Cluster ion beam polishing device

By introducing surface roughness sensors and dynamic path adjustment technology into the polishing device, the problem of uneven polishing was solved, achieving efficient and precise workpiece surface polishing and improving processing efficiency and quality.

CN224059519UActive Publication Date: 2026-03-31CHONGQING JINYUAN NANOTECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-07
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

Existing polishing equipment cannot adjust the polishing position based on real-time data of workpiece surface roughness, resulting in over-polishing of some areas and under-polishing of others, affecting processing efficiency and quality.

Method used

A surface roughness sensor is used to scan the workpiece surface in real time. The movement path of the workpiece and the cluster ion nozzle is dynamically adjusted by the control system. The area with higher roughness is polished in particular. The first and second drive motors drive the lead screw to rotate, so as to achieve automatic position adjustment.

Benefits of technology

It improves the precision and efficiency of polishing, shortens the polishing time, improves the surface finish and smoothness of the workpiece, and reduces surface roughness.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224059519U_ABST
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Abstract

The utility model discloses a cluster ion beam polishing device which comprises a polishing device body, a working table, a cluster ion nozzle and a workpiece body, a bottom plate is arranged at the bottom end in the polishing device body, the working table is arranged at the top of the bottom plate, the workpiece body is placed at the top of the working table, and the cluster ion nozzle is arranged on the working table. A first lead screw is arranged in the position, above the workbench, in the polishing device body, the first lead screw is sleeved with a first driving block, a cluster ion nozzle is fixed to one side of the first driving block, and surface roughness sensors are arranged at the two ends of the bottom of the first driving block correspondingly. By installing the polishing device body, the workbench, the workpiece body, the bottom plate, the first groove, the second lead screw, the second driving block, the second driving motor, the first lead screw, the first driving block, the cluster ion nozzle and the surface roughness sensor, the movement path of the workpiece body can be dynamically adjusted according to surface roughness data, and the machining efficiency is improved.
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Description

Technical Field

[0001] This utility model relates to the technical field of ion polishing devices, specifically a cluster ion beam polishing device. Background Technology

[0002] During the processing of diamond crystal workpieces, the surface often retains processing marks, microcracks, and a certain degree of roughness. These defects not only affect the appearance quality of the diamond crystal workpieces but also negatively impact their performance. For example, in the electronics field, they may affect the stability of electrical signal transmission, and in mold applications, they may reduce demolding performance. Argon gas cluster ion source polishing technology, as an emerging surface treatment method, has many superior performance advantages and brings new opportunities to solve the surface polishing problems of diamond crystal workpieces.

[0003] During workpiece polishing, gas ions are generated by an ion source. These gas ions enter the nozzle to form cluster ion beams, which bombard the workpiece surface to achieve nanoscale or even atomic-level surface polishing, improving its surface smoothness and flatness, and reducing surface roughness. However, since the surface roughness of the workpiece may vary in different areas, and the polishing device generally cannot adjust the polishing position according to real-time data, some areas may be over-polished while other areas are under-polished. Therefore, improvements are needed. Utility Model Content

[0004] The purpose of this invention is to provide a cluster ion beam polishing device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a cluster ion beam polishing device, comprising a polishing device body, a worktable, a cluster ion nozzle, and a workpiece body. A base plate is provided at the bottom of the polishing device body, and a worktable is provided at the top of the base plate. The workpiece body is placed on the top of the worktable. A first lead screw is provided inside the polishing device body above the worktable, and a first driving block is sleeved on the first lead screw. A cluster ion nozzle is fixed to one side of the first driving block, and an ion source is provided at the top of the cluster ion nozzle. Surface roughness sensors are provided at both ends of the bottom of the first driving block. A first driving motor is fixed to the top of one side of the polishing device body, and the output end of the first driving motor is connected to the first lead screw. A first groove is formed at the bottom of the polishing device body, and a second lead screw is provided inside the first groove. A second driving block is sleeved on the second lead screw, and the top of the second driving block is connected to the base plate. A second driving motor is provided inside the polishing device body at one end of the first groove, and the output end of the second driving motor is connected to the second lead screw.

