Electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of heat dissipation, and particularly discloses electronic equipment, a shell of the electronic equipment is provided with an accommodating space and a plurality of heat dissipation through holes, and the plurality of heat dissipation through holes are communicated with the accommodating space; the circuit board is accommodated in the accommodating space; the fan group comprises a first fan and is arranged in the accommodating space; the fin assembly comprises a plurality of first heat dissipation fins which are arranged at intervals, one sides of the first heat dissipation fins are fixed to the inner wall of the containing space, the other sides of the first heat dissipation fins abut against the circuit board, one ends of the first heat dissipation fins correspond to the first fan, the other ends of the first heat dissipation fins correspond to the heat dissipation through holes, and the heat dissipation through holes are arranged in the containing space. Therefore, the first fan drives air around the first heat dissipation fins to flow out from the plurality of heat dissipation through holes. By means of the mode, heat on the circuit board can be transmitted to the first heat dissipation fins arranged on the shell and then transmitted to the shell, and the first fan is matched to directly blow the first heat dissipation fins to improve the heat dissipation capacity of the electronic equipment.

Description

TECHNICAL FIELD

[0001] The embodiment of the present application relates to heat dissipation technical field, in particular to an electronic device. BACKGROUND

[0002] During the working process of the electronic device, a large amount of heat is generated by the chips and other components on the circuit board. In order to ensure the normal operation of the electronic device, a fan is usually arranged in the electronic device to drive the air flow in the electronic device, so as to take away the high-temperature air radiated by the heat generating elements on the circuit board to the surrounding, thereby maintaining the temperature in the electronic device within a predetermined temperature range, so that the electronic device can operate normally.

[0003] The inventor of the present application found that, at present, with the performance improvement of the electronic device, the temperature of the heat generating elements on the circuit board is increased, and the heat dissipation capacity of the built-in fan in the electronic device is insufficient. The performance of the electronic device is affected in the long-term high-temperature environment, and finally the normal operation of the electronic device is affected. CONTENT OF THE UTILITY MODEL

[0004] The embodiment of the present application provides an electronic device, and mainly solves the technical problem that the heat dissipation capacity of the existing electronic device is insufficient, and the performance stability of the electronic device is affected.

[0005] In order to solve the above technical problem, one technical scheme adopted by the present application is to provide an electronic device, which comprises a shell, a circuit board, a fan assembly and a fin assembly. The shell is provided with a receiving space and a plurality of heat dissipation through holes, the plurality of heat dissipation through holes are communicated with the receiving space, the circuit board is accommodated in the receiving space, the fan assembly comprises a first fan, and the first fan is accommodated in the receiving space. The fin assembly comprises a plurality of first heat dissipation fins, the plurality of first heat dissipation fins are arranged at intervals, one side of the plurality of first heat dissipation fins is fixed to the inner wall of the receiving space, the other side of the plurality of first heat dissipation fins abuts against the circuit board, one end of the plurality of first heat dissipation fins corresponds to the first fan, and the other end of the plurality of first heat dissipation fins corresponds to the plurality of heat dissipation through holes, so that the first fan drives the air around the first heat dissipation fin to flow out from the plurality of heat dissipation through holes.

[0006] Optionally, the fin assembly comprises a first heat conduction plate, one side of the first heat conduction plate is fixed to the other side of the plurality of first heat dissipation fins, and the other side of the first heat conduction plate is attached to the circuit board.

[0007] Optionally, the electronic device comprises a heat conduction layer, one side of the heat conduction layer is attached to the first heat conduction plate, and the other side of the heat conduction layer is attached to the first heat conduction plate.

[0008] Optionally, the first fan is provided with a conductive contact, and the circuit board is provided with a conductive protrusion which is in abutment with the conductive contact.

[0009] Optionally, the first fan comprises a screw element, the first fan is provided with a mounting portion extending around the periphery, the mounting portion is provided with a mounting hole, the receiving space is provided with a screw hole, and the screw element is screwed into the screw hole after passing through the mounting hole.

