Device for improving stability and uniformity of plasma photoresist removing equipment

Abstract

The utility model discloses a device for improving the stability and uniformity of plasma photoresist removing equipment. The device comprises a flat edge protection ring and an optical Aligner calibrator, the flat-edge protection ring is provided with a flat-edge structure and is used for placing a wafer with a flat edge so as to prevent an electrode from being exposed; the optical Aligner calibrator is based on an optical measurement technology, is installed at a limiting calibration position of an original wafer, detects the center and gap positions of the wafer, and achieves precise positioning and alignment. The device can improve the uniformity and yield of products and reduce the cost.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer manufacturing technical field especially relates to a device of improving plasma glue removal equipment stability and uniformity. BACKGROUND

[0002] In today's advanced wafer manufacturing process, plasma glue removal equipment occupies a crucial position, and is an indispensable key equipment in the whole production process. With the development of manufacturing process towards high precision and high stability, the stability requirement of plasma glue removal process is increasingly stringent.

[0003] In the plasma glue removal process, the environmental temperature is a very critical parameter. When the radio frequency output is carried out, ions with high reactivity and high energy are generated in the process chamber, which react with the photoresist on the wafer surface. Subsequently, the volatile substances generated by the reaction are removed by the working gas flow and vacuum pump, so as to achieve the purpose of removing photoresist of a certain thickness. In specific process scenarios such as low rate descum process (rate ≤ 50 nm / min), the requirement for temperature stability is more prominent. However, in this process, plasma discharge will continuously generate heat, and due to the difference in power and time of radio frequency discharge, the generated heat is also different, which leads to the change of process environmental temperature in the production process. The reactivity of photoresist will be significantly affected by the environmental temperature, and the fluctuation of environmental temperature will directly lead to the change of glue removal rate, thereby affecting the stability of wafer manufacturing process and product quality, especially in low rate (rate ≤ 50 nm / min) process, the influence is more obvious.

[0004] In order to effectively control the environmental temperature in the process cavity, heating rods and thermocouples are usually added to the process chamber shell part in the prior art to control the temperature. By setting a suitable temperature, the temperature of the process chamber shell can be adjusted, and the relative constancy of the temperature in the chamber is realized, so as to ensure the stability of the process. However, the current temperature control method still has certain improvement space in terms of relevance to process formula and precision of automatic adjustment, especially when dealing with low rate (rate ≤ 50 nm / min) glue removal process, it is difficult to meet the demand for accurate temperature control. Therefore, it is urgent to develop a solution that can effectively improve the stability of the equipment and the uniformity of the products. UTILITY MODEL CONTENTS

[0005] The utility model is to solve the above-mentioned shortage, provides a device of improving plasma glue removal equipment stability and uniformity, through the improvement and optimization of the key components of the equipment, solve the problem of poor uniformity of the existing equipment when processing the wafer with flat edge, improve the product yield, reduce the production cost, meet the increasing demand of high precision manufacturing process.

[0006] The above-mentioned purpose of the utility model is realized through the following technical scheme: a device for improving the stability and uniformity of plasma de-gluing equipment, comprising a flat-edge protection ring and an optical Aligner calibrator; the flat-edge protection ring is used for placing a wafer with a flat edge, and the bottom of the flat-edge protection ring is provided with a flat-edge structure; the optical Aligner calibrator is arranged on a wafer conveying path and is used for detecting the positions of the center and the notch (positioning flat edge) of the wafer, so as to realize the positioning and alignment of the wafer.

[0007] The utility model adopts a protection ring with a flat-edge structure at the bottom to replace the original circular protection ring. The flat-edge protection ring is designed to be compatible with the wafer with a flat edge, which can effectively avoid the problem of electrode surface exposure in the low-rate descum process. When the wafer with a flat edge is placed on the flat-edge protection ring, the structural fit of the two can ensure the stability of the wafer during the de-gluing process and reduce the inconsistency of etching rates caused by electrode exposure, thereby improving the uniformity of the product.

[0008] In order to meet the higher requirements of the flat-edge protection ring on the accuracy of wafer conveying, the device is provided with an optical Aligner calibrator. The calibrator is installed at the position of the original wafer limiting calibration device and works based on optical measurement technology. Specifically, it emits a beam of light to irradiate on the surface of the wafer, and then uses optical elements to focus the reflected light on a detector. The detector can accurately measure the intensity and position of the reflected light and transmit these information to the computer in real time. The computer processes and analyzes these information through specific algorithms to accurately determine the positions of the center and the notch (positioning flat edge) of the wafer. According to the calculation result, the system can adjust the positioning position of the wafer to ensure that the flat-edge wafer can accurately fall into the flat-edge protection ring, realizing high-precision wafer positioning and alignment.

