High-stability differential crystal oscillator

Abstract

The utility model discloses a high-stability differential crystal oscillator, and relates to the technical field of oscillation. The differential crystal oscillator comprises a PCB, an oscillator limiting protection assembly is arranged on one side of the top end of the PCB, a differential crystal oscillator assembly is arranged in the oscillator limiting protection assembly, a limiting bolt matched with the oscillator limiting protection assembly is arranged on one side of the top end of the PCB, and the differential crystal oscillator assembly comprises a base. A differential chip and a quartz wafer assembly are respectively arranged in the base; according to the utility model, the quartz wafer assembly is arranged, the large elliptical electrode and the small elliptical electrode with different specifications are arranged in the quartz wafer assembly, and the electrode structure is optimized, so that the problem of temperature measurement jump points of a traditional differential oscillator is solved, the temperature measurement is between-40 DEG C and + 125 DEG C, and the frequency fitting degree fluctuates within + / -0.3 ppm; therefore, the stability of the product at different temperatures is higher, and the terminal product is more reliable.

Description

Technical Field

[0001] This utility model relates to the field of oscillation technology, specifically a high-stability differential crystal oscillator. Background Technology

[0002] Differential oscillators are important electronic components. Their working principle is based on positive feedback and oscillation circuits. They generate stable oscillation signals by continuously amplifying small disturbances in the circuit. These signals have wide applications in electronic systems. After manufacturing, differential oscillators require temperature testing to check their performance and ensure reliable use at the end. Improving the temperature testing performance of ultra-high frequency differential products has become an urgent market demand. Currently, the temperature testing performance of most ultra-high frequency differential products on the market is not good, exhibiting irregular jumps across various temperature frequency bands. Although these products can function normally at room temperature, performance degrades when exposed to external temperature changes, affecting product usability. Furthermore, during use, external vibrations, impacts, or thermal expansion and contraction can cause oscillator displacement, leading to inconsistencies in the differential signal, resulting in signal interference or loss and affecting the overall performance of the equipment. To address these issues, the inventors propose a high-stability differential crystal oscillator to solve these problems. Utility Model Content

[0003] To address the issues of temperature jump points in traditional differential oscillators and the impact of external factors on differential signals during oscillator operation, this invention aims to provide a highly stable differential crystal oscillator.

[0004] To solve the above technical problems, the present invention adopts the following technical solution: a high-stability differential crystal oscillator, including a PCB circuit board, an oscillator limit protection component is provided on one side of the top of the PCB circuit board, a differential crystal oscillator component is provided in the oscillator limit protection component, and a limit bolt for use in conjunction with the oscillator limit protection component is provided on one side of the top of the PCB circuit board;

[0005] The differential crystal oscillator assembly includes a base, inside which are disposed a differential chip and a quartz crystal assembly, with the quartz crystal assembly placed above the differential chip. The differential chip is connected to the gold-plated layer at the bottom of the base by gold wire, and together with the quartz crystal assembly, an oscillation circuit is generated to output a differential signal. A metal cover plate is provided at the top of the base, and two sets of symmetrically distributed limiting grooves are formed on the outer wall of the base. The quartz crystal assembly includes a crystal body, with a large elliptical electrode plated on the upper surface and a small elliptical electrode plated on the lower surface. The pins of the differential chip are connected to the gold-plated layer of the base by gold wire bonding. The quartz crystal assembly is fixed in the base by conductive adhesive, and the differential chip is fixed to the bottom of the base by conductive adhesive. The base is made of ceramic material, and the metal cover plate is welded to the opening at the top of the base by parallel welding encapsulation technology.

[0006] Preferably, the oscillator limiting protection assembly includes a base, which is fixedly mounted on a PCB circuit board. Two symmetrically distributed fixing blocks are fixedly provided at the top end of the base away from the limiting bolt. A support arm is rotatably provided on the fixing block. A flip cover is rotatably provided on the outer wall of the support arm. Two symmetrically distributed limiting blocks that cooperate with the base are fixedly provided at the bottom end of the flip cover near the fixing block. A limiting frame that cooperates with the support arm is fixedly provided on the outer wall of the flip cover near the limiting bolt. A circular groove that cooperates with the limiting bolt is fixedly provided at the end of the flip cover away from the fixing block. Arc-shaped blocks that cooperate with the limiting groove are fixed on both sides of the inner wall of the base.

[0007] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0008] 1. This utility model provides stable physical protection for the quartz crystal assembly by setting up an oscillator limit protection component and a quartz crystal assembly, so as to avoid interference from external factors. The quartz crystal assembly is equipped with two large elliptical electrodes and a small elliptical electrode of different specifications. By optimizing the electrode structure, the problem of temperature measurement jump point in traditional differential oscillators is solved, and the temperature measurement is achieved within -40 to +125℃, and the frequency fitting degree fluctuation is within ±0.3ppm. This makes the product more stable at different temperatures and the end product more reliable.

