Aluminum nitride copper-clad ceramic plate

Abstract

The utility model discloses an aluminum nitride copper-clad ceramic plate which comprises a flexible layer, base material layers are arranged on the upper surface and the lower surface of the flexible layer, the base material layers are aluminum nitride ceramic plates, the lower surface of the base material layer on the lower side is fixedly connected with a heat dissipation layer, and the upper surface of the base material layer on the upper side is fixedly connected with a circuit layer. The upper surface of the circuit layer is fixedly connected with an insulating layer; the protection mechanism comprises a waterproof layer I, insertion blocks, a waterproof layer II and a water absorption layer, the waterproof layer II is fixedly connected to the upper surface of the insulating layer, insertion holes are uniformly formed in the waterproof layer II, the waterproof layer I is arranged on the upper side of the waterproof layer II, the insertion blocks are fixedly connected to the lower surface of the waterproof layer I, and the insertion blocks are uniformly distributed. According to the aluminum nitride copper-clad ceramic plate, the protection strength of the aluminum nitride copper-clad ceramic plate is improved, and the service life of the aluminum nitride copper-clad ceramic plate is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to ceramic substrate technical field, concretely is a kind of aluminium nitride copper clad ceramic plate. BACKGROUND

[0002] In many high-power high-frequency electronic devices when running, a lot of heat is often generated, in order to be able to carry these high-frequency electronic devices, usually use aluminium nitride copper clad ceramic plate as carrier, to realize and high-frequency electronic device circuit interconnection can give consideration to high thermal conductivity, electrical insulation and mechanical strength simultaneously;

[0003] Prior art: the patent of authorized publication number CN205900527U discloses a kind of aluminium nitride copper clad ceramic plate, including flexible layer and the base material layer of aluminium nitride ceramic plate being set on the both sides of the flexible layer, there is film layer on the side of the base material layer away from the base material layer, the flexible layer is silicon nitride ceramic plate, there is heat-conducting adhesive layer between the base material layer and the flexible layer;

[0004] This kind of aluminium nitride copper clad ceramic plate has the following shortcomings: base material layer is externally provided with copper clad plate, but copper clad plate lacks encapsulation protection, is prone to corrosion or damage, leading to the service life of aluminium nitride copper clad ceramic plate is lower, for this, we propose a kind of aluminium nitride copper clad ceramic plate. UTILITY MODEL CONTENT

[0005] The utility model solves the technical problems of overcoming the defects of the prior art, providing an aluminium nitride copper clad ceramic plate, which is waterproofed by a protection mechanism, prevents moisture in the air from entering the interior of the aluminium nitride copper clad ceramic plate through two waterproof layers and a water-absorbing layer, avoids corrosion of the circuit layer by external liquid, and avoids hydrolysis reaction of aluminium nitride when it comes into contact with water, thereby improving the protection strength of the aluminium nitride copper clad ceramic plate and the service life of the aluminium nitride copper clad ceramic plate, and effectively solving the problems in the background art.

[0006] To achieve the above object, the utility model provides the following technical scheme: an aluminium nitride copper clad ceramic plate, comprising a flexible layer, the upper and lower surfaces of the flexible layer are provided with base material layers, the base material layers are aluminium nitride ceramic plates, the lower surface of the lower base material layer is fixedly connected with a heat dissipation layer, the upper surface of the upper base material layer is fixedly connected with a circuit layer, the upper surface of the circuit layer is fixedly connected with an insulating layer, and further comprising a protection mechanism.

[0007] The protection mechanism comprises a waterproof layer one, a plug-in block, a waterproof layer two and a water absorption layer, the upper surface of the insulation layer is fixedly connected with the waterproof layer two, the waterproof layer two is internally provided with uniformly distributed insertion holes, the upper side of the waterproof layer two is provided with the waterproof layer one, the lower surface of the waterproof layer one is fixedly connected with uniformly distributed plug-in blocks, the plug-in blocks are all plugged into vertically adjacent insertion holes, and the waterproof layer two and the waterproof layer one are provided with the water absorption layer.

[0008] Further, the heat dissipation layer and the circuit layer are both copper-clad layers, heat conduction and precise circuit are formed.

[0009] Further, the waterproof layer one and the waterproof layer two are both epoxy resin layers, water is prevented from entering the inside of the aluminum nitride copper-clad ceramic plate.

