Wafer box

By designing miniaturized wafer boxes and limiting structures, the problems of transportation difficulties and high costs caused by the large size of traditional wafer boxes have been solved, and effective vacuum protection using standard vacuum bags has been achieved, reducing the risk of wafer contamination.

CN224054751UActive Publication Date: 2026-03-27BEIJING CEC HUADA ELECTRONIC DESIGN CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-26
Publication Date
2026-03-27

AI Technical Summary

Technical Problem

Traditional wafer boxes are large, which increases the difficulty and cost of transporting single wafers. In addition, the lack of dedicated vacuum bags results in inadequate vacuum protection, increasing the risk of wafer contamination.

Method used

Design a miniaturized wafer box, comprising a box body and a box cover. The box body is provided with a limiting structure and a clearance cavity for holding a single wafer, and can be used with a standard vacuum bag for vacuum packaging.

Benefits of technology

It reduces the cost of transporting a single wafer, reduces the risk of wafer contamination, and achieves effective vacuum protection without the need for custom-made vacuum bags.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a wafer box. The wafer box comprises a box body and a box cover. The box body is internally provided with a first accommodating cavity used for accommodating a wafer. One side of the box body is provided with an opening for the wafer to go in and out. The first accommodating cavity is communicated with the outside through the opening. Wherein the edge of the first accommodating cavity is only provided with a group of limiting structures, and one group of limiting structures is used for clamping one wafer. The box cover is configured to be capable of covering the opening so as to block the opening. The wafer box is used for loading and transporting the single wafers, so that when the wafers are transported in a factory, a special vacuum bag does not need to be customized, and the wafer box can be subjected to vacuum packaging by using a standard vacuum bag. And the transportation cost for transferring the single wafer in a factory is reduced.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the field of wafer's storage and transportation container, especially to a wafer box. BACKGROUND

[0002] In the process of module and circuit processing, wafer box is used for wafer chip transportation and transmission. In order to ensure the transportation and transmission efficiency, multiple wafers are placed in the same wafer box, so the volume of the traditional wafer box is relatively large, and a special vacuum bag is needed for vacuum protection. However, in actual production, single wafer may be transferred and processed in multiple packaging factories. Due to the large volume of the traditional wafer box, the difficulty and cost of single wafer transportation increase. In addition, some packaging factories do not have a special vacuum bag, which leads to unsatisfactory vacuum protection during single wafer transportation and transmission, and increases the risk of wafer contamination, causing quality problems in product processing.

[0003] Therefore, it is necessary to provide an improved wafer box to solve the above problems. SUMMARY

[0004] The purpose of the present application is to provide a wafer box with small volume and convenient transportation.

[0005] The present application discloses a wafer box, which comprises:

[0006] A box body is provided with a first accommodating cavity for accommodating wafers; one side of the box body is provided with an opening for wafer access, and the first accommodating cavity is in communication with the outside through the opening; wherein a set of limiting structures are provided at the edge of the first accommodating cavity, and the set of limiting structures are used for clamping a wafer;

[0007] A box cover is configured to cover the opening to block the opening.

[0008] Optionally, the limiting structure is a limiting groove.

[0009] Optionally, the first accommodating cavity comprises an accommodating main cavity and an avoidance cavity in communication with each other; the orthographic projection of the avoidance cavity in a first direction falls into the orthographic projection of the accommodating main cavity in the first direction, and the first direction is the thickness direction of the box body; the avoidance cavity is used for avoiding the circuit structure on the wafer; the non-overlapping part of the orthographic projection of the accommodating main cavity in the first direction and the avoidance cavity constitutes the limiting groove.

[0010] Optionally, the first accommodating cavity comprises two avoidance cavities, and the two avoidance cavities are respectively arranged on both sides of the accommodating main cavity.

[0011] Optionally, the box cover comprises a first fixing part, when the box cover is closed, the first fixing part is clamped in the accommodating main cavity, and a projection of the first fixing part on the first direction does not overlap with a projection of the avoiding cavity on the first direction.

