Film coating fixing ring of wafer and film coating equipment

Abstract

The utility model provides a film coating fixing ring and film coating equipment for a wafer, and the film coating fixing ring comprises an annular main body; the annular supporting edge and the straight edge supporting edge are arranged on the inner wall of the annular body, the contact surface of the annular supporting edge and the wafer and the contact surface of the straight edge supporting edge and the wafer are located on the same plane, and the annular supporting edge and the straight edge supporting edge are used for supporting the wafer; the straight-edge positioning protrusion is located on the inner wall of the annular body and connected with the straight-edge supporting edge, the two sides of the straight-edge positioning protrusion are connected with the inner wall of the annular body through a first outwards-protruding curved surface, and the protruding direction of the first outwards-protruding curved surface is parallel to the surface of the wafer and away from the wafer. By adopting the technical scheme of the invention, the risk of wafer clamping can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially relates to a wafer's film plating fixing ring and film plating equipment. BACKGROUND

[0002] Light emitting diode (LED) chip is a kind of energy-saving, environmental protection and long life and many advantages of semiconductor component.LED chip usually the production method is: through chemical vapor deposition process, epitaxial layer is grown on the wafer, then is made by a series of chip processes.In order to improve the luminous efficiency of LED, enhance the luminous brightness of LED, the directionality of light and reduce the scattering of light, then in the process of LED chip production, Bragg mirror film plating becomes a very important link.In the film plating process, the wafer with LED chip needs to be fixed on the film plating equipment through the film plating fixing ring of wafer.

[0003] In addition, the fast recovery diode (FRD) applied in electronic circuits such as switching power supply, pulse width modulator and frequency converter includes PIN junction diode; in order to improve, for example, anti-interference ability, in the process of manufacturing PIN junction diode, film plating needs to be carried out on the back of wafer.In the film plating process, the wafer with PIN junction diode needs to be fixed on the film plating equipment through the film plating fixing ring of wafer.

[0004] However, the existing film plating fixing ring of wafer has the problem of wafer card in the film plating process.Therefore, how to provide technical solutions to improve and optimize the film plating fixing ring of wafer to reduce the risk of wafer card has become a problem to be solved by the person skilled in the art. INVENTION CONTENTS

[0005] The technical problem solved by the utility model is to provide a film plating fixing ring of wafer and film plating equipment to reduce the risk of wafer card.

[0006] In order to solve the above problems, the film plating fixing ring of wafer provided by the utility model embodiment comprises: annular main body;Annular support along and straight edge support along are arranged on the inner wall of the annular main body, the contact surface between the annular support along and the wafer and the surface contacted by the straight edge support along and the wafer are in the same plane, and the annular support along and the straight edge support along are used to support the wafer;Straight edge positioning protrusion is located on the inner wall of the annular main body and connected with the straight edge support along, the two sides of the straight edge positioning protrusion are connected with the inner wall of the annular main body through first outer convex surface, and the convex direction of the first outer convex surface is parallel to the surface of the wafer and away from the wafer.

[0007] Optionally, the vertical height difference between the upper surface of the annular body and the upper surface of the annular support is greater than or equal to the thickness of the wafer.

[0008] Optionally, the outer edge of the wafer is adapted to the inner wall of the annular body and has a straight edge and a circular arc edge; the straight edge of the straight edge positioning protrusion is connected to the first outer convex surface through an inner convex surface, the protruding direction of the inner convex surface is parallel to the surface of the wafer and faces the wafer; the straight edge of the straight edge positioning protrusion is opposite to the straight edge of the wafer.

[0009] Optionally, the first outer convex surface comprises a first outer convex circular arc surface, and the inner convex surface comprises an inner convex circular arc surface; the first outer convex circular arc surface is connected to the inner convex circular arc surface in a tangent manner.

[0010] Optionally, the outer edge of the wafer is adapted to the inner wall of the annular body and has a straight edge and a circular arc edge; the length of the straight edge of the straight edge positioning protrusion is less than the length of the straight edge of the wafer.

[0011] Optionally, the annular support and the straight edge support are connected through a second outer convex surface.

[0012] Optionally, the film-coating fixing ring further comprises an annular rubber ring arranged on the inner wall of the annular body and the upper surface of the annular support.

[0013] Optionally, the difference between the inner diameter of the annular rubber ring and the inner diameter of the annular support is greater than 0 mm and less than or equal to 3 mm; the inner diameter of the annular rubber ring is greater than the outer diameter of the wafer; and the outer diameter of the wafer is greater than the inner diameter of the annular support.

