Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the technical field of electronic equipment, and the electronic equipment comprises a frame body, a mainboard assembly, a screen assembly and a heat dissipation assembly. The mainboard assembly is arranged in the frame body and comprises a mainboard and a processor, and the processor is arranged on the mainboard. The screen assembly is arranged on the frame body, a heat dissipation cavity is formed between the screen assembly and the mainboard assembly, and the processor is arranged on the side, facing the screen assembly, of the mainboard. And the heat dissipation assembly is located in the frame body, and the heat dissipation assembly is used for sucking gas outside the electronic equipment into the heat dissipation cavity and discharging the gas in the heat dissipation cavity out of the electronic equipment.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] To further enhance the performance of mobile phone processors, active cooling measures need to be added to the phone to dissipate the processor's heat to the external environment. Currently, some manufacturers are adding aluminum alloy air ducts to the back of the battery cover, using centrifugal fans to draw airflow into the aluminum alloy ducts, where the airflow is used to remove the processor's heat.

[0003] Adding a separate aluminum alloy air duct inside the phone would increase the phone's thickness, making it difficult to further reduce the thickness and significantly limiting the miniaturization of the phone. Utility Model Content

[0004] This application aims to provide an electronic device that at least solves the problem in the related art where, when an aluminum alloy air duct is set inside a mobile phone for dissipating heat, the aluminum alloy air duct occupies space in the thickness direction of the mobile phone.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] This application provides an electronic device, including:

[0007] Frame;

[0008] The motherboard assembly is housed within the frame. The motherboard assembly includes the motherboard and the processor, with the processor located on the motherboard.

[0009] The screen assembly is mounted on the frame, and a heat dissipation cavity is provided between the screen assembly and the motherboard assembly. The processor is located on the side of the motherboard facing the screen assembly.

[0010] The heat dissipation assembly, located inside the frame, is used to draw gas from outside the electronic device into the heat dissipation cavity and to exhaust gas from inside the heat dissipation cavity to the outside of the electronic device.

[0011] In the embodiments of this application, a portion of the heat generated by the processor is transferred towards the screen assembly, while another portion is transferred through the back of the motherboard to the back of the electronic device. According to simulation results, the heat transferred towards the screen assembly accounts for 75% of the total heat of the phone, which is three times the heat transferred towards the back of the electronic device. Therefore, this embodiment places the heat dissipation structure between the motherboard assembly and the screen assembly, greatly improving heat dissipation efficiency. The heat dissipation assembly is the power unit of the entire system. When the heat dissipation assembly operates, it generates suction, drawing external cold air into the heat dissipation cavity. The cold air carries away the heat from the surface of the motherboard assembly, becoming hot air, which is then exhausted to the outside of the electronic device after passing through the heat dissipation assembly.

[0012] Because the processor is located on the front of the motherboard, the heatsink is also positioned on the front of the motherboard, which improves the heat dissipation efficiency of the motherboard components, thereby enhancing their cooling performance and ensuring their stable operation. Furthermore, utilizing the space between the motherboard and screen components as a heat dissipation channel eliminates the need for additional metal air ducts inside the electronic device, saving space and allowing for further reduction in the device's thickness. This avoids the limitations that metal air ducts could impose on the miniaturization of electronic devices.

[0013] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0014] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0015] Figure 1 This is an exploded view of an electronic device according to an embodiment of this application;

[0016] Figure 2 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application;

[0017] Figure 3 This is a partial structural schematic diagram of an electronic device according to an embodiment of this application;

[0018] Figure 4 This is a schematic diagram of the internal structure of an electronic device according to an embodiment of this application;

[0019] Figure 5 This is a schematic diagram of the internal structure of an electronic device according to an embodiment of this application;

[0020] Figure 6 This is a partial structural schematic diagram of an electronic device according to an embodiment of this application;

[0021] Figure 7 This is a partial structural schematic diagram of an electronic device according to an embodiment of this application.

