Domain controller and movable platform
By adding protrusions to the domain controller's housing to provide stable support, the problem of circuit board warping around the chip is solved, heat dissipation is ensured, and the information processing capability of the domain controller is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2026-03-27
AI Technical Summary
Under high-temperature conditions, the circuit board around the domain controller chip is prone to warping, causing the chip to separate from the thermal adhesive layer and affecting the heat dissipation effect.
A raised portion is provided on the outer casing, which abuts against the side of the circuit board away from the chip, providing stable support, dispersing the stress on the circuit board, reducing the chance of warping, and preventing the chip from separating from the thermal adhesive layer.
This effectively reduces the chance of circuit board warping, ensures good heat dissipation for chips, prevents degradation of heat dissipation performance, and guarantees the information processing capability of the domain controller.
Smart Images
Figure CN224054617U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of domain controller manufacturing, in particular to a domain controller and a movable platform. BACKGROUND
[0002] The domain controller is a key network server for managing and controlling computers, users and resources within a domain. In the field of vehicles, the domain controller is responsible for managing and controlling various functions of the vehicle, including but not limited to powertrain, chassis control and information processing of the intelligent cockpit, etc. Since the domain controller needs to process a large amount of information, the heat dissipation performance of the domain controller directly affects its information processing capability.
[0003] In the related art, the domain controller includes a shell, a circuit board, a chip and a heat sink arranged in the shell, the chip is arranged on the circuit board, and the side of the chip away from the circuit board is in abutment with the heat sink through a heat dissipation adhesive layer. In use, the heat generated by the chip can be quickly conducted to the heat sink through the heat dissipation adhesive layer, thereby reducing the temperature of the chip and ensuring that the domain controller has good information processing capability.
[0004] However, when the temperature of the chip is high, the circuit board around the chip may be warped, causing the chip to separate from the heat dissipation adhesive layer in some areas, thereby affecting the normal heat dissipation of the chip. Invention content
[0005] In order to overcome the above-mentioned defects in the related art, the purpose of the present application is to provide a domain controller and a movable platform, which can reduce the probability of warping of the circuit board, avoid separation of the chip from the heat dissipation adhesive layer, and ensure that the chip has good heat dissipation effect.
[0006] On the one hand, the present application provides a domain controller, comprising a shell, a heat sink and a circuit board are arranged in the shell, a chip is arranged on the side of the circuit board facing the heat sink, the chip is connected with the heat sink through a heat dissipation adhesive layer, the shell is further provided with a protruding part, the protruding part is in abutment with the side of the circuit board away from the chip, in the plane parallel to the circuit board, the projection of the chip is located within the outer contour of the projection of the protruding part.
[0007] In one possible implementation, the protruding part is in the shape of a prism, in the plane parallel to the circuit board, the projection shape of the protruding part is similar to the projection shape of the chip, and the projection of the chip is located within the projection range of the protruding part.
[0008] In one possible implementation, the protruding part includes a plurality of partition ribs, the first ends of the plurality of partition ribs are connected to each other, and the second ends of the plurality of partition ribs are arranged at intervals.
[0009] In a plane parallel to the circuit board, a projection of the chip is located within an outer contour of projections of the plurality of partitions.
[0010] In a possible implementation, in a plane parallel to the circuit board, a projection center of the chip coincides with a projection of the first end of the plurality of partitions.
[0011] In a possible implementation, the raised portion comprises a plurality of convex edges and a plurality of partitions, the plurality of convex edges are connected in sequence, the first end of the plurality of partitions are connected to the intersection of two adjacent convex edges of the plurality of convex edges respectively, and the second end of the plurality of partitions are arranged at intervals.
[0012] In a plane parallel to the circuit board, a projection of the chip is located within an outer contour of projections of the plurality of partitions.
[0013] In a possible implementation, in a plane parallel to the circuit board, an outer contour shape of the projection of the plurality of convex edges is similar to a projection shape of the chip, and a length of the convex edge is 1-2 times a length of a corresponding side of the chip.
