Vapor chamber
By incorporating an integrally molded support and phase change component within the heat spreader, the problems of poor heat dissipation and high processing costs resulting from increased volume are solved. This achieves efficient heat dissipation and flexible installation of functional modules, making it suitable for high power density equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2026-03-27
AI Technical Summary
Existing heat dissipation plates, when their volume increases, have poor heat dissipation performance, and the separate molding of the support structure leads to high processing costs, long processing time, and severe deformation, affecting the bonding effect with the heat source.
The system employs integrated support components and phase change components. The support components include small and large support columns, while the phase change components are filled into the recessed areas to increase the contact area with the heat source and prevent deformation. Functional modules can also be installed in the recessed areas.
It improves the heat dissipation efficiency of the heat spreader, ensures that the contact surface with the heat source does not deform, simplifies the processing, reduces thermal resistance, and is suitable for high power density electronic devices and industrial equipment.
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Figure CN224054610U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of heat dissipation, particularly to a uniform heating plate. BACKGROUND
[0002] Nowadays, the popularization rate of electronic equipment is very high, and mobile phones, computers and new energy vehicles have appeared in different corners of society to provide services for people. However, electronic equipment inevitably generates heat during operation, especially in the battery, and if heat dissipation is not timely, a large amount of heat accumulation will affect the normal operation of electronic equipment. Therefore, heat dissipation devices are commonly provided in electronic equipment.
[0003] Among them, the uniform heating plate is a common heat dissipation device, and its working principle is: filling liquid working medium in the uniform heating plate, when the electronic equipment operates, the heat generated by the heat source is absorbed by the uniform heating plate, the liquid working medium in the uniform heating plate evaporates into steam after being heated, the steam expands rapidly and moves from the high-pressure heating area close to the heat source to the low-pressure cooling area away from the heat source due to the absorption of heat, and finally condenses into liquid in the cooling area and releases heat, and the liquid returns to the heating area through capillary action to form a cycle. As can be seen, the factors affecting the heat dissipation effect of the uniform heating plate include the heat dissipation area, material and heat conduction performance of the uniform heating plate. Therefore, in theory, the heat dissipation efficiency can be improved by increasing the heat dissipation area of the uniform heating plate and increasing the amount of working medium, and the volume of the uniform heating plate can be increased to set a large cavity inside to achieve the above purposes at the same time. However, people have found that after increasing the cavity volume of the uniform heating plate, the heat dissipation effect does not increase significantly, but rather, when the volume increases to a certain extent, the heat dissipation effect becomes worse. SUMMARY
[0004] Therefore, the purpose of the utility model is to overcome the defects or deficiencies of the prior art, and to provide a uniform heating plate. The utility model is realized by the following technical solutions:
[0005] A uniform heating plate, comprising a shell, a cover plate, a liquid absorbing core and a support; the shell has a semi-sealed structure, the cover plate is covered on the shell to form a sealed cavity, and the liquid absorbing core is arranged in the sealed cavity; one of the outer bottom surface of the shell or the outer side plate surface of the cover plate serves as a heat dissipation surface for contacting with a heat source; the support comprises a small support column, the small support column is integrally formed with the shell or the cover plate provided with the heat dissipation surface, and connects between the shell and the cover plate; the small support column is provided with a first recess extending to the sealed cavity on one side close to the heat dissipation surface; the first recess is provided with a phase change element with an outer end surface flush with the heat dissipation surface.
[0006] Compared with the prior art, the uniform heating plate is provided with the support member integrally formed with the shell or the cover plate, so that the processing is simplified, the deformation is avoided, the uniform heating plate can be kept in contact with the heat source, and the heat dissipation effect is ensured.
[0007] In one embodiment, in the direction in which the shell is directed to the cover plate, the cross-sectional area of the first recess close to one side of the heat dissipation surface is greater than that of the other side, so as to provide a draft angle, facilitate processing, and further increase the contact area of the phase change member and the heat source and reduce the thermal resistance.
[0008] In one embodiment, the support member further comprises a large support column integrally formed with the shell or the cover plate provided with the heat dissipation surface and connected between the shell and the cover plate; the large support column is located between the small support columns, and the cross-sectional area of the large support column close to the heat dissipation surface is greater than that of the small support columns close to the heat dissipation surface, so as to improve the support capacity.
