Chip removing device and chip production line

Abstract

The utility model belongs to the technical field of semiconductors, and discloses a chip removing device and a chip production line. The chip removing device comprises a film scraping mechanism, a lower ejector pin mechanism, a film adhering mechanism and an upper ejector pin mechanism, the film scraping mechanism comprises a first driving assembly and a film scraping carrying table, and the first driving assembly can drive the film scraping carrying table to be switched between a film feeding position and a waste removing position and can change the position of the film scraping carrying table in the horizontal direction; the lower ejector pin mechanism is arranged on the lower side of the waste removing position and comprises a lower ejector pin and a first lifting driving part, and the first lifting driving part can drive the lower ejector pin to ascend; the mucous membrane mechanism comprises a second driving mechanism, a mucous membrane mounting piece and a mucous membrane, the mucous membrane is mounted on the mucous membrane mounting piece, and the lower side of the mucous membrane is viscous; the upper ejector pin mechanism comprises an upper ejector pin and a second lifting driving piece, and the second lifting driving piece can drive the upper ejector pin to descend. According to the chip removing device and the chip production line, the error rate in the chip removing process can be reduced, and the chip removing efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field especially relates to a chip rejection device and chip production line. BACKGROUND

[0002] In the field of technology, semiconductor chips are developing rapidly, and the industry and equipment related to semiconductor chips have also entered a mature stage. The MinLED chip delivery inspection is composed of two processes of detection and selection. The appearance defect detection of the MinLED chip includes doublet, misalignment, angle skew, crystal, serious dirt, broken crystal, serious electrode scratch, photolithography special area, more gold, and less gold. Generally, the chip selection uses the cam mechanism of the upper needle to control the up-down movement of the suction nozzle to suck the chip, and then the upper needle structure puts the NG chip into the waste tray. Many devices of the same type focus on the detection function of the chip, such as self-developed algorithm and strong defect detection capability. However, the AOI does not have high detection requirements of the front-end process, and the selection is the core of the entire device. The above chip selection method has many problems.

[0003] The cam mechanism of the upper needle controls the up-down movement of the suction nozzle to suck the chip, and then puts the NG chip into the waste tray. This MinLED chip selection method has many problems, especially when the appearance defect of the chip is doublet, broken crystal, and crystal. The suction nozzle has the problems of missing material, incomplete suction of broken chips, and insufficient suction area leading to failure. Moreover, this selection method is low in efficiency and has a high probability of dropping the suction chip.

[0004] In addition, the traditional rejection waste method relies on adsorption to remove the damaged chip. The upper needle needs to move from the chip to the waste box, and then the negative pressure is removed. The damaged chip falls into the waste box. This method is low in working efficiency and wastes time in transferring waste.

[0005] Therefore, it is urgent to design a chip rejection device and a chip production line to solve the above problems. UTILITY MODEL CONTENTS

[0006] One purpose of the utility model is to provide a chip rejection device that can reduce the error rate during the chip rejection process, improve the efficiency of chip rejection, and shorten the time of chip rejection.

[0007] Another purpose of the utility model is to provide a chip production line that can reduce the error rate during the chip rejection process, improve the efficiency of chip rejection, and shorten the time of chip rejection.

[0008] To achieve this purpose, the utility model adopts the following technical solutions:

[0009] The chip rejection device comprises:

[0010] The membrane mechanism comprises a first driving assembly and a membrane carrier, the membrane carrier is used to carry and flatten the membrane with a plurality of chips on the upper side, the first driving assembly can drive the membrane carrier to switch between the upper membrane position and the reject position and can change the position of the membrane carrier in the horizontal direction;

[0011] The lower pin mechanism is arranged on the lower side of the reject position, the lower pin mechanism comprises a lower pin and a first lifting driving member, the first lifting driving member can drive the lower pin to rise so that the head of the lower pin abuts against the lower side of the membrane;

[0012] The mucosa mechanism comprises a second driving mechanism, a mucosa mounting member and a mucosa, the mucosa is mounted on the mucosa mounting member and has adhesion on the lower side, the second driving mechanism can drive the mucosa mounting member to switch between above the reject position and the membrane removal position;

[0013] The upper pin mechanism is arranged on the upper side of the reject position, the upper pin mechanism comprises an upper pin and a second lifting driving member, the second lifting driving member can drive the upper pin to descend so that the upper pin is pressed against the mucosa and the local mucosa is pressed against the lower pin and adheres to the chip.

