Wafer carrying arm structure
By designing a wafer transport arm structure that combines the Z-axis, θ-axis, and X-axis, the problems of scratches and space utilization in the multi-layer wafer transfer process were solved, achieving efficient and precise wafer transfer.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-14
- Publication Date
- 2026-03-27
AI Technical Summary
In the wafer fabrication process, existing technologies are difficult to use to handle multi-layer wafer transfer and avoid scratches, and the space utilization during the transfer process is insufficient.
Design a wafer transport arm structure including Z-axis, θ-axis and X-axis components. The structure picks up wafers through a vacuum component and combines the movements of the Z-axis, θ-axis and X-axis to achieve precise transport and position adjustment of multi-layer wafers, saving space.
It enables efficient transport of multi-layer wafers, avoids scratches, optimizes space utilization, and adapts to the needs of multiple wafer cassettes and workstations.
Smart Images
Figure CN224054759U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to wafer manufacturing technical field, concretely is a kind of wafer conveying arm structure. BACKGROUND
[0002] Wafer is the most front-end raw material in semiconductor manufacturing process.In the past two years, the trend of equipment localization is more and more obvious.In the processing and manufacturing process of wafer, in order to simplify transportation and reduce the risk of wafer pollution as much as possible, manufacturers use wafer box (CST) to carry and store wafers.
[0003] In the transmission process between each process, the structure of taking and placing wafer from CST is very important, which needs to be compatible with multi-layer wafers in CST, and at the same time cannot scratch the surface of wafer, sometimes it also needs to be compatible with long stroke.For the above problems, we develop a kind of wafer conveying arm structure. UTILITY MODEL CONTENTS
[0004] The utility model discloses a kind of wafer conveying arm structures, including Z-axis component, θ-axis component, X-axis component and wafer arm component, the Z-axis component further includes structure frame, guide rail screw rod assembly is rotationally connected in the structure frame, load component is slidably connected with the outer wall of the structure frame, the load component is threadedly connected with guide rail screw rod assembly, the θ-axis component further includes shaft coupling shaft assembly, the shaft coupling shaft assembly is fixedly installed in load component side, connecting flange is rotationally connected on the upper end of the shaft coupling shaft assembly, the X-axis component further includes fixed component, the fixed component is fixedly installed on the upper surface of connecting flange, gear belt pulley assembly is fixedly installed on the upper surface of the fixed component, the wafer arm component further includes vacuum component, the vacuum component is fixedly connected with the upper end of gear belt pulley assembly, arm is fixedly installed on the upper surface of the vacuum component.
[0005] Through the above technical scheme, when the upstream station needs to place wafer in a certain layer of wafer box, or needs to take and place wafer in a certain layer of wafer box to downstream station, first pick up wafer by vacuum component cooperation arm, after picking up, wafer conveying arm moves through Z-axis component to correspond the height of each layer in wafer box and the height of upstream and downstream stations, for a plurality of wafer boxes or a plurality of upstream and downstream stations transmission, realize 360 ° rotation in plane direction by θ-axis component, X-axis component realizes the drive to wafer in front and back direction, while save the space of whole structure, for the case of different stations, corresponding function can be realized by adjusting the stroke of Z-axis component, the structure can correspond to a plurality of wafer boxes and upstream and downstream stations.
[0006] In a preferred embodiment, the guide rail screw assembly lower end is fixedly installed with a servo motor plus synchronous belt assembly, and the servo motor plus synchronous belt assembly output shaft is fixedly connected with one side of the guide rail screw assembly.
[0007] Through the above technical scheme, the guide rail screw assembly is driven to rotate by the servo motor plus synchronous belt assembly, so that the load component moves up and down along the guide rail.
[0008] In a preferred embodiment, the shaft connecting device bottom is fixedly installed with a servo motor and a speed reducer, and the servo motor and the speed reducer output shaft are fixedly connected with the connecting flange lower wall.
[0009] Through the above technical scheme, the connecting flange is driven to rotate by the servo motor and the speed reducer.
[0010] In a preferred embodiment, the connecting flange one side is fixedly installed with a rotary drag chain, and the other side is fixedly connected with the fixed component lower wall.
