Current carrier and connector using same

Abstract

The utility model discloses a current carrier and a connector using the same, the current carrier comprises an iron base body and a copper conducting layer, the copper conducting layer covers at least one surface of the iron base body, and the iron base body and the copper conducting layer jointly form a composite conducting structure. The iron matrix plays a supporting role in the current carrier, so that the overall strength of the current carrier is enhanced. And when physical connection is carried out, the strength of the current carrying body is enhanced, so that the physical connection of the whole device is more stable and reliable. Meanwhile, the copper conducting layer covering the surface of the iron substrate can ensure that the bearing capacity of the current carrier meets the requirement, and due to the fact that part of copper is replaced by iron, the material cost is reduced, and the utilization rate of the current bearing capacity of the remaining copper is also improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic devices, specifically to a fluid carrier and a connector using the fluid carrier. Background Technology

[0002] In the connection of electronic devices, circuits, or systems, the key role of the current carrier is to ensure stable current transmission between the connected objects, making it an important component for enabling current to flow between different parts. In addition to its electrical connection function of current transmission, the current carrier is also used to achieve physical connection with the objects to be connected, playing a role in fixing and connecting the various parts, and maintaining the physical integrity of the entire electronic device, circuit, or system.

[0003] Currently, most current-carrying fluids are made of pure copper. Pure copper has a very high current-carrying capacity, often far exceeding the current-carrying capacity required in practical applications. This means that in actual use, the current-carrying capacity of many current-carrying fluids is not fully utilized, resulting in a waste of material properties. From the perspective of physical connection, pure copper is relatively weak. When using pure copper current-carrying fluids for physical connections, it may easily deform due to its insufficient strength. This is detrimental to electronic devices (such as connectors), circuits, or systems that require stable physical connections, and may even adversely affect the stability and reliability of the entire device. Utility Model Content

[0004] The first technical problem to be solved by this utility model is to propose a fluid carrier that can balance the utilization rate of copper's current carrying capacity and the overall strength of the fluid carrier, in light of the above-mentioned technical status.

[0005] The second technical problem to be solved by this utility model is to provide a connector that uses the above-mentioned fluid-carrying material.

[0006] The technical solution adopted by this utility model to solve the first technical problem is: a fluid carrier, comprising an iron substrate and a copper conductive layer, wherein the copper conductive layer covers at least one surface of the iron substrate, so that the iron substrate and the copper conductive layer together form a composite conductive structure.

[0007] Of course, in the fluid-carrying mechanism of this invention, there are more than one way to implement the copper conductive layer covering at least one surface of the iron substrate. Preferably, the iron substrate is a sheet, and the copper conductive layer covers one of its surfaces. Preferably, the copper conductive layer can also cover the outer surface of the iron substrate, encapsulating the iron substrate within the copper conductive layer.

[0008] Preferably, the composite conductive structure is a structure that is wide in the middle and narrow at both ends, with the middle part of the composite conductive structure forming a current-carrying part and the two ends of the composite conductive structure narrowing to form a current-connecting part.

[0009] Preferably, the current-carrying part has a connecting hole for connecting a bridging component, and the current-connecting part has a wire groove for clamping wires, the wire groove extending along the width direction of the current-carrying part.

[0010] To facilitate connection and insertion, the end of the current connection portion facing away from the current carrying portion forms a guide portion with gradually decreasing thickness and gradually narrowing width.

[0011] Specifically, the thickness ratio of the copper conductive layer to the iron substrate ranges from 1:1 to 7:3. Preferably, it is 5:5, 6:4, 7:3, etc.

[0012] Specifically, the copper conductive layer is made of copper, copper-nickel-silicon alloy, tin-phosphor bronze, or brass, such as C1100, C7025, C5191, H62, etc.; the iron substrate is made of ordinary carbon structural steel, such as Q235, Q345, etc., or alloy structural steel, such as 20Cr, 40Cr, 35CrMo, etc., or stainless steel, such as 304, 316, etc., or cast iron, such as gray cast iron, ductile iron, and white cast iron, etc.

[0013] There are several options for connecting the iron substrate and the copper conductive layer. Preferably, the current carrier further includes a connector that passes through the iron substrate and the copper conductive layer to connect and fix them together. Specifically, the iron substrate and the copper conductive layer may each have rivet holes that correspond to each other and are fitted with the connector through which the connector passes. The connector includes a rivet.