[0022] Figure label:

[0023] 100 Electronic device, 110 Frame, 111 Enclosure, 112 Air outlet, 113 Bracket, 114 Mounting part, 115 Bending part, 116 Shelf, 120 Motherboard assembly, 121 Motherboard, 122 Processor, 123 Heat sink, 124 Assembly space, 130 Screen assembly, 141 Heat dissipation cavity, 142 Air intake gap, 143 Gap, 144 Sealing cavity, 150 Heat dissipation assembly, 151 Fan blade, 152 Magnetic component, 153 Shaft, 154 Coil, 155 Circuit board, 160 First seal, 161 First annular seal, 162 Second annular seal, 163 Slot, 164 Sealing area, 170 Electronic component, 180 Second seal. Detailed Implementation

[0024] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0027] The following is combined Figures 1-7 This application describes an electronic device according to an embodiment of the present application.

[0028] Combination Figure 1 and Figure 2 As shown, an electronic device 100 according to some embodiments of this application includes: a frame 110, a motherboard assembly 120, a screen assembly 130, and a heat dissipation assembly 150. The motherboard assembly 120 is disposed within the frame 110 and includes a motherboard 121 and a processor 122, with the processor 122 disposed on the motherboard 121. The screen assembly 130 is disposed on the frame 110, and a heat dissipation cavity 141 is provided between the screen assembly 130 and the motherboard assembly 120. The processor 122 is disposed on the side of the motherboard 121 facing the screen assembly 130. The heat dissipation assembly 150 is located within the frame 110 and is used to draw gas from outside the electronic device 100 into the heat dissipation cavity 141 and to discharge gas from the heat dissipation cavity 141 to the outside of the electronic device 100.

[0029] The motherboard assembly 120 and the screen assembly 130 are mounted on the frame 110, with the motherboard assembly 120 and the screen assembly 130 spaced apart, using the space between them as a heat dissipation cavity 141. A heat dissipation assembly 150 is also installed inside the frame 110. When the heat dissipation assembly 150 is in operation, it can draw air from outside the electronic device 100 into the heat dissipation cavity 141 and expel air from the heat dissipation cavity 141, thereby creating a flowing airflow within the heat dissipation cavity 141. This flowing airflow can carry away the heat generated by the motherboard assembly 120 during operation, thus achieving the function of cooling the motherboard assembly 120.

[0030] The motherboard assembly 120 includes a motherboard 121 and a processor 122. The processor 122 is mounted on the motherboard 121, and the motherboard 121 is positioned on the side of the motherboard 122 facing the screen assembly 130, which means the processor 122 is positioned on the front of the motherboard 121. During use, the processor 122 is the primary heat source for the electronic device 100. The processor 122 is typically placed on the front of the motherboard 121, i.e., on the side of the motherboard 121 facing the screen assembly 130. This avoids the heat from the processor 122 concentrating on the back of the electronic device 100. When a user holds the electronic device 100, their hand will come into contact with the back of the electronic device 100. The aforementioned mounting method of the processor 122 reduces the heat perceived by the user's hand.

[0031] A portion of the heat generated by the processor 122 is transferred towards the screen assembly 130, while another portion is transferred through the back of the motherboard 121 to the back of the electronic device 100. According to simulation results, the heat transferred towards the screen assembly 130 accounts for 75% of the total heat of the phone, which is three times the heat transferred towards the back of the electronic device 100. Therefore, in this embodiment, the heat dissipation structure is positioned between the motherboard assembly 120 and the screen assembly 130, significantly improving heat dissipation efficiency. The heat dissipation assembly 150 serves as the power source for the entire system. When the heat dissipation assembly 150 operates, it generates suction, drawing external cold air into the heat dissipation cavity 141. This cold air carries away heat from the surface of the motherboard assembly 120, becoming hot air. This hot air is then exhausted to the outside of the electronic device 100 after passing through the heat dissipation assembly 150.

[0032] Since the processor 122 is located on the front of the motherboard 121, and the heat dissipation cavity 141 is also located on the front of the motherboard 121, it is beneficial to improve the heat dissipation efficiency of the motherboard assembly 120, thereby improving the heat dissipation effect of the motherboard assembly 120 and ensuring the stability of the motherboard assembly 120's operation. Moreover, by using the space between the motherboard assembly 120 and the screen assembly 130 as a heat dissipation channel, there is no need to add an additional metal air duct inside the electronic device 100, saving the space occupied by the metal air duct. The thickness of the electronic device 100 can be further reduced, avoiding the limitation that the metal air duct would impose on the miniaturization of the electronic device 100.