[0012] Optionally, the box body comprises a bottom wall, a first side wall, a second side wall, a third side wall and a fourth side wall, the first side wall and the second side wall are oppositely arranged, and the third side wall and the fourth side wall are oppositely arranged.

[0013] The box cover comprises two first fixing parts, and the two first fixing parts are arranged at opposite ends of the box cover; when the box cover is closed, one of the first fixing parts abuts against the first side wall, and the other first fixing part abuts against the second side wall.

[0014] Optionally, the box cover comprises a second accommodating cavity; when the box cover is closed, the second accommodating cavity communicates with the first accommodating cavity to jointly form a cavity for accommodating wafers.

[0015] Optionally, at least one of the box body and the box cover is provided with a plurality of operation holes, and projections of the plurality of operation holes on the first direction do not overlap with projections of the first accommodating cavity and the second accommodating cavity on the first direction.

[0016] Optionally, a length of the accommodating main cavity on the first direction is greater than or equal to 3 mm and less than or equal to 4 mm, and a length of the avoiding cavity on the first direction is greater than or equal to 2 mm and less than or equal to 5 mm.

[0017] Optionally, the box body comprises a bottom wall, a first side wall, a second side wall, a third side wall and a fourth side wall, the first side wall and the second side wall are oppositely arranged, and the third side wall and the fourth side wall are oppositely arranged.

[0018] Edges of opposite sides of the box cover are each provided with a second fixing part in a convex shape, and the third side wall and the fourth side wall are each provided with a fixing groove on a side away from the opening; when the box cover is closed, the second fixing part is clamped in the fixing groove.

[0019] Compared with the related art, the wafer box is used for loading and transporting single wafers, so that when a factory transports wafers, it is not necessary to customize a special vacuum bag, and a standard vacuum bag can be used to vacuum package the wafer box. And the transportation cost of the factory when transporting single wafers is reduced.

[0020] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the specification. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings, which are incorporated herein and constitute part of this specification, illustrate embodiments consistent with the application and serve to explain the principles of the application.

[0022] Figure 1 A schematic view of a structure of a wafer box.

[0023] Figure 2 A schematic view of a structure of a box body of a wafer box.

[0024] Figure 3 A schematic view of a side view of a box body of a wafer box.

[0025] Figure 4 A schematic view of a cross-sectional view along Figure 3 line B-B.

[0026] Figure 5 A schematic view of a front view of a box cover of a wafer box.

[0027] Figure 6 A schematic view of a side view of a box cover of a wafer box.

[0028] Figure 7 A schematic view of a wafer and a wafer fixing ring.

[0029] Reference signs: box body 10; first accommodating cavity 11; accommodating main cavity 111; avoiding cavity 112; limiting groove 12; protruding tooth 13; fixing groove 14; bottom wall 15; first side wall 16; second side wall 17; third side wall 18; fourth side wall 19; box cover 20; first fixing part 21; second fixing part 22; operation hole 23; second accommodating cavity 24; wafer sheet 100; bearing film 200; wafer fixing ring 300. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments (or, “modes of implementation”) of the present application will be described clearly and completely with reference to the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated.

[0031] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0032] like Figure 1 as well as Figure 2 As shown, this application provides a wafer cassette, which includes a cassette body 10 and a cassette cover 20. The cassette body 10 has a first receiving cavity 11 for accommodating wafers. One side of the cassette body 10 has an opening 113 for wafers to enter and exit, and the first receiving cavity 11 communicates with the outside through the opening 113. The edge of the first receiving cavity 11 has only one set of limiting structures, which are used to hold one wafer in place. The cassette cover 20 is configured to close onto the opening 113 to seal it. The cassette cover 20 is also configured to open to allow wafers to enter and exit the first receiving cavity 11.

[0033] The wafer cassette of this application is used for loading and transporting single wafers, eliminating the need for factories to customize special vacuum bags when transporting wafers; standard vacuum bags can be used to vacuum-pack the wafer cassette. This also reduces the transportation costs for single wafer transfers within the factory.