[0014] In a possible implementation, the second end of the plurality of partitions is further provided with a connecting boss, the connecting boss is provided with a connecting hole, and a fastener is connected to the circuit board after passing through the connecting hole.
[0015] In a possible implementation, a length of the partition is greater than or equal to 10 mm, a width of the partition is greater than or equal to 4 mm, and in a plane parallel to the circuit board, a projection of the plurality of partitions is located within a projection range of the circuit board.
[0016] In a possible implementation, the shell comprises a bottom cover and an upper shell body, the bottom cover is arranged on the upper shell body, and the raised portion is integrated with the bottom cover.
[0017] In a possible implementation, a draft angle of the raised portion is greater than or equal to 5°.
[0018] In a possible implementation, the circuit board is further provided with a conversion circuit board, and the chip is arranged on the conversion circuit board.
[0019] In another aspect, the application provides a mobile platform comprising the domain controller as described above.
[0020] The application provides a domain controller and a movable platform. The domain controller comprises a shell, a heat sink and a circuit board are stacked in the shell, a chip is arranged on the side of the circuit board facing the heat sink, the chip is connected with the heat sink through a heat dissipation adhesive layer, the shell is further provided with a protruding part, the protruding part abuts against the side of the circuit board away from the chip, and the projection of the chip is located in the outer contour of the projection of the protruding part in the plane parallel to the circuit board. The protruding part is arranged on the shell, the protruding part abuts against the side of the circuit board away from the chip, and the chip is located in the outer contour of the protruding part, so that the protruding part can provide stable support for the circuit board, the protruding part can disperse the stress borne by the circuit board to a larger area, stress dispersion is realized, the probability of warping of the circuit board around the chip is reduced, the chip and the heat dissipation adhesive layer are prevented from being separated, and the chip has good heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the application or the related art, the following will briefly introduce the drawings needed to be used in the embodiments or the related art description. Obviously, the drawings in the following description are some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor.
[0022] Figure 1 A partial cross-sectional view of a domain controller provided by an embodiment of the application is shown in the figure.
[0023] Figure 2 A structure diagram of a bottom cover provided by an embodiment of the application is shown in the figure.
[0024] Figure 3 A partial cross-sectional view of a domain controller provided by another embodiment of the application is shown in the figure.
[0025] Figure 4 A structure diagram of a bottom cover provided by another embodiment of the application is shown in the figure.
[0026] Figure 5 A structure diagram of a bottom cover provided by still another embodiment of the application is shown in the figure.
[0027] Reference signs:
[0028] 100 - shell; 101 - bottom cover; 102 - upper shell; 110 - protruding part; 111 - partition rib; 112 - raised edge; 113 - connecting boss; 114 - connecting hole;
[0029] 200 - heat sink;
[0030] 300 - circuit board;
[0031] 400 - chip;
[0032] 500 - adapter circuit board. DETAILED DESCRIPTION
[0033] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application.
[0034] Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of protection of the present application. The following embodiments and features in the embodiments can be combined with each other without conflict.
[0035] As described in the background, in the related art solution, when the domain controller runs for a long time, the temperature of the chip will continue to rise, causing the circuit board around the chip to warp downward (away from the chip) due to thermal expansion, so that part of the area of the chip is separated from the heat dissipation adhesive layer, causing the heat dissipation performance of the chip to be greatly reduced, and the heat of the chip cannot be transmitted out. When the temperature of the chip continues to rise to the temperature limit, a thermal hang-up phenomenon occurs, so that the domain controller cannot be used normally.
[0036] Therefore, the embodiments of the present application aim to provide a domain controller and a movable platform, by providing a protruding portion on the shell, the protruding portion abuts on the side of the circuit board away from the chip, and the chip is located within the outer contour range of the protruding portion, so that the protruding portion can provide stable support for the circuit board, the protruding portion can disperse the stress received by the circuit board to a larger area, realize stress dispersion, reduce the probability of warping of the circuit board around the chip, avoid separation of the chip and the heat dissipation adhesive layer, and ensure that the chip has good heat dissipation effect.