[0014] As an optional solution, the first driving assembly comprises a first driving member and a second driving member, one of the first driving member and the second driving member can output the movement in the X direction, and the other can output the movement in the Y direction, the second driving member is connected to the output end of the first driving member, the membrane carrier is mounted on the output end of the second driving member, and the Y direction is perpendicular to the X direction.

[0015] As an optional solution, the membrane carrier comprises:

[0016] The carrier bottom plate is connected to the output end of the second driving member;

[0017] The clamping assembly comprises a first bottom plate, a membrane ring, a connecting member and a pressing assembly, the first bottom plate is connected to the upper side of the carrier bottom plate, the pressing assembly is connected to the lower side of the first bottom plate, the output end of the pressing assembly penetrates through the first bottom plate, the connecting member is located on the upper side of the first bottom plate and connected to the output end of the pressing assembly, the membrane ring is provided with the flattened membrane, and the pressing assembly can pull the connecting member downward to clamp the membrane ring between the first bottom plate and the connecting member;

[0018] The separation driving member is mounted on the carrier bottom plate, the separation driving member can output the movement in the Z direction to abut against the lower side of the connecting member and lift the connecting member against the pulling force of the pressing assembly.

[0019] As an optional solution, the above pressing assembly comprises:

[0020] A linear bearing connected to the lower side of the first bottom plate, an inner shaft of the linear bearing being connected to the connecting piece;

[0021] A limiting piece connected to the lower end of the linear bearing;

[0022] An elastic piece sleeved on the outer periphery of the linear bearing, one end of the elastic piece abutting against the mounting flange of the linear bearing, and the other end of the elastic piece abutting against the limiting piece.

[0023] As an optional solution, the above cover slide further comprises a rotating driving assembly, the first bottom plate being connected with a first shaft at the lower side, the first shaft being pivotally connected to the slide base, the rotating driving assembly comprising:

[0024] A rotating driving piece mounted on the slide base and having an output shaft;

[0025] A idler wheel pivotally connected to the slide base, the center of the rotating driving piece, the idler wheel and the first shaft being arranged in a triangular shape;

[0026] A transmission belt surrounding the outside of the output shaft, the idler wheel and the first shaft and being commonly tensioned by the three.

[0027] As an optional solution, the above chip removing device further comprises a visual detection mechanism, the visual detection mechanism being used for detecting the damaged chip and being communicatively connected to the first driving assembly.

[0028] As an optional solution, the upper needle comprises an upper needle body and a first needle head, the upper needle body being connected to the output end of the second lifting driving piece, the first needle head being connected to the other end of the upper needle body, the head area of the first needle head being smaller than the area of the chip; and / or

[0029] The lower needle comprises a lower needle body and a second needle head, the lower needle body being connected to the output end of the first lifting driving piece, the second needle head being connected to the other end of the lower needle body, the head area of the second needle head being smaller than the area of the chip.

[0030] As an optional solution, the upper needle body and the first needle head are floatingly connected; and / or

[0031] The lower needle body and the second needle head are floatingly connected.

[0032] As an optional solution, the second driving mechanism comprises:

[0033] A third driving member and a fourth driving member, one of the third driving member and the fourth driving member is capable of outputting a Y direction movement, the other of the third driving member and the fourth driving member is capable of outputting an X direction movement, the fourth driving member is installed at an output end of the third driving member;

[0034] A fifth driving member connected to an output end of the fourth driving member, the fifth driving member is capable of outputting a Z direction movement, the X direction, the Y direction and the Z direction are perpendicular to each other, the mucosa mounting member is connected to an output end of the fifth driving member;

[0035] A manual sliding table connected to one side of the output end of the fourth driving member and connected to the mucosa mounting member on the other side.

[0036] A chip production line comprising the chip removing device.

[0037] The chip removing device has the advantages that:

[0038] The chip removing device has the advantages that:

[0039] The utility model also provides a chip production line, including above-mentioned chip rejection device. The chip production line through adopting above-mentioned chip rejection device, can reduce the error rate in the chip rejection process and improve the efficiency of chip rejection, shorten the time of chip rejection. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 It is the structural schematic diagram of chip rejection device provided by the utility model embodiment;

[0041] Figure 2 It is the structural schematic diagram of membrane mechanism provided by the utility model embodiment;

[0042] Figure 3 It is the structural schematic diagram of membrane carrier provided by the utility model embodiment;

[0043] Figure 4 It is Figure 3 The enlarged view of A in Fig.

