Anti-corrosion heating plate with long service life

Abstract

The utility model relates to the technical field of heating plates, and discloses a long-service-life anti-corrosion heating plate which comprises a heating plate body and a base, an anti-corrosion assembly is arranged in the heating plate body, a heat insulation frame is fixedly connected to the outer wall of the heating plate body in a sleeved mode, a disassembling assembly is arranged between the heat insulation frame and the base, and the heat insulation frame is fixedly connected with the base in a sleeved mode. A connecting groove and a mounting groove are formed in the upper end of the base, the heat insulation frame is arranged in the connecting groove in a clamped mode, the anti-corrosion assembly comprises a disc body base layer, the disc body base layer is arranged in the heating disc body, and a base layer contact layer is arranged at the upper end of the disc body base layer. According to the utility model, through the arrangement of the anti-corrosion assembly, the anti-corrosion capability of the heating plate can be effectively improved under the combined action of a plurality of functional layers, so that the service life of the heating plate is effectively prolonged, and through the arrangement of the disassembly assembly, the combined connection and the disassembly operation between the heating plate body and the base can be quickly realized; and convenience is brought to maintenance and replacement work.

Description

TECHNICAL FIELD

[0001] The utility model relates to heating disc technical field especially relates to a high life anticorrosion heating disc. BACKGROUND

[0002] In the semiconductor manufacturing process, silicon wafer (wafer) as core components, its processing technology has extremely strict requirement on temperature. The heating disc for silicon wafer (wafer) in semiconductor equipment, bears the key task of heating silicon wafer (wafer) to the specified temperature range accurately, ensures that various complex semiconductor processes, such as lithography, etching, deposition, etc. can be carried out smoothly in stable temperature environment, and its performance directly influences the processing quality and production efficiency of silicon wafer (wafer), and further determines the yield and performance of semiconductor products.

[0003] However, the existing heating disc for silicon wafer (wafer) in semiconductor equipment has many drawbacks. There is a serious deficiency in corrosion resistance. The semiconductor manufacturing workshop is full of various strong corrosive chemicals and gases, and the surface coating of the traditional heating disc is easily eroded and difficult to resist the damage of these chemicals for a long time. Therefore, the technical personnel in the field provide a high life anticorrosion heating disc to solve the problems raised in the background technology. UTILITY MODEL CONTENT

[0004] The utility model discloses a high life anticorrosion heating disc to solve the problems raised in the background technology, which is provided to solve the problems in the prior art. The anticorrosion assembly is provided. The base contact layer made of silicon nitride coating, the corrosion-resistant functional layer made of yttrium oxide coating material and the surface functional layer made of silicon carbide coating material can effectively improve the corrosion resistance of the heating disc, thereby effectively improving the service life of the heating disc.

[0005] To achieve the above object, the utility model provides the following technical scheme: a high life anticorrosion heating disc, including heating disc body and base, the inside of heating disc body is provided with anticorrosion assembly, the outer wall of heating disc body is fixed with heat insulation frame, the heat insulation frame and base are provided with split assembly, the upper end of base is provided with connecting groove and mounting groove, the heat insulation frame is hinged in connecting groove;

[0006] The anticorrosion assembly includes a disc body base, the disc body base is arranged in the inside of the heating disc body, the upper end of the disc body base is provided with a base contact layer, the upper end of the base contact layer is provided with a corrosion-resistant functional layer, and the upper end of the corrosion-resistant functional layer is provided with a surface functional layer.

[0007] Through the technical scheme, the base contact layer is compatible with the semiconductor material and has strong adhesion, can resist the corrosion of common chemical substances in the semiconductor manufacturing process to a certain extent, and preliminarily blocks the contact between the external corrosive medium and the heating disc base, the anti-corrosion functional layer provides long-term anti-corrosion protection and can withstand the impact of corrosive media, the surface functional layer improves the surface performance and reduces the friction coefficient, avoids the adhesion of silicon wafers, and at the same time improves the anti-corrosion and anti-oxidation capabilities, and ensures the quality and stability of the silicon wafers in the heating process.