[0010] Optionally, the first heat dissipation fin comprises a flow guiding section, an accelerating section and a diffusing section, the flow guiding section, the accelerating section and the diffusing section are connected in sequence, the vertical distance from the end of the flow guiding section to the housing is greater than the vertical distance from the end of the accelerating section to the housing, and the vertical distance from the end of the flow guiding section to the housing is less than the vertical distance from the end of the diffusing section to the housing, so that the interval groove between two adjacent first heat dissipation fins forms a flow guiding channel section, an accelerating channel section and a diffusing channel section.

[0011] Optionally, the electronic device comprises a heat dissipation copper pipe, the fan assembly comprises a second fan, the fin assembly comprises a plurality of second heat dissipation fins, the heat dissipation copper pipe, the second fan and the plurality of second heat dissipation fins are all accommodated in the receiving space, two adjacent second heat dissipation fins are arranged at intervals to form an air slot, the evaporation section of the heat dissipation copper pipe is embedded between the circuit board and the plurality of first heat dissipation fins, the condensation section of the heat dissipation copper pipe is embedded in the second heat dissipation fin, and the air outlet of the second fan corresponds to the air inlet of the air slot.

[0012] Optionally, the number of the heat dissipation copper pipe and the second fan is two, the evaporation section of the two heat dissipation copper pipes is embedded between the first heat dissipation fin and the circuit board, and the condensation section of the two heat dissipation copper pipes respectively encloses the two second fans.

[0013] Optionally, the housing comprises an upper shell and a bottom cover, the upper shell is provided with a receiving groove, the bottom cover covers the groove opening of the receiving groove to form the receiving space, and the heat dissipation through hole is arranged in the upper shell.

[0014] Optionally, the bottom cover is provided with a plurality of air inlet holes corresponding to the air inlets of the fan assembly, and the heat dissipation through hole is located in the side wall of the upper shell.

[0015] The beneficial effects of this application embodiment are as follows: Unlike the prior art, this application embodiment provides an electronic device including a housing, a circuit board, a fan assembly, and a fin assembly. The housing is provided with a receiving space and a plurality of heat dissipation holes, which communicate with the receiving space. The circuit board is housed in the receiving space. The fan assembly includes a first fan housed in the receiving space. The fin assembly includes a plurality of first heat dissipation fins spaced apart. One side of each first heat dissipation fin is fixed to the inner wall of the receiving space, and the other side of each first heat dissipation fin abuts against the circuit board. One end of each first heat dissipation fin corresponds to the first fan, and the other end of each first heat dissipation fin corresponds to the plurality of heat dissipation holes, so that the first fan drives the air around the first heat dissipation fins to flow out through the plurality of heat dissipation holes. With the above structure, the embodiments of this application can transfer the heat of the circuit board that is in direct contact with the first heat dissipation fins to the heat dissipation fins, and then to the housing, through the first heat dissipation fins disposed on the housing. The heat is then transferred to the housing, and the first fan blows the heat dissipation fins to accelerate the flow of hot air around the first fins, thereby improving the heat dissipation capacity of the electronic device and providing a suitable environment for the stable operation of the electronic device. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the drawings without creative effort.

[0017] Figure 1 This is an exploded structural diagram of an electronic device provided in an embodiment of this application;

[0018] Figure 2 This is a schematic diagram of the assembly structure of an electronic device provided in an embodiment of this application;

[0019] Figure 3 This is a cross-sectional structural diagram of an electronic device provided in an embodiment of this application;

[0020] Figure 4 yes Figure 3 A magnified view of part A in the image;

[0021] Figure 5 This is a cross-sectional schematic diagram of the bottom cover of an electronic device provided in an embodiment of this application;

[0022] Figure 6 yes Figure 5 A magnified view of part B in the image;

[0023] Figure 7 Fig. 1 is a structural schematic diagram of a circuit board and a first fan of an electronic device provided by an embodiment of the present application;

[0024] Figure 8 Fig. 2 is a partial enlarged view of the C part in Fig. 1. Figure 7

[0025] Reference signs:

[0026] 100, electronic device;