[0006] Preferably, the top ends of both sides of the worktable are rotatably connected to clamps via rotating seats, and a driving component is provided at the center of the worktable. The two ends of the top of the driving component are respectively rotatably connected to a first transmission rod and a second transmission rod via rotating shafts, and the tops of the first transmission rod and the second transmission rod are connected to the clamps.

[0007] Preferably, a cylinder is fixed to one end of the top of the base plate, and the output end of the cylinder is connected to the bottom of the drive component via a telescopic rod.

[0008] Preferably, each of the clamps has a screw passing through its top, and each screw has a pressure block at its bottom end.

[0009] Preferably, a second groove is provided on the bottom side of the polishing device body away from the first groove, and a guide rod is provided inside the second groove, and a guide sleeve is provided on the bottom side of the base plate away from the second drive block.

[0010] Preferably, a purification box is provided on one side of the main body of the polishing device, and an exhaust hood is provided on the top of the main body of the polishing device. The top of the exhaust hood is connected to the purification box through an air guide pipe, and a negative pressure fan is provided on the air guide pipe.

[0011] Preferably, the purification chamber is equipped with a filter screen, and the filter screen is made of activated carbon.

[0012] Preferably, all the pressing blocks are made of rubber material, and all the pressing blocks are in contact with the surface of the workpiece body.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This cluster ion beam polishing device is equipped with a polishing device body, a worktable, a workpiece body, a base plate, a first groove, a second lead screw, a second drive block, a second drive motor, a first lead screw, a first drive block, a cluster ion nozzle, and a surface roughness sensor. When polishing the workpiece body, gas ions are generated by the ion source. The gas ions enter the cluster ion nozzle to form a cluster ion beam. The cluster ion beam bombards the surface of the workpiece body, thereby polishing. The first drive motor and the second drive motor can drive the first lead screw and the second lead screw to rotate, so that the first drive block and the second drive block respectively drive the cluster ion nozzle and the workpiece body to adjust their positions. During the polishing process, the surface roughness sensor scans the surface of the workpiece body at a fixed frequency to obtain surface roughness data. The data is transmitted to the control system. Based on the surface roughness data, the movement path of the workpiece body is dynamically adjusted to focus on polishing areas with higher roughness, shortening the polishing time and improving processing efficiency. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a frontal cross-sectional view of the present invention.

[0016] Figure 2 This is a partial top view of the structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the workbench structure of this utility model;

[0018] Figure 4 For the present utility model Figure 3 Enlarged structural diagram at point A in the middle;

[0019] Figure 5 This is a schematic diagram of the nozzle structure of this utility model.

[0020] In the diagram: 1. Polishing device body; 2. Worktable; 3. Cylinder; 4. Drive component; 5. First transmission rod; 6. Second transmission rod; 7. Fixture; 8. Base plate; 9. First groove; 10. Second groove; 11. First lead screw; 12. First drive motor; 13. Cluster ion nozzle; 14. Exhaust hood; 15. Air guide pipe; 16. Negative pressure fan; 17. Purification box; 18. Filter screen; 19. Second lead screw; 20. Second drive motor; 21. Workpiece body; 22. Second drive block; 23. Screw; 24. Press block; 25. Ion source; 26. First drive block; 27. Surface roughness sensor. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0022] Please see Figure 1-5 An embodiment of this utility model is provided: a cluster ion beam polishing device, including a polishing device body 1, a worktable 2, a cluster ion nozzle 13 and a workpiece body 21. A base plate 8 is provided at the bottom of the interior of the polishing device body 1, and a worktable 2 is provided at the top of the base plate 8. The workpiece body 21 is placed on the top of the worktable 2.

[0023] The top of both sides of the workbench 2 are rotatably connected to the clamps 7 via rotating seats, and a driving component 4 is provided in the center of the workbench 2. The two ends of the top of the driving component 4 are respectively rotatably connected to the first transmission rod 5 and the second transmission rod 6 via rotating shafts. The tops of the first transmission rod 5 and the second transmission rod 6 are connected to the clamps 7.

[0024] A cylinder 3 is fixed at one end of the top of the base plate 8, and the output end of the cylinder 3 is connected to the bottom of the drive component 4 through a telescopic rod;

[0025] The workpiece body 21 to be polished is placed on top of the worktable 2. The output end of the cylinder 3 drives the drive component 4 to rotate, so that the first transmission rod 5 and the second transmission rod 6 rotate relative to each other, causing the clamp 7 to clamp inward.