[0010] Further, the water absorption layer is a high-molecular hygroscopic resin layer, water or various liquids entering the inside of the aluminum nitride copper-clad ceramic plate is absorbed.

[0011] Further, the flexible layer is a silicon nitride ceramic plate, the overall strength and impact resistance of the aluminum nitride copper-clad ceramic plate are improved.

[0012] Further, the insulation layer is an organic resin layer, the circuit layer is insulated and protected.

[0013] Further, the whole of the heat dissipation layer, the waterproof layer one, the waterproof layer two, the water absorption layer, the insulation layer, the circuit layer, the flexible layer and the base material layer is provided with uniformly distributed and vertically penetrating mounting holes at four corners, so that external components can be fixedly connected.

[0014] Compared with the prior art, the aluminum nitride copper-clad ceramic plate has the following advantages:

[0015] The circuit layer of the aluminum nitride copper-clad ceramic plate is waterproof protected by the protection mechanism, water in the air is prevented from entering the inside of the aluminum nitride copper-clad ceramic plate by the two waterproof layers and the water absorption layer, the circuit layer is prevented from being corroded by external liquids, and the aluminum nitride is prevented from hydrolyzing when meeting water, so that the protection strength of the aluminum nitride copper-clad ceramic plate is improved, and the service life of the aluminum nitride copper-clad ceramic plate is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is a structural schematic view of the utility model;

[0017] Fig. 2 The cross-sectional structure schematic view of the present application.

[0018] In the figure: 1 heat dissipation layer, 2 protection mechanism, 21 waterproof layer one, 22 plug-in block, 23 waterproof layer two, 24 water absorption layer, 3 insulation layer, 4 circuit layer, 5 flexible layer, 6 base material layer. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0020] Please refer to Figs. 1-2 The present embodiment provides a technical solution: an aluminum nitride copper-clad ceramic plate, which comprises a flexible layer 5, the flexible layer 5 is a silicon nitride ceramic plate, the upper and lower surfaces of the flexible layer 5 are provided with base material layers 6, the base material layers 6 are aluminum nitride ceramic plates, the flexible layer 5 is arranged inside the two base material layers 6, the bending strength of silicon nitride is greater than that of aluminum nitride, so as to improve the strength and impact resistance of the aluminum nitride copper-clad ceramic plate, the lower surface of the lower base material layer 6 is fixedly connected with a heat dissipation layer 1, the upper surface of the upper base material layer 6 is fixedly connected with a circuit layer 4, the heat dissipation layer 1 and the circuit layer 4 are both copper-clad layers, the heat dissipation layer 1 is a relatively thick copper-clad layer, which is used for heat dissipation of the inside of the aluminum nitride copper-clad ceramic plate, the circuit layer 4 is a high-precision circuit formed by etching a relatively thin copper-clad layer, which realizes the electrical interconnection of electronic devices, the upper surface of the circuit layer 4 is fixedly connected with an insulation layer 3, the insulation layer 3 is an organic resin layer, the insulation layer 3 uses the organic resin layer to insulate and protect the circuit layer 4, and the aluminum nitride copper-clad ceramic plate further comprises a protection mechanism 2.

[0021] The protection mechanism 2 comprises a waterproof layer one 21, a plug-in block 22, a waterproof layer two 23 and a water absorption layer 24, the upper surface of the insulation layer 3 is fixedly connected with the waterproof layer two 23, the waterproof layer two 23 is internally provided with uniformly distributed insertion holes, the upper side of the waterproof layer two 23 is provided with the waterproof layer one 21, the lower surface of the waterproof layer one 21 is fixedly connected with uniformly distributed plug-in blocks 22, the plug-in blocks 22 are all plugged into vertically adjacent insertion holes, the waterproof layer two 23 is provided with the water absorption layer 24 between the waterproof layer two 23 and the waterproof layer one 21, the waterproof layer one 21 and the waterproof layer two 23 are all epoxy resin layers, the water absorption layer 24 is a high polymer hygroscopic resin layer, the waterproof layer one 21 and the waterproof layer two 23 are used for waterproof protection of the aluminum nitride copper-clad ceramic plate, meanwhile, the water absorption layer 24 between the waterproof layer one 21 and the waterproof layer two 23 can completely absorb the penetrated water molecules, the waterproof layer one 21 is pulled upwards, the plug-in blocks 22 are pulled out from the insertion slots, and then the water absorption layer 24 can be removed, so that the water absorption layer 24 can be replaced, and the whole of the heat dissipation layer 1, the waterproof layer one 21, the waterproof layer two 23, the water absorption layer 24, the insulation layer 3, the circuit layer 4, the flexible layer 5 and the base material layer 6 is provided with uniformly distributed and vertically penetrating mounting holes in four corners, and can be fixedly installed with external devices through the mounting holes.

