Tool for dynamically aging semiconductor detection

Abstract

The utility model discloses a tool for dynamic aging semiconductor detection, and relates to the technical field of semiconductor aging test, the tool comprises a bearing assembly, the bearing assembly comprises a support bottom shell and a guide hole, the top of the support bottom shell is fixedly connected with a support plate, the top of the support plate is fixedly connected with a guide seat and a clamping assembly, and the guide seat is fixedly connected with the guide seat. The clamping assembly is arranged at the top of the supporting plate, the clamping assembly comprises a supporting piece and an elastic clamping piece, the supporting piece is fixedly connected to the top of the supporting plate, and the elastic clamping piece is fixedly connected to one side of the supporting piece. Through the arrangement of the first transmission part and the second transmission part, the positions of the hot air nozzles can be synchronously adjusted in the transistor clamping and mounting process, so that the hot air nozzles are accurately positioned on the front side and the rear side of the transistor, and stable environment temperature rise is carried out on the transistor in a bidirectional hot air gushing mode; therefore, the accuracy of the dynamic aging test of the main body is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor aging test technology, and in particular to a tooling for dynamic aging semiconductor testing. Background Technology

[0002] Semiconductors include transistors, chips, and integrated circuits. In the routine aging test of semiconductors, especially in the dynamic aging test of transistors, it is necessary to position and clamp them, and test the anti-aging performance of transistors by simulating high-temperature working environment and working mode.

[0003] Existing dynamic aging semiconductor testing fixtures typically use standard fixing bolts to clamp transistors during use. The controllability of the bolt clamping stroke is generally limited, and the rigid clamping can easily damage the fragile transistor body. This results in a series of problems, such as the inability to provide elastic clamping and the inability to automatically adjust the position of the hot air blower to the front and rear sides after the transistor is installed to provide accurate temperature rise testing. Utility Model Content

[0004] In view of the problems existing in the existing tooling for dynamic aging semiconductor testing, this utility model is proposed.

[0005] Therefore, the problem to be solved by this utility model is how to solve a series of problems such as the inability to provide elastic clamping and the inability to automatically adjust the position of the hot air blower to the front and rear sides after the transistor is installed in order to provide accurate heat and temperature rise testing.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a tooling for dynamic aging semiconductor testing, comprising,

[0007] A load-bearing assembly, comprising a supporting base and a guide hole, wherein a support plate is fixedly connected to the top of the supporting base, and a guide seat is fixedly connected to the top of the support plate; and,

[0008] A clamping assembly, disposed on the top of a support plate, includes a support member and an elastic clamping member. The support member is fixedly connected to the top of the support plate, and the elastic clamping member is fixedly connected to one side of the support member; and...

[0009] A displacement assembly is disposed inside the supporting base shell. The displacement assembly includes a first transmission component, a second transmission component, and a reset component. The first transmission component is movably connected to the inner wall of the guide seat, the second transmission component is disposed at the bottom of the first transmission component, and the reset component is fixedly connected to the inside of the supporting base shell.

[0010] As a preferred embodiment of the tooling for dynamic aging semiconductor testing described in this utility model, the support member includes a support shaft, the bottom of which is rotatably connected to the top of a support plate, a connecting crossbar is fixedly connected to the top of the support shaft, a connecting vertical bar is fixedly connected to the bottom of the connecting crossbar, a connecting sleeve is fixedly connected to the bottom of the connecting vertical bar, a fixing crossbar is fixedly connected to one side of the connecting sleeve, and a fixing sleeve is movably sleeved on the surface of the fixing crossbar.

[0011] As a preferred embodiment of the tooling for dynamic aging semiconductor testing described in this utility model, the elastic clamping member includes a fixed vertical plate and a clamping spring. The fixed vertical plate is fixedly connected to one side of the fixed sleeve. A sliding rod is embedded inside the fixed vertical plate. A clamping plate is fixedly connected to one side of the sliding rod. A first limiting block is fixedly connected to the other side of the sliding rod. An elastic contact pad is fixedly connected to the surface of the clamping plate.

[0012] As a preferred embodiment of the tooling for dynamic aging semiconductor testing described in this utility model, the elastic clamping member further includes a groove, and a sliding roller is rotatably connected inside the groove.