[0026] Each of the fixtures 7 has a screw 23 passing through its top, and each of the screw 23 has a pressure block 24 at its bottom. The pressure blocks 24 are all made of rubber and are in contact with the surface of the workpiece body 21.

[0027] When the clamp 7 rotates and presses, the top of the workpiece body 21 is clamped and fixed by the pressure block 24. The pressure block 24 can be finely adjusted by rotating the screw 23, which is suitable for workpiece bodies 21 of different thicknesses.

[0028] A first lead screw 11 is provided inside the polishing device body 1 above the worktable 2, and a first drive block 26 is sleeved on the first lead screw 11. A cluster ion nozzle 13 is fixed on one side of the first drive block 26, and an ion source 25 is provided on the top of the cluster ion nozzle 13.

[0029] Gas ions are generated by ion source 25 and enter cluster ion nozzle 13 to form cluster ion beam. The cluster ion beam is used to bombard the surface of workpiece body 21, thereby polishing.

[0030] A first drive motor 12 is fixed to the top of one side of the main body 1 of the polishing device, and the output end of the first drive motor 12 is connected to the first lead screw 11.

[0031] The bottom of the polishing device body 1 is provided with a first groove 9, and a second lead screw 19 is provided inside the first groove 9. A second drive block 22 is sleeved on the second lead screw 19, and the top of the second drive block 22 is connected to the bottom plate 8. A second drive motor 20 is provided inside the polishing device body 1 at one end of the first groove 9, and the output end of the second drive motor 20 is connected to the second lead screw 19.

[0032] The first drive motor 12 and the second drive motor 20 can drive the first lead screw 11 and the second lead screw 19 to rotate, so that the first drive block 26 and the second drive block 22 can respectively drive the cluster ion nozzle 13 and the worktable 2 to adjust their positions, so that the polishing area can be automatically adjusted.

[0033] A second groove 10 is provided on the side of the bottom of the polishing device body 1 away from the first groove 9, and a guide rod is provided inside the second groove 10. A guide sleeve is provided on the side of the bottom of the base plate 8 away from the second drive block 22 to guide and limit the movement of the base plate 8.

[0034] Surface roughness sensors 27 are provided at both ends of the bottom of the first drive block 26. During the polishing process, the surface roughness sensors 27 scan the surface of the workpiece body 21 at a fixed frequency to obtain surface roughness data. The data is transmitted to the control system, which drives the first drive motor 12 and the second drive motor 20 to work. This allows the movement path of the workpiece body 21 and the cluster ion nozzle 13 to be dynamically adjusted according to the surface roughness data of the workpiece body 21, focusing on polishing areas with higher roughness, shortening polishing time, and improving processing efficiency.

[0035] A purification box 17 is provided on one side of the main body 1 of the polishing device, and an exhaust hood 14 is provided on the top of the main body 1 of the polishing device. The top of the exhaust hood 14 is connected to the purification box 17 through an air guide pipe 15, and a negative pressure fan 16 is provided on the air guide pipe 15.

[0036] The purification chamber 17 is equipped with a filter screen 18, which is made of activated carbon. The exhaust gas generated during the polishing process enters the purification chamber 17 through the exhaust hood 14 and the air guide pipe 15. The filter screen 18 removes pollutants from the exhaust gas, preventing it from being directly discharged into the environment.

[0037] The specific models and specifications of the first drive motor 12, the second drive motor 20, the cylinder 3, the negative pressure fan 16, and the surface roughness sensor 27 need to be determined based on the specifications and parameters of the device. The selection and calculation method is existing technology, so it will not be described in detail here.

