Precise electroplating equipment for through hole and filling hole electroplating
By adopting fixed and movable suspension brackets and spraying mechanisms in the electroplating equipment, the problem of electrolyte spraying caused by excessive anode plate spacing was solved, and uniform metal ion supply inside and outside the cathode plate holes was achieved, thus improving electroplating quality and finished product reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2026-03-31
AI Technical Summary
When performing through-hole or through-hole electroplating on cathode plates, the excessive distance between the two anode plates causes the electrolyte to be sprayed too far, resulting in liquid diffusion, reduced flow rate, and insufficient metal ion concentration. This affects the uniformity of the coating and the integrity of the hole filling, especially in high-density and micro-pore electroplating.
The design combines fixed and movable suspension brackets with anode modules and a liquid spraying mechanism. The spacing between anode modules is adjusted by a Y-axis drive device, and the liquid spraying mechanism moves synchronously with the movable suspension bracket, shortening the electrolyte spraying distance, ensuring uniform electrolyte supply and circulation, and improving the liquid exchange efficiency and metal ion supply inside the pores.
This achieves a uniform supply of metal ions inside and outside the cathode plate holes, improving the uniformity of the coating and the integrity of hole filling, thereby enhancing electroplating quality and finished product reliability.
Smart Images
Figure CN224062944U_ABST
Abstract
Description
[Technical Field]
[0001] This utility model relates to the technical field of electroplating equipment, and more particularly to a precision electroplating equipment having a fixed and a movable dual anode mechanism, and a liquid spraying mechanism linked to the movable anode mechanism, suitable for through-hole electroplating or hole-filling electroplating of cathode plates (substrates). [Background Technology]
[0002] A current electroplating device, such as the one shown in Taiwan Patent Publication No. I575117, has two anode plates (electroplating material) in an electroplating tank, with a cathode plate (the substrate to be electroplated) placed between them. The current output of the power supply is controlled to allow metal ions from the electroplating material on the anode plates to deposit onto the surface of the cathode plate (the substrate). Because the electroplating device must allow the cathode plate to be placed between the two anode plates, and for safety reasons, the distance between the two anode plates is currently set at 200–400 mm.
[0003] However, when performing through-hole or through-hole plating on cathode plates (substrates), especially when the cathode plate is thick, excessive distance between the nozzle used to spray the electrolyte and the cathode plate surface can lead to several adverse effects. First, the long distance causes liquid diffusion when the electrolyte is sprayed onto the cathode plate surface, resulting in a slower flow rate and insufficient electrolyte supply, leading to a decrease in electrolyte exchange efficiency within the holes on the cathode plate. Furthermore, excessive spraying distance can also result in insufficient metal ion concentration within the holes. During electroplating, the obstructed delivery of metal ions affects the uniformity and density of metal deposition, leading to defects such as insufficient plating thickness or incomplete hole filling. These problems are particularly severe in high-density and micro-hole electroplating processes, directly impacting the conductivity and structural reliability of the finished product.
[0004] Therefore, how to solve the problem of excessive distance between the two anode plates and two spray discs in existing electroplating equipment, and overcome the problems encountered in through-hole electroplating and filling-hole electroplating, is the issue that this utility model aims to actively address.
[0005]
New content
[0006] The main purpose of this utility model is to provide a precision electroplating equipment for through-hole and through-hole electroplating. The electroplating tank is equipped with two fixed and two movable suspensions, which are respectively connected to the anode module. Two liquid spraying mechanisms are provided between the two suspensions. One of the liquid spraying mechanisms is linked to the movable suspension. This design allows the cathode plate (substrate) to be safely placed into the electroplating tank and automatically reduces the distance between the anode module and the liquid spraying mechanism, shortens the electrolyte spraying distance, and improves the liquid exchange efficiency and metal ion supply efficiency inside the holes of the cathode plate.