[0008] Further, the disassembly assembly comprises two locking blocks, rebound grooves are formed in the inner walls of the two sides of the connecting groove, the two locking blocks are slidingly arranged in the corresponding rebound grooves, locking grooves are formed in the two sides of the heat insulation frame, connecting rods are movably arranged in the interiors of the two rebound grooves, one end of each of the connecting rods is fixedly connected with the corresponding locking block, and a return spring is movably sleeved on the outer wall of each of the connecting rods.

[0009] Through the technical scheme, when the heating part needs to be maintained or the heating disc body needs to be cleaned, maintained or replaced, the combined connection and disassembly operation between the heating disc body and the base can be realized only by controlling the movement of the locking block, thereby bringing convenience to the maintenance and replacement work.

[0010] Further, a heating pipe is fixedly arranged in the interior of the mounting groove, and a contact groove is formed in the lower end of the heating disc body, the heating pipe is arranged in correspondence with the contact groove and in contact with the inner wall of the contact groove.

[0011] Through the technical scheme, the heating pipe and the contact groove are arranged, and heat can be transmitted to the heating disc body by starting the heating pipe.

[0012] Further, the base contact layer is made of silicon nitride coating material, the anti-corrosion functional layer is made of yttrium oxide coating material, and the surface functional layer is made of silicon carbide coating material.

[0013] Through the technical scheme, the base layer contact layer made of silicon nitride coating material is coated on the disc base layer by using chemical vapor deposition process, which is compatible with commonly used semiconductor materials and has good adhesion, can be tightly combined with the metal base, provides a solid foundation for the subsequent coating, and can resist the corrosion of common chemicals in the semiconductor manufacturing process to a certain extent, preliminarily blocks the contact of external corrosive medium with the heating disc base, secondly, the corrosion-resistant functional layer made of yttrium oxide coating material is sprayed on the base layer contact layer by using thermal spraying technology, which can resist the impact of external corrosive medium and prevent it from penetrating to the base surface, providing long-term corrosion resistance for the heating disc, and the performance is stable in high temperature environment, and the heat conduction performance is sufficient to meet the demand of the semiconductor heating disc, finally, the surface functional layer made of silicon carbide coating material is coated on the corrosion-resistant functional layer by using chemical vapor deposition process, which can improve the surface performance of the heating disc, reduce the friction coefficient, avoid the adhesion of the silicon wafer and the heating disc, further improve the corrosion resistance and oxidation resistance, and ensure the quality and stability of the silicon wafer in the heating process.

[0014] Further, the two locking blocks are clamped in the corresponding locking grooves, and the two ends of the plurality of return springs are fixedly connected to the opposite inner walls of the corresponding locking blocks and the rebound grooves, respectively.

[0015] Through the technical scheme, the locking blocks are clamped in the corresponding locking grooves, and the return springs are effectively limited, so that the combination and connection of the heating disc body and the base between them can be realized.

[0016] Further, the disc base layer is made of aluminum alloy material.

[0017] Through the technical scheme, the disc base layer is made of aluminum alloy material, which has high thermal conductivity and can quickly and effectively transfer heat to the silicon wafer (wafer), ensuring the uniformity and efficiency of heating.

[0018] Further, the heat insulation frame is made of ceramic fiber material.

[0019] Through the technical scheme, the heat insulation frame is made of ceramic fiber material, which has extremely low thermal conductivity and can effectively prevent heat conduction from the heating disc to the surrounding environment, reduce heat loss, improve the thermal efficiency of the heating disc, help maintain the temperature stability of the silicon wafer (wafer) during heating, and also improve the safety in use to avoid being scalded by mistake.

[0020] Further, one end of the two connecting rods on one side penetrates the base and is fixedly connected with a pull plate.

[0021] Through the technical scheme, the pull plate is provided, and then the corresponding connecting rod can be moved by pulling the pull plate by the operator.