[0034] The following will provide a detailed description of various embodiments of this application that conform to the above-described inventive concept.

[0035] like Figure 1 as well as Figure 2 As shown in the figure, this application discloses a wafer cassette, which includes a cassette body 10 and a cassette cover 20.

[0036] The housing 10 includes a first receiving cavity 11 for accommodating a wafer. One side of the housing 10 is provided with an opening 113 for the wafer to enter and exit, and the first receiving cavity 11 communicates with the outside through the opening 113.

[0037] In an optional embodiment, the box body 10 can include a bottom wall 15, a first side wall 16, a second side wall 17, a third side wall 18, and a fourth side wall 19. The first side wall 16 is opposite to the second side wall 17, and the third side wall 18 is opposite to the fourth side wall 19. The opening 113 is located at the top of the box body 10. Optionally, the first direction F1, the second direction F2, and the third direction F3 are perpendicular to each other. The bottom wall 15 of the box body 10 can be parallel to the plane defined by the first direction F1 and the second direction F2, the first side wall 16 and the second side wall 17 can be parallel to the plane defined by the first direction F1 and the third direction F3, and the third side wall 18 and the fourth side wall 19 can be parallel to the plane defined by the second direction F2 and the third direction F3. The length of the first accommodating cavity 11 in the first direction F1 is less than the length in the second direction F2 and the third direction F3, i.e., the length of the first accommodating cavity 11 in the first direction F1 corresponds to the thickness of the wafer, and the first direction F1 is also the thickness direction of the box body.

[0038] As shown in Figure 3 and Figure 4 , a set of limiting structures is arranged at the edge of the first accommodating cavity 11, and the set of limiting structures is used for clamping a wafer. Optionally, the limiting structure can be a limiting groove 12. Specifically, the first accommodating cavity 11 includes an accommodating main cavity 111 and an avoiding cavity 112 that are in communication with each other. The orthogonal projection of the avoiding cavity 112 in the first direction F1 falls into the orthogonal projection of the accommodating main cavity 111 in the first direction F1. The avoiding cavity 112 is used for avoiding the circuit structure on the wafer. The part of the orthogonal projection of the accommodating main cavity 111 in the first direction F1 that does not overlap with the avoiding cavity 112 constitutes the limiting groove 12.

[0039] As shown in Figure 7 , it should be noted that the wafer 100 is generally transferred and transported by a wafer fixing ring 300. The inner side of the wafer fixing ring 300 has a diameter greater than the outer diameter of the wafer 100. A layer of a bearing film 200 is fixed on the wafer fixing ring 300, and the wafer 100 is fixed to the bearing film 200. When fixed, the wafer 100 does not directly contact the wafer fixing ring 300.

[0040] As shown in Figure 2 , Figure 3 , Figure 4 and Figure 7As shown, the projection of the avoiding cavity 112 in the first direction F1 is circular or a part of a circle. The diameter of the circle is greater than the diameter of the wafer 100 and less than the outer diameter of the wafer fixing ring 300. The orthographic projection of the accommodating main cavity 111 in the first direction F1 includes a circular arc segment close to the bottom wall 15 and a straight segment vertically extending from the circular arc segment, and the diameter of the circular arc segment is greater than or equal to the outer diameter of the wafer fixing ring 300. In this way, when the wafer 100 is loaded into the box together with the wafer fixing ring 300 from the opening 113, the wafer fixing ring 300 will be clamped in the part of the orthographic projection of the accommodating main cavity 111 in the first direction F1 that does not overlap with the avoiding cavity 112, i.e., the limiting groove 12. The wafer 100 will be fixed in the area corresponding to the avoiding cavity 112, i.e., the orthographic projection of the wafer 100 in the first direction F1 will fall into the orthographic projection of the avoiding cavity 112. The side of the wafer 100 provided with the circuit structure faces the avoiding cavity 112. In this way, the circuit structure on the wafer 100 can be effectively protected due to the existence of the avoiding cavity 112.