[0007] To achieve the above objectives, this utility model proposes a precision electroplating device for through-hole and through-hole filling electroplating. A preferred embodiment includes an electroplating tank, a fixed suspension frame and a movable suspension frame, a fixed anode module and a movable anode module, as well as a first liquid spraying mechanism and a second liquid spraying mechanism, wherein:
[0008] The electroplating tank is a tank with an opening at the top, which is used to store an electroplating solution. A fixed suspension bracket is immovably fixed to a first side of the electroplating tank, and a movable suspension bracket is movable in the Y direction on a second side of the electroplating tank. The fixed suspension bracket and the movable suspension bracket extend parallel to each other in the X direction on the electroplating tank at intervals. One or both ends of the movable suspension bracket are provided with a Y-direction drive device, which is used to drive the movable suspension bracket to reciprocate in the Y direction on the electroplating tank.
[0009] The fixed anode module is attached below the fixed suspension bracket, and the movable anode module is attached below the movable suspension bracket. The fixed anode module and the movable anode module are placed in the electroplating solution of the electroplating tank in the Z direction, parallel to each other. A longitudinal space is formed between the fixed anode module and the movable anode module. The Y-direction drive device can drive the movable suspension bracket to move back and forth in the Y direction, thereby expanding and shrinking the lateral width of the longitudinal space, so that a cathode plate of a cathode holder can be placed into the longitudinal space in the Z direction from above the electroplating tank.
[0010] The first and second spraying mechanisms are mounted on the electroplating tank. A first spraying module is located below the first spraying mechanism, within the fixed anode module. The second spraying mechanism is integrated with the movable suspension frame and can reciprocate in the Y direction. A second spraying module is located below the second spraying mechanism, within the movable anode module.
[0011] The first spraying mechanism and the second spraying mechanism are each provided with an X-direction driving device. The X-direction driving device drives the first spraying module and the second spraying module to reciprocate in the X direction within the electroplating tank. The cathode plate is placed between the first spraying module and the second spraying module in the Z direction, so that the first spraying module and the second spraying module spray electroplating liquid onto both sides of the cathode plate during reciprocating movement.
[0012] This utility model can achieve the following effects:
[0013] (I) This utility model, through the design of fixed and movable two suspension brackets and anode modules, allows the width of the longitudinal space formed between the two anode modules to be adjusted by the Y-direction drive device, so that the cathode plate can be easily placed into the longitudinal space from above the electroplating tank, and then the longitudinal space is automatically reduced to achieve rapid loading and unloading of the cathode plate and ensure the safety of equipment operation.
[0014] (II) The present invention, through the design of the second spraying mechanism being able to move synchronously with the movable suspension frame in the Y direction, enables the second spraying module to automatically approach the surface of the cathode plate after the cathode plate is placed, thereby shortening the spraying distance of the electrolyte, improving the spraying efficiency and flow rate of the electrolyte, enhancing the liquid exchange effect inside the holes, and effectively improving the defects such as uneven coating and incomplete filling of holes caused by the excessive distance between the traditional spray plate and the cathode plate.
[0015] (III) Both the first and second spraying mechanisms of this utility model are equipped with X-direction driving devices, which can drive the corresponding spraying modules to move back and forth in the X direction in the electroplating tank, so that the electrolyte can be sprayed into the holes of the cathode plate in a circulating manner, ensuring that sufficient and uniform metal ion supply can be obtained inside and outside the holes during the through-hole and through-hole electroplating process, greatly improving the uniformity of the coating and the integrity of the through-hole filling, thereby improving the electroplating quality and the reliability of the finished product.
[0016] [Simplified Explanation of the Diagram]
[0017] Figure 1 This is a top view of the precision electroplating equipment for through-hole and hole-filling electroplating according to this utility model.
[0018] Figure 2 This is a schematic diagram of the electroplating tank, movable anode module, and Y-axis drive device of this utility model.
[0019] Figure 3 This is a cross-sectional schematic diagram of the spraying mechanism and anode module in the electroplating tank of this utility model.
[0020] Figure 4 These are front and side views of the liquid spraying module of this utility model.
[0021] Figure 5 This is a schematic diagram of the cathode hanger and cathode plate of this utility model.
[0022] Figure 6 This is a schematic diagram of the transport mechanism of the cathode hanger of this utility model.