[0011] Through the above technical scheme, the rotary drag chain is arranged to protect the rotating part cable.
[0012] In a preferred embodiment, the arm is a ceramic suction cup, a circular suction cup, a microporous adsorption or a rubber suction cup.
[0013] In a preferred embodiment, the fixed component one side is fixedly installed with a servo motor and a module, and the servo motor and the module are gear driven with the gear belt wheel assembly.
[0014] In summary, due to the adoption of the above technical scheme, the beneficial effects of the present application are: the wafer conveying arm structure is proposed.
[0015] When the upstream station needs to place the wafer in a certain layer of the wafer box, or needs to take and place the wafer in a certain layer of the wafer box to the downstream station, the wafer is picked up by the vacuum assembly in cooperation with the arm first, and after the picking up is completed, the wafer conveying arm moves through the Z-axis assembly to correspond to the height of each layer in the wafer box and the height of the upstream and downstream stations, and for the transmission of a plurality of wafer boxes or a plurality of upstream and downstream stations, the θ-axis assembly is used to realize 360° rotation in the plane direction, and the X-axis assembly is used to realize the driving in the front and back directions of the wafer, while the space of the whole structure is saved, and for different station conditions, the corresponding functions can be realized by adjusting the stroke of the Z-axis assembly, and the structure can correspond to a plurality of wafer boxes and upstream and downstream stations. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is the front view of the utility model;
[0017] Figure 2It is the structure schematic view of Z axis assembly in the utility model.
[0018] Figure 3 It is the structure schematic view of θ axis assembly in the utility model.
[0019] Figure 4 It is the structure schematic view of X axis assembly in the utility model.
[0020] Figure 5 It is the structure schematic view of wafer arm assembly in the utility model.
[0021] Marked in the figure: 100-Z axis assembly;101-servo motor plus synchronous belt assembly;102-guide rail screw rod assembly;103-structure frame;104-load part;200-θ axis assembly;201-servo motor and speed reducer;202-coupling shaft assembly;203-rotary drag chain;204-connection flange;300-X axis assembly;301-fixed part;302-servo motor and module;303-gear belt pulley assembly;400-wafer arm assembly;401-vacuum assembly;402-arm. DETAILED DESCRIPTION
[0022] To make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0023] The embodiments of the utility model will be described below in conjunction with Figures 1-5 A wafer conveying arm structure is described in detail.
[0024] EMBODIMENT
[0025] A wafer conveying arm structure comprises a Z axis assembly 100, a θ axis assembly 200, an X axis assembly 300 and a wafer arm assembly 400. The Z axis assembly 100 further comprises a structure frame 103, the structure frame 103 is internally rotationally connected with a guide rail screw rod assembly 102, the structure frame 103 is slidably connected with a load part 104 on the outer wall, the load part 104 is threadedly connected with the guide rail screw rod assembly 102, the guide rail screw rod assembly 102 is fixedly installed with a servo motor plus synchronous belt assembly 101 at the lower end, the output shaft of the servo motor plus synchronous belt assembly 101 is fixedly connected with one side of the guide rail screw rod assembly 102. The wafer conveying arm is moved through the Z axis assembly 100 to correspond to the height of each layer in the wafer cassette and the height of the upstream and downstream stations, and is transmitted to a plurality of wafer cassettes or a plurality of upstream and downstream stations.
[0026] The θ axis assembly 200 further comprises a shaft coupling assembly 202 fixedly installed on one side of the load component 104, a connecting flange 204 rotatably connected to the upper end of the shaft coupling assembly 202, and a servo motor and speed reducer 201 fixedly installed at the bottom of the shaft coupling assembly 202; the output shaft of the servo motor and speed reducer 201 is fixedly connected to the lower wall of the connecting flange 204, and the connecting flange 204 is driven to rotate by the servo motor and speed reducer 201.
