High-strength high-conductivity tight copper strip
By employing an upper and lower composite high conductivity layer and a graphene coating on the copper strip, the problems of low strength and poor conductivity of the copper strip are solved, achieving high strength, high conductivity and efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-08
- Publication Date
- 2026-03-31
AI Technical Summary
Existing copper strips have low strength, are easy to break or bend, have poor conductivity, cannot work properly, and have poor heat dissipation.
It adopts a composite high conductivity layer structure with an outer heat dissipation layer. The high conductivity layer uses polypyrrole layer, polyphenylene sulfide layer, polyphthalocyanine compound layer and polyaniline layer, combined with graphene coating as heat dissipation layer, and is covered with EMI absorption magnetic ring and zinc plating layer on the outer surface to improve stability and heat dissipation performance.
It improves the structural stability and conductivity of copper strips, enhances their resistance to breakage, improves heat dissipation efficiency, reduces heat accumulation, and extends their service life.
Smart Images

Figure CN224067428U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of high-strength, high-conductivity, and dense copper strips, and more specifically, to a high-strength, high-conductivity, and dense copper strip. Background Technology
[0002] Copper strip is a metal component mainly used in the production of electrical components, lamp holders, battery caps, buttons, seals, and connectors. It is primarily used as a conductive, heat-conducting, and corrosion-resistant material. Examples include electrical components, switches, washers, gaskets, vacuum devices, radiators, conductive base materials, and various parts such as automotive radiators, heat sinks, and cylinder plates.
[0003] Currently available copper strips on the market have low strength, making them prone to breakage or bending, which can prevent transformers from functioning properly. Furthermore, their poor conductivity means they cannot withstand low power loads. Existing technology, such as the one disclosed in patent announcement CN208722580U, provides a high-strength, high-conductivity precision copper strip for transformers, relating to the field of copper strip technology. This high-strength, high-conductivity precision copper strip for transformers includes a base layer, a high-strength layer fixedly connected internally to the base layer, a high-conductivity layer fixedly connected to the surface of the base layer, an anti-interference layer fixedly connected to the surface of the high-conductivity layer, a heat dissipation layer fixedly connected to the surface of the anti-interference layer, and a protective layer fixedly connected to the surface of the heat dissipation layer. The protective layer has heat dissipation holes on its surface. This transformer uses high-strength, high-conductivity precision copper strip. The high-conductivity layer includes a polypyrrole layer, a polyphenylene sulfide layer, a polyphthalocyanine compound layer, and a polyaniline layer, which gives the copper strip high conductivity. This effectively solves the problem that copper strips on the market have low strength, which makes them easy to break or bend, causing the transformer to malfunction. At the same time, the poor conductivity of copper strips makes them unable to withstand low power.
[0004] The aforementioned patent employs a highly complex structure that is currently impossible to achieve. Its inner heat dissipation layer uses an open-hole design, which is impossible to implement when using copper strips, resulting in high costs. Furthermore, the heat dissipation layer is built-in and does not directly interact with the highly conductive layer during heat conduction. As a highly conductive layer, the highly conductive layer generates a lot of heat when current passes through it, resulting in poor heat dissipation performance. Utility Model Content
[0005] To address the problems existing in the prior art, the purpose of this utility model is to provide a high-strength, high-conductivity, and tightly packed copper strip. By adopting upper and lower composite high-conductivity layers, its structure is stable and has high strength. A heat dissipation layer is directly coated on the outside of the high-conductivity layer, which directly acts on the high-conductivity layer to dissipate heat and improve heat dissipation performance.
[0006] To solve the above problems, the present invention adopts the following technical solution.
