Chip FC packaged vehicle-mounted camera module structure

Abstract

The utility model discloses a vehicle-mounted camera module structure with a chip FC (Fiber Channel) packaged, which is characterized in that an adhesive is fixedly arranged on the periphery of the bottom of a lens, an FC packaged chip is arranged below the lens, the FC packaged chip is arranged at the bottom of the lens through the adhesive, and the FC packaged chip and the lens are connected into a whole; according to the utility model, the COB bare chip FC packaging technology is adopted by the vehicle-mounted module chip, so that the imaging quality is higher, the technological process is simpler, the risk of dust particles on the chip and dust particles on glass is reduced, and the heat dissipation performance of the module is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field especially relates to a chip FC package's vehicle-mounted camera module structure. BACKGROUND

[0002] With the prevalence of new four automotives and intelligent driving concept, the vehicle-mounted perception sensor market is developing rapidly, and the vehicle-mounted camera, which is compared with the automatic driving eyes, will become the new blue ocean industry of the industry. As the core sensing equipment in the field of automatic driving of automobile, the imaging quality of vehicle-mounted camera is related to the direct experience of intelligent driving. Therefore, only the continuous optimization and exploration of technology can meet the higher requirements of customers, but the chip packaging inside the camera module used at present generally adopts BGA packaging, which needs to use a large volume of resin to wrap the chip, resulting in poor efficiency of heat conduction of the chip to the resin and the circuit board, and further resulting in poor heat dissipation effect, so the chip packaging structure of the existing camera is not suitable for manufacturing small volume and good heat dissipation vehicle-mounted high-definition camera. Therefore, a chip FC package vehicle-mounted camera module structure is needed to solve the above problems. SUMMARY

[0003] The utility model discloses a kind of chip FC package vehicle-mounted camera module structures to solve the problems such as the chip packaging structure of the existing camera in prior art is not suitable for manufacturing small volume, good heat dissipation vehicle-mounted high-definition camera.

[0004] To achieve the above object, the utility model adopts the following technical scheme: a kind of chip FC package vehicle-mounted camera module structure, including lens, the bottom perimeter of lens is fixedly provided with adhesive, the lower portion of lens is provided with FC package chip, and FC package chip is fixedly set in the bottom of lens by adhesive (2), and FC package chip and lens are integrated.

[0005] Further, the bottom of FC package chip is fixedly provided with tin ball, and the tin ball is provided with several.

[0006] Further, the bottom of FC package chip is movably provided with circuit hard board, and is welded by surface assembly technology with circuit hard board through several tin balls and is conducted.

[0007] Further, the bottom of lens is movably provided with front shell, and lens is fixedly provided with front shell in by adhesive.

[0008] Further, the bottom of front shell is fixedly connected and arranged with rear shell, and the bottom of circuit hard board is in contact with the inside of rear shell.

[0009] The utility model discloses an advantageous effect is: 1. In the utility model, through the COB bare chip FC packaging technology of vehicle module chip, have higher imaging quality, simpler process, reduce the dust particle on the chip, the dust particle risk on the glass also improved the heat dissipation of module simultaneously. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 For the utility model structure schematic Figure One ;

[0011] Figure 2 For the utility model structure schematic Figure Two .

[0012] In the drawing: 1 lens, 2 adhesive, 3 FC package chip, 4 tin ball, 5 circuit hard board, 6 front shell, 7 rear shell. DETAILED DESCRIPTION

[0013] Below, will combine the drawings in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, the described embodiment only is a part of the embodiment of the utility model, not all the embodiment.

[0014] Referring Figures 1-2 , this embodiment provides a kind of FC package's vehicle-mounted camera module structure of chip, including lens 1, the bottom perimeter of lens 1 is fixedly provided with adhesive 2, the lower part of lens 1 is provided with FC package chip 3, and FC package chip 3 is fixedly arranged at the bottom of lens 1 by adhesive 2, and FC package chip 3 is integrated with lens 1 connection;Preferably, by using bare chip, standard FC package chip 3 module is made by adopting flip-chip packaging process, FC package chip 3 module front is provided with the connection structure with lens 1, so that FC package chip 3 module front is integrated with lens 1 connection, to reduce the dust particle on the chip, the dust particle risk on the glass, to improve the sealing of FC package chip 3 and lens 1, FC package chip 3 module and lens 1 are directly conducted, to increase the module heat dissipation performance.