[0014] Besides the fixing with connectors, the iron substrate and the copper conductive layer can also be bonded together through a bonding layer. Preferably, a bonding layer is formed at the contact surface between the iron substrate and the copper conductive layer. Optionally, the iron substrate and the copper conductive layer are welded, and the bonding layer is a weld bonding layer made of conductive and fusible material such as tin. Optionally, the copper conductive layer is connected and fixed to the iron substrate by hot-melt bonding, and the bonding layer is a hot-melt bonding layer. Since copper has a relatively lower melting point than iron, the hot-melt bonding layer is made of copper. Optionally, the copper conductive layer is connected and fixed to the iron substrate by cold forging, and the bonding layer is a cold-forged bonding layer. Copper is softer than iron, so a rough texture is created on the surface of the iron substrate, and the soft conductor is forced into the rough texture of the iron substrate by high-pressure cold forging to achieve the connection and fixation between the two. Therefore, the material of the cold-forged bonding layer is copper and iron.

[0015] The technical solution adopted by this utility model to solve the second technical problem is: a connector, characterized in that it uses any of the fluid carriers described in the present invention.

[0016] Compared with existing technologies, the advantages of this invention are as follows: In the fluid-carrying structure of this invention, the traditional pure copper fluid-carrying material is improved into a composite fluid-carrying structure composed of an iron substrate and a copper conductive layer. The iron substrate provides support within the fluid-carrying material, thus enhancing its overall strength. During physical connections, the increased strength of the fluid-carrying material makes the physical connections of the entire device more stable and reliable. Simultaneously, the copper conductive layer covering the iron substrate ensures that the fluid-carrying capacity meets requirements. Because a portion of the copper in the fluid-carrying structure of this invention is replaced with iron, material costs are reduced, and the utilization rate of the remaining copper's current-carrying capacity is improved. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the fluid-carrying structure of Embodiment 1 of this utility model;

[0018] Figure 2 This is a schematic diagram of the iron substrate and copper conductive layer after separation in Embodiment 1 of this utility model;

[0019] Figure 3 This is a schematic diagram of the connector structure of Example 1.

[0020] Figure 4 A schematic diagram of another connector with the same structure as in Embodiment 1 is shown.

[0021] Figure 5 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0022] Figure 6 This is a schematic diagram of the structure of Embodiment 3 of this utility model;

[0023] Figure 7 This is a cross-sectional view of Embodiment 3 of the present invention. Detailed Implementation

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0025] Example 1

[0026] like Figures 1-2 The figure shown is an embodiment of a fluid-carrying agent according to the present invention.

[0027] In this embodiment, the fluid-carrying structure is formed by fixing an iron substrate 1 and a copper conductive layer 2 together. The iron substrate 1 is a sheet, and the copper conductive layer 2 covers one surface of the iron substrate 1.

[0028] The iron substrate 1 acts as a support in the fluid-carrying structure, enhancing the overall strength of the fluid. During physical connections, the increased strength of the fluid makes the entire connection more stable and reliable. When the fluid-carrying structure is installed inside the connector (refer to...),... Figure 3 or Figure 4 The iron substrate 1 plays a major role in bearing the pressure applied to the connector.

[0029] The copper conductive layer 2 covering the surface of the iron substrate 1 can ensure that the current carrying capacity meets the requirements. Since some of the copper is replaced by iron, the material cost is reduced and the utilization rate of the current carrying capacity of the remaining copper is improved.

[0030] The aforementioned composite conductive structure is a structure that is wide in the middle and narrow at both sides, such as... Figure 1 As shown, a current-carrying portion 010 is formed in the middle of the composite conductive structure, and the two ends narrow to form current-connecting portions 020. The current-carrying portion 010 has a connecting hole 011 for connecting a bridging component, and the current-connecting portion 020 has a wire groove 021 for clamping wires, which extends along the width direction of the current-carrying component. To facilitate connection insertion, a guide portion 022 with gradually decreasing thickness and width is formed at the end of the current-connecting portion 020 opposite to the current-carrying portion.

[0031] The thickness ratio of the copper conductive layer 2 to the iron substrate 1 ranges from 1:1 to 7:3. Preferably, ratios are 5:5, 6:4, and 7:3. The copper conductive layer 2 is made of copper, copper-nickel-silicon alloy, tin-phosphor bronze, or brass, such as C1100, C7025, C5191, and H62. The iron substrate 1 is made of ordinary carbon structural steel, such as Q235 and Q345, or alloy structural steel, such as 20Cr, 40Cr, and 35CrMo, or stainless steel, such as 304 and 316, or cast iron, such as gray cast iron, ductile iron, and white cast iron.