[0023] Figure 7 This is a schematic diagram of the operation of the precision electroplating equipment of this utility model.
[0024] [Symbol Explanation]
[0025] 100: Electroplating solution
[0026] 10: Electroplating bath
[0027] 11: Saddle
[0028] 20A: Fixed suspension bracket
[0029] 20B: Movable suspension bracket
[0030] 21A: Fixed anode module
[0031] 21B: Movable Anode Module
[0032] 22: Anode box
[0033] 23: Anode plate
[0034] 24: Anode membrane
[0035] 25: Shielding plate
[0036] 30A: First liquid spraying mechanism
[0037] 30B: Second spray mechanism
[0038] 31A: First liquid spraying module
[0039] 31B: Second liquid spraying module
[0040] 32: Spray disc
[0041] 33: Nozzle
[0042] 34: Liquid supply tubing
[0043] 35: Steering pipe fitting
[0044] 36: Liquid supply hose
[0045] 40: Cathode hanger
[0046] 41: Cathode plate
[0047] 50: Y-axis drive device
[0048] 60: X-axis drive device
[0049] 70: Transportation agencies
Detailed Implementation Methods
[0050] See Figure 1 , Figure 2 and Figure 3As shown, the present invention discloses a precision electroplating equipment for through-hole and through-hole filling electroplating. A preferred embodiment includes an electroplating tank 10, a fixed suspension bracket 20A and a movable suspension bracket 20B, a fixed anode module 21A and a movable anode module 21B, and a first liquid spraying mechanism 30A and a second liquid spraying mechanism 30B, wherein:
[0051] The electroplating tank 10 is a rectangular tank with an open opening at the top, more specifically a cuboid electroplating tank formed by two long side walls, two short side walls and a bottom wall. The electroplating tank 10 is connected to other electroplating solution circulation systems (not shown) through pipelines for storing electroplating solution 100 for electroplating within the electroplating tank 10. Figure 2 (As shown).
[0052] The fixed suspension bracket 20A is fixed immovably to the first side of the electroplating tank 10, as shown. The fixed suspension bracket structure 20A and the movable suspension bracket 20B structure (see reference) Figure 2 Similarly, the movable suspension bracket 20B is movably disposed on the second side of the electroplating tank 10 in the Y direction, so that the two suspension brackets 20A and 20B extend parallel to each other in the X direction on the electroplating tank 10. One or both ends of the movable suspension bracket 20B are provided with a Y-direction drive device 50 (e.g., Figure 2 As shown), the Y-axis drive device 50 can be a pneumatic cylinder, an electric cylinder, or other device capable of generating mechanical power. The Y-axis drive device 50 is used to drive the movable suspension bracket 20B to reciprocate in the Y direction on the electroplating tank 10 (e.g., ...). Figure 1 As shown in the Y direction, the distance between the fixed suspension bracket 20A and the movable suspension bracket 20B in the Y direction can be expanded or reduced. When expanded, a cathode hanger 40 can safely place a cathode plate 41 (substrate) into the electroplating tank 10 between the two. After the cathode plate 41 is placed in, the distance between the two suspension brackets 20A and 20B in the Y direction is reduced.
[0053] like Figure 1 and Figure 2As shown, the fixed anode module 21A is attached below the fixed suspension bracket 20A, and the movable anode module 21B is attached below the movable suspension bracket 20B. The two anode modules 21A and 21B have the same structure, so that the two anode modules 21A and 21B are placed parallel to each other in the Z direction into the electroplating solution of the electroplating tank 10. Thus, a longitudinal space W1 is formed between the fixed anode module 21A and the movable anode module 20B. Since the Y-direction drive device 50 can drive the movable suspension bracket 20B to move back and forth in the Y direction, the Y-direction (lateral) width of the longitudinal space W1 between the two anode modules 21A and 21B can be expanded and reduced simultaneously. When expanded, a cathode plate 41 of the cathode bracket 40 can be placed into the longitudinal space W1 from above the electroplating tank 10 in the Z direction. After placement, the movable suspension bracket 20B is driven by the Y-direction drive device 50 to reduce the longitudinal space W1, so that the two anode modules 21A and 21B are adjacent to the two sides of the cathode plate 41.