[0009] 2. By setting up an oscillator limit protection component, this utility model enables the oscillator limit protection component to position the substrate in the differential crystal oscillator component in both horizontal and vertical directions, providing stronger support for the differential crystal oscillator component, effectively resisting external impacts and vibrations, reducing loosening caused by casing vibration or temperature changes, improving the stability and reliability of the entire device, and reducing the risk of displacement or damage. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the structure of this utility model;

[0012] Figure 2 This is a schematic diagram of the overall structure of the differential crystal oscillator assembly placed into the oscillator limiting protection assembly of this utility model;

[0013] Figure 3 This is a schematic diagram of the unfolded structure of the oscillator limit protection component in this utility model;

[0014] Figure 4 This is a schematic diagram of the overall exploded structure of the differential crystal oscillator group and the oscillator limit protection component in this utility model;

[0015] Figure 5 This is a schematic diagram of the structure of the limiting block after it is connected and limited to the base in this utility model;

[0016] Figure 6 This is a schematic diagram comparing the large elliptical electrode and the small elliptical electrode in this utility model;

[0017] Figure 7 This is a schematic diagram of the side profile of the differential crystal oscillator of this utility model.

[0018] In the diagram: 1. PCB circuit board; 2. Oscillator limit protection assembly; 21. Base; 22. Fixing block; 23. Support arm; 24. Flip cover; 25. Limiting block; 26. Limiting frame; 27. Circular groove; 28. Arc block; 3. Differential crystal oscillator assembly; 31. Base; 32. Differential chip; 33. Quartz crystal assembly; 331. Crystal body; 332. Large elliptical electrode; 333. Small elliptical electrode; 34. Metal cover plate; 35. Limiting groove; 4. Limiting bolt. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] like Figure 1-7As shown, this utility model provides a high-stability differential crystal oscillator, including a PCB circuit board 1, an oscillator limit protection component 2 is provided on one side of the top of the PCB circuit board 1, a differential crystal oscillator component 3 is provided in the oscillator limit protection component 2, and a limit bolt 4 is provided on one side of the top of the PCB circuit board 1 to cooperate with the oscillator limit protection component 2.

[0021] The differential crystal oscillator assembly 3 includes a base 31, inside which a differential chip 32 and a quartz crystal assembly 33 are respectively provided, and the quartz crystal assembly 33 is placed above the differential chip 32. The differential chip 32 is connected to the gold-plated layer at the bottom of the base 31 by gold wire, and the quartz crystal assembly 33 together generate an oscillation circuit to output a differential signal. A metal cover plate 34 is provided at the top of the base 31, and two sets of symmetrically distributed limiting grooves 35 are opened on the outer wall of the base 31.

[0022] By adopting the above technical solution, the quartz crystal assembly 33 and the differential chip 32 are installed in the base 31, and the metal cover plate 34 is fixedly installed on the top of the base 31 to achieve physical protection of the quartz crystal assembly 33 and the differential chip 32, thereby reducing the influence of external interference on the oscillation signal.

[0023] The oscillator limit protection component 2 includes a base 21, which is fixedly mounted on the PCB circuit board 1. Two symmetrically distributed fixing blocks 22 are fixedly provided at the top end of the base 21 away from the limit bolt 4. A support arm 23 is rotatably provided on the fixing block 22. A flip cover 24 is rotatably provided on the outer wall of the support arm 23. Two symmetrically distributed limit blocks 25 that cooperate with the base 31 are fixedly provided at the bottom end of the flip cover 24 near the fixing block 22. A limit frame 26 that cooperates with the support arm 23 is fixedly provided on the outer wall of the flip cover 24 near the limit bolt 4.

[0024] By adopting the above technical solution, the flip cover 24 is closed, which causes the limiting block 25 to fit against the base 31 and vertically limit the base 31.

[0025] The quartz crystal assembly 33 includes a crystal body 331, with a large elliptical electrode 332 plated on the upper surface of the crystal body 331 and a small elliptical electrode 333 plated on the lower surface of the crystal body 331.

[0026] By adopting the above technical solution, setting two sets of elliptical electrodes of different sizes helps to improve the frequency stability of the crystal oscillator under different temperature and environmental conditions and reduce interference between resonant modes.

[0027] The flip cover 24 is fixedly provided with a circular groove 27 at the end away from the fixing block 22, which is used to cooperate with the limit bolt 4.

[0028] By adopting the above technical solution, the limiting bolt 4 limits the fixing block 22 through the circular groove 27.

[0029] Both sides of the inner wall of the base 21 are fixed with arc-shaped blocks 28 that cooperate with the limiting groove 35.

[0030] By adopting the above technical solution, the base 21 is laterally limited by the arc-shaped block 28 on the base 31.

[0031] The pins of the differential chip 32 are connected to the gold-plated layer of the base 31 by gold wire bonding.

[0032] By adopting the above technical solution, the differential chip 32 and the gold-plated layer of the base 31 are efficiently connected by gold wire bonding.

[0033] The quartz crystal assembly 33 is bonded and fixed inside the base 31 with conductive adhesive, and the differential chip 32 is bonded and fixed to the bottom of the base 31 with conductive adhesive.

[0034] By adopting the above technical solution, the quartz wafer assembly 33 and the differential chip 32 are respectively fixedly installed in the base 31.