[0022] The utility model has the advantages of the following:

[0023] 1. The utility model discloses a long -life anticorrosive heating disc which is provided with an anticorrosion assembly. First, the base contact layer made of silicon nitride coating is compatible with semiconductor materials and has strong adhesion, can resist the corrosion of common chemicals in the semiconductor manufacturing process to a certain extent, and preliminarily blocks the contact between external corrosive medium and the heating disc base. Second, the anticorrosion function layer provides long-term anticorrosion protection and can withstand the impact of corrosive medium. The surface function layer improves the surface properties and reduces the friction coefficient, avoids the adhesion of silicon wafers, improves the anticorrosion and antioxidation capabilities, and ensures the quality and stability of silicon wafers during the heating process. The combination of these function layers can effectively improve the anticorrosion capability of the heating disc and prolong the service life.

[0024] 2. The utility model discloses a long -life anticorrosive heating disc which is provided with a split assembly. When the heating part needs to be maintained or the heating disc body needs to be cleaned, maintained or replaced, the combination connection and disassembly operation between the heating disc body and the base can be quickly realized by moving the locking block, which brings convenience to the maintenance and replacement work. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 Fig. 1 is a perspective view of the long -life anticorrosive heating disc according to the utility model;

[0026] Figure 2 Fig. 2 is a partial internal structure schematic view of the long -life anticorrosive heating disc according to the utility model;

[0027] Figure 3 Fig. 3 is a front sectional view of the long -life anticorrosive heating disc according to the utility model;

[0028] Figure 4 Fig. 4 is a structure enlarged view of position A in Fig. 1; Figure 3

[0029] Figure 5 Fig. 5 is a bottom sectional view of the long -life anticorrosive heating disc according to the utility model.

[0030] LEGEND:

[0031] 1, heating disc body; 2, base; 3, heat insulation frame; 4, anticorrosion assembly; 5, split assembly; 6, mounting groove; 7, heating pipe; 8, contact groove; 9, disc body base layer; 10, base contact layer; 11, anticorrosion function layer; 12, surface function layer; 13, connecting groove; 14, rebound groove; 15, connecting rod; 16, locking block; 17, locking groove; 18, return spring; 19, pull plate.​ DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments of the utility model. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0033] With reference to Figure 1 , Figure 2 and Figure 5 , the utility model provides an embodiment: a kind of high life anticorrosive heating disc, including heating disc body 1 and base 2, the inside of heating disc body 1 is provided with anticorrosive component 4, the outer wall of heating disc body 1 is fixed with heat insulation frame 3, heat insulation frame 3 is made of ceramic fiber material, by using ceramic fiber material to make heat insulation frame 3, it has very low thermal conductivity, can effectively prevent heat from heating disc to surrounding environment conduction, reduce heat loss, improve the thermal efficiency of heating disc, help to maintain the temperature stability in the process of silicon wafer (wafer) heating, also can improve use safety, avoid being scalded by mistake, split component 5 is arranged between heat insulation frame 3 and base 2, the upper end of base 2 is provided with connecting groove 13 and mounting groove 6, heat insulation frame 3 is engaged in connecting groove 13, heating pipe 7 is fixedly arranged in mounting groove 6, the lower end of heating disc body 1 is provided with contact recess 8, heating pipe 7 is correspondingly arranged with contact recess 8 and is in contact with the inner wall of contact recess 8, by the heating pipe 7 and contact recess 8, in turn, heat can be transferred to heating disc body 1 by starting heating pipe 7;