[0054] like Figure 1 and Figure 3 As shown, the first spraying mechanism 30A and the second spraying mechanism 30B have the same structure and are disposed on the electroplating tank 10, located between the fixed suspension frame 20A and the movable suspension frame 20B. A first spraying module 31A is located below the first spraying mechanism 30A, inside the fixed anode module 21A. The second spraying mechanism 30B is combined with the movable suspension frame 20B to move synchronously in the Y direction. A second spraying module 31B is located below the second spraying mechanism 30B, inside the movable anode module 21B. An X-axis driving device 60 is provided at one end of each of the first and second spraying mechanisms 30A and 30B, respectively, to drive the first spraying module 31A and the second spraying module 31B to move reciprocally in the X direction within the electroplating tank 10. Therefore, when the cathode plate 41 is placed in the longitudinal space W1 between the first spray module 31A and the second spray module 31B in the Z direction, the two spray modules 31A and 31B can spray electroplating liquid onto the two sides of the cathode plate 41 respectively when they reciprocate, so as to achieve the operation of through-hole electroplating and hole-filling electroplating on the cathode plate 41.
[0055] See Figure 3 and Figure 4 As shown, the structure of the first spray module 31A and the second spray module 31B is the same (therefore...). Figure 4(Only the second spray module 31B is shown in its structure), which has a spray disc 32, a plurality of nozzles 33, and at least one supply pipe 34. The spray disc 32 is a rectangular disc with a grid-like or lattice-like pipeline inside, and the flow channels inside the pipeline are connected together. Thus, the plurality of nozzles 33 are provided on the side of the pipeline of the spray disc 32 facing the cathode plate. The nozzles 33 are existing objects and their type is not limited. One or both ends of the spray disc 32 are connected to the supply pipe 34, so that the supply pipe 34 can deliver electroplating liquid into the pipeline of the spray disc 32, and then spray it out from the nozzles 33 toward the cathode plate. The lower end of the spray disc 32 and the supply pipe 34 are connected by a directional pipe connector 35, so that when the spray disc 32 is driven by the X-direction drive device 60 to move back and forth in the X direction, the supply pipe 34 can rotate to adapt to the movement of the spray disc 32, realizing the design of the spray disc 32 reciprocating. In addition, a fluid supply hose 36 can also be connected to the upper end of the fluid supply rigid tube 34. Figure 3 As shown), the other end of the liquid supply hose 36 is used to connect to other liquid supply devices, thereby delivering the electroplating solution of the circulating system to the spray plate 32.
[0056] See also Figure 1 and Figure 2 As shown, the fixed anode module 21A and the movable anode module 21B have the same structure. Figure 2 The diagram only shows the movable anode module 21B. Both modules have an anode box 22, which is a non-metallic box that is closed on three sides with one open side facing the cathode plate 41. An anode plate 23 is installed inside each anode box 22, vertically positioned within the box. Each anode box 22 also has an anode membrane 24 and a shielding plate 25. The anode membrane 24 acts as a filter material to isolate the electroplating solution, vertically shielding the side of the anode plate 23 facing the open side. This allows only ions and metal ions to pass through the membrane, preventing other substances or bubbles that may be generated during the reaction from moving to the cathode plate 41, thus ensuring the stability and quality of the electroplating process. The shielding plate 25 vertically shields the open side of the anode box 22, preventing unwanted electroplating areas from forming on the surface of the cathode plate 41, ensuring that only specific areas of the cathode plate 41 come into contact with cations (metal ions).