[0014] Optionally, the material of the annular rubber ring comprises one or more of butadiene styrene rubber, chloroprene rubber, nitrile rubber, ethylene-propylene rubber, silicone rubber and isoprene rubber.

[0015] Correspondingly, the application also provides a film-coating equipment for a wafer, which comprises: a planetary pot, the surface of the planetary pot being provided with one or more openings; a film-coating fixing ring as described in any one of the preceding embodiments, which is arranged at the openings in a one-to-one correspondence and is detachably connected to the openings; and an evaporation unit, which is located in the planetary pot and has an evaporation direction facing the openings.

[0016] Optionally, the film-coating equipment further comprises a cover plate for shielding the non-evaporation surface of the wafer; the cover plate is provided with air holes penetrating through the cover plate; and the cover plate is provided with a handle for lifting the cover plate.

[0017] Compared with the prior art, the technical scheme of the embodiments of the application has the following advantages:

[0018] The wafer coating fixing ring provided by the application comprises a ring-shaped main body, a ring-shaped support edge arranged on the inner wall of the ring-shaped main body and used for supporting a wafer, and a straight edge positioning protrusion arranged on the inner wall of the ring-shaped main body and connected with the straight edge support edge, and the two sides of the straight edge positioning protrusion are connected with the inner wall of the ring-shaped main body through first outer convex surfaces. In the process of coating the wafer, the first outer convex surfaces are arranged to provide redundant space for the movement of the wafer in the wafer coating fixing ring, so that the risk of wafer sticking is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the provided drawings.

[0020] Figure 1 It is a structural schematic diagram of a wafer coating fixing ring.

[0021] Figure 2 It is a schematic diagram of wafer sticking on a wafer coating fixing ring.

[0022] Figures 3 to 7 It is a structural schematic diagram of a wafer coating fixing ring according to an embodiment of the present application.

[0023] Figure 8 It is a schematic diagram of wafer sticking on a wafer coating fixing ring according to an embodiment of the present application.

[0024] Figures 9 to 11 It is a structural schematic diagram of a wafer coating fixing ring according to another embodiment of the present application.

[0025] Figures 12 to 13 It is a structural schematic diagram of a wafer coating device according to the present application.

[0026] Figures 14 to 16 It is a working principle schematic diagram of wafer coating according to an embodiment of the present application. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0028] Because of the film-coating fixing ring of the wafer mentioned in the background art, there is a wafer clamping problem. Figure 1 The reasons for the wafer clamping are analyzed below.

[0029] As shown in Figure 1 , it is a film-coating fixing ring of a wafer.

[0030] The film-coating fixing ring of the wafer comprises: a ring-shaped main body 100, and a straight edge protrusion 102 connected to an inner wall 101 of the ring-shaped main body 100.

[0031] The wafer 103 has a straight edge 104 and a circular arc edge 105, and the straight edge 104 of the wafer 103 is opposite to the straight edge protrusion 102.

[0032] As shown in Figure 2 , it is a schematic diagram of wafer clamping on a film-coating fixing ring of a wafer, and there are the following problems:

[0033] First, when the surface to be coated of the wafer 103 is coated, the film-coating fixing ring expands due to heat at a high temperature of film-coating, so that the inner diameter of the ring-shaped main body 100 becomes smaller, and meanwhile, the wafer 103 moves in the ring-shaped main body 100 during the film-coating process, causing the position 106 at the junction of the straight edge 104 and the circular arc edge 105 of the wafer 103 to be clamped on the straight edge protrusion 102.

[0034] After the film-coating of the surface to be coated of the wafer 103 is completed, the temperature returns to normal temperature, the fixing ring shrinks at normal temperature, and the wafer 103 clamped on the straight edge protrusion 102 at the position 106 makes it difficult to take the wafer 103 off the film-coating fixing ring and / or causes the wafer to break.

[0035] Second, the wafer 103 has a size tolerance, for example, the actual size of the wafer 103 is smaller than the theoretical value, and when the surface to be coated of the wafer 103 is coated, the position 106 at the junction of the straight edge 104 and the circular arc edge 105 of the wafer 103 is clamped on the straight edge protrusion 102, so that it is difficult to take the wafer 103 off the film-coating fixing ring and / or the wafer breaks.

[0036] In view of the above technical problems, the film-coating fixing ring of the wafer provided in the embodiments of the present application can reduce the risk of wafer clamping.

[0037] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the following will be combined with the embodiments of the present application. Figures 3 to 7The embodiments of the utility model carry out clear, complete description to technical scheme, obviously, the described embodiment is only a part of the utility model, not all, in the case of no conflict, the following embodiment and the feature in the embodiment can be combined mutually.

