insulating packaging module (3).

10. The high strength modular photovoltaic assembly bypass module of claim 1, wherein, A wire fixing sheet (9) is further included, the wire fixing sheet (9) is arranged at the end of at least one of the first conductive terminal (1) and the second conductive terminal (2), and the wire fixing sheet (9) is a bendable structure.

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