[0038] Working Principle: In this embodiment, the workpiece body 21 to be polished is placed on top of the worktable 2. The output end of the cylinder 3 drives the drive component 4 to rotate, causing the first transmission rod 5 and the second transmission rod 6 to rotate relative to each other, driving the clamp 7 to clamp inward. The pressure block 24 clamps and fixes the top of the workpiece body 21. The pressure block 24 can be finely adjusted by rotating the screw 23, which is suitable for workpiece bodies 21 of different thicknesses. Then, gas ions are generated by the ion source 25. The gas ions enter the cluster ion nozzle 13 and form a cluster ion beam in the cluster ion nozzle 13. The cluster ion beam is used to bombard the surface of the workpiece body 21, thereby polishing. The first drive motor 12 and the second drive motor 20 can drive the first lead screw 11 and the second lead screw 19 to rotate, so that the first drive motor 12 drives the first lead screw 11 and the second lead screw 19 to rotate. Block 26 and the second drive block 22 respectively drive the cluster ion nozzle 13 and the worktable 2 to adjust their positions, so that the polishing area can be automatically adjusted. During the polishing process, the surface roughness sensor 27 scans the surface of the workpiece body 21 at a fixed frequency to obtain surface roughness data. The data is transmitted to the control system, which drives the first drive motor 12 and the second drive motor 20 to work. This allows the movement path of the workpiece body 21 and the cluster ion nozzle 13 to be dynamically adjusted according to the surface roughness data of the workpiece body 21, focusing on polishing areas with higher roughness, shortening the polishing time and improving processing efficiency. In addition, the exhaust gas generated during the polishing process enters the air guide pipe 15 through the exhaust hood 14 and then enters the purification box 17. The pollutants in the exhaust gas are removed through the filter screen 18 to avoid direct discharge into the environment.

[0039] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0040] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0041] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0042] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A cluster ion beam polishing apparatus, characterized by, Including polishing device main part (1), workstation (2), cluster ion nozzle (13) and workpiece main part (21), the bottom end inside polishing device main part (1) is provided with bottom plate (8), and the top of bottom plate (8) is provided with workstation (2), the top of workstation (2) is placed with workpiece main part (21), the first lead screw (11) is provided in polishing device main part (1) above workstation (2), and the first drive block (26) is sleeved on the first lead screw (11), one side of the first drive block (26) is fixed with cluster ion nozzle (13), and the top of cluster ion nozzle (13) is provided with ion source (25), both ends of the bottom of the first drive block (26) are provided with surface roughness sensor (27), the top of one side of polishing device main part (1) is fixed with first drive motor (12), and the output end of first drive motor (12) is connected with first lead screw (11), the bottom end inside polishing device main part (1) is provided with first recess (9), and the inside of first recess (9) is provided with second lead screw (19), the second drive block (22) is sleeved on the second lead screw (19), and the top of second drive block (22) is connected with bottom plate (8), the second drive motor (20) is provided in polishing device main part (1) one end of first recess (9), and the output end of second drive motor (20) is connected with second lead screw (19).

2. The cluster ion beam polishing apparatus of claim 1, wherein: The top of both sides of workstation (2) is rotatably connected with clamp (7) through rotating seat, and the central position inside workstation (2) is provided with driving part (4), both ends of the top of driving part (4) are rotatably connected with first transmission rod (5) and second transmission rod (6) through rotating shaft, and the top of first transmission rod (5) and second transmission rod (6) is connected with clamp (7).

3. The cluster ion beam polishing apparatus of claim 2, wherein: One end of the top of bottom plate (8) is fixed with air cylinder (3), and the output end of air cylinder (3) is connected with the bottom of driving part (4) through telescopic rod.

4. The cluster ion beam polishing apparatus of claim 2, wherein: The top of clamp (7) is crossed with screw rod (23), and the bottom end of screw rod (23) is provided with pressing block (24).

5. The cluster ion beam polishing apparatus of claim 1, wherein: The side of the bottom end inside polishing device main part (1) away from first recess (9) is provided with second recess (10), and the inside of second recess (10) is provided with guide rod, and the bottom of bottom plate (8) is provided with guide sleeve away from second drive block (22) on one side.

6. The cluster ion beam polishing apparatus of claim 1, wherein: One side of polishing device main part (1) is provided with purification box (17), and the top of polishing device main part (1) is provided with suction hood (14), the top of suction hood (14) is connected with purification box (17) through air guide pipe (15), and negative pressure fan (16) is arranged on air guide pipe (15).

7. The cluster ion beam polishing apparatus of claim 6, wherein: The inside of purification box (17) is provided with filter screen (18), and filter screen (18) is made of activated carbon material.

8. The cluster ion beam polishing apparatus of claim 4, wherein: The pressing block (24) is made of rubber material, and the pressing block (24) is in contact with the surface of workpiece main part (21).