[0038] In the embodiment of the application, the fixed ring comprises: a ring-shaped main body; a ring-shaped supporting edge and a straight edge supporting edge arranged on the inner wall of the ring-shaped main body, the contact surface of the ring-shaped supporting edge and the wafer is in the same plane as the surface of the wafer in contact with the straight edge supporting edge, and the ring-shaped supporting edge and the straight edge supporting edge are used to support the wafer; a straight edge positioning protrusion located on the inner wall of the ring-shaped main body and connected with the straight edge supporting edge, the two sides of the straight edge positioning protrusion are connected with the inner wall of the ring-shaped main body through a first outer convex surface, and the convex direction of the first outer convex surface is parallel to the surface of the wafer and away from the wafer.

[0039] The wafer film coating fixed ring provided by the application comprises a ring-shaped main body, a ring-shaped supporting edge and a straight edge supporting edge arranged on the inner wall of the ring-shaped main body for supporting the wafer, and a straight edge positioning protrusion located on the inner wall of the ring-shaped main body and connected with the straight edge supporting edge, and the two sides of the straight edge positioning protrusion are connected with the inner wall of the ring-shaped main body through a first outer convex surface. In the process of coating the wafer, the first outer convex surface is arranged to provide redundant space for the movement of the wafer in the film coating fixed ring, thereby reducing the risk of wafer sticking.

[0040] In Figures 3 to 7 The structure diagram of the wafer film coating fixed ring of one embodiment of the utility model is disclosed. It should be noted that, Figure 3 The top view of the wafer film coating fixed ring of the embodiment of the utility model is shown in the figure, Figure 4 The Figure 3 The sectional view along the A1A2 direction in the figure, Figure 5 The Figure 3 The sectional view along the B1B2 direction in the figure.

[0041] Reference Figure 3 , in combination Figure 6 The film coating fixed ring comprises a ring-shaped main body 200.

[0042] The ring-shaped main body 200 is used for loading and containing the wafer 201.

[0043] The material of the ring-shaped main body 200 comprises metal material (such as stainless steel material, aluminum material, etc.) or anti-static plastic material (such as polycarbonate, electric polypropylene, acrylic, etc.). The shape of the ring-shaped main body 200 comprises one or more of a circular ring body, a square ring body and an oval ring body.

[0044] In this embodiment, the material of the annular body 200 is aluminum, and the shape of the annular body 200 is a square ring.

[0045] It should be noted that the aluminum material has the advantages of light weight, good heat conduction performance, strong plasticity, and easy processing.

[0046] With reference to Figure 3 , the plated fixed ring includes a ring-shaped support edge 202 and a straight edge support edge 203 arranged on the inner wall 209 of the annular body 200.

[0047] The ring-shaped support edge 202 and the straight edge support edge 203 are used to support the wafer 201.

[0048] The material of the ring-shaped support edge 202 includes a metal material (such as stainless steel, aluminum, etc.) or an anti-static plastic material (such as polycarbonate, electric polypropylene, acrylic, etc.). The material of the straight edge support edge 203 includes a metal material (such as stainless steel, aluminum, etc.) or an anti-static plastic material (such as polycarbonate, electric polypropylene, acrylic, etc.). In this embodiment, the material of the ring-shaped support edge 202 is stainless steel, and the material of the straight edge support edge 203 is stainless steel.

[0049] In this embodiment, the ring-shaped support edge 202 and the straight edge support edge 203 are integrally formed with the annular body 200, and in other embodiments, the ring-shaped support edge 202 and the straight edge support edge 203 are connected to the inner wall 209 of the annular body 200 by bonding or nut.

[0050] In this embodiment, the contact surface of the ring-shaped support edge 202 and the wafer 201 is in the same plane as the surface of the straight edge support edge 203 in contact with the wafer, which has the beneficial effect of reducing the risk of the wafer 201 separating from the annular body 200.

[0051] In this embodiment, considering the dimensional tolerance of the wafer 201, the width w1 of the ring-shaped support edge 202 along the direction parallel to the surface of the wafer 201 is greater than 0 mm and less than or equal to 4 mm, and the width w2 of the straight edge support edge 203 along the direction parallel to the surface of the wafer 201 is greater than 0 mm and less than or equal to 4 mm.

[0052] With reference to Figure 4 , in this embodiment, the vertical height difference d1 between the upper surface 204a of the annular body 200 and the upper surface 205 of the ring-shaped support edge 202 is greater than or equal to the thickness of the wafer 201, which has the beneficial effect of reducing the risk of the wafer 201 separating from the annular body 200.