[0022] The working principle of the aluminum nitride copper-clad ceramic plate is as follows: the aluminum nitride copper-clad ceramic plate can be fixedly installed with external devices through the mounting holes, the flexible layer 5 is arranged in the two base material layers 6, the bending strength of the silicon nitride is greater than that of the aluminum nitride, so that the strength and impact resistance of the aluminum nitride copper-clad ceramic plate are improved, the heat dissipation layer 1 is a relatively thick copper-clad layer and is used for heat dissipation of the inside of the aluminum nitride copper-clad ceramic plate, the circuit layer 4 is a high-precision circuit formed by etching of a relatively thin copper-clad layer, realizes electrical interconnection of electronic devices, the insulation layer 3 uses an organic resin layer and insulates and protects the circuit layer 4, the waterproof layer one 21 and the waterproof layer two 23 are used for waterproof protection of the aluminum nitride copper-clad ceramic plate, meanwhile, the water absorption layer 24 between the waterproof layer one 21 and the waterproof layer two 23 can completely absorb the penetrated water molecules, the waterproof layer one 21 is pulled upwards, the plug-in blocks 22 are pulled out from the insertion slots, and then the water absorption layer 24 can be removed, so that the water absorption layer 24 can be replaced.

[0023] The above is only an embodiment of the utility model, and does not limit the patent range of the utility model, and equivalent structures or equivalent process transformations using the utility model specification and drawing contents, or direct or indirect application in other related technical fields, are all included in the patent protection range of the utility model.

Claims

1. An aluminum nitride copper-clad ceramic plate, comprising a flexible layer (5), the upper and lower surfaces of the flexible layer (5) are provided with a substrate layer (6), the substrate layer (6) is an aluminum nitride ceramic plate, the lower surface of the lower substrate layer (6) is fixedly connected with a heat dissipation layer (1), the upper surface of the upper substrate layer (6) is fixedly connected with a circuit layer (4), and the upper surface of the circuit layer (4) is fixedly connected with an insulating layer (3), characterized in that: The protection mechanism (2) is also included; The protection mechanism (2) comprises a waterproof layer one (21), a plug block (22), a waterproof layer two (23) and a water absorption layer (24), the upper surface of the insulation layer (3) is fixedly connected with the waterproof layer two (23), the waterproof layer two (23) is internally provided with uniformly distributed insertion holes, the upper side of the waterproof layer two (23) is provided with the waterproof layer one (21), the lower surface of the waterproof layer one (21) is fixedly connected with uniformly distributed plug blocks (22), the plug blocks (22) are all inserted into vertically adjacent insertion holes, and the waterproof layer two (23) and the waterproof layer one (21) are provided with the water absorption layer (24) therebetween.

2. The aluminum nitride copper clad ceramic sheet according to claim 1, wherein: The heat dissipation layer (1) and the circuit layer (4) are both copper-clad layers.

3. The aluminum nitride copper clad ceramic sheet according to claim 1, wherein: The waterproof layer one (21) and the waterproof layer two (23) are both epoxy resin layers.

4. The aluminum nitride CCL according to claim 1, wherein: The water absorption layer (24) is a high polymer hygroscopic resin layer.

5. The aluminum nitride copper clad ceramic slab of claim 1 wherein: The flexible layer (5) is a silicon nitride ceramic plate.

6. The aluminum nitride CCL according to claim 1, wherein: The insulation layer (3) is an organic resin layer.

7. The aluminum nitride CCL according to claim 1, wherein: The whole of the heat dissipation layer (1), the waterproof layer one (21), the waterproof layer two (23), the water absorption layer (24), the insulation layer (3), the circuit layer (4), the flexible layer (5) and the base material layer (6) is provided with uniformly distributed and vertically penetrating mounting holes at four corners.

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