[0057] See Figure 3 , Figure 5 and Figure 6 As shown, the cathode bracket 40 is arranged in parallel. Figure 1 Between the fixed suspension bracket 20A and the movable suspension bracket 20B, the cathode bracket 40 can be raised and lowered by a transport mechanism 70, so that the cathode plate 41 below it is placed into the longitudinal space W1 between the first spray module 31A and the second spray module 31B, and conversely, it can be vertically raised and removed from the longitudinal space W1. Wherein... Figure 6As shown, the conveying mechanism 70 is an existing known mechanism, usually an electric linear screw assembly or a hydraulic / pneumatic cylinder, etc. Any mechanism that can be used to raise and lower the cathode bracket 40 to place the cathode plate 41 into or remove the electroplating tank 10 can be used to implement the conveying mechanism 70 of this utility model to meet the industrial demand for automation of electroplating equipment.
[0058] See also Figure 5 As shown, a preferred embodiment of the cathode bracket 40 described above includes a suspension bracket 42 and a frame 43 composed of a plurality of conductive components (metal rods, etc.), wherein a cathode conductive element 44 is provided on both sides of the suspension bracket 42, and the cathode conductive element 44 is used to connect to the negative terminal of the power supply circuit, for example... Figure 1 As shown, the electroplating tank 10 is provided with a saddle 11, allowing the cathode conductive element 33 to be detachably mounted on the saddle 11. The frame 43 is a conductive rectangular frame, and the frame 43 is provided with an upper retainer 45 for clamping the upper end of the cathode plate 41 and conducting electricity, and a lower retainer 45 for clamping the lower end of the cathode plate 41 and conducting electricity, thereby vertically fixing the cathode plate 41 in the frame 43.
[0059] See Figure 7 As shown, the operating principle of this precision electroplating equipment is as follows: the Y-direction drive device 50 drives the movable suspension frame 20B and the second spraying mechanism 30B connected to it to move in the Y direction, expanding the distance between the fixed suspension frame 20A and the movable suspension frame 20B, thereby expanding the longitudinal space W1 between the fixed anode module 21A and the movable anode module 21B, so that the space W1 has sufficient width so that the cathode plate 41 can be safely and smoothly placed in later. Subsequently, the transport mechanism 70 is activated, driving the cathode hanger 40 to descend vertically from above in the Z direction, so that the cathode plate 41 is placed in the longitudinal space W1 in the electroplating tank 10 and positioned between the first spraying module 31A and the second spraying module 31B.
[0060] After the cathode plate 41 is positioned, the Y-axis drive device 50 is activated again, driving the movable suspension bracket 20B and the second spraying mechanism 30B to move in opposite directions, gradually reducing the longitudinal space W1. This causes the first spraying module 31A and the second spraying module 31B to be adjacent to the two sides of the cathode plate 41, while the anode modules 21A and 21B are also adjacent to the two sides of the cathode plate 41, forming a stable electroplating environment. When entering the electroplating process, the X-axis drive device 60 begins to drive the first spraying module 31A and the second spraying module 31B to reciprocate in the X direction (see reference). Figure 4As shown), the electroplating solution is evenly sprayed out through a plurality of nozzles 33 through the internal mesh pipes of its spray plate 32. The plurality of nozzles 33 continuously and alternately spray the solution on both sides of the holes of the cathode plate 41 (not spraying the solution on the same hole at the same time), which enables the electroplating solution to effectively pass through the holes on the cathode plate 41, perform through-hole electroplating and hole-filling electroplating, ensure that the cathode plate 41 obtains a good electroplating coating and hole-filling effect, and achieve a stable and high-quality electroplating operation.
[0061] This utility model has been disclosed above with reference to preferred embodiments. However, those skilled in the art should understand that these embodiments are merely illustrative and should not be construed as limiting the scope of this utility model. It should be noted that all variations and substitutions equivalent to these embodiments should be considered within the scope of this utility model. Therefore, the protection scope of this utility model is defined by the claims.