[0027] 1, circuit board; 11, conductive protrusion;

[0028] 2, fin assembly; 21, first heat dissipation fin; 211, interval slot; 2111, flow guide passage segment; 2112, acceleration passage segment; 2113, diffusion passage segment; 2114, first horn-shaped guide segment; 2115, second horn-shaped guide segment; 21a, flow guide segment; 21b, acceleration segment; 21c, diffusion segment; 22, first heat spreading plate; 23, second heat dissipation fin;

[0029] 3, fan assembly; 31, first fan; 311, conductive contact; 312, screw element; 313, mounting portion; 314, mounting hole; 32, second fan;

[0030] 4, housing; 41, accommodation space; 42, heat dissipation through hole; 4a, upper shell; 4a1, accommodation groove; 4b, bottom cover; 4b1, air inlet hole; 411, screw hole;

[0031] 5, heat dissipation copper pipe; 51, evaporation segment; 52, condensation segment. DETAILED DESCRIPTION

[0032] In order to facilitate the understanding of the present application, the present application will be described in more detail below in conjunction with the drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element or one or more intervening elements can be present therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element or one or more intervening elements can be present therebetween. The terms "vertical", "horizontal", "left", "right", and similar expressions used in the present specification are only for the purpose of illustration.

[0033] Unless otherwise defined, all technical and scientific terms used in the present specification have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the present specification are only for the purpose of describing specific embodiments of the present application and are not intended to limit the present application. The term "and / or" used in the present specification includes any and all combinations of one or more of the associated listed items. ​

[0034] Referring to Figures 1 to 4 , the electronic device 100 includes a housing 4, a circuit board 1, a fan assembly 3 and a fin assembly 2, the circuit board 1, the fan assembly 3 and the fin assembly 2 are all accommodated in the housing 4, specifically, the housing 4 is provided with a receiving space 41 and a plurality of heat dissipation through holes 42, the plurality of heat dissipation through holes 42 are in communication with the receiving space 41, the plurality of heat dissipation through holes 42 provide a channel for the receiving space 41 to communicate with the external environment; the circuit board 1 is accommodated in the receiving space 41, wherein the circuit board 1 is the main heat source (for example, the chip of the electronic device 100) of the electronic device 100, when the circuit board 1 works, the air around the circuit board 1 is heated and warmed to become hot air, the fan assembly 3 includes a first fan 31, the first fan 31 is accommodated in the receiving space 41, the first fan 31 is used to blow the air in the receiving space 41 to flow; the fin assembly 2 includes a plurality of first heat dissipation fins 21, the plurality of first heat dissipation fins 21 are arranged at intervals, one side of the plurality of first heat dissipation fins 21 is fixed to the inner wall of the receiving space 41, the other side of the plurality of first heat dissipation fins 21 abuts against the circuit board 1, so as to directly transfer the heat on the circuit board 1 to the plurality of first heat dissipation fins 21 by heat conduction, which is conducive to the rapid conduction of the heat of the circuit board 1, one end of the plurality of first heat dissipation fins 21 corresponds to the first fan 31, the other end of the plurality of first heat dissipation fins 21 corresponds to the plurality of heat dissipation through holes 42, so that the gap of one end of the interval groove 211 formed by the interval arrangement of the first heat dissipation fin 21 corresponds to the first fan 31, and the gap of the other end of the interval groove 211 corresponds to the heat dissipation through hole 42, and then the first fan 31 drives the air around the first heat dissipation fin 21 to flow out from the plurality of heat dissipation through holes 42, that is, the first fan 31 drives the hot air in the interval groove 211 to flow from the receiving space 41 to the external environment through the plurality of heat dissipation through holes 42, thereby realizing the heat dissipation of the circuit board 1. Through the above structure, the heat generated by the circuit board 1 in the working state can be timely transferred through the plurality of first heat dissipation fins 21 in contact with it, and the blowing of the first fan 31 to the plurality of first heat dissipation fins 21 timely discharges the hot air around the first heat dissipation fin 21, and the cooling of the cold air supplemented to the periphery of the first heat dissipation fin 21 realizes the cooling of the first heat dissipation fin 21, thereby maintaining the circuit board 1 at a suitable working temperature, providing a suitable working environment for the stable work of the circuit board 1, and further because the plurality of first heat dissipation fins 21 are directly fixed to the inner wall of the housing 4, the heat generated on the circuit board 1 is also transferred to the housing 4 through the plurality of first heat dissipation fins 21, so that the housing 4 participates in the heat dissipation of the circuit board 1, further improving the heat dissipation capacity of the electronic device 100.