[0037] The content of the embodiments of the present application will be described in detail below in combination with the accompanying drawings, so that those of ordinary skill in the art can understand the content of the present application in more detail.
[0038] Please refer to Figures 1-5 The present embodiment provides a domain controller, which comprises a shell 100. The shape of the shell 100 can be set according to assembly needs, for example, it can be prismatic or cylindrical. The shell 100 can comprise a bottom cover 101 and an upper shell 102, for example. The upper shell 102 is formed with a cavity for mounting other parts, and the bottom cover 101 is covered on the upper shell 102 to constitute the shell 100. Exemplarily, the bottom cover 101 can be detachably connected with the upper shell 102 through fasteners such as screws and bolts, so as to facilitate installation and subsequent maintenance and disassembly.
[0039] The heat sink 200 and the circuit board 300 are stacked in the shell 100, the chip 400 is arranged on the side of the circuit board 300 facing the heat sink 200, the chip 400 is connected with the heat sink 200 through a heat-conducting adhesive layer (not shown in the figure), and the heat generated by the chip 400 during operation can be transmitted to the heat sink 200 through heat conduction, so that the heat sink 200 can quickly dissipate the heat, thereby ensuring the information processing capability of the domain controller.
[0040] The shell 100 is further provided with a protruding portion 110, which can be arranged on the bottom cover 101. The protruding portion 110 abuts against the side of the circuit board 300 away from the chip 400, and the projection of the chip 400 is located within the outer contour of the projection of the protruding portion 110 in the plane parallel to the circuit board 300. The outer contour refers to the contour formed by the connecting lines between the adjacent edges of the protruding portion 110 (for example Figure 4 the middle A region and Figure 5 the middle B region).
[0041] In this embodiment, the protruding portion 110 is arranged on the shell 100, the protruding portion 110 abuts against the side of the circuit board 300 away from the chip 400, and the chip 400 is located within the outer contour of the protruding portion 110, so that the protruding portion 110 can provide stable support for the circuit board 300, the stress on the circuit board 300 can be dispersed to a larger area by the protruding portion 110, stress dispersion is achieved, the probability of warping of the circuit board 300 around the chip 400 is reduced without affecting the normal function of the circuit board 300, the circuit board 300 can still maintain good flatness under the condition of being heated, the chip 400 and the heat-conducting adhesive layer are prevented from being separated, and the chip 400 has good heat dissipation effect.
[0042] Please continue to refer to Figure 1 and Figure 2 In a possible implementation, the protruding portion 110 of this embodiment is in the shape of a prism, and the projection shape of the protruding portion 110 is similar to the projection shape of the chip 400 in the plane parallel to the circuit board 300, for example, the projection shape of the protruding portion 110 and the projection shape of the chip 400 can both be rectangular. The projection of the chip 400 is located within the projection range of the protruding portion 110; that is, the projection range of the protruding portion 110 is greater than or equal to the projection range of the chip 400.
[0043] The prismatic protruding portion 110 of the embodiment is convenient for forming (e.g. die casting). Through the above structure, the embodiment can ensure that the protruding portion 110 can completely abut against the region of the circuit board 300 corresponding to the chip 400, so that the protruding portion 110 can provide stable support for the circuit board 300, the protruding portion 110 can disperse the stress received by the circuit board 300 to a larger area, realize stress dispersion, reduce the probability of warping of the circuit board 300 around the chip 400 under the premise of not affecting the normal function of the circuit board 300, ensure that the circuit board 300 can still maintain good flatness under the condition of being heated, avoid the separation of the chip 400 and the heat dissipation adhesive layer, and ensure that the chip 400 has good heat dissipation effect.