[0033] During the operation of the electronic device 100, the processor 122 generates a large amount of energy. Of course, other components on the motherboard 121 besides the processor 122 also generate heat. This embodiment uses the heat generated by the processor 122 as an example for illustration. The heat dissipation path of other components is the same as that of the processor 122, and will not be described again here.

[0034] For example, screen assembly 130 may be an LCD (Liquid Crystal Display) screen.

[0035] Combination Figure 1 and Figure 2 As shown, in some embodiments, the motherboard assembly 120 may optionally include a heat sink 123, which is disposed on the side of the processor 122 facing the screen assembly 130, and a heat dissipation cavity 141 is provided between the screen assembly 130 and the heat sink 123.

[0036] A heat sink 123 is provided on the side of the processor 122 facing the screen assembly 130. The heat sink 123 and the screen assembly 130 are spaced apart, and the space between the heat sink 123 and the screen assembly 130 is used as a heat dissipation cavity 141.

[0037] The processor 122 is located between the motherboard 121 and the heat sink 123. The heat of the processor 122 can be transferred to the heat dissipation cavity 141. The heat sink 123 can be made of a material with high thermal conductivity, so that the heat of the processor 122 can be quickly transferred to the heat sink 123. The heat sink 123 and the airflow in the heat dissipation cavity 141 have a large contact area, which is beneficial to improving the heat dissipation effect of the processor 122.

[0038] For example, the heat sink 123 can be a vapor chamber (VX).

[0039] Combination Figure 1 and Figure 2 As shown, in some embodiments, optionally, the frame 110 includes a frame plate 116 and a surrounding frame 111 connected to each other. The surrounding frame 111 is arranged around the frame plate 116. An air intake gap 142 is provided between the surrounding frame 111 and the screen assembly 130. The air intake gap 142 is connected to the heat dissipation cavity 141.

[0040] The frame 111 surrounds the frame plate 116 and is distributed circumferentially along the frame plate 116. An air intake gap 142 is provided at the splicing position between the frame 111 and the screen assembly 130, that is, the air intake gap 142 is located at the edge of the frame 110. In the circumferential direction of the screen assembly 130, the screen assembly 130 is not completely fitted to the frame 111, but air intake gaps 142 are left between some edges of the screen assembly 130 and the frame 111, allowing external air to be drawn into the heat dissipation cavity 141 through the air intake gaps 142.

[0041] By providing an air intake gap 142 between the frame 111 and the screen assembly 130, it is not necessary to open an air intake hole on the frame 110, thus avoiding damage to the overall appearance of the electronic device 100. The air intake gap 142 also does not affect the layout of the traditional side button positions.

[0042] In some embodiments, the frame 111 is optionally provided with an air outlet 112, and the air inlet gap 142 and the air outlet 112 are connected through the heat dissipation cavity 141.

[0043] An air outlet 112 is provided on the frame 111. Gas flows into the heat dissipation cavity 141 through the air inlet gap 142. The gas in the heat dissipation cavity 141 is discharged outward through the air outlet 112, thereby forming a flowing airflow in the heat dissipation cavity 141. The flowing airflow can quickly remove the heat in the heat dissipation cavity 141, thereby achieving rapid heat dissipation of the processor 122.

[0044] Combination Figure 1 and Figure 2 As shown, in some embodiments, the air intake gap 142 and the heat dissipation assembly 150 are optionally located on opposite sides of the processor 122.

[0045] External gas is drawn into the heat dissipation cavity 141 through the air intake gap 142, and the gas in the heat dissipation cavity 141 is discharged from the electronic device 100 through the heat dissipation assembly 150. In this embodiment, the air intake gap 142 and the heat dissipation assembly 150 are arranged on opposite sides of the processor 122. This ensures that the gas flowing into the heat dissipation cavity 141 can pass through the processor 122. When a large amount of airflow passes through the processor 122, the airflow can efficiently remove the heat from the processor 122, which is beneficial to improving the heat dissipation speed of the processor 122.

[0046] Combination Figure 1 , Figure 2 and Figure 4 As shown, in some embodiments, the electronic device 100 may optionally include a first seal 160, which is located between the frame plate 116 and the screen assembly 130. The first seal 160 has a slot 163, and the air intake gap 142 and the heat dissipation cavity 141 are connected through the slot 163.