[0007] A high-strength, high-conductivity, and compact copper strip includes a copper strip body. A first high-conductivity layer is compositely fixed to the inner surface of the upper end of the copper strip body, and a second high-conductivity layer is compositely fixed to the inner surface of the lower end of the copper strip body. A first heat dissipation layer is compositely fixed to the outer end of the first high-conductivity layer, and a second heat dissipation layer is compositely fixed to the outer surface of the second high-conductivity layer. An anti-interference layer is covered to the outer surface of the copper strip body, and an anti-corrosion and wear-resistant layer is covered to the outer surface of the anti-interference layer. By using composite high-conductivity layers on both sides, its structure is stable and has high strength. The heat dissipation layer is directly coated on the outside of the high-conductivity layer, directly acting on the high-conductivity layer to dissipate heat and improve heat dissipation performance.
[0008] Furthermore, the first and second highly conductive layers are made by composite processing of a polypyrrole layer, a polyphenylene sulfide layer, a polyphthalocyanine compound layer, and polyaniline.
[0009] Furthermore, the first and second highly conductive layers adopt a U-shaped structure.
[0010] Furthermore, the anti-interference layer employs an EMI absorbing magnetic ring, which is wrapped around the outer surface of the copper strip body.
[0011] Furthermore, the anti-corrosion and wear-resistant layer is a zinc-plated layer.
[0012] Furthermore, the first heat dissipation layer and the second heat dissipation layer are coated with graphene.
[0013] Furthermore, the main body of the copper strip adopts an H-shaped structure.
[0014] Compared with existing technologies, the advantages of this utility model are:
[0015] (1) By using an upper and lower composite high conductivity layer, its structure is stable and has high strength. A heat dissipation layer is directly coated on the outside of the high conductivity layer, which directly acts on the heat dissipation of the high conductivity layer and improves the heat dissipation performance. Attached Figure Description
[0016] Figure 1 This is a first schematic diagram of the overall structure of this utility model;
[0017] Figure 2 This is a second schematic diagram of the overall structure of this utility model;
[0018] Figure 3 This is a third schematic diagram of the overall structure of this utility model;
[0019] Figure 4 This is a cross-sectional view of the overall structure of this utility model.
[0020] Explanation of the labels in the diagram:
[0021] 1. Copper strip body, 2. First high conductivity layer, 3. Second high conductivity layer, 4. First heat dissipation layer, 5. Second heat dissipation layer, 6. Anti-interference layer, 7. Anti-corrosion and wear-resistant layer. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1
[0023] Please see Figure 1-4 A high-strength, high-conductivity, and compact copper strip includes a copper strip body 1. A first high-conductivity layer 2 is compositely fixed on the inner surface of the upper end of the copper strip body 1, and a second high-conductivity layer 3 is compositely fixed on the inner surface of the lower end of the copper strip body 1. A first heat dissipation layer 4 is compositely fixed on the outer end of the first high-conductivity layer 2, and a second heat dissipation layer 5 is compositely fixed on the outer end surface of the second high-conductivity layer 3. An anti-interference layer 6 is covered on the outer end surface of the copper strip body 1, and an anti-corrosion and wear-resistant layer 7 is covered on the outer end surface of the anti-interference layer 6. By using upper and lower composite high-conductivity layers, its structure is stable and has high strength. The heat dissipation layer is directly coated on the outside of the high-conductivity layer, which directly acts on the heat dissipation of the high-conductivity layer and improves the heat dissipation performance.
[0024] The first high conductivity layer 2 and the second high conductivity layer 3 are made of a composite process of polypyrrole layer, polyphenylene sulfide layer, polyphthalocyanine compound layer and polyaniline. Through the polypyrrole layer, polyphenylene sulfide layer, polyphthalocyanine compound layer and polyaniline layer, the copper strip has high conductivity (existing technology).
[0025] The first high conductivity layer 2 and the second high conductivity layer 3 adopt a U-shaped structure, and the copper strip body 1 adopts an H-shaped structure, which facilitates the composite on the H-shaped copper strip body 1. The top and bottom surfaces are composited together, resulting in high structural strength, high resistance to breakage, and high service strength. The thickness of the anti-interference layer 4 is 10 to 15 micrometers. The anti-interference layer 4 is an EMI absorbing magnetic ring, which enables the copper strip to have anti-interference capability (existing technology). The anti-interference layer 6 adopts an EMI absorbing magnetic ring and is wrapped around the outer surface of the copper strip body 1.