[0044] Please continue to refer to Figure 3 and Figure 4 In another possible implementation, the protruding portion 110 of the embodiment includes a plurality of partitioning ribs 111, the first ends of the plurality of partitioning ribs 111 are connected to each other, and the second ends of the plurality of partitioning ribs 111 are arranged at intervals. The plurality of partitioning ribs 111 form a structure in a general "cross" shape on the bottom cover 101. In the plane parallel to the circuit board 300, the projection of the chip 400 is located within the outer contour of the projection of the plurality of partitioning ribs 111; that is, the projection of the chip 400 is located within the A region in Figure 4 .
[0045] Compared with the schemes shown in Figure 1 and Figure 2 , the embodiment increases the abutment region of the protruding portion 110 and the circuit board 300, so that the stress received by the circuit board 300 per unit area can be reduced, the deformation amount of the circuit board 300 is reduced, and the influence on the connection of other devices on the circuit board 300 is avoided.
[0046] It can be understood that the protruding portion 110 of the embodiment can also provide stable support for the circuit board 300, the protruding portion 110 can disperse the stress received by the circuit board 300 to a larger area, realize stress dispersion, reduce the probability of warping of the circuit board 300 around the chip 400 under the premise of not affecting the normal function of the circuit board 300, ensure that the circuit board 300 can still maintain good flatness under the condition of being heated, avoid the separation of the chip 400 and the heat dissipation adhesive layer, and ensure that the chip 400 has good heat dissipation effect.
[0047] Further, in the plane parallel to the circuit board 300, the projection center of the chip 400 coincides with the projection of the first ends of the plurality of partitioning ribs 111 in the embodiment. That is, the intersection center of the plurality of partitioning ribs 111 corresponds to the center of the chip 400.
[0048] Since the abutting force of the protruding portion 110 on the circuit board 300 gradually spreads outwards from the intersection center of the plurality of partitioning ribs 111, the abutting force is the greatest at the intersection center of the plurality of partitioning ribs 111. By aligning the projection center of the chip 400 with the projection of the first ends of the plurality of partitioning ribs 111, it can be ensured that the abutting force of the protruding portion 110 on the circuit board 300 does not deviate, thereby better avoiding separation of the chip 400 from the heat dissipation adhesive layer.
[0049] Please continue to refer to Figure 3 and Figure 5 In still another possible implementation, the protruding portion 110 of the present embodiment includes a plurality of raised edges 112 and a plurality of partitioning ribs 111. The plurality of raised edges 112 are connected end to end in sequence, thereby forming a hollow region. The first ends of the plurality of partitioning ribs 111 are connected to the intersection points of adjacent two of the plurality of raised edges 112, and the second ends of the plurality of partitioning ribs 111 are arranged at intervals. In a plane parallel to the circuit board 300, the projection of the chip 400 is located within the outer contour of the projection of the plurality of raised edges 112; that is, the projection of the chip 400 is located within the B region in FIG. 6. Figure 5
[0050] Compared with the scheme shown in FIG. 5, the protruding portion 110 of the present embodiment, after abutting against the circuit board 300, does not cause excessive strain of the circuit board 300 in the pressed region, and the hollow region formed by the plurality of raised edges 112 can avoid the back region of the circuit board 300 that directly faces the chip 400, so that the parts arranged in this region are not affected by the protruding portion 110. Figure 4
[0051] It can be understood that the protruding portion 110 of the present embodiment can also provide stable support for the circuit board 300. The protruding portion 110 can disperse the stress received by the circuit board 300 to a larger area, thereby achieving stress dispersion. On the premise of not affecting the normal function of the circuit board 300, the present embodiment reduces the probability of warping of the circuit board 300 around the chip 400, ensures that the circuit board 300 can still maintain good flatness under the condition of being heated, avoids separation of the chip 400 from the heat dissipation adhesive layer, and ensures that the chip 400 has good heat dissipation effect.
[0052] In other possible implementations, the protruding portion 110 of the present embodiment can also adopt a combination of the above schemes. For example, the protruding portion 110 can include a prismatic body and a plurality of partitioning ribs 111. The first ends of the plurality of partitioning ribs 111 are connected to the body, and the second ends of the plurality of partitioning ribs 111 are arranged at intervals. In a plane parallel to the circuit board 300, the projection shape of the body is similar to the projection shape of the chip 400, and the projection of the chip 400 is located within the projection range of the body.