[0047] A first seal 160 is installed between the frame plate 116 and the screen assembly 130. The first seal 160 seals the space between the frame plate 116 and the screen assembly 130, increasing the difficulty for external water and impurities to enter the interior of the electronic device 100.

[0048] In order to allow air to enter the heat dissipation cavity 141, an air intake gap 142 is provided at a portion of the edge between the frame 111 and the screen assembly 130, and the other edge positions between the frame 111 and the screen assembly 130 are sealed by the first seal 160.

[0049] To prevent the first seal 160 from blocking the air inlet gap 142, a slot 163 is provided in a portion of the structure of the first seal 160 in this embodiment. The slot 163 is connected to the air inlet gap 142, and external gas flows into the heat dissipation cavity 141 through the air inlet gap 142 and the slot 163 in sequence. The slot 163 connects the air inlet gap 142 and the heat dissipation cavity 141, ensuring that external gas can flow into the heat dissipation cavity 141.

[0050] Combination Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, in some embodiments, the electronic device 100 may optionally further include electronic components 170. The first seal 160 includes a first annular sealing portion 161 and a second annular sealing portion 162. The first annular sealing portion 161 is provided with a slot 163. The second annular sealing portion 162 is connected to the first annular sealing portion 161. A sealing area 164 is formed between the frame plate 116, the screen assembly 130, and the second annular sealing portion 162. At least a portion of the electronic components 170 are located within the sealing area 164.

[0051] Both the first annular sealing part 161 and the second annular sealing part 162 are annular structures. A slot 163 is provided on the first annular sealing part 161. Therefore, the first annular sealing part 161 is located inside the heat dissipation cavity 141. Except for the slot 163, the structure of the first annular sealing part 161 is a complete and continuous structure, so that the gas in the heat dissipation cavity 141 can only flow in through the air inlet gap 142, and the gas flowing into the heat dissipation cavity 141 can only flow towards the heat dissipation component 150. The airflow direction in the heat dissipation cavity 141 is fixed, thereby ensuring that the airflow can stably dissipate heat from the processor 122.

[0052] A sealing area 164 is formed between the frame 116, the screen assembly 130, and the second annular sealing part 162. Since no slot 163 is provided on the second annular sealing part 162, external gases and impurities are not easily allowed to enter the sealing area 164. The sealing area 164 is a relatively sealed environment. At least some of the electronic components 170 in the electronic device 100 are installed in the sealing area 164. The sealed environment of the sealing area 164 plays a role in waterproofing and dustproofing the electronic components 170, thereby ensuring that the electronic components 170 are not easily exposed to external water and dust, reducing damage to the electronic components 170, and ensuring the stable operation of the electronic components 170.

[0053] Combination Figure 1 , Figure 2 , Figure 3 and Figure 6 As shown, in some embodiments, optionally, the frame 110 further includes: a bracket 113, the bracket 113 being connected to the frame plate 116, a gap 143 being provided between the bracket 113 and the screen assembly 130, a heat dissipation cavity 141 and an air outlet 112 being connected through the gap 143, a heat dissipation assembly 150 being connected to the bracket 113, and at least a portion of the heat dissipation assembly 150 being located within the gap 143.

[0054] A heat dissipation component 150 is mounted on a bracket 113. The bracket 113 and the screen assembly 130 are spaced apart, thus creating a gap 143 between the bracket 113 and the screen assembly 130. At least a portion of the heat dissipation component 150 is located within the gap 143, and the heat dissipation cavity 141 is connected to the gap 143. Driven by the heat dissipation component 150, airflow in the heat dissipation cavity 141 flows into the gap 143. The gap 143 is connected to an air outlet 112, and the airflow in the gap 143 is discharged to the outside of the electronic device 100 through the air outlet 112. Figure 1 , Figure 2 , Figure 3 and Figure 6As shown, in some embodiments, optionally, the frame 110 further includes a second seal 180, the first side of the bracket 113 faces the gap 143, the second side of the bracket 113 is provided with a sealing cavity 144, the second seal 180 is located between the bracket 113 and the frame plate 116, and the second seal 180 is used to seal the sealing cavity 144.

[0055] The gap 143 is located on the first side of the bracket 113, through which airflow can pass. A portion of the sealed cavity 144 inside the electronic device 100 is located on the second side of the bracket 113, and the sealed cavity 144 is used to install a portion of the electrical components that need to be waterproof.