[0009] In one embodiment, the thickness of the liquid absorption core is less than the height of the small support column and the large support column, so as to form a space for storing gas working medium in the sealed cavity.
[0010] In one embodiment, after the shell and the cover plate are fixed together, a passivation layer is arranged on the outer side of the shell and the cover plate, so as to improve the corrosion resistance of the uniform heating plate.
[0011] In one embodiment, the shell and / or the cover plate are stainless steel parts, and the passivation layer is a chromium oxide film, so as to form a dense passivation layer.
[0012] In one embodiment, a functional module is further included; the outer side of the shell or the cover plate without the heat dissipation surface is provided with a functional module mounting surface facing away from the heat dissipation surface, the functional module is mounted on the functional module mounting surface, the large support column is provided with a turning plate hole close to the functional module mounting surface, the hole wall of the turning plate hole extends in the sealed cavity, and a mounting hole communicating with the turning edge hole is arranged on the functional module mounting surface, so as to realize the expansion of functions, and the functional module is mounted on the functional module mounting surface through bolts, the large support column provides a large support force to the functional module, and the deformation caused by the functional module is reduced.
[0013] In one embodiment, the large support column is provided with a second recess close to the heat dissipation surface, the turning plate hole is located in the second recess, so that the turning plate hole can be close to the middle part of the large support column, and the large support column can better provide support to the functional module.
[0014] In one embodiment, the functional module is a heat dissipation fin, which realizes heat dissipation of high-power-density electronic devices or industrial devices.
[0015] In one embodiment, the inner bottom surface edge of the shell is provided with a side wall extending towards the cover plate, and the side wall is provided with a liquid injection channel in communication with the sealed cavity, so as to facilitate injection of the liquid working medium.
[0016] For better understanding and implementation, the utility model is described in detail below with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is an exploded schematic view of the overall structure of the vapor chamber of the utility model;
[0018] Figure 2 It is a front view of the vapor chamber of the utility model;
[0019] Figure 3 It is a partial cutaway projection view after cutting along the line A-A; Figure 2
[0020] Figure 4 It is a partial cutaway exploded view after cutting along the line B-B; Figure 2
[0021] Figure 5 It is an exploded schematic view when the cover plate of the utility model is installed to the shell;
[0022] Figure 6 It is an exploded schematic view when the functional module of the utility model is installed to the cover plate;
[0023] Figure 7 It is a flow chart of the manufacturing process of the vapor chamber of the utility model in one embodiment.
[0024] Reference signs: 10, shell; 11, side wall; 12, opening part; 13, liquid injection channel; 20, cover plate; 21, mounting hole; 30, liquid absorbing core; 31, through hole; 40, support; 41, small support column; 411, first recessed part; 412, phase change part; 42, large support column; 421, second recessed part; 422, flange hole; 50, passivation layer; 60, functional module; 61, threaded hole; 70, heat-conducting silicone grease layer; 100, heat source. DETAILED DESCRIPTION
[0025] Applicant found that although the contact area with heat source and the contained working quality will increase when the volume of the heat plate increases, the span of the heat dissipation surface will increase, especially in the length direction, so that the deformation is prone to occur in the middle part, which leads to the heat plate not being able to completely adhere to the heat source and reduces the heat dissipation capacity. This situation is particularly serious when the heat dissipation surface of the heat plate increases to a certain extent. If other functional modules are added to the heat plate, the deformation will be aggravated. Applicant also found that although some supporting structures can be provided in the heat plate to reduce the deformation, if the heat plate and the supporting structure are formed separately, different molds and processes need to be used for processing, which leads to high cost, long processing time and additional labor for installing the supporting structure. Therefore, the heat plate and the supporting structure can be integrally formed, but due to the limitation of processing technology and thickness uniformity, the corresponding recess structure needs to be provided on the heat plate corresponding to the supporting structure. However, the recess structure reduces the contact area between the surface of the heat plate and other components, which affects the heat dissipation effect.