[0041] Optionally, the length of the accommodating main cavity 111 in the first direction F1 is greater than or equal to 3 mm and less than or equal to 4 mm, and the length of the avoiding cavity 112 in the first direction F1 is greater than or equal to 2 mm and less than or equal to 5 mm. In this way, the wafer box can effectively load and protect the wafer 100, and the size of the wafer box can be reduced to facilitate transportation.

[0042] Optionally, the first accommodating cavity 11 can include two avoiding cavities 112, and the two avoiding cavities 112 are arranged on the two sides of the accommodating main cavity 111, respectively. The orthographic projections of the two avoiding cavities 112 in the first direction F1 overlap. Normally, the wafer 100 is provided with the circuit structure on one side only. In this way, the first accommodating cavity 11 is arranged, so that the front and back of the wafer 100 will not be loaded in reverse when the wafer 100 is loaded, thereby avoiding damage to the circuit structure on the wafer 100.

[0043] As shown in Figure 5 and Figure 6 , the box cover 20 includes a first fixing part 21, and when the box cover 20 is closed, the first fixing part 21 is clamped in the accommodating main cavity 111, and the orthographic projection of the first fixing part 21 in the first direction F1 does not overlap with the orthographic projection of the avoiding cavity 112 in the first direction F1.

[0044] Optionally, the first fixing part 21 can be a structure protruding towards the box body 10. The length of the first fixing part 21 in the first direction F1 can be slightly greater than the length of the accommodating main cavity 111 in the first direction F1. In this way, the first fixing part 21 and the accommodating main cavity 111 can realize interference fit.

[0045] Optionally, please refer to Figure 1 and Figure 2The lid 20 may include two first fixing parts 21, which are respectively disposed at opposite ends of the lid 20. When the lid 20 is closed, the two first fixing parts 21 are engaged with the receiving main cavity 111, with one first fixing part 21 abutting against the first side wall 16 and the other first fixing part 21 abutting against the second side wall 17.

[0046] Optionally, the box body 10 may include two protruding teeth 13 corresponding to the two first fixing parts 21, with the protruding teeth 13 protruding from the box body 10 toward the lid 20. One of the two protruding teeth 13 is located near the first side wall 16, and the other is located near the second side wall 17. The protruding teeth 13 cooperate with the protruding first fixing parts 21, allowing the first fixing parts 21 to be more securely engaged within the receiving cavity 111. Optionally, the protruding teeth 13 may gradually widen from the side away from the bottom wall 15 to the side near the bottom wall 15, and the two sides of the lid 20 may gradually narrow from the side away from the bottom wall 15 to the side near the bottom wall 15. In this way, the lid 20 can be inserted accurately and precisely.

[0047] like Figure 1 , Figure 2 , Figure 5 as well as Figure 6 As shown, the lid 20 has protruding second fixing parts 22 on both opposite edges, and the third sidewall 18 and the fourth sidewall 19 have fixing grooves 14 on the side away from the opening 113. When the lid 20 is closed, the second fixing parts 22 engage with the fixing grooves 14. Specifically, the two second fixing parts 22 on opposite sides of the lid 20 engage with the fixing grooves 14 of the third sidewall 18 and the fourth sidewall 19 respectively, so that the side of the box body 10 with the opening 113 is engaged between the two second fixing parts 22. Optionally, the minimum distance between the two fixing grooves 14 is slightly larger than the minimum distance between the two second fixing parts 22 to achieve an interference fit between the box body 10 and the lid.

[0048] Optionally, the lid 20 includes a second receiving cavity 24. Figure 5 (The area indicated by the dashed line). When the cover 20 is closed, the second receiving cavity 24 communicates with the first receiving cavity 11 to jointly form a cavity for receiving the wafer. Optionally, when the cover 20 is closed, the orthographic projection of the second receiving cavity 24 in the first direction F1 and the orthographic projection of the clearance cavity 112 in the first direction F1 together form a complete circle. The diameter of this circle is larger than the diameter of the wafer 100 and smaller than the inner diameter of the wafer retaining ring 300. In an optional embodiment, the orthographic projection of the clearance cavity 112 in the first direction F1 can be a complete circle, in which case the cover 20 may not have a second receiving cavity 24.