[0053] With reference toFigure 3 , in combination Figure 6 In the embodiment, the annular supporting edge 202 and the straight edge supporting edge 203 are connected by a second outer convex surface 207 to expose the area of the wafer 201 that needs to be coated.

[0054] The convex direction of the second outer convex surface 207 is parallel to the surface of the wafer 201 and away from the wafer 201.

[0055] With reference to Figure 3 The coating fixing ring comprises a straight edge positioning convexity 208.

[0056] The straight edge positioning convexity 208 is used to confirm the placement direction of the wafer 201 on the coating fixing ring.

[0057] In the embodiment, the straight edge positioning convexity 208 is located on the inner wall 209 of the annular body 200 and connected with the straight edge supporting edge 203.

[0058] With reference to Figure 5 The vertical height difference d2 between the upper surface 204b of the straight edge positioning convexity 208 and the upper surface 206 of the straight edge supporting edge 203 is greater than or equal to the thickness of the wafer 201, which has the beneficial effect of reducing the risk of the wafer 201 detaching from the annular body 200.

[0059] In the embodiment, the upper surface 204b of the straight edge positioning convexity 208 is in the same plane as the upper surface 204a of the annular body 200.

[0060] With reference to Figure 6 The outer edge of the wafer 201 is adapted to the inner wall 209 of the annular body 200 and has a straight edge 210 and a circular arc edge 211. In the embodiment, the straight edge positioning convexity 208 is opposite to the straight edge 210 of the wafer 201, and the circular arc edge 211 of the wafer 201 is opposite to the arc-shaped inner wall 209 of the annular body 200.

[0061] The straight edge supporting edge 203 is used to support the straight edge 210 of the wafer 201, and the annular supporting edge 202 is used to support the circular arc edge 211 of the wafer 201.

[0062] In the embodiment, the length L1 of the straight edge of the straight edge positioning convexity 208 is less than the length L2 of the straight edge 210 of the wafer 201, which has the beneficial effect of reserving space to reduce the risk of wafer 201 sticking.

[0063] With reference to Figure 7 In combination Figure 6 , Figure 7 To Figure 6The space structure diagram of the middle coating fixed ring area 212. The two sides of the straight edge positioning protrusion 208 are connected with the inner wall 209 of the annular body 200 through a first outer convex curved surface 213, and the convex direction of the first outer convex curved surface 213 is parallel to the surface of the wafer 201 and away from the wafer 201.

[0064] The two sides of the straight edge positioning protrusion 208 are connected with the inner wall 209 of the annular body 200 through the first outer convex curved surface 213, that is, a certain space is reserved between the two sides of the straight edge positioning protrusion 208 and the inner wall 209 of the annular body 200, which has the following beneficial effects:

[0065] First, when the wafer 201 is coated, the risk of wafer 201 card caused by thermal expansion and contraction of the coating fixed ring can be reduced.

[0066] Second, when the wafer 201 is coated, the risk of wafer 201 card caused by the size tolerance of the wafer 201 can be reduced.

[0067] Continue to refer to Figure 3 , in combination Figure 7 , the straight edge positioning protrusion 208 is connected with the first outer convex curved surface 213 through an inner convex curved surface 214, and the convex direction of the inner convex curved surface 214 is parallel to the surface of the wafer 201 and towards the wafer 201.

[0068] During the coating process of the wafer 201, the inner convex curved surface 214 can reduce the risk of wafer 201 breakage after hitting the straight edge positioning protrusion 208.

[0069] The first outer convex curved surface 213 comprises a first outer convex circular arc curved surface, and the inner convex curved surface 214 comprises an inner convex circular arc curved surface, the first outer convex circular arc curved surface is connected with the inner convex circular arc curved surface, and the sharp corner is prevented from being formed on the inner wall of the annular body 200, thereby reducing the risk of wafer 201 breakage caused by the sharp corner.

[0070] Continue to refer to Figure 3 , in the embodiment, the two sides of the straight edge positioning protrusion 208 are connected with the inner wall 209 of the annular body 200 through a first outer convex circular arc curved surface, and the straight edge positioning protrusion 208 is connected with the first outer convex curved surface 213 through an inner convex circular arc curved surface.

[0071] Refer to Figure 8 , it is a schematic view of the wafer card on the coating fixed ring of the wafer of an embodiment of the utility model.

[0072] After the wafer 201 moves on the coating fixing ring, the straight edge 210 of the wafer 201 moves to the area 212, and the position 215 where the straight edge 210 of the wafer 201 meets the arc edge 211 does not cause a carding problem, thereby reducing the risk of wafer 201 carding and / or chipping.