[0015] Further, the bottom of FC package chip 3 is fixedly provided with tin ball 4, and the tin ball 4 is provided with a plurality of; Preferably, FC package chip 3 module back is provided with tin ball 4 structure for surface assembly technology with main circuit hard board 5 surface assembly technology is conducted electrically, so that necessary bottom filling glue can be added for increasing reliability and heat dissipation performance.

[0016] Further, the bottom of FC package chip 3 is movably provided with circuit hard board 5, and a plurality of tin balls 4 are welded and conducted with the surface assembly technology of circuit hard board 5;Preferably, by using surface assembly technology process, traditional assembly process flow is simplified, and process difficulty is reduced.

[0017] Further, the bottom outer activity of the lens 1 is provided with the front shell 6, and the lens 1 is fixedly arranged in the front shell 6 through the adhesive 2; preferably, the lens 1 and the FC package chip 3 are assembled through the front shell 6, so that the lens 1 is installed in the front shell 6.

[0018] Further, the bottom of the front shell 6 is fixedly clamped with the rear shell 7, and the bottom of the circuit hard plate 5 is in contact with the inside of the rear shell 7; preferably, the camera module is assembled through the rear shell 7, so that the circuit hard plate 5 is fixedly arranged at the bottom of the FC package chip 3, thereby reducing the process assembly process and reducing the assembly error.

[0019] In the utility model, in use, first, the FC package chip 3 module is made of a standard FC package chip 3 by using a bare chip and adopting a flip chip technology packaging process, then the tin ball 4 structure is arranged on the back of the FC package chip 3 module for being fixed and electrically conducted with the main circuit hard plate 5 through surface assembly technology; if necessary, the bottom filling glue can be added for increasing reliability and heat dissipation performance; after the FC package chip 3 module is fixed with the circuit hard plate 5, the adhesive 2 structure or welding structure is adopted to fix the lens 1, finally, the front of the FC package chip 3 module can be provided with a lens 1 connecting structure, generally, the adhesive 2 structure or welding structure is adopted, so that the FC package chip 3 module and the lens 1 are connected into an integrated whole, thereby reducing the dust particle risk on the chip and the dust particle risk on the glass, improving the sealing property of the FC package chip 3 and the lens 1, further reducing the process assembly process and the assembly error, and simultaneously, the FC package chip 3 module and the lens 1 are directly conducted, the module heat dissipation performance is increased, and the process difficulty is reduced.

[0020] The above is only a preferred specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the utility model concept of the utility model within the technical range disclosed by the utility model, which should be covered in the protection scope of the utility model.

Claims

1. A chip FC packaged vehicle camera module structure, comprising a lens (1), characterized in that: An adhesive (2) is fixedly installed around the bottom of the lens (1), and an FC package chip (3) is installed below the lens (1). The FC package chip (3) is fixedly installed at the bottom of the lens (1) by the adhesive (2), and the FC package chip (3) is integrated with the lens (1).

2. The chip FC packaged car camera module structure according to claim 1, wherein, The bottom of the FC packaged chip (3) is fixedly provided with solder balls (4), and there are several solder balls (4).

3. The chip FC packaged car camera module structure according to claim 2, wherein, The bottom of the FC packaged chip (3) is movably provided with a circuit board (5), and is connected to the circuit board (5) by surface mount technology through a number of solder balls (4).

4. The chip FC packaged car camera module structure according to claim 3, wherein, The lens (1) has a front shell (6) movably disposed on the bottom outside, and the lens (1) is fixedly disposed inside the front shell (6) by an adhesive (2).

5. The chip FC packaged car camera module structure according to claim 4, wherein, The bottom of the front shell (6) is fixedly snapped with the rear shell (7), and the bottom of the circuit board (5) is in contact with the inside of the rear shell (7).

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