[0049] Optionally, at least one of the box body 10 and the box cover 20 is provided with an operation hole 23, and the orthographic projection of the operation hole 23 in the first direction F1 has no overlapping area with the orthographic projection of the first accommodating cavity 11 and the second accommodating cavity 24 in the first direction F1. The operation hole 23 can be a through hole or a blind hole. The provision of the operation hole 23 saves the material for manufacturing the wafer box, and the operation hole 23 can also provide a holding position to facilitate operation when the wafer box is transported or the box cover 20 is to be pulled out of the box body 10.

[0050] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of the present application is not limited to the precise structures described in the above embodiments and shown in the drawings; any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A wafer cassette, characterized by, The wafer box comprises: a box body, a first accommodating cavity for accommodating a wafer is arranged in the box body; an opening for the wafer to enter or exit is arranged on one side of the box body, and the first accommodating cavity is in communication with the outside through the opening; wherein only a set of limiting structures is arranged at the edge of the first accommodating cavity, and the set of limiting structures is used for clamping one wafer; a box cover, the box cover is configured to be able to cover the opening to block the opening.

2. The wafer cassette of claim 1, wherein, The limiting structure is a limiting groove.

3. The wafer cassette of claim 2, wherein, The first accommodating cavity comprises an accommodating main cavity and an avoidance cavity which are in communication with each other; the orthographic projection of the avoidance cavity in a first direction falls into the orthographic projection of the accommodating main cavity in the first direction, and the first direction is the thickness direction of the box body; the avoidance cavity is used for avoiding the circuit structure on the wafer; the non-overlapping part of the orthographic projection of the accommodating main cavity in the first direction and the orthographic projection of the avoidance cavity in the first direction constitutes the limiting groove.

4. The wafer cassette of claim 3, wherein, The first accommodating cavity comprises two avoidance cavities, and the two avoidance cavities are arranged on the two sides of the accommodating main cavity respectively.

5. The wafer cassette of claim 3, wherein, The box cover comprises a first fixing part, and when the box cover is covered, the first fixing part is clamped in the accommodating main cavity, and the orthographic projection of the first fixing part in the first direction and the orthographic projection of the avoidance cavity in the first direction have no overlapping area.

6. The wafer cassette of claim 5, wherein, The box body comprises a bottom wall, a first side wall, a second side wall, a third side wall and a fourth side wall which surround the first accommodating cavity, the first side wall and the second side wall are arranged opposite to each other, and the third side wall and the fourth side wall are arranged opposite to each other; The box cover comprises two first fixing parts, and the two first fixing parts are arranged at the opposite two ends of the box cover; when the box cover is covered, one of the first fixing parts abuts against the first side wall, and the other first fixing part abuts against the second side wall.

7. The wafer cassette of claim 3, wherein, The box cover comprises a second accommodating cavity; when the box cover is covered, the second accommodating cavity is in communication with the first accommodating cavity to jointly constitute a cavity for accommodating a wafer.

8. The wafer cassette of claim 7, wherein, At least one of the box body and the box cover is provided with an operation hole, and the orthographic projection of the operation hole in the first direction has no overlapping area with the orthographic projection of the first accommodating cavity and the second accommodating cavity in the first direction.

9. The wafer cassette of claim 3, wherein, The length of the accommodating main cavity in the first direction is greater than or equal to 3mm and less than or equal to 4mm, and the length of the avoidance cavity in the first direction is greater than or equal to 2mm and less than or equal to 5mm.

10. The wafer cassette of claim 1, wherein, The box body comprises a bottom wall, a first side wall, a second side wall, a third side wall and a fourth side wall which surround the first accommodating cavity, the first side wall and the second side wall are arranged opposite to each other, and the third side wall and the fourth side wall are arranged opposite to each other; The edges of the opposite two sides of the box cover are each provided with a convex second fixing part, and the side of the third side wall and the fourth side wall away from the opening is provided with a fixing groove; when the box cover is covered, the second fixing part is clamped in the fixing groove.