[0035] It can be understood that the fixing manner of the first heat dissipation fins 21 on the inner wall of the shell 4 includes but is not limited to welding, gluing, one-piece forming, etc. For example, in the present embodiment, the first heat dissipation fins 21 are fixed to the shell 4 by welding.

[0036] For the first heat dissipation fins 21 described above, please refer to Figures 3 to 6 , the first heat dissipation fins 21 include a flow guiding section 21a, an acceleration section 21b and a diffusion section 21c, which are connected in sequence, the vertical distance from the end of the flow guiding section 21a to the shell 4 is greater than the vertical distance from the end of the acceleration section 21b to the shell 4, and the vertical distance from the end of the flow guiding section 21a to the shell 4 is less than the vertical distance from the end of the diffusion section 21c to the shell 4, so that the interval groove 211 between two adjacent first heat dissipation fins 21 forms a flow guiding channel section 2111, an acceleration channel section 2112 and a diffusion channel section 2113, the cross-sectional area of the flow guiding channel section 2111 is greater than that of the acceleration channel section 2112, and the port of the flow guiding channel section corresponds to the air outlet of the first fan 31. Such a structure design can reduce the airflow resistance into the interval groove 211, avoid local vortex or noise at the inlet caused by high-speed airflow, and at the same time, the large cross-section can guide the airflow to be uniformly distributed to the surface of the first heat dissipation fins 21; the acceleration channel section 2112 uses the Venturi effect to accelerate the airflow passing through it by reducing the cross-sectional area, and the increase of flow rate will strengthen the convective heat transfer (the convective heat dissipation efficiency is positively correlated with the flow rate), and the high-speed airflow can quickly take away the heat on the surface of the first heat dissipation fins 21; the cross-sectional area of the flow guiding channel section is less than that of the diffusion channel section 2113, and the increase of the cross-sectional area of the diffusion channel section 2113 reduces the flow rate, converts the kinetic energy of the airflow into static pressure (diffusion effect), reduces the dynamic pressure loss at the outlet, and at the same time, prolongs the residence time of the airflow, so that the heat is more fully transferred to the air. In addition, the diffusion channel section 2113 can reduce the risk of backflow and stabilize the airflow.

[0037] It should be noted that Figure 5 and Figure 6 , the first horn-shaped guiding section 2114 is arranged at the connection position of the flow guiding channel section 2111 and the acceleration channel section 2112, and the second horn-shaped guiding section 2115 is arranged at the connection position of the acceleration channel section 2112 and the diffusion channel section 2113, so as to realize the smooth transition at the connection positions of the flow guiding channel section 2111, the acceleration channel section 2112 and the diffusion channel section 2113, and further realize the smooth flow of the airflow in the interval groove 211. Among them, along the direction of the flow guiding channel section 2111 towards the acceleration channel section 2112, the cross-sectional area of the first horn-shaped guiding section 2114 gradually decreases, and along the direction of the acceleration channel section 2112 towards the diffusion channel section 2113, the cross-sectional area of the second horn-shaped guiding section 2115 gradually increases.

[0038] The heat generated by the heat-generating electronic components on the circuit board 1 is not evenly distributed on the surface of the electronic components, and then the heat transferred to the first plurality of heat dissipation fins 21 is not evenly distributed, there are heat concentration areas, which affects the heat dissipation of the combination of the first plurality of heat dissipation fins 21 and the first fan 31 to the circuit board 1, so a certain auxiliary heat dissipation structure is needed to make the heat on the heat-generating electronic components evenly distributed on the plurality of heat dissipation fins.