[0026] To solve the above problems, the applicant provides a heat plate. A supporting member is provided in the heat plate to prevent deformation, and a recess structure is provided on the outer side of the heat plate corresponding to the supporting member. A phase change member made of a phase change material is filled in the recess structure, so that the outer surface of the heat plate remains flat, ensuring the contact area with other components and improving the heat dissipation effect. In addition, the supporting member includes small supporting columns and large supporting columns, which can be used to install different functional modules as needed, improving the applicability of the heat plate. The following is one specific embodiment of the heat plate:
[0027] Please refer to Figure 1 The heat plate provided in the present application includes a shell 10, a cover plate 20, a wick 30 and a supporting member 40. The shell 10 is a semi-closed structure, the cover plate 20 is attached to the shell 10 to form a sealed cavity (not labeled) between the shell 10 and the cover plate 20, and the wick 30 and the supporting member 40 are arranged in the sealed cavity. The wick 30 is attached to the inner side of one of the shell 10 or the cover plate 20 according to the position of the heat source 100, and is separated from the inner side of the other by a certain distance. For example, when the outer bottom surface of the shell 10 is in contact with the heat source 100, the wick 30 is arranged on the outer bottom surface of the shell 10. The supporting members 40 are evenly spaced between the shell 10 and the cover plate 20 to support the sealed cavity and prevent it from deforming.
[0028] Specifically, in the embodiment, the outer bottom surface of the shell 10 is used as a heat dissipation surface and is in contact with the heat source 100. The shell 10 is a semi-enclosed rectangular box body, a side wall 11 is protruded upward around the inner bottom surface edge of the shell 10 to form an open portion 12 at the top thereof, and a liquid injection channel 13 is formed in the side wall 11 and is in communication with the inside of the shell 10. The liquid working medium can be injected into the inside of the shell 10 through the liquid injection channel 13.
[0029] The cover plate 20 is a plate member and is covered on the open portion 12 of the shell 10. One side plate surface thereof is in contact with the side wall 11 and is parallel to the bottom surface of the shell 10, so as to form a sealed cavity between the shell 10 and the cover plate 20.
[0030] The liquid absorbing core 30 is laid on the inner bottom surface of the shell 10 and is used for realizing capillary backflow. The liquid absorbing core 30 can be, but is not limited to, a stainless steel fiber felt member, a metal wire mesh or a powder sintering member, etc.
[0031] The support member 40 includes a plurality of small support columns 41 and large support columns 42 which are arranged on the inner bottom surface of the shell 10. Correspondingly, the thickness of the liquid absorbing core 30 is smaller than the height of the small support columns 41 and the large support columns 42, and the small support columns 41 and the large support columns 42 are provided with through holes 31 corresponding to the small support columns 41 and the large support columns 42. The small support columns 41 and the large support columns 42 pass through the through holes 31 to position the liquid absorbing core 30.
[0032] The plurality of small support columns 41 are uniformly protruded on the inner bottom surface of the shell 10 and are connected between the inner bottom surface of the shell 10 and the cover plate 20 to support the shell 10 and the cover plate 20 and prevent them from collapsing and deforming into the sealed cavity. The small support columns 41 are integrally formed with the shell 10 and are provided with first recessed portions 411 extending into the sealed cavity on the side close to the outer bottom surface of the shell 10. The openings of the first recessed portions 411 are outwardly directed, and phase change members 412 are arranged in the first recessed portions 411. The phase change members 412 can be made of a single phase change material such as paraffin or fatty acid, or a composite phase change material such as paraffin and expanded graphite or paraffin and graphene. The phase change material is filled into the first recessed portions 411, and the outer end surface of the phase change material is flush with the outer bottom surface of the shell 10. By arranging the phase change members 412 in the first recessed portions 411, the actual contact area with the heat source 100 can be increased, the thermal resistance can be significantly reduced, and the heat dissipation efficiency can be improved. Preferably, in the direction in which the outer bottom surface of the shell 10 points to the cover plate 20, the cross-sectional area of the first recessed portion 411 close to the outer bottom surface of the shell 10 is greater than the cross-sectional area close to the cover plate 20, so as to form a draft angle for facilitating processing and increasing the contact area of the phase change member 412 with the heat source 100.