[0044] Figure 5 It is the structural schematic diagram of upper needle mechanism provided by the utility model embodiment;

[0045] Figure 6 It is the structural schematic diagram of upper needle provided by the utility model embodiment;

[0046] Figure 7 It is the structural schematic diagram of lower needle mechanism provided by the utility model embodiment;

[0047] Figure 8 It is the structural schematic diagram of mucosa mechanism provided by the utility model embodiment;

[0048] Figure 9 It is Figure 8 The enlarged view of B in Fig.

[0049] In the figure:

[0050] 10, membrane mechanism; 11, first drive assembly; 111, first drive piece; 112, second drive piece; 12, membrane carrier; 121, carrier bottom plate;

[0051] 122, clamping assembly; 1221, first bottom plate; 1222, membrane ring; 1225, connecting piece; 1223, lower pressing assembly; 12231, linear bearing; 12232, limiting piece; 12233, elastic piece; 1224, first shaft;

[0052] 123, separation drive piece; 124, rotary drive assembly; 1241, rotary drive piece; 1242, idler wheel; 1243, transmission belt;

[0053] 20, lower ejector mechanism; 21, lower ejector; 211, lower ejector body; 212, second needle head; 22, first lifting driving member;

[0054] 30, mucosa mechanism; 31, second driving mechanism; 311, third driving member; 312, fourth driving member; 313, fifth driving member; 314, manual sliding table; 32, mucosa mounting member; 33, mucosa;

[0055] 40, upper ejector mechanism; 41, upper ejector; 411, upper ejector body; 412, first needle head; 42, second lifting driving member;

[0056] 50, visual detection mechanism. DETAILED DESCRIPTION

[0057] The utility model will be described in further detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model, and not to limit the utility model. In addition, it should be noted that, in order to facilitate the description, only the part related to the utility model is shown in the drawings, not all structures.

[0058] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0059] In the utility model, unless otherwise explicitly specified and limited, the first feature is "on" or "below" the second feature, which can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0060] In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used to distinguish in the description, and have no special meaning.

[0061] The present embodiment provides a chip rejection device, which can reduce the error rate in the chip rejection process and improve the efficiency of chip rejection, and shorten the time of chip rejection. As shown in Figure 1 and Figure 2 , the chip rejection device includes a membrane mechanism 10, a lower ejector mechanism 20, a sticky membrane mechanism 30, and an upper ejector mechanism 40. The membrane mechanism 10 includes a first driving assembly 11 and a membrane stage 12, the membrane stage 12 is used to support and flatten the membrane with a plurality of chips on the upper side, the first driving assembly 11 can drive the membrane stage 12 to switch between the upper membrane position and the rejection position and can change the position of the membrane stage 12 in the horizontal direction; the lower ejector mechanism 20 is arranged on the lower side of the rejection position, the lower ejector mechanism 20 includes a lower ejector 21 and a first lifting driving member 22 (see Figure 7 ), the first lifting driving member 22 can drive the lower ejector 21 to rise so that the head of the lower ejector 21 abuts against the lower side of the membrane; the sticky membrane mechanism 30 includes a second driving mechanism 31, a sticky membrane mounting member 32, and a sticky membrane 33, the sticky membrane 33 is mounted on the sticky membrane mounting member 32 and has adhesion on the lower side, the second driving mechanism 31 can drive the sticky membrane mounting member 32 to switch above the rejection position and the membrane removal position; the upper ejector mechanism 40 is arranged on the upper side of the rejection position, the upper ejector mechanism 40 includes an upper ejector 41 and a second lifting driving member 42 (see Figure 5 and Figure 6 ), the second lifting driving member 42 can drive the upper ejector 41 to descend so that the upper ejector 41 is pressed to the sticky membrane 33 and the local sticky membrane 33 is pressed to the lower ejector 21 and sticks to the chip.