[0034] The anticorrosion assembly 4 comprises a disc base layer 9 made of aluminum alloy material. The disc base layer 9 made of aluminum alloy material has high thermal conductivity, which can quickly and effectively transfer heat to the silicon wafer, ensuring the uniformity and efficiency of heating. The disc base layer 9 is arranged inside the heating disc body 1. The upper end of the disc base layer 9 is provided with a base layer contact layer 10. The upper end of the base layer contact layer 10 is provided with an anticorrosion functional layer 11. The upper end of the anticorrosion functional layer 11 is provided with a surface functional layer 12. By arranging the anticorrosion assembly 4, firstly, the base layer contact layer 10 is compatible with semiconductor materials and has strong adhesion, which can resist the corrosion of common chemical substances in the semiconductor manufacturing process to a certain extent, and preliminarily block the contact between the external corrosive medium and the heating disc base. Secondly, the anticorrosion functional layer 11 provides long-term corrosion protection and can withstand the impact of corrosive media. The surface functional layer 12 improves the surface properties, reduces the friction coefficient, avoids the adhesion of silicon wafers, and at the same time improves the corrosion resistance and oxidation resistance, ensuring the quality and stability of the silicon wafer during the heating process. The base layer contact layer 10 is made of silicon nitride coating material. The anticorrosion functional layer 11 is made of yttrium oxide coating material. The surface functional layer 12 is made of silicon carbide coating material. The base layer contact layer 10 made of silicon nitride coating material is coated on the disc base layer 9 by chemical vapor deposition process. It has good compatibility with common semiconductor materials and good adhesion, can be tightly combined with the metal base, provides a solid foundation for the subsequent coating, can resist the corrosion of common chemical substances in the semiconductor manufacturing process to a certain extent, and preliminarily blocks the contact between the external corrosive medium and the heating disc base. Secondly, the anticorrosion functional layer 11 made of yttrium oxide coating material is sprayed onto the base layer contact layer 10 by thermal spraying technology. It can withstand the impact of external corrosive media, prevent them from penetrating into the base surface, provide long-term corrosion protection for the heating disc, and have stable performance in high-temperature environment. Its thermal conductivity is sufficient to meet the needs of semiconductor heating disc. Finally, the surface functional layer 12 made of silicon carbide coating material is coated on the anticorrosion functional layer 11 by chemical vapor deposition process. It can improve the surface properties of the heating disc, reduce the friction coefficient, avoid the adhesion of silicon wafers and the heating disc, further improve the corrosion resistance and oxidation resistance, and ensure the quality and stability of the silicon wafer during the heating process.

[0035] Reference Figure 3 and Figure 4The split assembly 5 comprises two locking blocks 16, the inner walls on both sides of the connecting groove 13 are provided with rebound grooves 14, the two locking blocks 16 are slidingly arranged in the corresponding rebound grooves 14, the two sides of the heat insulation frame 3 are provided with locking grooves 17, the two rebound grooves 14 are movably provided with connecting rods 15 at the front and rear positions, one end of the plurality of connecting rods 15 is fixedly connected with the corresponding locking block 16, the outer wall of the plurality of connecting rods 15 is movably sleeved with a return spring 18, the two locking blocks 16 are clampedly arranged in the corresponding locking grooves 17, and the two ends of the plurality of return springs 18 are fixedly connected with the opposite inner walls of the corresponding locking block 16 and the rebound groove 14. By clampingly arranging the locking block 16 in the corresponding locking groove 17 and effectively limiting the return spring 18, the heating disc body 1 and the base 2 can be combined and connected together. By providing the split assembly 5, when the heating part needs to be maintained or the heating disc body 1 needs to be cleaned and maintained or replaced, the combined connection and disassembly operation between the heating disc body 1 and the base 2 can be realized by controlling the movement of the locking block 16, which brings convenience to the maintenance and replacement work. One end of the two connecting rods 15 on one side penetrates the base 2 and is fixedly connected with a pull plate 19. By providing the pull plate 19, the operator can conveniently move the corresponding connecting rod 15 by pulling the pull plate 19.