[0033] The large support column 42 is projected on the inner bottom surface of the shell 10 between the small support columns 41 in a direction perpendicular to the inner bottom surface of the shell 10, and is provided with a second recessed portion 421 extending toward the sealed space on the side close to the outer bottom surface of the shell 10. The opening of the second recessed portion 421 is directed outward, and in the direction of the outer bottom surface of the shell 10 pointing to the cover plate 20, the cross-sectional area of the side of the second recessed portion 421 close to the outer bottom surface of the shell 10 is larger than that of the side close to the cover plate 20, and the inner diameter of the side of the second recessed portion 421 close to the outer bottom surface of the shell 10 is larger than that of the side of the first recessed portion 411 close to the outer bottom surface of the shell 10. A flange hole 422 is formed in the middle of the side of the large support column 42 close to the cover plate 20, the hole wall of the flange hole 422 extends toward the inner bottom surface of the shell 10 and is located in the second recessed portion 421. Correspondingly, the mounting hole 21 formed in the cover plate 20 and communicated with the flange hole 422 can fix the shell 10 and the cover plate 20 together after a screw is screwed into the mounting hole 21 and the flange hole 422. In addition, the outer side surface of the cover plate 20 can also serve as a functional module mounting surface for mounting a functional module 60, and the large support column 42 provides support for the cover plate 20 with the functional module 60 mounted thereon, and the functional module 60 can also be positioned on the cover plate 20 by a bolt or the like mounted in the flange hole 422. When the large support column 42 is used to mount a functional module, its position on the inner bottom surface of the shell 10 is determined according to the mounting position of the functional module 60 on the cover plate 20. Due to the support of the small support columns 41 and the large support column 42, even if the shell 10 and the cover plate 20 are enlarged or the functional module 60 is arranged above, the sealed space can still maintain its shape without collapsing or deforming.
[0034] Further, the outer side surfaces of the shell 10 and the cover plate 20 are provided with a passivation layer 50 through passivation treatment to improve corrosion resistance. In this embodiment, the shell 10 and the cover plate 20 are stainless steel parts, and after being mounted together, the shell 10 and the cover plate 20 are provided with a dense chromium oxide film as the passivation layer 50 through passivation treatment on their outer sides.
[0035] Further, in the present embodiment, the functional module 60 is a heat dissipation fin, and a threaded hole 61 matched with the flange hole 422 is formed on the functional module 60, and the functional module 60 is fixed to the outer side plate surface of the cover plate 20 by bolts or the like. In addition, a heat-conducting silicone grease layer 70 can also be laid between the outer side surface of the cover plate 20 and the functional module 60 to reduce thermal resistance and improve heat conduction efficiency. Through the bolt mounting mode, various functional modules 60 can be flexibly arranged as needed, and the functional module 60 can also be replaced in time when it fails, facilitating the maintenance of the equipment. When the functional module 60 is a heat dissipation fin, the efficiency of heat dissipation can be improved, especially after the vapor chamber is arranged in an environment of forced convection cooling, the combination of the heat dissipation fin can significantly improve the overall heat dissipation effect, and is particularly suitable for the heat dissipation of high-power-density electronic equipment or industrial equipment. The specific structure of the heat dissipation fin can be referred to the existing design, which will not be described in detail here.
[0036] In addition, it can be understood that, in the present embodiment, the outer bottom surface of the shell 10 serves as a heat dissipation surface in contact with a heat source, and the outer side plate surface of the cover plate 20 serves as a functional module mounting surface for mounting the functional module 60, but according to actual needs, the outer bottom surface of the shell 10 can also serve as the functional module mounting surface, and the outer side plate surface of the cover plate 20 can serve as the heat dissipation surface, and the position of the support 40 is adjusted accordingly at this time.
[0037] In the present embodiment, referring to Figure 7 , the support 40 is integrally formed with the shell 10 by a stamping process, and the manufacturing of the vapor chamber includes the following steps:
[0038] S10: Process a plate material such as stainless steel by a stamping process to obtain a shell 10 provided with the small support column 41, the large support column 42 and the liquid injection channel 13, and punch out the flange hole 422 at the top of the large support column 42.
[0039] S20: Obtain the cover plate 20 provided with the mounting hole 21 by a stamping process.
[0040] S30: Lay the wick 30 on the inner bottom surface of the shell 10.