Claims
1. A precision electroplating apparatus for through-hole and via plating, characterized by, It includes an electroplating tank, a fixed suspension frame and a movable suspension frame, a fixed anode module and a movable anode module, and a first liquid spraying mechanism and a second liquid spraying mechanism, wherein: The electroplating tank is a tank body with a slot at the upper end, and the electroplating tank is used to store an electroplating solution; The fixed suspension frame is fixedly arranged on the first side of the electroplating tank, and the movable suspension frame is movably arranged on the second side of the electroplating tank, and the fixed suspension frame and the movable suspension frame are spaced apart and extend in the X direction parallel to the electroplating tank; one end or both ends of the movable suspension frame is provided with a Y direction driving device, and the Y direction driving device is used to drive the movable suspension frame to reciprocate in the Y direction of the electroplating tank; The fixed anode module is combined below the fixed suspension frame, and the movable anode module is combined below the movable suspension frame, and the fixed anode module and the movable anode module are arranged in the Z direction into the electroplating solution of the electroplating tank in parallel; A longitudinal space is formed between the fixed anode module and the movable anode module, and the Y direction driving device can drive the movable suspension frame to reciprocate in the Y direction, so that the transverse width of the longitudinal space is enlarged and reduced, so that a cathode plate of a cathode hanger can be arranged in the Z direction into the longitudinal space from above the electroplating tank; The first liquid spraying mechanism and the second liquid spraying mechanism are arranged on the electroplating tank; a first liquid spraying module is arranged below the first liquid spraying mechanism, and the first liquid spraying module is located on the inner surface of the fixed anode module; the second liquid spraying mechanism is combined with the movable suspension frame and can reciprocate in the Y direction, and a second liquid spraying module is arranged below the second liquid spraying mechanism, and the second liquid spraying module is located on the inner surface of the movable anode module; and The first liquid spraying mechanism and the second liquid spraying mechanism are respectively provided with an X direction driving device, and the X direction driving device drives the first liquid spraying module and the second liquid spraying module to reciprocate in the X direction of the electroplating tank; the cathode plate is arranged in the Z direction between the first liquid spraying module and the second liquid spraying module, so that the first liquid spraying module and the second liquid spraying module spray the electroplating solution to two surfaces of the cathode plate when reciprocating.
2. The fine electroplating apparatus for through-hole and hole-filling electroplating according to claim 1, wherein The first liquid spraying module and the second liquid spraying module are respectively provided with a spraying disc, a plurality of nozzles and at least one liquid supply hard pipe; the spraying disc has a grid-shaped or lattice-shaped pipeline, and the pipeline of the spraying disc is provided with the plurality of nozzles towards one surface of the cathode plate; one end or both ends of the spraying disc is connected with the liquid supply hard pipe, and the liquid supply hard pipe transports the electroplating solution to the pipeline of the spraying disc.
3. The fine electroplating apparatus for through-hole and hole-filling electroplating of claim 2, wherein, The lower end of the spraying disc and the liquid supply hard pipe are connected through a turning pipe connector, so that the liquid supply hard pipe can be turned when the spraying disc reciprocates in the X direction.
4. The fine electroplating apparatus for through-hole and hole-filling electroplating of claim 3, wherein, The upper end of the liquid supply hard pipe is connected with a liquid supply soft pipe, and the other end of the liquid supply soft pipe is connected with other liquid supply devices.
5. The apparatus for precision electroplating of through holes and hole filling electroplating of claim 1, wherein, The fixed anode module and the movable anode module are respectively provided with an anode box, an anode plate, an anode film and a shielding plate; the anode box is a nonmetal box body with three closed sides and an opening face facing the cathode plate; the anode plate is vertically arranged in the anode box; the anode film is vertically shielded on a side of the anode plate facing the opening face; and the shielding plate is vertically shielded on the opening face of the anode box.
6. The apparatus for precision electroplating of through holes and hole filling electroplating of claim 1, wherein, The cathode hanger is provided with a suspension hanger composed of a plurality of conductive members and a frame; two sides of the suspension hanger are provided with cathode conductive elements; the frame is provided with an upper fixer clamping the upper end of the cathode plate and a lower fixer clamping the lower end of the cathode plate.
7. The apparatus for precision electroplating of through holes and hole filling of claim 1, wherein, The cathode hanger is arranged on a conveying mechanism; the conveying mechanism is used for placing the cathode hanger in the Z direction on the electroplating tank, so that the cathode plate is placed into the longitudinal space in the electroplating tank and then moved to be close to the inner face of the fixed anode module.