[0073] Reference Figures 9 to 11 The coating fixing ring of another embodiment wafer of the present application corresponds to the structure schematic diagram. Figure 10 For Figure 9 The cross-sectional view along the C1C2 direction, Figure 11 For Figure 9 The cross-sectional view along the D1D2 direction. The Figure 9 Compared with Figure 3 It can be seen that the rubber ring is arranged on the inner wall of the annular body and the upper surface of the annular support along. For the sake of brevity and clarity of description, only the rubber ring is described in the embodiments of the present application, and the description of other structures can be referred to the foregoing embodiments, which will not be described here.

[0074] With reference to Figure 9 , in combination with Figure 3 and Figure 4 , the coating fixing ring comprises: an annular rubber ring 216 arranged on the inner wall 209 of the annular body 200 and the upper surface 205 of the annular support along 202.

[0075] When the wafer 201 is coated, especially high-temperature coating, compared with the annular body 200, the rubber ring 216 has a high expansion rate, which can reduce the probability of the wafer 201 moving in the coating fixing ring, thereby reducing the risk of wafer 201 carding and / or chipping.

[0076] The material of the rubber ring 216 comprises one or more of styrene butadiene rubber, chloroprene rubber, nitrile rubber, ethylene propylene rubber, silicone rubber, and isoprene rubber. In the embodiments, the material of the rubber ring 216 is styrene butadiene rubber.

[0077] The rubber ring 216 is fixed on the inner wall 209 of the annular body 200 and the upper surface 205 of the annular support along 202 by means of glue bonding.

[0078] With reference to Figure 9 , in combination with Figure 5 , the rubber ring 216 is also arranged on the upper surface 206 of the straight edge support along 203, which can further reduce the probability of the wafer 201 moving in the coating fixing ring, thereby reducing the risk of wafer 201 carding.

[0079] The principle of the thermal expansion characteristics of the rubber ring 216 is described as follows: the rubber material has a large volume change when heated due to its high molecular chain structure, because the macromolecular chains in the rubber are entangled with each other, and there is free space between the networks, so the shrinkage allowance is also large. When the temperature rises, the macromolecular movement inside the rubber intensifies, causing the material to expand; conversely, it will shrink after cooling, and the shrinkage amount is much larger than that of metal materials.

[0080] In order to reduce the risk of the wafer 201 being stuck in the film plating fixing ring due to thermal expansion and / or reduce the risk of the wafer 201 being stuck due to the size tolerance of the wafer 201 when the wafer 201 is plated, the difference between the inner diameter R1 of the annular rubber ring 216 and the inner diameter R2 of the annular support ring 202 is greater than 0 mm and less than or equal to 3 mm, the inner diameter R1 of the annular rubber ring 216 is greater than the outer diameter of the wafer 201, and the outer diameter of the wafer 201 is greater than the inner diameter R2 of the annular support ring 202. The rubber ring 216 expands towards the center of the wafer 201 at high temperature, which can reduce the probability of the wafer 201 moving in the film plating fixing ring, thereby reducing the risk of the wafer 201 being stuck and / or broken, and after the high-temperature plating is completed, the rubber ring 216 returns to the state before the high temperature, which is beneficial to the wafer 201 being removed from the film plating fixing ring, thereby reducing the risk of the wafer 201 being stuck and / or broken.

[0081] It should be noted that the inner diameter R1 of the rubber ring 216, the inner diameter R2 of the annular support ring 202, and the outer diameter of the wafer 201 all refer to the radius.

[0082] The application also discloses a wafer plating equipment for plating the wafer 201 to form a metal film layer on the surface of the wafer 201 to be plated, so as to form a Bragg mirror.

[0083] Figures 12 to 13 It is a structure schematic diagram corresponding to the wafer plating equipment of the utility model.

[0084] Reference Figure 12 The wafer plating equipment comprises a planetary pot 300.

[0085] The planetary pot 300 is a device for an evaporation table, and the planetary pot 300 has the following functions:

[0086] First, the evaporation material is uniformly distributed. The main function of the planetary pot 300 is to uniformly distribute the evaporation material (such as metal, semiconductor or other materials) to the surface of the wafer to be plated. Through heating evaporation or electron beam evaporation, the evaporation material is converted from solid to gas, and then rotates in the planetary pot 300, so that the surface of the wafer to be plated can uniformly contact the evaporation material, thereby forming a uniform film.

[0087] Second, improve evaporation efficiency. The rotational movement of the planetary pot 300 ensures that the sample can be uniformly affected during the evaporation process, avoiding local differences, making the final film thickness more consistent and reliable. This dynamic movement helps to improve the efficiency of evaporation, allowing the material to be converted and deposited on the wafer surface to be plated more quickly.