[0039] It can be understood that the way to achieve rapid heat transfer includes but is not limited to: setting a heat plate, setting a heat-conducting glue, increasing the contact area, and establishing a contact heat-conducting structure of a plurality of heat dissipation fins.

[0040] For example, in the present embodiment, please refer to Figure 1 , the heat plate is set, specifically, the fin assembly 2 includes a first heat plate 22, one side of the first heat plate 22 is fixed to the other side of the plurality of first heat dissipation fins 21, and the first heat plate 22 covers the slot of the above-mentioned spacing groove 211, so that the two adjacent first heat dissipation fins 21 and the inner wall of the shell 4 and the first heat plate 22 together form a plurality of heat dissipation pipelines, one end of the plurality of heat dissipation pipelines corresponds to the first fan 31, the other end of the plurality of heat dissipation pipelines corresponds to the heat dissipation through hole 42, the other side of the first heat plate 22 is attached to the circuit board 1, the heat on the circuit board 1 is rapidly distributed on the whole heat plate after being transferred to the first heat plate 22, and then the heat plate transfers the heat to the plurality of heat dissipation fins fixed thereto, thereby realizing the uniform distribution of the heat on the circuit board 1 on the plurality of first heat dissipation fins 21, and optimizing the heat dissipation capacity of the plurality of first heat dissipation fins 21 to the circuit board 1.

[0041] It should be noted that the shape of the first heat plate 22 needs to be adapted to the shape of the above-mentioned first heat dissipation fin 21, so that the slot of the spacing groove 211 is closed, and the spacing groove 211 after the slot is closed forms a pipeline structure, that is, the above-mentioned flow guide channel section 2111, acceleration channel section 2112 and diffusion channel section 2113 respectively constitute flow guide channel pipe, acceleration channel pipe and diffusion channel pipe, thereby further optimizing the functions of the flow guide channel section 2111, the acceleration channel section 2112 and the diffusion channel section 2113, and avoiding the situation that the airflow flows out from the slot of the spacing groove 211.

[0042] It should be noted that the circuit board 1 is attached to the acceleration channel section 2112 to achieve the optimal heat dissipation effect of the first heat dissipation fin 21 and the first fan 31.

[0043] It can be understood that the contact surface of the first vapor chamber 22 and the circuit board 1 cannot guarantee complete contact, and there will be a gap between the first vapor chamber 22 and the circuit board 1. Therefore, in some embodiments, the electronic device 100 includes a heat-conducting layer, one side of the heat-conducting layer is attached to the first vapor chamber 22, and the other side of the heat-conducting layer is attached to the first vapor chamber 22.

[0044] It should be noted that the heat-conducting layer has a shape that can be molded, and the materials that can be used include but are not limited to: heat-conducting silicone grease, heat-conducting silicone gel, heat-conducting gel, and heat-conducting cement. In this embodiment, the heat-conducting layer is preferably heat-conducting silicone grease, which is applied to the circuit board 1 when the circuit board 1 is assembled with the housing 4.

[0045] For the first fan 31 described above, please refer to Figure 7 and Figure 8 The first fan 31 is provided with a conductive contact 311, and the circuit board 1 is provided with a conductive protrusion 11, which abuts against the conductive contact 311, thereby achieving electrical connection between the circuit board 1 and the first fan 31. Specifically, when designing the overall structure of the electronic device 100, the circuit board 1 and the first fan 31 are pre-positioned. When the first fan 31 is assembled in the housing 4, the first fan 31 is fixed in the housing 4 according to the pre-set mounting position, and the circuit board 1 is installed according to the pre-set positioning structure to achieve abutment between the protrusion and the conductive contact 311, thereby achieving electrical connection between the circuit board 1 and the first fan 31. The inductive connection between the circuit board 1 and the first fan 31 reduces the installation steps when assembling the electronic device 100, and improves the production efficiency of the electronic device 100.