[0062] The chip rejection device, through the setting of the adhesive film mechanism 30, when the second driving mechanism 31 drives the adhesive film 33 to reach the rejection position, the first driving assembly 11 drives the adhesive film carrier 12 to reach the rejection position, the first lifting driving part 22 drives the lower ejector pin 21 to reach below the rejection position, the second lifting driving part 42 drives the upper ejector pin 41 to reach above the adhesive film 33 and opposite to the lower ejector pin 21, the first driving assembly 11 drives the adhesive film carrier 12 to change the position in the horizontal direction to make the defective chip correspond to the upper ejector pin 41 and the lower ejector pin 21, at this time, the first lifting driving part 22 drives the lower ejector pin 21 to rise, the second lifting driving part 42 drives the upper ejector pin 41 to descend, which is equivalent to that the upper ejector pin 41 and the lower ejector pin 21 clamp the adhesive film 33, the defective chip and the film sheet, because the adhesive side of the adhesive film 33 contacts the defective chip, when the upper ejector pin 41 and the lower ejector pin 21 are away from each other, the defective chip is separated from the film sheet and adheres to the adhesive film 33, completing a rejection, the first driving assembly 11 adjusts the position of the adhesive film carrier 12 in the horizontal direction again to make another defective chip opposite to the upper ejector pin 41 and the lower ejector pin 21, the upper ejector pin 41 and the lower ejector pin 21 clamp the adhesive film 33, the defective chip and the film sheet again, completing the rejection of another defective chip, when the rejection operation is performed for many times, the defective chips on the current film sheet are adhered to the adhesive film 33, the second driving mechanism 31 drives the adhesive film mounting part 32 to reach the film unloading position, the adhesive film 33 or the adhesive film mounting part 32 is uniformly unloaded and replaced with a new one, at the same time, the first driving assembly 11 drives the adhesive film carrier 12 to return to the film loading position, and another film sheet to be rejected can be replaced, and the rejection process in the prior art is to use the adsorption means, after adsorbing a defective chip, the defective chip is transferred to the waste box, and then returns to the adsorption position, for a film sheet, there are many defective chips, the adsorption and transfer process is easy to damage the good products, and increases the operation time, and the scheme of the embodiment greatly saves the rejection time, and the adhesion mode reduces the error rate and the influence on the good chips around the defective chip compared with the adsorption mode.

[0063] Optionally, as Figure 2As shown, the first driving assembly 11 comprises a first driving member 111 capable of outputting movement in the X direction and a second driving member 112 capable of outputting movement in the Y direction, the second driving member 112 is connected to the output end of the first driving member 111, the membrane carrier 12 is installed on the output end of the second driving member 112, and the Y direction is perpendicular to the X direction. Through the above arrangement, the movement adjustment of the membrane carrier 12 in the horizontal direction and the adjustment between the waste position and the film loading position can be realized. In another embodiment, the first driving member 111 outputs movement in the Y direction, and the second driving member 112 outputs movement in the X direction, which can also achieve the above effect, which is not limited herein. In this embodiment, the first driving member 111 and the second driving member 112 are both linear modules, and in other embodiments, the first driving member 111 and the second driving member 112 can also be driving elements capable of outputting linear movement such as air cylinders, which are not limited herein.

[0064] Optionally, as shown, Figure 3 As shown, the membrane carrier 12 comprises a carrier bottom plate 121 connected to the output end of the second driving member 112, a clamping assembly 122, and a separation driving member 123. The clamping assembly 122 comprises a first bottom plate 1221 connected to the upper side of the carrier bottom plate 121, a membrane ring 1222, a connecting member 1225, and a pressing assembly 1223 connected to the lower side of the first bottom plate 1221, the output end of the pressing assembly 1223 penetrating the first bottom plate 1221, the connecting member 1225 being located on the upper side of the first bottom plate 1221 and connected to the output end of the pressing assembly 1223, the membrane ring 1222 being provided with a flattened film, and the pressing assembly 1223 being capable of pulling the connecting member 1225 downward to clamp the membrane ring 1222 between the first bottom plate 1221 and the connecting member 1225. The separation driving member 123 is installed on the carrier bottom plate 121 and is capable of outputting movement in the Z direction to abut against the lower side of the connecting member 1225 and overcome the pulling force of the pressing assembly 1223 to lift the connecting member 1225. Through the above arrangement, when the membrane ring 1222 is installed, the output end of the separation driving member 123 is extended to lift the connecting member 1225, so that the distance between the connecting member 1225 and the first bottom plate 1221 is sufficient to extend into a membrane ring 1222, after the membrane ring 1222 is placed on the first bottom plate 1221, the output end of the separation driving member 123 is retracted, and under the pressing force of the pressing assembly 1223, the connecting member 1225 presses the membrane ring 1222 on the first bottom plate 1221 and is fixed.