[0013] In a preferred embodiment of the tooling for dynamic aging semiconductor testing described in this utility model, the two ends of the clamping spring are respectively fixed to the fixed vertical plate and the clamping plate.

[0014] As a preferred embodiment of the tooling for dynamic aging semiconductor testing described in this utility model, the first transmission component includes a test socket, a shaped card holder is fixedly connected to the surface of the test socket, a fixing pin is provided at the bottom of the shaped card holder, and the fixing pin is fixedly connected to the top of the guide seat.

[0015] As a preferred embodiment of the tooling for dynamic aging semiconductor testing described in this utility model, the second transmission component includes a trapezoidal slider, which is movably connected to the inner wall of the supporting base shell. A transmission plate is fixedly connected to one side of the trapezoidal slider, and a transmission support rod is fixedly connected to the top of the transmission plate. A hot air nozzle is fixedly connected to the top of the transmission support rod.

[0016] In a preferred embodiment of the tooling for dynamic aging semiconductor testing described in this utility model, the guide hole is used in conjunction with the transmission support rod.

[0017] As a preferred embodiment of the tooling for dynamic aging semiconductor testing described in this utility model, the reset component includes a fixed frame, a reset spring, and a guide slide rod. The fixed frame is fixedly connected to the inner wall of the supporting base shell, the guide slide rod is fixedly connected to the inner wall of the fixed frame, a sliding guide block is sleeved on the surface of the guide slide rod, and a second limiting block is fixedly connected to one side of the guide slide rod.

[0018] In a preferred embodiment of the tooling for dynamic aging semiconductor testing described in this utility model, the reset spring is fixedly connected to the surface of the sliding guide block, and the reset spring is fixedly connected to the inner wall of the fixed frame.

[0019] The beneficial effects of this utility model are as follows: by setting the first transmission component and the second transmission component, the position of the hot air nozzle can be adjusted synchronously during the transistor clamping and installation process, so that it is accurately positioned on the front and rear sides of the transistor, and the bidirectional hot air jet can be used to stably raise the ambient temperature of the transistor, thereby improving the accuracy of the dynamic aging test of the transistor body. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a structural diagram of a tooling used for dynamic aging semiconductor testing.

[0022] Figure 2 This is a cross-sectional view of a tooling used for dynamic aging semiconductor testing.

[0023] Figure 3 This is a structural diagram of the clamping assembly for a tooling used in dynamic aging semiconductor testing.

[0024] Figure 4 This is a structural diagram of the reset component for a tooling used in dynamic aging semiconductor testing.

[0025] Figure 5 Tooling for dynamic aging semiconductor testing Figure 2 A magnified view of A in the middle.

[0026] Figure 6 Tooling for dynamic aging semiconductor testing Figure 3 A magnified view of B in the middle.

[0027] In the diagram: 100, load-bearing component; 101, supporting base shell; 102, supporting plate; 103, guide seat; 104, guide hole; 200, clamping component; 201, support member; 201a, supporting shaft; 201b, connecting crossbar; 201c, connecting sleeve; 201d, fixed crossbar; 201e, fixed sleeve; 201f, connecting vertical bar; 202, elastic clamping member; 202a, fixed vertical plate; 202b, first limiting block; 202c, sliding rod; 202d, groove; 202e, sliding roller; 202f. Clamping plate; 202g, clamping spring; 202h, elastic contact pad; 300, displacement assembly; 301, first transmission component; 301a, test socket; 301b, irregular-shaped card holder; 301c, fixing pin; 302, second transmission component; 302a, trapezoidal slider; 302b, transmission plate; 302c, transmission support rod; 302d, hot air nozzle; 303, reset component; 303a, fixing frame; 303b, reset spring; 303c, guide slide rod; 303d, second limit block; 303e, sliding guide block. Detailed Implementation

[0028] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0029] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0030] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0031] Example 1

[0032] Reference Figure 1 and Figure 2 This is the first embodiment of the present invention. This embodiment provides a tooling for dynamic aging semiconductor testing. The tooling for dynamic aging semiconductor testing includes a support component 100, a clamping component 200, and a displacement component 300.