[0046] It can be understood that the shape of the conductive protrusion 11 includes but is not limited to: a conductive column, a conductive probe, a conductive spring, a conductive ball, and a conductive cone. In this embodiment, the shape of the conductive protrusion 11 is preferably a conductive column.

[0047] It should be noted that the electrical connection between the circuit board 1 and the first fan 31 can also use a plug and socket, a wire connection, etc., which will not be described one by one here.

[0048] The first fan 31 is installed in the housing 4 in a manner including but not limited to: screwing, clamping, gluing, and welding. In this embodiment, the first fan 31 is screwed into the receiving space 41 of the housing 4.

[0049] Specifically, the first fan 31 comprises a threaded part 312; the peripheral side of the first fan 31 extends with a mounting portion 313, the mounting portion 313 is provided with a mounting hole 314; the accommodation space 41 is provided with a threaded hole 411, that is, the threaded hole 411 is arranged on the inner wall of the accommodation space 41, the threaded part 312 is screwed to the threaded hole 411 after passing through the mounting hole 314, and the mounting mode of screwing realizes the detachable mounting of the first fan 31 and the shell 4, facilitating the maintenance and replacement of the first fan 31 in the later period.

[0050] In some embodiments, the electronic device 100 comprises a heat dissipation copper pipe 5; the fan assembly 3 comprises a second fan 32; the fin assembly 2 comprises a plurality of second heat dissipation fins 23, the heat dissipation copper pipe 5, the second fan 32 and the second heat dissipation fins 23 are all accommodated in the accommodation space 41, two adjacent second heat dissipation fins 23 are arranged at intervals to form an air chute, the condensation section 52 of the heat dissipation copper pipe 5 is embedded in the second heat dissipation fin 23, and the air outlet of the second fan 32 corresponds to the air inlet of the air chute. The evaporation section 51 of the heat dissipation copper pipe 5 volatilizes the medium in the heat dissipation copper pipe 5 into a gaseous state by absorbing the heat of the circuit board 1, the gaseous medium condenses in the condensation section 52 to transfer heat to the second heat dissipation fin 23, and the second fan 32 blows air into the air chute to take away the heat on the surface of the second heat dissipation fin 23, thereby realizing heat dissipation of the circuit board 1.

[0051] It can be understood that the plurality of second heat dissipation fins 23 can be fixed to the inner wall of the shell 4, so that the shell 4 also participates in the heat dissipation of the second heat dissipation fin 23, or can be movably mounted in the accommodation space 41 of the shell 4, facilitating the maintenance and replacement of the second heat dissipation fin 23 in the later period, which will not be illustrated one by one here

[0052] It should be noted that the first heat conduction plate 22 fixed to the first heat dissipation fin 21 is attached to the evaporation section 51 of the heat dissipation copper pipe 5, that is, the evaporation section 51 of the heat dissipation copper pipe 5 is embedded between the circuit board 1 and the plurality of first heat dissipation fins 21, to realize the cooperation of heat dissipation with the second fan 32 and the second heat dissipation fin 23, and the heat conduction layer is coated between the first heat conduction plate 22 and the heat dissipation copper pipe 5 to improve the heat conduction efficiency.

[0053] In some embodiments, the electronic device 100 further comprises a second heat conduction plate (not marked), one side of the second heat conduction plate is attached to the heat dissipation copper pipe 5, and the other side of the second heat conduction plate is attached to the circuit board 1, to improve the efficiency of heat transfer from the circuit board 1 to the heat dissipation copper pipe 5. And a heat conduction layer is also coated between the circuit board 1 and the second heat conduction plate.

[0054] The number of the heat dissipation copper pipes 5 and the second fans 32 is two, the evaporation section 51 of the two heat dissipation copper pipes 5 is embedded between the first heat dissipation fins 21 and the circuit board 1, the condensation section 52 of the two heat dissipation copper pipes 5 respectively encloses the two second fans 32, so as to form the distribution structure of "8" shape, improves the utilization rate of the containing space 41 in the electronic equipment 100, the second heat dissipation fins 23 are distributed at the air outlet of the second fan 32, so as to form the three-fan heat dissipation structure of the two second fans 32 and the first fan 31, and improve the heat dissipation efficiency of the electronic equipment 100.