[0088] Third, precise control of deposition thickness and uniformity. In the field of semiconductor manufacturing and materials science, the planetary pot 300 can precisely control the deposition thickness and uniformity of the material, which directly affects the performance and quality of the product.

[0089] The planetary pot 300 is usually a one-time stamping hemispherical pot.

[0090] The material of the planetary pot 300 includes metal materials (such as stainless steel materials, aluminum materials, etc.) or plastic materials (such as polycarbonate, electric polypropylene, acrylic, etc.), and in this embodiment, the material of the planetary pot 300 is stainless steel.

[0091] The surface of the planetary pot 300 has one or more openings.

[0092] The opening is used to expose the surface of the wafer 201 to be plated to the inside of the planetary pot 300.

[0093] The plating fixing ring as described in the foregoing embodiments is placed in the opening one by one.

[0094] Continuing to refer to Figure 12 , in this embodiment, the surface of the planetary pot 300 has 1 opening 301, and one opening 301 corresponds to one plating fixing ring.

[0095] In this embodiment, the plating fixing ring and the opening 301 are detachably connected, that is, the connection mode of each plating fixing ring and an opening 301 is detachable connection, so as to facilitate the removal of the plating fixing ring from the planetary pot 300.

[0096] Continuing to refer to Figure 12 , in combination Figure 6 , the wafer 201 plating equipment includes an evaporation unit 302.

[0097] The evaporation unit 302 is used for plating the surface of the wafer 201 to be plated.

[0098] In this embodiment, the evaporation unit 302 is located in the planetary pot 300, and the evaporation direction is towards each opening 301, which facilitates the plating of the surface of the wafer 201 to be plated.

[0099] The evaporation unit 302 mainly comprises: a vacuum pump (not shown) for vacuumizing, commonly including a mechanical pump and a molecular pump; a target material (not shown) for providing a film-coated material; a sputtering source (not shown) for applying a magnetic field and an electric field to the target material, so that ions bombard the surface of the target material to form high-energy particles, which impact the wafer to be coated on the surface of the wafer to be coated and perform film coating; the sputtering source includes a magnetron sputtering source and an ion beam sputtering source. A high vacuum gauge (not shown) is used to detect the vacuum degree of the wafer 201 during film coating.

[0100] It should be noted that during the process of the high-energy particles impacting the wafer, the wafer is subjected to the force of the high-energy particles, and in severe cases, the wafer may move.

[0101] Through the evaporation unit 302, a first metal layer is formed on the surface of the wafer to be evaporated, a second metal layer is formed on the surface of the first metal layer, and a third metal layer is formed on the surface of the second metal layer, and the first metal layer, the second metal layer and the third metal constitute a Bragg reflector. In this embodiment, the first metal layer material includes titanium, the second metal layer material includes nickel, and the third metal layer material includes silver.

[0102] The first metal layer material titanium has good contact properties with the surface of the wafer to be coated, the first metal layer material nickel is used to prevent the third metal layer material silver from penetrating into the LED device on the non-coated surface of the wafer, and the third metal layer material silver has high reflectivity to improve the light-emitting efficiency of the LED.

[0103] The evaporation time of the first metal layer is 30 minutes, the evaporation temperature is 150 degrees Celsius, the evaporation time of the second metal layer is 30 minutes, the evaporation temperature is 150 degrees Celsius, and the evaporation time of the third metal layer is 30 minutes, and the evaporation temperature is 150 degrees Celsius.

[0104] Continuing to refer to Figure 12 , the wafer coating equipment comprises: a chamber 303 for accommodating the planetary pot 300 and the evaporation unit 302.

[0105] Referring to Figure 13 , in combination with Figure 6 , the wafer 201 coating equipment comprises: a cover plate 304 for shielding the non-evaporation surface of the wafer 201. The wafer 201 comprises a non-evaporation surface, that is, a non-coating surface, and a surface to be evaporated, that is, a surface to be coated, opposite to the non-evaporation surface.

[0106] It should be noted that the non-evaporation surface is the surface with a semiconductor device, that is, the front surface of the wafer, and the surface to be evaporated opposite to the non-evaporation surface is the back surface of the wafer.

[0107] It should be noted that the film coating fixing ring of the embodiment of the present application can also be used for film coating on the front surface of the wafer.

[0108] The shape of the cover plate 304 includes one or more of a circle, a square, an ellipse, a triangle, and a polygon. In this embodiment, the shape of the cover plate 304 is a circle. The outer edge of the cover plate 304 is flush with the outer edge of the upper surface 204a of the annular body 200 (as shown in FIG. 4). In other embodiments, the outer edge of the cover plate 304 can exceed the outer edge of the upper surface 204a of the annular body 200. Figure 4

[0109] The material of the cover plate 304 includes a metal material (such as a stainless steel material, an aluminum material, etc.) or a plastic material (such as polycarbonate, electric polypropylene, acrylic, etc.). In this embodiment, the material of the cover plate 304 is a plastic material.