[0065] Optionally, the connecting member 1225 is provided with two, each of which is provided with a pressing assembly 1223 and a separation driving member 123 to ensure that the membrane ring 1222 is balanced in force when it is pressed.

[0066] Optionally, as shown,Figure 3 and Figure 4 As shown, the pressing assembly 1223 includes a linear bearing 12231, a limiting member 12232, and an elastic member 12233. The linear bearing 12231 is connected to the lower side of the first base plate 1221, and the inner shaft of the linear bearing 12231 is correspondingly connected to the connecting member 1225. The limiting member 12232 is connected to the lower end of the linear bearing 12231. The elastic member 12233 is sleeved on the outer periphery of the linear bearing 12231, with one end abutting against the mounting flange of the linear bearing 12231 and the other end abutting against the limiting member 12232. It should be noted that the linear bearing 12231 in the figure is labeled as the mounting part. The top of the moving end of the linear bearing 12231 is connected to the connector 1225, and the bottom is connected to the limit member 12232. The elastic force of the elastic member 12233 forces the moving end of the linear bearing 12231 to move downward, thereby pressing the connector 1225 against the first base plate 1221. When the output end of the separation drive member 123 extends, the moving end of the linear bearing 12231 moves upward, and the elastic member 12233 is compressed.

[0067] In other embodiments, the pressing component 1223 may also be a spring cylinder or the like, and is not limited here.

[0068] In this embodiment, the separation drive 123 is a cylinder. In other embodiments, the separation drive 123 may also be other drive elements that can output linear motion, which is not limited here.

[0069] Optionally, such as Figure 3 As shown, the diaphragm stage 12 also includes a rotation drive assembly 124. A first shaft 1224 is connected to the lower side of the first base plate 1221. The first shaft 1224 is pivotally connected to the stage base plate 121. The rotation drive assembly 124 includes a rotation drive component 1241, an idler wheel 1242, and a transmission belt 1243. The rotation drive component 1241 is mounted on the stage base plate 121 and has an output shaft. The idler wheel 1242 is pivotally connected to the stage base plate 121. The rotation drive component 1241, the idler wheel 1242, and the center of the first base plate 1221 are arranged in a triangle. The transmission belt 1243 surrounds the output shaft, the idler wheel 1242, and the first shaft 1224 and is tensioned by all three. With the above settings, the clamping assembly 122 can rotate under the drive of the rotation drive 1241. It should be noted that the chips on the diaphragm are generally arranged in a matrix. When the arrangement direction of the chips is not parallel to the X and Y directions after the diaphragm ring 1222 is installed, the rotation drive assembly 124 drives the rotation to make the arrangement direction of the chips parallel to the X and Y directions. After that, only the first drive 111 and the second drive 112 need to move.

[0070] The idler wheel 1242 serves to avoid the connecting piece 1225.

[0071] Optionally, the first shaft 1224 is provided with a gear outside, and the base plate 121 of the carrier is provided with a gear correspondingly, the transmission belt 1243, the output shaft and the idler gear 1242 are in the form of gears, and transmission distance is more accurate.

[0072] Optionally, as shown in Figure 1 The chip rejection device further comprises a visual detection mechanism 50 for detecting damaged chips and being in communication connection with the upper ejector mechanism 40 and the lower ejector mechanism 20 respectively. Through the above setting, after the membrane ring 1222 is installed, it is detected by the visual detection mechanism 50, on one hand, to detect defective chips, and on the other hand, to detect whether the membrane ring 1222 needs to be turned.

[0073] Optionally, as shown in Figure 5 and Figure 6 The upper ejector 41 comprises an upper ejector body 411 and a first needle head 412, the upper ejector body 411 is connected to the output end of the second lifting driving part 42, and the first needle head 412 is connected to the other end of the upper ejector body 411, and the head area of the first needle head 412 is smaller than the area of the chip. Through the above setting, the second lifting driving part 42 drives the upper ejector body 411 and the first needle head 412 to move up and down, and at the same time, the area of the first needle head 412 is smaller than the area of the chip, so that when the first needle head 412 is pressed down, the first needle head 412 has no influence on the chips around the chip, and it is ensured that the mucous membrane 33 can be accurately adhered to the defective chip when the first needle head 412 is pressed down.