[0033] Specifically, the support assembly 100 includes a support base 101 and a guide hole 104. A support plate 102 is fixedly connected to the top of the support base 101, and a guide seat 103 is fixedly connected to the top of the support plate 102.

[0034] The support plate 102 can provide a good balanced support effect for the working parts and the transistors clamped on its surface.

[0035] Specifically, the clamping assembly 200 is disposed on the top of the support plate 102. The clamping assembly 200 includes a support member 201 and an elastic clamping member 202. The support member 201 is fixedly connected to the top of the support plate 102, and the elastic clamping member 202 is fixedly connected to one side of the support member 201.

[0036] During a single transistor testing process, five transistors are tested simultaneously. They are sequentially clamped inside the clamping assembly 200. The elastic clamping member 202 allows for clamping of both sides of the transistors, preventing damage to the transistor body due to excessively rigid clamping.

[0037] Specifically, the displacement component 300 is disposed inside the support base shell 101. The displacement component 300 includes a first transmission component 301, a second transmission component 302, and a reset component 303. The first transmission component 301 is movably connected to the inner wall of the guide seat 103, the second transmission component 302 is disposed at the bottom of the first transmission component 301, and the reset component 303 is fixedly connected to the inside of the support base shell 101.

[0038] By setting the reset component 303, it can guide the second transmission component during its movement, thereby improving the movement stability of its main body. At the same time, when reset is required, the second transmission component can be driven to reset by the elastic force generated by the deformation recovery of the internal elastic structure.

[0039] Example 2

[0040] Reference Figures 2-6 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0041] Specifically, the support member 201 includes a support shaft 201a, the bottom of which is rotatably connected to the top of the support plate 102. A connecting crossbar 201b is fixedly connected to the top of the support shaft 201a, a connecting vertical bar 201f is fixedly connected to the bottom of the connecting crossbar 201b, a connecting sleeve 201c is fixedly connected to the bottom of the connecting vertical bar 201f, a fixing crossbar 201d is fixedly connected to one side of the connecting sleeve 201c, and a fixing sleeve 201e is movably fitted onto the surface of the fixing crossbar 201d.

[0042] By setting the support shaft 201a, the connecting crossbar 201b can be balanced and supported during rotation, and the entire clamping component 200 can be offset to the outside of the bearing component 100 when it is not needed.

[0043] Specifically, the elastic clamping member 202 includes a fixed vertical plate 202a and a clamping spring 202g. The fixed vertical plate 202a is fixedly connected to one side of the fixed sleeve 201e. A sliding rod 202c is embedded inside the fixed vertical plate 202a. A clamping plate 202f is fixedly connected to one side of the sliding rod 202c. A first limiting block 202b is fixedly connected to the other side of the sliding rod 202c. An elastic contact pad 202h is fixedly connected to the surface of the clamping plate 202f.

[0044] By setting the elastic contact pad 202h, the clamped end of the transistor can be protected by elastic contact, avoiding damage due to excessive rigid clamping. By setting the first limiting block 202b, the sliding rod 202c can be prevented from falling off the inner wall of the fixed vertical plate 202a.

[0045] Specifically, the elastic clamping member 202 also includes a groove 202d, and a sliding roller 202e is rotatably connected inside the groove 202d.

[0046] By setting up a sliding roller 202e, the sliding friction force can be converted into rolling friction force during the process of pushing the transistor in, thereby improving the ease of rolling in and avoiding damage to the transistor caused by contact friction.

[0047] Specifically, the two ends of the clamping spring 202g are fixed to the fixed vertical plate 202a and the clamping plate 202f, respectively.

[0048] By setting a clamping spring 202g, the spring's own elastic properties can provide a flexible clamping effect on both sides of the transistor.

[0049] Specifically, the first transmission component 301 includes a test socket 301a, a shaped card holder 301b is fixedly connected to the surface of the test socket 301a, a fixing pin 301c is provided at the bottom of the shaped card holder 301b, and the fixing pin 301c is fixedly connected to the top of the guide seat 103.