[0032] Both the iron substrate 1 and the copper conductive layer 2 are cast using a mold, and they are independent and separate when the casting is completed. Therefore, a bonding layer 3 needs to be formed at the contact surface between the iron substrate 1 and the copper conductive layer 2 to fix the iron substrate 1 and the copper conductive layer 2 together.

[0033] The bonding layer 3 can be a welded bonding layer, a hot-melt bonding layer, or a cold-forging bonding layer.

[0034] When the iron substrate 1 and the copper conductive layer 2 are connected and fixed by welding, the bonding layer 3 is a welding bonding layer, and its material is conductive and soluble material such as tin.

[0035] When the iron substrate 1 and the copper conductive layer 2 are connected and fixed by a hot-melt process, the bonding layer 3 is a hot-melt bonding layer. Since the melting point of copper is relatively lower than that of iron, the hot-melt bonding layer is made of copper.

[0036] When the iron substrate 1 and the copper conductive layer 2 are connected and fixed using a cold forging process, the bonding layer 3 is a cold forging bonding layer. Copper is relatively softer than iron, so it is considered to create a rough texture on the surface of the iron substrate 1, and then force the soft conductor into the rough texture of the iron substrate 1 through high-pressure cold forging to achieve the connection and fixation between the two. Therefore, the materials of the cold forging bonding layer are copper and iron.

[0037] Additionally, this embodiment also provides a connector. Specifically, the connector utilizes the aforementioned fluid-carrying agent, such as... Figure 3 or Figure 4 As shown.

[0038] Example 2

[0039] This implementation example Figure 5 As shown, the difference from Embodiment 1 is that the fluid-carrying layer in this embodiment does not have a bonding layer 3, but it additionally includes a connector 4. The connector 4 passes through the iron substrate 1 and the copper conductive layer 2 to connect and fix the two. The connector 4 can be a rivet, and rivet holes (not shown in the figure) are respectively provided in the iron substrate 1 and the copper conductive layer 2, corresponding to each other and matching the passage of the connector 4.

[0040] Example 3

[0041] This implementation example Figures 6-7 As shown, the difference from Embodiment 1 is that the copper conductive layer 2 covers the outer surface of the iron substrate 1 and encapsulates the iron substrate 1 inside the copper conductive layer 2. The outer copper conductive layer 2 allows the outer surface of the fluid-carrying body to serve as a conductive contact surface. The iron substrate 1 acts as the core to support the entire fluid-carrying body. The iron substrate 1 is completely encapsulated by the copper conductive layer 2, forming an integral structure with a tighter bond and greater structural strength.

Claims

1. A current carrier fluid, characterized in that, The current-carrying body comprises an iron base (1) and a copper conductive layer (2) covering at least one surface of the iron base (1) to form a composite conductive structure together.

2. The fluid of claim 1, wherein, The iron base (1) is a sheet, and the copper conductive layer (2) covers one surface of the iron base (1).

3. The fluid of claim 1, wherein, The copper conductive layer (2) covers the outer surface of the iron base (1) and wraps the iron base (1) inside the copper conductive layer (2).

4. The fluid of any one of claims 1 to 3, wherein The composite conductive structure is a structure with a wide middle and narrow sides, the middle of the composite conductive structure forms a current-carrying part (010), and the two ends of the composite conductive structure are narrowed to form current connection parts (020).

5. The fluid of claim 4, wherein, The current-carrying part (010) is provided with a connecting hole (011) for connecting a bridge, and the current connection part (020) has a wire slot (021) for clamping a wire, which extends along the width direction of the current-carrying body.

6. The fluid of claim 5, wherein, The end of the current connection part (020) away from the current-carrying part (010) forms a guide part (022) with gradually decreasing thickness and width.

7. The fluid of any of claims 1 to 3, wherein The thickness ratio of the copper conductive layer (2) to the iron base (1) is 1:1-7:

3.

8. The fluid of any of claims 1-3, wherein, The copper conductive layer (2) is made of red copper, copper-nickel-silicon alloy, tin-phosphorus bronze or brass, and the iron base (1) is made of ordinary carbon structural steel, alloy structural steel, stainless steel or cast iron.

9. The fluid of any of claims 1-3, wherein, The current-carrying body further comprises a connecting piece (4) penetrating the iron base (1) and the copper conductive layer (2) to connect and fix them, the connecting piece (4) comprises a rivet, or a bonding layer (3) is formed on the contact surface of the iron base (1) and the copper conductive layer (2) to connect and fix them, the bonding layer (3) comprises a welding bonding layer, a hot melt bonding layer or a cold upsetting bonding layer.

10. A connector characterized by comprising: The current-carrying body is applied to the current-carrying body of any one of claims 1-9.

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