[0026] The anti-corrosion and wear-resistant layer 7 is made of zinc plating. The outer surface is galvanized, which is wear-resistant and corrosion-resistant. (The zinc plating layer forms a dense zinc layer on the metal surface, which can effectively prevent corrosive substances from contacting the underlying metal, thereby extending the service life of the metal. Zinc is more chemically reactive than iron. When the zinc layer is exposed to air, it will react with oxygen, moisture, etc., to form a protective film (such as ZnO, Zn(OH)2 and basic zinc carbonate). This protective film can slow down the corrosion of zinc. Even if the zinc layer is locally damaged, zinc will continue to protect the exposed steel substrate through electrochemical reaction, acting as a sacrificial anode.)
[0027] The first heat dissipation layer 4 and the second heat dissipation layer 5 are coated with graphene. The advantages of graphene heat dissipation mainly include high efficiency, lightweight and portable design, no electromagnetic interference, and ease of processing and use. Graphene is a two-dimensional crystal composed of a single layer of carbon atoms, possessing excellent thermal conductivity and lightweight properties. Graphene heat dissipation materials, through their superior thermal conductivity and thermal radiation properties, can rapidly absorb heat and dissipate it into the surrounding environment through thermal radiation, thereby reducing the temperature of the heat source and improving the stability and lifespan of the equipment. Graphene has an extremely high thermal conductivity, enabling it to quickly conduct heat from the heat source to the entire patch and dissipate it through thermal radiation. This efficient heat dissipation method helps reduce the temperature of the heat source, improving the stability and lifespan of the equipment. Furthermore, the thermal conductivity of graphene can reach approximately 1300 W m⁻¹ K⁻¹, several times higher than traditional materials, further enhancing heat dissipation efficiency.
[0028] The above description is merely a preferred embodiment of this utility model; however, the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and its improved concept, should be included within the protection scope of this utility model.
Claims
1. A high strength high conductivity compact copper strip comprising a copper strip body (1) characterized by: The upper end inner side surface of the copper strip body (1) is fixed with a first high-conductivity layer (2), the lower end inner side surface of the copper strip body (1) is fixed with a second high-conductivity layer (3), the outer end of the first high-conductivity layer (2) is fixed with a first heat dissipation layer (4), the outer end surface of the second high-conductivity layer (3) is fixed with a second heat dissipation layer (5), the outer end surface of the copper strip body (1) is covered with an anti-interference layer (6), and the outer end surface of the anti-interference layer (6) is covered with a corrosion-resistant wear-resistant layer (7).
2. The high-strength, high-conductivity, compact copper strip of claim 1, wherein: The first high-conductivity layer (2) and the second high-conductivity layer (3) are made of a polypyrrole layer, a polyphenylene sulfide layer, a polyphthalocyanine compound layer, and a polyaniline composite.
3. The high-strength, high-conductivity, compact copper strip of claim 1, wherein: The first high-conductivity layer (2) and the second high-conductivity layer (3) adopt a U-shaped structure.
4. The high strength, high conductivity, compacted copper strip of claim 1 wherein: The anti-interference layer (6) adopts an EMI absorbing magnetic ring and is coated on the outer surface of the copper strip body (1).
5. The high strength, high conductivity, compacted copper strip of claim 1 wherein: The corrosion-resistant wear-resistant layer (7) adopts a galvanized layer.
6. The high strength, high conductivity, compacted copper strip of claim 1 wherein: The first heat dissipation layer (4) and the second heat dissipation layer (5) adopt a graphene coating.
7. The high strength, high conductivity, compacted copper strip of claim 1 wherein: The structure of the copper strip body (1) adopts an H-shaped structure.
Citation Information
Patent Citations
Accurate copper strips of type is led with height that excels in to transformer
CN208722580U