[0055] For the above-mentioned shell 4, please refer to the figure, the shell 4 includes an upper shell 4a and a bottom cover 4b, the upper shell 4a is provided with a containing groove 4a1, the bottom cover 4b covers the slot of the containing groove 4a1 to form a containing space 41, and the heat dissipation through hole 42 is arranged on the upper shell 4a. The detachable mounting structure of the upper shell 4a and the bottom cover 4b facilitates the assembly of the fan assembly 3 and the fin assembly 2 in the containing space 41, and improves the installation efficiency of the electronic equipment 100.

[0056] Further, the bottom cover 4b is provided with a plurality of air inlet holes 4b1, and the plurality of air inlet holes 4b1 correspond to the air inlets of the fan assembly 3. In this embodiment, the plurality of air inlet holes 4b1 are divided into three regions, namely the first air inlet region, the second air inlet region and the third air inlet region, the first air inlet region corresponds to the air inlet of the first fan 31, and the second air inlet region and the third air inlet region correspond to the air inlets of the two second fans 32. The heat dissipation through hole 42 is arranged on the side wall of the upper shell 4a, and the first fan 31 and the two second fans 32 correspond to the heat dissipation through hole 42. Since the density of hot air is less than that of cold air, the cold air enters the containing space 41 from the air inlet hole 4b1 of the bottom cover 4b, and the hot air is discharged from the heat dissipation through hole 42 under the blowing of the first fan 31 and the second fan 32, so as to form a heat dissipation air duct from bottom to top, which is beneficial to the heat dissipation of the circuit board 1 in the containing space 41.

[0057] In the embodiment of the present application, the electronic device 100 comprises a shell 4, a fan assembly 3, a fin assembly 2 and a heat dissipation copper pipe 5, the fan assembly 3, the fin assembly 2 and the heat dissipation copper pipe 5 are all arranged in the shell 4, wherein the shell 4 is provided with a receiving space 41 and a plurality of heat dissipation through holes 42, the plurality of heat dissipation through holes 42 are in communication with the receiving space 41; the circuit board 1 is contained in the receiving space 41; the fan assembly 3 comprises a first fan 31 and a second fan 32, the first fan 31 and the second fan 32 are both contained in the receiving space 41; the fin assembly 2 comprises a plurality of first heat dissipation fins 21 and a plurality of second heat dissipation fins 23, the plurality of first heat dissipation fins 21 are arranged at intervals, one side of the plurality of first heat dissipation fins 21 is fixed to the inner wall of the receiving space 41, the other side of the plurality of first heat dissipation fins 21 abuts against the circuit board 1, one end of the plurality of first heat dissipation fins 21 corresponds to the first fan 31, the other end of the plurality of first heat dissipation fins 21 corresponds to the plurality of heat dissipation through holes 42, two adjacent second heat dissipation fins 23 are arranged at intervals to form an air slot, the condensation section 52 of the heat dissipation copper pipe 5 is embedded in the second heat dissipation fin 23, the air outlet of the second fan 32 corresponds to the air inlet of the air slot, so that the first fan 31 drives the air around the first heat dissipation fin 21 to flow out from the plurality of heat dissipation through holes 42, and the second fan 32 drives the air around the second heat dissipation fin 23 to flow out from the plurality of heat dissipation through holes 42. Through the above structure, the heat dissipation copper pipe 5 absorbs the heat released by the circuit board 1 in the embodiment of the present application, cooperates with the plurality of first heat dissipation fins 21 fixed to the shell 4 and the first heat dissipation fan, and the plurality of second heat dissipation fins 23 and the second fan 32 assist the heat dissipation copper pipe 5 to dissipate heat, so as to realize high-efficiency heat conduction and dissipation for the circuit board 1, and ensure the stable output of the high performance of the electronic device 100, especially for the heat dissipation of the high-performance chip on the circuit board 1 at present.