[0035] The base 31 is made of ceramic material, and the metal cover 34 is welded to the opening on the top of the base 31 by parallel welding encapsulation technology.

[0036] By adopting the above technical solution, the metal cover plate 34 is fixedly welded to the top of the base 31.

[0037] Working principle: First, place the base 31 in the base 21 so that the limiting groove 35 corresponds to the arc block 28, thereby limiting the base 31 laterally. Then, flip the flip cover 24 so that the circular groove 27 contacts the limiting bolt 4. Then, rotate the support arm 23 so that the support arm 23 is slightly lower than the limiting frame 26. Push the end of the support arm 23 into the limiting frame 26 so that the support arm 23 enters the limiting frame 26. The limiting frame 26 limits the support arm 23. During the rotation, the support arm 23 will push the flip cover 24 forward so that the limiting block 25 fits against the corresponding upper surface and outer wall of the base 31, thereby limiting the base 31 vertically for the second time.

[0038] The two layers of electrodes coated on the upper and lower surfaces of the wafer body 331 are changed from traditional square electrodes to elliptical electrodes. The elliptical electrodes not only increase the electrode area and reduce the crystal oscillator resistance, but also reduce the resistance fluctuation with temperature changes. This matches the differential chip 32, allowing the differential chip 32 to have a more stable resistance input under different temperature environments, thereby making the final output frequency more stable under different temperatures and improving the temperature measurement jump point of the product. The two elliptical electrodes are set as a large elliptical electrode 332 and a small elliptical electrode 333. During fine adjustment, because the upper electrode surface needs to be etched, if the upper and lower electrode surfaces are the same size, the silver layer on the upper and lower electrode surfaces will be inconsistent. When the external temperature changes, due to the inconsistent silver layer, the upper and lower silver layers shrink differently due to temperature changes, making the crystal oscillator oscillate unstable. By using upper and lower electrodes of different sizes, with the upper electrode being larger, the increased part of the silver layer on the upper electrode just cancels out the amount of etching for fine adjustment, thereby making the amount of silver layer on the upper and lower electrode surfaces the same, making the temperature measurement frequency more stable.

[0039] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A high-stability differential crystal oscillator comprising a PCB circuit board (1), characterized in that: The PCB circuit board (1) is provided with an oscillator limiting protection assembly (2) on one side of the top end, and a limiting bolt (4) is arranged on the other side of the top end of the PCB circuit board (1) and cooperates with the oscillator limiting protection assembly (2). The differential crystal oscillator assembly (3) comprises a base (31), and the base (31) is internally provided with a differential chip (32) and a quartz wafer assembly (33), and the quartz wafer assembly (33) is placed above the differential chip (32); the differential chip (32) is connected to the gold layer at the bottom of the base (31) by gold wires; the quartz wafer assembly (33) generates an oscillation circuit output differential signal; and the base (31) is provided with a metal cover plate (34) at the top end, and the outer wall of the base (31) is provided with two groups of limiting grooves (35) which are symmetrically distributed.

2. A high-stability differential crystal oscillator as claimed in claim 1, characterized in that The oscillator limiting protection assembly (2) comprises a base (21), and the base (21) is fixedly installed on the PCB circuit board (1); the base (21) is fixedly provided with two symmetrically distributed fixed blocks (22) at the top end away from the limiting bolt (4); the fixed blocks (22) are rotatably provided with support arms (23); the support arms (23) are rotatably provided with turnover covers (24) on the outer walls; the turnover covers (24) are fixedly provided with two symmetrically distributed limiting blocks (25) on the bottom end near one side of the fixed blocks (22) and cooperated with the base (31); and the turnover covers (24) are fixedly provided with limiting frames (26) on the outer walls near the limiting bolt (4) and cooperated with the support arms (23).

3. A high-stability differential crystal oscillator as claimed in claim 1, characterized in that, The quartz wafer assembly (33) comprises a wafer body (331), and the wafer body (331) is plated with a large-ellipse electrode (332) on the upper surface and a small-ellipse electrode (333) on the lower surface.

4. A high-stability differential crystal oscillator as claimed in claim 2, characterized in that The turnover covers (24) are fixedly provided with circular grooves (27) on the ends away from the fixed blocks (22) and cooperated with the limiting bolt (4).

5. A high-stability differential crystal oscillator as claimed in claim 4, characterized in that The base (21) is fixedly provided with arc-shaped blocks (28) on the inner walls on both sides and cooperated with the limiting grooves (35).

6. A high-stability differential crystal oscillator as defined in claim 1, wherein, The pins of the differential chip (32) are connected to the gold layer of the base (31) by gold wire bonding.

7. A high-stability differential crystal oscillator as defined in claim 1, wherein, The quartz wafer assembly (33) is fixedly adhered in the base (31) by conductive adhesive, and the differential chip (32) is fixedly adhered at the bottom of the base (31) by conductive adhesive.

8. A high-stability differential crystal oscillator as defined in claim 1, wherein, The base (31) is made of ceramic material, and the metal cover plate (34) is welded to the opening at the top of the base (31) by parallel welding packaging technology.

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