[0050] By setting the irregularly shaped card holder 301b and the fixing pin 301c, it can automatically engage when the test socket 301a moves downward, thus limiting the position of the test socket 301a after displacement.

[0051] Specifically, the second transmission component 302 includes a trapezoidal slider 302a, which is movably connected to the inner wall of the supporting base shell 101. A transmission plate 302b is fixedly connected to one side of the trapezoidal slider 302a, a transmission support rod 302c is fixedly connected to the top of the transmission plate 302b, and a hot air nozzle 302d is fixedly connected to the top of the transmission support rod 302c.

[0052] By setting the transmission plate 302b, the transmission rod 302c can be moved under the transmission action of the trapezoidal slider 302a, thereby driving the hot air nozzle 302d to adjust its position, so as to achieve the effect of uniform heating or quick reset without affecting operation.

[0053] Specifically, the guide hole 104 is used in conjunction with the transmission support rod 302c.

[0054] By setting the guide hole 104, a relatively stable guiding effect can be provided during the movement of the transmission support rod 302c.

[0055] Specifically, the reset component 303 includes a fixed frame 303a, a reset spring 303b, and a guide slide rod 303c. The fixed frame 303a is fixedly connected to the inner wall of the supporting base shell 101, and the guide slide rod 303c is fixedly connected to the inner wall of the fixed frame 303a. A sliding guide block 303e is sleeved on the surface of the guide slide rod 303c, and a second limiting block 303d is fixedly connected to one side of the guide slide rod 303c.

[0056] By setting the guide rod 303c, the sliding guide block 303e sleeved on its surface can be stably supported and a good positioning and guiding effect can be provided to avoid misalignment when it is quickly reset.

[0057] Specifically, the reset spring 303b is fixedly connected to the surface of the sliding guide block 303e, and the reset spring 303b is fixedly connected to the inner wall of the fixed frame 303a.

[0058] The reset spring 303b can quickly push the sliding guide block 303e to reset under the elastic force generated by the recovery deformation, thereby driving the second transmission component 302 to reset.

[0059] In use, the user first takes out the transistors that need to be subjected to dynamic aging tests and arranges them on one side. The user then puts protective sleeves on the upper end of the transistor pins to prevent the pins from breaking due to operational errors during the test. Then, the user holds the upper end of the transistor body and slowly pushes it between the two clamping plates 202f along the sliding roller 202e. The clamping plates 202f are slowly opened by the transistor. The user then manually fine-tunes the transistor pins and inserts them into the pin slots on the top of the test socket 301a. The user then operates the remaining transistors in sequence to complete the installation of all five transistors.

[0060] During the transistor installation process, once it moves to full contact with the elastic contact pad 202h, the clamping plate 202f will reset under the elastic force generated by the recovery deformation of the clamping spring 202g, and provide elastic clamping to both sides of the transistor through the elastic contact pad 202h, avoiding damage to it due to the enhanced rigid clamping effect. Then, while inserting the transistor, the user simultaneously presses the test socket 301a gently, causing it to move downwards and squeeze the trapezoidal sliders 302a on both the front and rear sides.

[0061] The trapezoidal slider 302a is displaced during the compression of the test socket 301a, thereby driving the transmission rod 302c to move via the transmission plate 302b. This drives the hot air nozzle 302d to move precisely to the front and rear sides of the transistor. Then, the dynamic aging test can be performed by activating the transmission rod 302c to heat it. At this time, the fixing pin 301c engages with the irregularly shaped card holder 301b, which serves to limit the position of the test socket 301a.

[0062] After the test is completed, the user presses the test socket 301a down slightly again, so that the fixing pin 301c is no longer locked with the irregular-shaped card holder 301b. Under the elastic force generated by the deformation of the guide rod 303c, the sliding guide block 303e drives the trapezoidal slider 302a to reset. Then, through the transmission plate 302b and the transmission support rod 302c, the hot air nozzle 302d is driven to reset, so as to avoid its position affecting the disassembly and removal of the transistor.