[0027] The X axis assembly 300 further comprises a fixed component 301 fixedly installed on the upper surface of the connecting flange 204, a rotating drag chain 203 fixedly installed on one side of the connecting flange 204, and a fixed component 301 fixedly connected to the lower wall of the rotating drag chain 203 on the other side; the rotating drag chain 203 is provided to protect the rotating part cable, a gear pulley assembly 303 is fixedly installed on the upper surface of the fixed component 301, a servo motor and module 302 is fixedly installed on one side of the fixed component 301, and the servo motor and module 302 is in gear transmission with the gear pulley assembly 303; the X axis assembly 300 drives the wafer in the front-back direction, and saves the space of the entire structure.
[0028] The wafer arm assembly 400 further comprises a vacuum assembly 401 fixedly connected to the upper end of the gear pulley assembly 303, and an arm 402 fixedly installed on the upper surface of the vacuum assembly 401; the arm 402 is a ceramic suction cup, a circular suction cup, a microporous adsorption or a rubber suction cup; the wafer is first picked up by the vacuum assembly 401 cooperating with the arm 402.
[0029] Working principle:
[0030] When the upstream station needs to place the wafer in a certain layer of the wafer box, or needs to take and place the wafer in a certain layer of the wafer box to the downstream station, the wafer is first picked up by the vacuum assembly 401 cooperating with the arm 402; after the wafer is picked up, the wafer transfer arm moves through the Z axis assembly 100 to correspond to the height of each layer in the wafer box and the height of the upstream and downstream stations; for the transmission of a plurality of wafer boxes or a plurality of upstream and downstream stations, the θ axis assembly 200 is used to realize the 360° rotation in the plane direction, the X axis assembly 300 is used to drive the wafer in the front-back direction, and the space of the entire structure is saved; for different station conditions, the stroke of the Z axis assembly 100 can be adjusted to realize the corresponding function; the structure can correspond to a plurality of wafer boxes and upstream and downstream stations.
[0031] The above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can still be modified, or some technical features therein can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A wafer transfer arm structure comprising a Z-axis assembly (100), a θ-axis assembly (200), an X-axis assembly (300), and a wafer arm assembly (400), characterized in that: The Z-axis assembly (100) further comprises a structural frame (103), a guide rail screw rod assembly (102) is rotatably connected inside the structural frame (103), a load part (104) is slidably connected to the outer wall of the structural frame (103), the load part (104) is threadedly connected with the guide rail screw rod assembly (102), the θ-axis assembly (200) further comprises a shaft coupling assembly (202), the shaft coupling assembly (202) is fixedly installed on one side of the load part (104), a connecting flange (204) is rotatably connected to the upper end of the shaft coupling assembly (202), the X-axis assembly (300) further comprises a fixed part (301), the fixed part (301) is fixedly installed on the upper surface of the connecting flange (204), a gear pulley assembly (303) is fixedly installed on the upper surface of the fixed part (301), the wafer arm assembly (400) further comprises a vacuum assembly (401), the vacuum assembly (401) is fixedly connected with the upper end of the gear pulley assembly (303), and an arm (402) is fixedly installed on the upper surface of the vacuum assembly (401).
2. The wafer transfer arm structure of claim 1, wherein: The lower end of the guide rail screw rod assembly (102) is fixedly installed with a servo motor and synchronous belt assembly (101), and the output shaft of the servo motor and synchronous belt assembly (101) is fixedly connected with one side of the guide rail screw rod assembly (102).
3. The wafer handling arm structure of claim 1, wherein: The bottom of the shaft coupling assembly (202) is fixedly installed with a servo motor and speed reducer (201), and the output shaft of the servo motor and speed reducer (201) is fixedly connected with the lower wall of the connecting flange (204).
4. The wafer handling arm structure of claim 1, wherein: One side of the connecting flange (204) is fixedly installed with a rotary drag chain (203), and the other side of the rotary drag chain (203) is fixedly connected with the lower wall of the fixed part (301).
5. The wafer handling arm structure of claim 1, wherein: The arm (402) is a ceramic suction cup, a circular suction cup, a microporous adsorption or a rubber suction cup.
6. The wafer handling arm structure of claim 1, wherein: One side of the fixed part (301) is fixedly installed with a servo motor and module (302), and the servo motor and module (302) is in gear transmission with the gear pulley assembly (303).