[0110] With reference to Figure 13 , in combination with Figure 12 , the cover plate 304 is provided with a gas hole 305 penetrating through the cover plate 304. The gas hole 305 has the following functions:

[0111] First, before film coating on the surface of the wafer to be coated, the chamber 303 needs to be evacuated. The gas hole 305 allows the gas between the cover plate 304 and the wafer 201 to be discharged from the chamber 303, reducing the probability of the gas affecting the quality of the coating film.

[0112] Second, after film coating on the surface of the wafer to be coated, the chamber 303 needs to be filled with gas, such as nitrogen. The gas hole 305 allows nitrogen to enter between the cover plate 304 and the wafer 201, reducing the risk of the cover plate 304 crushing or crushing the wafer 201.

[0113] The cover plate 304 is provided with a handle 306 for lifting the cover plate 304.

[0114] The shape of the handle 306 includes one or more of a circular cylinder, an elliptical cylinder, and a square cylinder. In this embodiment, the shape of the handle 306 is a circular cylinder.

[0115] The handle 306 is arranged at any position of the cover plate 304. In this embodiment, the handle 306 is arranged at the center of the cover plate 304.

[0116] In this embodiment, the handle 306 is integrally formed with the cover plate 304. In other embodiments, the handle 306 is independently formed with the cover plate 304, and the handle 306 is fixed on the cover plate 304 by bonding or nut. ​

[0117] With reference to Figure 12 The planet pot 300 further comprises a fixing clamp 307 for fixing the cover plate 304 on the coating fixing ring, and preventing the coating fixing ring of the wafer from falling off from the opening 301.

[0118] The cover plate 304 corresponds to at least one fixing clamp 307. In the embodiment, the number of the fixing clamps 307 is two.

[0119] The material of the fixing clamp 307 comprises metal (such as stainless steel, aluminum, etc.) or plastic (such as polycarbonate, electric polypropylene, acrylic, etc.). In the embodiment, the material of the fixing clamp 307 is stainless steel.

[0120] The wafer coating device further comprises a rotating device for rotating the planet pot 300 when coating the surface of the wafer to be coated. The rotation comprises uniform rotation and variable speed rotation. In the embodiment, the rotating device rotates the planet pot 300 at a uniform speed.

[0121] With reference to Figure 12 The rotating device comprises a motor (not shown) and a rotating shaft 308. The motor is connected to the rotating shaft 308, the rotating shaft 308 is connected to the planet pot 300, the motor drives the rotating shaft 308 to rotate, and the rotating shaft 308 drives the planet pot 300 to rotate.

[0122] With reference to Figures 14 to 16 FIG. 4 is a schematic diagram of the working principle of the wafer coating according to the embodiment of the present application.

[0123] The working principle of the wafer coating according to the embodiment of the present application is as follows:

[0124] The wafer 201 is placed on the annular support edge 202 and the straight edge support edge 203 of the coating fixing ring. The straight edge 210 of the wafer 201 is opposite to the straight edge positioning protrusion 208, the arc edge 211 of the wafer 201 is opposite to the inner wall 209 of the annular body 200, and the surface to be coated of the wafer 201 is in contact with the annular support edge 202 and the straight edge support edge 203.

[0125] The coating fixing ring loaded with the wafer 201 is clamped and fixed at the opening 301 of the planet pot 300. One coating fixing ring corresponds to one opening 301, and the surface to be coated of the wafer 201 faces the inside of the planet pot 300.

[0126] The cover plate 304 is used to cover the non-evaporated surface of the wafer 201, and the fixing clip 307 is used to fix the cover plate 304 on the coating fixing ring of the wafer.

[0127] The planetary pot 300, which includes the wafer, a coating fixing ring, and a cover plate 304, is placed in the coating equipment such that the surface of the wafer 201 to be coated is opposite to the evaporation unit 302.

[0128] The chamber 303 is evacuated using the vacuum pump to maintain the chamber 303 in a vacuum state.

[0129] The planetary cooker 300 is driven to rotate clockwise in the direction F (e.g., using the rotating device). Figure 16 The wafer 201 rotates at a constant speed (as shown), and the vapor deposition unit 302 deposits a film onto the surface of the wafer 201 to be coated.

[0130] After the coating is completed on the surface of the wafer 201 to be coated, the planetary pan 300 is removed.