[0063] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A tooling for dynamic aging semiconductor testing, characterized in that: include, A support assembly (100) includes a supporting base shell (101) and a guide hole (104). A support plate (102) is fixedly connected to the top of the supporting base shell (101), and a guide seat (103) is fixedly connected to the top of the support plate (102). A clamping assembly (200) is disposed on the top of a support plate (102). The clamping assembly (200) includes a support member (201) and an elastic clamping member (202). The support member (201) is fixedly connected to the top of the support plate (102), and the elastic clamping member (202) is fixedly connected to one side of the support member (201). A displacement assembly (300) is disposed inside the support base shell (101). The displacement assembly (300) includes a first transmission member (301), a second transmission member (302), and a reset member (303). The first transmission member (301) is movably connected to the inner wall of the guide seat (103). The second transmission member (302) is disposed at the bottom of the first transmission member (301). The reset member (303) is fixedly connected to the inside of the support base shell (101).

2. The tooling for dynamic aging semiconductor testing as described in claim 1, characterized in that: The support member (201) includes a support shaft (201a), the bottom of which is rotatably connected to the top of the support plate (102). A connecting crossbar (201b) is fixedly connected to the top of the support shaft (201a), a connecting vertical bar (201f) is fixedly connected to the bottom of the connecting crossbar (201b), a connecting sleeve (201c) is fixedly connected to the bottom of the connecting vertical bar (201f), a fixing crossbar (201d) is fixedly connected to one side of the connecting sleeve (201c), and a fixing sleeve (201e) is movably fitted onto the surface of the fixing crossbar (201d).

3. The tooling for dynamic aging semiconductor testing as described in claim 2, characterized in that: The elastic clamping member (202) includes a fixed vertical plate (202a) and a clamping spring (202g). The fixed vertical plate (202a) is fixedly connected to one side of the fixed sleeve (201e). A sliding rod (202c) is embedded inside the fixed vertical plate (202a). A clamping plate (202f) is fixedly connected to one side of the sliding rod (202c). A first limiting block (202b) is fixedly connected to the other side of the sliding rod (202c). An elastic contact pad (202h) is fixedly connected to the surface of the clamping plate (202f).

4. The tooling for dynamic aging semiconductor testing as described in claim 3, characterized in that: The elastic clamping member (202) further includes a groove (202d), and a sliding roller (202e) is rotatably connected inside the groove (202d).

5. The tooling for dynamic aging semiconductor testing as described in claim 4, characterized in that: The two ends of the clamping spring (202g) are fixed to the fixed vertical plate (202a) and the clamping plate (202f), respectively.

6. The tooling for dynamic aging semiconductor testing as described in claim 5, characterized in that: The first transmission component (301) includes a test socket (301a), and a shaped card holder (301b) is fixedly connected to the surface of the test socket (301a). A fixing pin (301c) is provided at the bottom of the shaped card holder (301b), and the fixing pin (301c) is fixedly connected to the top of the guide seat (103).

7. The tooling for dynamic aging semiconductor testing as described in claim 6, characterized in that: The second transmission component (302) includes a trapezoidal slider (302a), which is movably connected to the inner wall of the supporting base shell (101). A transmission plate (302b) is fixedly connected to one side of the trapezoidal slider (302a), and a transmission support rod (302c) is fixedly connected to the top of the transmission plate (302b). A hot air nozzle (302d) is fixedly connected to the top of the transmission support rod (302c).

8. The tooling for dynamic aging semiconductor testing as described in claim 7, characterized in that: The guide hole (104) is used in conjunction with the transmission support rod (302c).

9. The tooling for dynamic aging semiconductor testing as described in claim 8, characterized in that: The reset component (303) includes a fixed frame (303a), a reset spring (303b), and a guide slide rod (303c). The fixed frame (303a) is fixedly connected to the inner wall of the supporting base shell (101). The guide slide rod (303c) is fixedly connected to the inner wall of the fixed frame (303a). A sliding guide block (303e) is sleeved on the surface of the guide slide rod (303c). A second limiting block (303d) is fixedly connected to one side of the guide slide rod (303c).

10. The tooling for dynamic aging semiconductor testing as described in claim 9, characterized in that: The return spring (303b) is fixedly connected to the surface of the sliding guide block (303e), and the return spring (303b) is fixedly connected to the inner wall of the fixed frame (303a).

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