[0056] A second sealing element 180 is installed between the bracket 113 and the frame plate 116 to seal the gap between the bracket 113 and the frame plate 116, thereby sealing the sealing cavity 144 and preventing water, impurities and airflow in the gap 143 from flowing into the sealing cavity 144, thus avoiding any impact on the electrical components in the sealing cavity 144.

[0057] Combination Figure 1 , Figure 2 , Figure 3 and Figure 6 As shown, in some embodiments, optionally, the heat dissipation assembly 150 includes: a fan blade 151, a magnetic element 152, a rotating shaft 153, a coil 154, and a circuit board 155. The fan blade 151 and the magnetic element 152 are located within a gap 143. The rotating shaft 153 is connected to the fan blade 151, and its two ends are located within the gap 143 and the sealed cavity 144, respectively. The coil 154 and the circuit board 155 are located within the sealed cavity 144. The circuit board 155 is electrically connected to the coil 154. When the coil 154 is energized, the magnetic field generated by the coil 154 interacts with the magnetic field of the magnetic element 152, causing the coil 154 to drive the rotating shaft 153 to rotate.

[0058] After the circuit board 155 is connected to a power source, current flows through the coil 154. According to the principle of electromagnetic induction, the energized coil 154 generates a magnetic field, and the magnetic component 152 generates a fixed magnetic field. The magnetic field of the magnetic component 152 interacts with the magnetic field generated by the energized coil 154, producing a force that causes the coil 154 to rotate. The coil 154 is typically wound around a frame, which is connected to the rotating shaft 153. When the coil 154 tends to rotate under the influence of the magnetic force, it drives the rotating shaft 153 to rotate as well. The fan blade 151 is mounted on the rotating shaft 153, so the rotating shaft 153 can drive the fan blade 151 to rotate, and the fan blade 151 drives the airflow.

[0059] The fan blades 151 and magnetic component 152 do not require waterproofing; therefore, they can be placed within the gap 143. The circuit board 155 and coil 154 require waterproofing; therefore, they can be placed within the sealed cavity 144. This method ensures the stable operation of the heat dissipation assembly 150 and reduces its damage rate.

[0060] Combination Figure 1 , Figure 2 , Figure 3 , Figure 6 and Figure 7 As shown, in some embodiments, optionally, the bracket 113 includes: a mounting portion 114 and a bending portion 115. The mounting portion 114 is connected to the heat dissipation assembly 150, and the bending portion 115 is connected to the mounting portion 114 and the frame plate 116. The bending portion 115 is bent relative to the mounting portion 114, and the maximum distance between the mounting portion 114 and the screen assembly 130 is less than the maximum distance between the bending portion 115 and the screen assembly 130.

[0061] The maximum distance between the mounting part 114 and the screen assembly 130 is H1, and the maximum distance between the bending part 115 and the screen assembly 130 is H2.

[0062] The mounting part 114 and the bending part 115 are connected, and the bending part 115 is connected to the frame plate 116. The bending part 115 is bent relative to the mounting part 114.

[0063] The fan blade 151 and magnetic component 152 are located on one side of the bracket 113, and the circuit board 155 and coil 154 are located on the other side of the bracket 113. A portion of the heat dissipation assembly 150 is provided on each side of the bracket 113. Therefore, the bracket 113 cannot be too close to the screen assembly 130, nor too far away from it; instead, it needs to be centrally positioned within the frame plate 116. If the centrally positioned bracket 113 extends in one direction, it will affect the arrangement of the air outlet 112. In this embodiment, a bending portion 115 is provided that bends relative to the mounting portion 114, and the bending portion 115 can be bent away from the screen assembly 130, thereby providing space for the arrangement of the air outlet 112 and facilitating the processing of the air outlet 112 on the frame 111.

[0064] In this embodiment, the mounting part 114 and the bending part 115 are an integral structure. In other embodiments, the mounting part 114 and the bending part 115 can be connected to each other by means of bonding, welding, screw locking, etc.

[0065] Currently, heat dissipation methods such as vapor chambers and graphite heat sinks are used to fully diffuse the processor's heat through the outer surface of electronic devices. This has pushed the natural heat dissipation capacity of electronic devices to its engineering limits, preventing further increases in processor power consumption. Consequently, the gaming and imaging performance of electronic devices is limited and cannot be improved. To further enhance processor performance, active cooling measures are needed to dissipate the processor's heat directly to the external environment through forced convection or other methods.