[0053] It can be understood that the protruding part 110 of the above scheme can also provide stable support for the circuit board 300, and can disperse the stress received by the circuit board 300 to a larger area, achieve stress dispersion, reduce the probability of warping of the circuit board 300 around the chip 400 under the premise of not affecting the normal function of the circuit board 300, ensure that the circuit board 300 can still maintain good flatness under the condition of heating, avoid separation of the chip 400 and the heat dissipation adhesive layer, and ensure that the chip 400 has good heat dissipation effect.
[0054] Further, in the plane parallel to the circuit board 300, the projection of the plurality of edges 112 of the embodiment has an outer contour shape similar to the projection shape of the chip 400, and the length of the edge 112 is 1-2 times the length of the corresponding chip 400 (for example, the length of the chip is 20mm, and the length of the edge 112 is 30mm), so as to ensure that the abutting force of the plurality of edges 112 applied to the circuit board 300 can effectively suppress the warping of the circuit board 300 around the chip 400, avoid the separation of the chip 400 and the heat dissipation adhesive layer, and ensure that the chip 400 has good heat dissipation effect.
[0055] Please continue to refer to Figure 4 and Figure 5 In the embodiment, the second end of the plurality of partition ribs 111 is further provided with a connecting boss 113, and the connecting boss 113 is provided with a connecting hole 114. The fastener is connected with the circuit board 300 after penetrating through the connecting hole 114.
[0056] In the embodiment, the second end of the partition rib 111 is provided with the connecting boss 113 and the connecting hole 114, so that the partition rib 111 can be locked and fixed with the circuit board 300 by using the fastener, thereby improving the stability of the connection between the protruding part 110 and the circuit board 300 and improving the abutting effect of the protruding part 110 on the circuit board 300.
[0057] Please continue to refer to Figure 4 and Figure 5 In the embodiment, the length of the partition rib 111 is greater than or equal to 10mm (for example, 30mm), the width of the partition rib 111 is greater than or equal to 4mm (for example, 8mm), and the height of the protruding part 110 can be greater than or equal to 5mm. It can be understood that the greater the length and width of the partition rib 111, the better the abutting effect of the protruding part 110 on the circuit board 300, and the less likely the chip 400 and the heat dissipation adhesive layer are separated. The height of the protruding part 110 is matched with the gap between the bottom cover 101 and the circuit board 300, so as to ensure that the protruding part 110 can abut on the circuit board 300. The specific values of the length and width of the partition rib 111 can be determined based on the size of the chip 400. In addition, in the plane parallel to the circuit board 300, the projection of the plurality of partition ribs 111 is located within the projection range of the circuit board 300, thereby avoiding affecting the layout of other parts in the domain controller.
[0058] In the embodiment, the protruding part 110 is formed integrally with the bottom cover 101. Exemplarily, the protruding part 110 can be integrally formed with the bottom cover 101 through a stamping process, and the use of the integrally formed process can improve production efficiency.
[0059] Optionally, in the embodiment, the number of the protruding part 110 formed on the bottom shell 101 can be multiple, and the protruding part 110 can adopt any one or a combination of more than one of the combinations shown in Figure 2 4
[0060] Further, in the embodiment, the draft angle of the protruding part 110 is greater than or equal to 5°. Setting the draft angle in the above range can avoid the bottom cover 101 being cracked during stamping, thereby ensuring a high success rate of stamping.
[0061] Please continue to refer to Figure 1 and Figure 3 In the embodiment, the circuit board 300 can also be provided with a conversion circuit board 500, and the chip 400 can be arranged on the conversion circuit board 500. The conversion circuit board 500 has the functions of realizing conversion between different interfaces, expanding the number of interfaces, and adapting to height differences.
[0062] The embodiment also provides a mobile platform comprising the domain controller.