[0131] It should be noted that, during the process of the rotating device driving the planetary pan 300 to rotate clockwise in the direction F, the probability of the wafer 201 moving on the coating fixing ring is increased.

[0132] Because the first convex curved surface 213 is provided in this application to provide redundant space for the movement of the wafer 201 within the coating fixing ring, the wafer 201 is less likely to get stuck due to force during the rotation of the planetary pot 300 driven by the rotating device, and is also less likely to get stuck due to force during the process when the wafer is subjected to the force of the high-energy particles. Thus, the wafer can be further protected throughout the entire vapor deposition process.

[0133] It should be understood that the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document indicates that the preceding and following related objects are in an "or" relationship. "Multiple" in the embodiments of this application refers to two or more. The descriptions such as "first," "second," etc., appearing in the embodiments of this application are only for illustration and to distinguish the described objects; they have no order and do not represent a special limitation on the number of devices in the embodiments of this application, nor do they constitute any limitation on the embodiments of this application.

[0134] The utility model discloses although has disclosed as above with preferable embodiment, but it is not used to limit the utility model, any person skilled in the art without departing from the spirit and range of the utility model can utilize the method and technical content of above disclosure to make possible change and modification to the utility model technical scheme, therefore, all the content without departing from the utility model technical scheme, according to the technical essence of the utility model to the simple modification, equivalent change and modification of above embodiment, all belong to the protection range of the utility model technical scheme.

Claims

1. A plating fixing ring for a wafer, characterized by comprising: Comprising: a ring-shaped main body; a ring-shaped support ridge and a straight edge support ridge arranged on the inner wall of the ring-shaped main body, the ring-shaped support ridge and the straight edge support ridge being used to support a wafer; a contact surface of the wafer, the surface of the wafer contacting the straight edge support ridge and the ring-shaped support ridge being in the same plane, the ring-shaped support ridge and the straight edge support ridge being used to support the wafer; a straight edge positioning protrusion arranged on the inner wall of the ring-shaped main body and connected with the straight edge support ridge, two sides of the straight edge positioning protrusion being connected with the inner wall of the ring-shaped main body through a first outer convex surface, the convex direction of the first outer convex surface being parallel to the surface of the wafer and away from the wafer; an outer edge of the wafer having a straight edge and a circular arc edge, the length of the straight edge of the straight edge positioning protrusion being smaller than the length of the straight edge of the wafer; a ring-shaped rubber ring arranged on the inner wall of the ring-shaped main body and the upper surface of the ring-shaped support ridge.

2. The coated retaining ring of claim 1, wherein, The vertical height difference between the upper surface of the ring-shaped main body and the upper surface of the ring-shaped support ridge is greater than or equal to the thickness of the wafer.

3. The coated retaining ring of claim 1, wherein, The outer edge of the wafer is adapted to the inner wall of the ring-shaped main body and has a straight edge and a circular arc edge; wherein the straight edge positioning protrusion is connected with the first outer convex surface through an inner convex surface, the convex direction of the inner convex surface being parallel to the surface of the wafer and towards the wafer; the straight edge positioning protrusion is opposite to the straight edge of the wafer. The first outer convex surface comprises a first outer convex circular arc surface, and the inner convex surface comprises an inner convex circular arc surface, the first outer convex circular arc surface being tangentially connected with the inner convex circular arc surface.

4. The coated retaining ring of claim 3, wherein, The outer edge of the wafer is adapted to the inner wall of the ring-shaped main body.

5. The coated retaining ring of claim 1, wherein, The ring-shaped support ridge and the straight edge support ridge are connected through a second outer convex surface.

6. The coated retaining ring of claim 1, wherein, The difference between the inner diameter of the ring-shaped rubber ring and the inner diameter of the ring-shaped support ridge is within a range greater than 0 mm and less than or equal to 3 mm, the inner diameter of the ring-shaped rubber ring being greater than the outer diameter of the wafer, and the outer diameter of the wafer being greater than the inner diameter of the ring-shaped support ridge.

7. The coated retaining ring of claim 1, wherein Comprising:

8. A wafer coating apparatus, characterized in that, a planetary pot, the surface of the planetary pot having one or more openings; the film-coating fixing ring according to any one of claims 1 to 7 being correspondingly arranged at the openings, and being detachably clamped with the openings; an evaporation unit being arranged in the planetary pot and having an evaporation direction towards each opening. Further comprising:

9. The coating apparatus of claim 8, wherein, a cover plate for shielding a non-evaporation surface of the wafer, the cover plate being provided with air holes penetrating through the cover plate, and the cover plate being provided with a handle for lifting the cover plate. ​

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