[0058] It should be noted that the preferred embodiments of the present application are given in the specification and drawings of the present application, but the present application can be implemented in many different forms, and is not limited to the embodiments described in the specification. These embodiments are not additional limitations on the content of the present application, and the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. Furthermore, each of the above technical features continues to be combined, forming various embodiments not listed above, which are considered to be within the scope of the present application. Furthermore, for those skilled in the art, the above description can be improved or changed, and all these improvements and changes shall fall within the scope of protection of the appended claims of the present application.

Claims

1. An electronic device, comprising: The electronic device comprises: a shell provided with a receiving space and a plurality of heat dissipation through holes in communication with the receiving space; a circuit board accommodated in the receiving space; a fan assembly comprising a first fan accommodated in the receiving space; a fin assembly comprising a plurality of first heat dissipation fins, the plurality of first heat dissipation fins being spaced apart, one side of the plurality of first heat dissipation fins being fixed to an inner wall of the receiving space, the other side of the plurality of first heat dissipation fins abutting the circuit board, one end of the plurality of first heat dissipation fins corresponding to the first fan, the other end of the plurality of first heat dissipation fins corresponding to the plurality of heat dissipation through holes, so that the first fan drives the air around the first heat dissipation fins to flow out of the plurality of heat dissipation through holes.

2. The electronic device according to claim 1, wherein the fin assembly comprises a first heat pipe, one side of the first heat pipe being fixed to the other side of the plurality of first heat dissipation fins, the other side of the first heat pipe being attached to the circuit board.

3. The electronic device according to claim 2, wherein the electronic device comprises a heat conduction layer, one side of the heat conduction layer being attached to the first heat pipe, the other side of the heat conduction layer being attached to the first heat pipe.

4. The electronic device according to claim 1, wherein the first fan is provided with a conductive contact point; the circuit board is provided with a conductive protrusion, the conductive protrusion abutting the conductive contact point.

5. The electronic device according to claim 1, wherein the first fan comprises a threaded member; the first fan extends an installation portion on the peripheral side, the installation portion being provided with an installation hole; the receiving space is provided with a threaded hole, the threaded member being screwed into the threaded hole after passing through the installation hole.

6. The electronic device according to claim 1, wherein the first heat dissipation fin comprises a flow guiding section, an accelerating section and a diffusion section, the flow guiding section, the accelerating section and the diffusion section being connected in sequence, the vertical distance from the end of the flow guiding section to the shell being greater than the vertical distance from the end of the accelerating section to the shell, the vertical distance from the end of the flow guiding section to the shell being less than the vertical distance from the end of the diffusion section to the shell, so that the gap between two adjacent first heat dissipation fins forms a flow guiding channel section, an accelerating channel section and a diffusion channel section.

7. The electronic device according to claim 1, wherein the electronic device comprises a heat dissipation copper pipe; the fan assembly comprises a second fan; the fin assembly comprises a plurality of second heat dissipation fins, the heat dissipation copper pipe, the second fan and the plurality of second heat dissipation fins being accommodated in the receiving space, two adjacent second heat dissipation fins being spaced apart to form an air slot, the evaporation section of the heat dissipation copper pipe being embedded between the circuit board and the plurality of first heat dissipation fins, the condensation section of the heat dissipation copper pipe being embedded in the second heat dissipation fins, the air outlet of the second fan corresponding to the air inlet of the air slot.

8. The electronic device according to claim 7, wherein The number of the heat dissipation copper pipes and the second fans is two, the evaporation sections of the two heat dissipation copper pipes are embedded between the first heat dissipation fins and the circuit board, and the condensation sections of the two heat dissipation copper pipes respectively enclose the two second fans.

9. The electronic device of claim 1, wherein, The shell comprises an upper shell and a bottom cover, the upper shell is provided with a receiving groove, the bottom cover covers the groove opening of the receiving groove to form the receiving space, and the heat dissipation through hole is arranged on the upper shell.

10. The electronic device of claim 9, wherein, The bottom cover is provided with a plurality of air inlet holes corresponding to the air inlet of the fan assembly, and the heat dissipation through hole is located on the side wall of the upper shell.

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