[0074] Optionally, as shown in Figure 7 The lower ejector 21 comprises a lower ejector body 211 and a second needle head 212, the lower ejector body 211 is connected to the output end of the first lifting driving part 22, and the second needle head 212 is connected to the other end of the lower ejector body 211, and the head area of the second needle head 212 is smaller than the area of the chip. Through the above setting, the first lifting driving part 22 drives the lower ejector body 211 and the second needle head 212 to move up and down, and at the same time, the area of the second needle head 212 is smaller than the area of the chip, so that when the second needle head 212 is lifted up, the second needle head 212 has no influence on the chips around the chip.

[0075] Optionally, the upper ejector body 411 and the first needle head 412 are floatingly connected; the lower ejector body 211 and the second needle head 212 are floatingly connected. Through the above setting, it is prevented that the first needle head 412 has too large pressing force on the mucous membrane 33, causing damage to the mucous membrane 33, and at the same time, it is prevented that the second needle head 212 has too large supporting force on the membrane, causing damage to the membrane.

[0076] In addition, the lower ejector body 211 has an adsorption function for the diaphragm, which can prevent the diaphragm from moving during the rejection process, thereby affecting the rejection accuracy.

[0077] Optionally, as shown in Figure 8 and Figure 9 The second driving mechanism 31 includes a third driving member 311, a fourth driving member 312, a fifth driving member 313, and a manual sliding table 314, one of the third driving member 311 and the fourth driving member 312 can output a Y-direction movement, the other of the third driving member 311 and the fourth driving member 312 can output an X-direction movement, the fourth driving member 312 is installed on an output end of the third driving member 311; the fifth driving member 313 is connected to an output end of the fourth driving member 312, the fifth driving member 313 can output a Z-direction movement, the X-direction, the Y-direction and the Z-direction are perpendicular to each other, the mucosa mounting member 32 is connected to an output end of the fifth driving member 313; one side of the manual sliding table 314 is connected to the output end of the fourth driving member 312, and the other side is connected to the mucosa mounting member 32. The above arrangement can realize the position movement of the mucosa 33 in the X-direction, the Y-direction and the Z-direction, and the manual sliding table 314 can manually compensate the position of the mucosa 33.

[0078] It should be noted that the driving elements capable of outputting linear movement mentioned in the embodiment can be selected from any one of a linear module, a cylinder or a linear motor, which is not limited here.

[0079] The embodiment further provides a chip production line including the chip rejection device. The chip production line can reduce the error rate in the chip rejection process, improve the efficiency of the chip rejection, and shorten the time of the chip rejection by using the chip rejection device.

[0080] Obviously, the above embodiments of the utility model are only examples for clearly explaining the utility model, and are not the limitation of the embodiments of the utility model. For ordinary skilled in the art, various obvious changes, re-adjustment and replacement can be made without departing from the protection scope of the utility model. Here, it is not necessary and impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement made in the spirit and principle of the utility model should be included in the protection scope of the utility model claim.

Claims

1. A chip rejection device, characterized in that, include: The membrane-splitting mechanism (10) includes a first drive assembly (11) and a membrane-splitting stage (12). The membrane-splitting stage (12) is used to support and flatten a membrane with multiple chips mounted on its upper side. The first drive assembly (11) can drive the membrane-splitting stage (12) to switch between the membrane-on position and the rejection position and can change the position of the membrane-splitting stage (12) in the horizontal direction. The lower ejector pin mechanism (20) is located below the waste rejection position. The lower ejector pin mechanism (20) includes a lower ejector pin (21) and a first lifting drive member (22). The first lifting drive member (22) can drive the lower ejector pin (21) to rise so that the head of the lower ejector pin (21) abuts against the lower side of the diaphragm. The adhesive membrane mechanism (30) includes a second drive mechanism (31), an adhesive membrane mounting component (32), and an adhesive membrane (33). The adhesive membrane (33) is mounted on the adhesive membrane mounting component (32) and has an adhesive side. The second drive mechanism (31) can drive the adhesive membrane mounting component (32) to switch between the waste removal position and the unloading position. An upper ejector mechanism (40) is disposed on the upper side of the rejection position. The upper ejector mechanism (40) includes an upper ejector (41) and a second lifting drive (42). The second lifting drive (42) can drive the upper ejector (41) to descend so that the upper ejector (41) presses against the mucosa (33) and causes a portion of the mucosa (33) to press against the lower ejector (21) and stick to the chip.

2. The chip rejection device according to claim 1, characterized in that, The first drive assembly (11) includes a first drive member (111) and a second drive member (112). One of the first drive member (111) and the second drive member (112) can output movement in the X direction, and the other can output movement in the Y direction. The second drive member (112) is connected to the output end of the first drive member (111), and the diaphragm stage (12) is mounted on the output end of the second drive member (112). The Y direction is perpendicular to the X direction.