[0063] Specifically, the mobile platform of the embodiment can be a vehicle, a drone, a robot, etc., and the domain controller is arranged in the vehicle to manage and control various functions of the vehicle by processing data information. Since the above domain controller is used, the probability of warping of the circuit board can be reduced, the chip and the heat dissipation adhesive layer can be prevented from being separated, the chip can have a good heat dissipation effect, and the domain controller can have a good information processing capability.
[0064] In the description of the present application, it should be understood that the terms “center”, “longitudinal”, “transverse”, “length”, “width”, “thickness”, “upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential” and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.
[0065] In the present application, unless specifically defined otherwise, the terms "mounting", "connection", "connecting", "fixed", and like terms should be construed in a broad sense and, for example, can be fixed connection, detachable connection, or integral; can be direct connection, or indirect connection through an intermediate medium; can be internal connection of two elements, or interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.
[0066] It should be noted that in the description of the present application, the terms "first", "second" are only used for the convenience of describing different parts, and cannot be understood as indicating or implying the order relationship, relative importance, or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features.
[0067] The embodiments or implementations in the present application are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other.
[0068] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0069] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A domain controller, characterized in that, The housing is internally stacked with a radiator and a circuit board, the circuit board is provided with a chip on a side facing the radiator, the chip is connected with the radiator through a heat dissipation adhesive layer, the housing is further provided with a protruding portion, the protruding portion abuts on a side of the circuit board away from the chip, in a plane parallel to the circuit board, a projection of the chip is located within an outer contour of a projection of the protruding portion.
2. The domain controller of claim 1, wherein, The protruding portion is in the shape of a prism, in the plane parallel to the circuit board, a projection shape of the protruding portion is similar to a projection shape of the chip, and the projection of the chip is located within the projection range of the protruding portion.
3. The domain controller of claim 1, wherein, The protruding portion includes a plurality of partition ribs, first ends of the plurality of partition ribs are connected to each other, and second ends of the plurality of partition ribs are arranged at intervals. In the plane parallel to the circuit board, the projection of the chip is located within an outer contour of the projections of the plurality of partition ribs.
4. The domain controller of claim 3, wherein, In the plane parallel to the circuit board, the projection center of the chip coincides with the projection of the first ends of the plurality of partition ribs.
5. The domain controller of claim 1, wherein, The protruding portion includes a plurality of convex edges and a plurality of partition ribs, the plurality of convex edges are sequentially connected in a head-to-tail manner, the first ends of the plurality of partition ribs are connected to intersection points of adjacent two convex edges in the plurality of convex edges, respectively, and the second ends of the plurality of partition ribs are arranged at intervals. In the plane parallel to the circuit board, the projection of the chip is located within an outer contour of the projections of the plurality of convex edges.
6. The domain controller of claim 5, wherein, In the plane parallel to the circuit board, an outer contour shape of the projections of the plurality of convex edges is similar to a projection shape of the chip, and a length of the convex edge is 1-2 times a side length of the corresponding chip.
7. The domain controller of claim 3 or 5, wherein, The second ends of the plurality of partition ribs are further provided with connecting bosses, the connecting bosses are internally provided with connecting holes, and fasteners are connected with the circuit board after passing through the connecting holes; and / or The length of the partition rib is greater than or equal to 10 mm, the width of the partition rib is greater than or equal to 4 mm, and in the plane parallel to the circuit board, the projections of the plurality of partition ribs are all located within the projection range of the circuit board.
8. The domain controller of claim 1, wherein, The housing includes a bottom cover and an upper housing, the bottom cover is arranged on the upper housing, and the protruding portion is integrated with the bottom cover; and / or The draft angle of the protruding portion is greater than or equal to 5°.
9. The domain controller of claim 1, wherein, The circuit board is further provided with a conversion circuit board, and the chip is arranged on the conversion circuit board.
10. A movable platform, characterized by The domain controller includes any one of claims 1-9. The domain controller includes any one of claims 1-9.