[0036] Working principle: through the anticorrosion assembly 4, that is, through the base contact layer 10 made of silicon nitride coating material, which is compatible with the commonly used semiconductor materials and has good adhesion, can be tightly combined with the metal matrix, provides a solid foundation for the subsequent coating, and can resist the corrosion of common chemical substances in the semiconductor manufacturing process to a certain extent, and can prevent the contact of external corrosive media with the heating disc matrix, secondly, through the corrosion-resistant functional layer 11 made of yttrium oxide coating material, which can withstand the impact of external corrosive media and prevent its penetration to the surface of the matrix, providing long-term corrosion protection for the heating disc, and stable performance in high temperature environment, and its thermal conductivity is sufficient to meet the needs of the semiconductor heating disc, finally, through the surface functional layer 12 made of silicon carbide coating material, which can improve the surface performance of the heating disc, reduce the friction coefficient, avoid the adhesion of the silicon wafer to the heating disc, further improve the corrosion and oxidation resistance, and ensure the quality and stability of the silicon wafer during the heating process, and stable performance in high temperature and high vacuum environment of semiconductor manufacturing, in addition, the heat insulation frame 3 made of ceramic fiber material has very low thermal conductivity, which can effectively prevent heat conduction from the heating disc to the surrounding environment, reduce heat loss, improve the thermal efficiency of the heating disc, help maintain the temperature stability of the silicon wafer (wafer) during the heating process, and also improve the safety in use, avoid being scalded by mistake, finally, through the split assembly 5, when the heating part needs to be maintained, or the heating disc body 1 needs to be cleaned and maintained or replaced, the locking block 16 can be separated from the locking groove 17 by pulling the pull plate 19, that is, the locking of the heating disc body 1 can be unlocked, so that it can be separated from the base 2, and when the combination installation is completed, the heat insulation frame 3 is clamped into the connecting groove 13, and the locking block 16 is clamped into the locking groove 17 through the back spring 18, that is, the installation is completed.

[0037] Finally, it should be noted that: the above only describes the preferred specific embodiments of the present application, and is not used to limit the present application, although the present application has been described in detail with reference to the foregoing specific embodiments, for those skilled in the art, the technical solutions recorded in the foregoing specific embodiments can be modified, or some technical features can be replaced, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A long-life, corrosion-resistant heating plate, comprising a heating plate body (1) and a base (2), characterized in that: The heating plate body (1) is provided with an anti-corrosion component (4) inside. The outer wall of the heating plate body (1) is fixedly sleeved with a heat insulation frame (3). A splitting component (5) is provided between the heat insulation frame (3) and the base (2). The upper end of the base (2) is provided with a connecting groove (13) and an installation groove (6). The heat insulation frame (3) is engaged in the connecting groove (13). The anti-corrosion component (4) includes a plate base layer (9), which is disposed inside the heating plate body (1). A base contact layer (10) is provided at the upper end of the plate base layer (9), an anti-corrosion functional layer (11) is provided at the upper end of the base contact layer (10), and a surface functional layer (12) is provided at the upper end of the anti-corrosion functional layer (11).

2. The long-life, corrosion-resistant heating plate according to claim 1, characterized in that: The splitting assembly (5) includes two locking blocks (16). The inner walls of both sides of the connecting groove (13) are provided with spring grooves (14). The two locking blocks (16) are slidably disposed in the corresponding spring grooves (14). The heat insulation frame (3) is provided with locking grooves (17) on both sides. The inner front and rear parts of the two spring grooves (14) are provided with connecting rods (15). One end of the multiple connecting rods (15) is fixedly connected to the corresponding locking block (16). The outer walls of the multiple connecting rods (15) are movably sleeved with return springs (18).

3. The long-life, corrosion-resistant heating plate according to claim 1, characterized in that: A heating tube (7) is fixedly installed inside the mounting groove (6). A contact groove (8) is provided at the lower end of the heating plate body (1). The heating tube (7) is arranged correspondingly to the contact groove (8) and is in contact with the inner wall of the contact groove (8).

4. The long-life, corrosion-resistant heating plate according to claim 1, characterized in that: The base contact layer (10) is made of silicon nitride coating material, the anti-corrosion functional layer (11) is made of yttrium oxide coating material, and the surface functional layer (12) is made of silicon carbide coating material.

5. A long-life, corrosion-resistant heating plate according to claim 2, characterized in that: Both locking blocks (16) are engaged in the corresponding locking grooves (17), and the two ends of the plurality of return springs (18) are respectively fixedly connected to the inner wall of the opposite side of the corresponding locking block (16) and the return groove (14).

6. The long-life, corrosion-resistant heating plate according to claim 1, characterized in that: The base layer (9) of the disc is made of aluminum alloy.

7. A long-life, corrosion-resistant heating plate according to claim 1, characterized in that: The heat-insulating frame (3) is made of ceramic fiber material.

8. A long-life, corrosion-resistant heating plate according to claim 2, characterized in that: One end of each of the two connecting rods (15) located on one side passes through the base (2) and is fixedly connected to a pull plate (19).

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