3. The chip rejection device according to claim 2, characterized in that, The membrane stage (12) includes: The platform base plate (121) is connected to the output end of the second drive unit (112); The clamping assembly (122) includes a first base plate (1221), a diaphragm ring (1222), a connector (1225), and a pressing assembly (1223). The first base plate (1221) is connected to the upper side of the platform base plate (121), and the pressing assembly (1223) is connected to the lower side of the first base plate (1221). The output end of the pressing assembly (1223) passes through the first base plate (1221). The connector (1225) is located on the upper side of the first base plate (1221) and connected to the output end of the pressing assembly (1223). The diaphragm ring (1222) is provided with a flattened diaphragm. The pressing assembly (1223) can pull the connector (1225) down to clamp the diaphragm ring (1222) between the first base plate (1221) and the connector (1225). A separation drive unit (123) is installed on the platform base plate (121). The separation drive unit (123) can output movement along the Z direction to abut against the lower side of the connector (1225) and overcome the pulling force of the pressing assembly (1223) to lift the connector (1225).

4. The chip rejection device according to claim 3, characterized in that, The pressing assembly (1223) includes: A linear bearing (12231) is connected to the lower side of the first base plate (1221), and the inner shaft of the linear bearing (12231) is correspondingly connected to the connecting member (1225); A limiting member (12232) is connected to the lower end of the linear bearing (12231); The elastic element (12233) is sleeved on the outer periphery of the linear bearing (12231), with one end abutting against the mounting flange of the linear bearing (12231) and the other end abutting against the limiting element (12232).

5. The chip rejection device according to claim 3, characterized in that, The diaphragm stage (12) further includes a rotation drive assembly (124). A first shaft (1224) is connected to the lower side of the first base plate (1221). The first shaft (1224) is pivotally connected to the base plate (121) of the stage. The rotation drive assembly (124) includes: A rotation drive (1241) is mounted on the platform base plate (121) and has an output shaft; An idler wheel (1242) is pivotally connected to the base plate (121) of the platform. The center of the rotation drive (1241), the idler wheel (1242) and the first base plate (1221) are arranged in a triangle. A drive belt (1243) is arranged around the output shaft, the idler pulley (1242) and the first shaft (1224) and is tensioned by all three together.

6. The chip rejection apparatus according to any one of claims 1-5, characterized in that, The chip rejection device further includes a visual inspection mechanism (50), which is used to detect damaged chips and communicate with the first driving component (11).

7. The chip rejection apparatus according to any one of claims 1-5, characterized in that, The upper ejector pin (41) includes an upper ejector pin body (411) and a first needle tip (412). The upper ejector pin body (411) is connected to the output end of the second lifting drive unit (42), and the first needle tip (412) is connected to the other end of the upper ejector pin body (411). The head area of ​​the first needle tip (412) is smaller than the area of ​​the chip; and / or The lower ejector pin (21) includes a lower ejector pin body (211) and a second needle head (212). The lower ejector pin body (211) is connected to the output end of the first lifting drive (22), and the second needle head (212) is connected to the other end of the lower ejector pin body (211). The head area of ​​the second needle head (212) is smaller than the area of ​​the chip.

8. The chip rejection device according to claim 7, characterized in that, The upper ejector body (411) and the first needle (412) are floatingly connected; and / or The lower ejector pin body (211) and the second needle head (212) are floatingly connected.

9. The chip rejection apparatus according to any one of claims 1-5, characterized in that, The second drive mechanism (31) includes: The third drive unit (311) and the fourth drive unit (312) are provided. One of the third drive unit (311) and the fourth drive unit (312) can output movement in the Y direction, and the other can output movement in the X direction. The fourth drive unit (312) is installed at the output end of the third drive unit (311). The fifth driving member (313) is connected to the output end of the fourth driving member (312). The fifth driving member (313) is capable of outputting movement along the Z direction. The X direction, the Y direction and the Z direction are perpendicular to each other. The mucosa mounting member (32) is connected to the output end of the fifth driving member (313). The manual slide (314) is connected to the output end of the fourth drive unit (312) on one side and to the mucosa mounting unit (32) on the other side.

10. A chip production line, characterized in that, Includes the chip rejection device as described in any one of claims 1-9.

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