[0041] To ensure that the wick 30 is tightly attached to the inner wall of the sealed cavity, it can be fixed to the inner bottom surface of the shell 10 or the inner side plate surface of the cover plate 20 by vacuum sintering or the like.
[0042] S40: Cover the cover plate 20 on the opening of the shell 10, and fix the two together by brazing or laser welding or the like.
[0043] S50: clean the outer side of the shell 10 and the cover plate 20, and perform passivation treatment to set the passivation layer 50 on the outer side of both.
[0044] S60: fill the first recess 411 with a phase change material to form the phase change piece 412, so that the outer end surface is flush with the outer bottom surface of the shell 10, and the actual contact area with the heat source 100 is increased.
[0045] S70: lay the thermally conductive silicone grease layer 70 on the outer side plate surface of the cover plate 20, install the functional module 60 on the outer side plate surface of the cover plate 20, and fix them with bolts or the like.
[0046] S80: after injecting the liquid working medium into the sealed cavity through the liquid injection channel 13, seal the liquid injection channel 13.
[0047] Compared with the prior art, the uniform heating plate has the following advantages:
[0048] 1. The uniform heating plate is not easy to deform, and the contact surface with the heat source is guaranteed, and the heat dissipation efficiency is high;
[0049] 2. Convenient to process, high production efficiency;
[0050] 3. Corrosion resistance;
[0051] 4. Can expand the function, especially beneficial to the heat dissipation of high-power-density electronic equipment or industrial equipment.
[0052] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the utility model. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more
[0053] The above-described embodiments only express several embodiments of the utility model, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the utility model patent. It should be pointed out that for ordinary skilled persons in the art, without departing from the concept of the utility model, a number of modifications and improvements can be made, which all belong to the protection scope of the utility model.
Claims
1. A vapor chamber comprising a housing, a cover plate, and a wick; the housing has a semi-sealed structure, the cover plate is attached to the housing to form a sealed cavity, and the wick is arranged in the sealed cavity; one of the outer bottom surface of the housing or the outer side plate surface of the cover plate serves as a heat dissipation surface for contacting a heat source; characterized in that, Also included are: The support includes small support columns which are integrally formed with the shell or cover plate provided with the heat dissipation surface and connect between the shell and the cover plate; the small support columns are provided with first recesses extending toward the sealed cavity on the side close to the heat dissipation surface; the first recesses are provided with phase change elements with outer end surfaces flush with the heat dissipation surface.
2. The vapor chamber of claim 1, wherein: In the direction of the shell pointing to the cover plate, the cross-sectional area of the first recess on the side close to the heat dissipation surface is larger than that on the other side.
3. The vapor chamber of claim 1, wherein: The support further includes large support columns which are integrally formed with the shell or cover plate provided with the heat dissipation surface and connect between the shell and the cover plate; the large support columns are located between the small support columns, and the cross-sectional area of the large support columns on the side close to the heat dissipation surface is larger than that of the small support columns on the side close to the heat dissipation surface.
4. The vapor chamber of claim 3, wherein: The thickness of the liquid absorption core is smaller than the height of the small support columns and the large support columns.
5. The vapor chamber of claim 3, wherein: After the shell and the cover plate are fixed together, the outer side of the shell and the cover plate is provided with a passivation layer.
6. The vapor chamber of claim 5, wherein: The shell and / or the cover plate are stainless steel parts, and the passivation layer is a chromium oxide film.
7. The vapor chamber of claim 3, wherein: Also included are functional modules; the outer side of the shell or cover plate without the heat dissipation surface is provided with a functional module mounting surface facing away from the heat dissipation surface, the functional modules are mounted on the functional module mounting surface; the large support columns are provided with flanged holes on the side close to the functional module mounting surface, the flanged hole walls extend within the sealed cavity; the functional module mounting surface is provided with mounting holes communicating with the flanged holes.
8. The vapor chamber of claim 7, wherein: The large support columns are provided with second recesses extending toward the sealed cavity on the side close to the heat dissipation surface, and the flanged holes are located within the second recesses.
9. The vapor chamber of claim 8, wherein: The functional modules are heat dissipation fins.
10. The vapor chamber of claim 1, wherein: The inner bottom surface of the shell is provided with a side wall extending toward the cover plate, and the side wall is provided with a liquid injection channel communicating with the sealed cavity.