[0009] The utility model has the following advantages compared with the prior art:

[0010] 1. Improve product uniformity: by using the flat-edge protection ring, the electrode surface exposure is effectively avoided, the etching rate difference is reduced, the whole wafer can maintain a relatively consistent etching rate during the de-gluing process, and the uniformity of the product is significantly improved. According to the actual use verification of the equipment, compared with the circular protection ring, the uniformity of the product is obviously improved after using the flat-edge protection ring, for example, from the Mapping chart data, it can be seen that the fluctuation range of the related parameters is greatly reduced.

[0011] 2. Improve product yield: the improvement of uniformity directly reduces the product defects caused by uneven de-gluing, thereby effectively improving the yield of the product and reducing the scrap rate, which brings direct economic benefits to the enterprise.

[0012] 3. Reduced production costs: Improved product yield means lower raw material and production costs, which in turn reduces subsequent processing costs due to product quality issues, improves production efficiency, and enhances the company's competitiveness in the market.

[0013] 4. Precise positioning and alignment: The application of the optical Aligner calibrator can accurately detect the wafer center and notch position, ensuring the accurate fit between the flat-edge wafer and the flat-edge protection ring, improving the accuracy of wafer transfer and positioning, and further ensuring the stability and reliability of the resist removal process. Attached Figure Description

[0014] Figure 1 The diagram shows a structural comparison between a circular protective ring and a flat-edge protective ring.

[0015] Figure 2 This is a schematic diagram of the appearance of an existing mechanical calibrator.

[0016] Figure 3 This is a schematic diagram of existing circular wafer calibration.

[0017] Figure 4 This is a schematic diagram of the optical Aligner calibrator in this utility model.

[0018] Figure 5 This is the original conveying flow diagram of the low-temperature plasma degumming equipment.

[0019] Figure 6 This is the current conveyor flow diagram for a low-temperature plasma degumming device.

[0020] Figure 7 The data mapping diagram for actual use verification of the equipment compares the impact of circular and flat-edge protective rings on product uniformity, and intuitively demonstrates the beneficial effects of this utility model through specific data. Detailed Implementation

[0021] The present invention will now be described in further detail with reference to the accompanying drawings.

[0022] like Figure 1 As shown, a device for improving the stability and uniformity of plasma resist removal equipment includes a flat-edge protection ring 1 and an optical Aligner calibrator; the flat-edge protection ring 1 is used to place a wafer with a flat edge, and its bottom is provided with a flat-edge structure 2; the optical Aligner calibrator is set on the wafer transport path and is used to detect the wafer center and notch (positioning flat edge) position to achieve wafer positioning and alignment.

[0023] The working principle of this utility model:

[0024] In practical application, the original circular protection ring is first disassembled from the plasma stripping device, and then the new flat edge protection ring is installed. At the same time, the original wafer limiting calibration device is replaced by an optical Aligner calibrator, and the installation position is ensured to be accurate and work with other parts of the device.

[0025] When the wafer is processed, the wafer with flat edge is transported to the detection area of the optical Aligner calibrator by the conveying mechanism of the device. According to the working principle of the optical Aligner calibrator, light is emitted to irradiate the wafer surface, the detector quickly captures the relevant information of the reflected light and transmits it to the computer. After rapid processing and analysis by the computer, the accurate position of the wafer center and the gap (positioning flat edge) is obtained. If the deviation of the wafer position is detected, the system will automatically adjust the conveying path and positioning position of the wafer, so that the flat edge wafer can be accurately placed in the flat edge protection ring.

[0026] Subsequently, the flat edge protection ring with the flat edge wafer enters the plasma stripping process link. Due to the structural design of the flat edge protection ring, the electrode surface is effectively avoided to be exposed, so that the wafer can uniformly receive plasma treatment during the stripping process, ensuring the consistency of the stripping rate. Through actual production verification, after using the device of the utility model, the uniformity of the product is significantly improved, the yield is improved, the production cost is reduced, and the process requirements of high-precision wafer manufacturing are met.

[0027] The above only describes the preferred embodiments of the utility model, and does not limit the utility model. Any modification, equivalent replacement and improvement within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A device for improving stability and uniformity of a plasma ashing apparatus, characterized by: The application relates to a wafer protection ring and an optical Aligner calibrator. The wafer protection ring is provided with a flat edge structure for placing a wafer with a flat edge; the optical Aligner calibrator is arranged on a wafer conveying path and used for detecting a wafer center and a notch position so as to realize positioning and alignment of the wafer.

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