[0066] Existing air-cooling solutions require placing the centrifugal fan inside a sealed metal air duct, with the aluminum alloy air duct positioned towards the motherboard's battery cover. To ensure adequate airflow, the metal air duct needs to be at least 2mm high. Additionally, the surface area of ​​the inlet and outlet components must be adequate, placing stringent requirements on the overall system design and significantly limiting the thickness of electronic devices. Furthermore, air cooling can only exchange heat from the back of the motherboard, while the processor is mostly located on the front of the motherboard. The back of the motherboard generates only 25% of the heat, while the front of the motherboard transfers 75% of the overall system's heat. Therefore, traditional air cooling is ineffective.

[0067] Adding a miniature fan requires opening air inlets and outlets on electronic devices, which disrupts the overall minimalist design. Furthermore, the layout of the air inlets and outlets also affects the traditional side button layout, impacting the user experience.

[0068] This embodiment provides a novel active air-cooling solution that efficiently improves the heat dissipation capacity of the front of the motherboard 121 of the electronic device 100. At the same time, it eliminates the aluminum alloy air duct on the back of the motherboard in the traditional solution, solves the bottleneck problem of the overall thickness of the motherboard 121 area, and reduces costs.

[0069] The improvement of this embodiment is that the air cooling removes heat from one side of the screen assembly 130 in three times the way that traditional air cooling removes heat from the battery cover side. The metal air duct of traditional air cooling is eliminated, and the existing space between the screen assembly 130 and the heat sink 123 is used instead, improving heat exchange efficiency, increasing the heat exchange area, reducing the thickness limitations imposed by the metal air duct on the overall stack, and saving on the cost of aluminum alloy air ducts and the overall weight of the device.

[0070] The screen assembly 130 is assembled onto the frame 110 using annular foam adhesive to form a heat dissipation cavity 141. The heat dissipation plate 123 is assembled onto the frame 110 using double-sided adhesive. One side of the heat dissipation cavity 141 is the screen assembly 130, and the other side is the heat dissipation plate 123. The frame 110 has an opening in the middle, and the processor 122 is assembled at the corresponding position. The heat dissipation plate 123 needs to reserve an assembly space 124 for the heat dissipation assembly 150, and the heat dissipation assembly 150 is assembled into the assembly space 124. In this embodiment, the heat dissipation assembly 150 can be a centrifugal fan. A centrifugal fan housing is added to the battery cover direction of the frame 110 and sealed onto the frame plate 116.

[0071] Conventional heat sinks are typically positioned closest to the processor. A portion of the heat generated by the processor is transferred directly to the screen assembly containing the heat sink via thermal conductive gel, while another portion is transferred to the battery cover via the back of the motherboard. Simulation results indicate that the heat generated by the screen assembly containing the heat sink accounts for 75% of the total heat in the electronic device, three times the heat generated by the battery cover. Therefore, this embodiment positions the cooling system towards the screen assembly 130, significantly improving heat dissipation efficiency. A centrifugal fan serves as the power source for the entire system. The air pressure generated by the fan's rotation creates suction, drawing cool air through the micro-slits in the screen assembly 130 into the heat dissipation cavity 141 formed by the screen assembly 130 and the frame 110. After making full contact with the surface of the heat sink 123, the cool air carries away the heat from its surface, becoming hot air. This hot air passes through the mounting holes 124 on the centrifugal fan and the heat sink 123, and is then exhausted through the exhaust vent 112 on the other side.

[0072] The first sealing element 160 can be foam adhesive, which fixes the screen assembly 130 to the frame 110, and at the same time uses the ring shape of the foam adhesive to seal the non-waterproof parts.

[0073] The bracket 113 is sealed to the frame plate 116 by a second seal 180, which can be foam adhesive. The waterproof circuit board 155 is placed inside the machine, while the water-resistant fan blades 151 and magnetic components 152 are placed on the outside. This method solves the problem of waterproofing the machine caused by adding a centrifugal fan.

[0074] In this embodiment, the electronic device 100 can be a mobile phone, a tablet computer, an e-reader, a smartwatch, a music player, etc.

[0075] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0076] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising: The electronic device comprises: a frame; a mainboard assembly arranged in the frame, the mainboard assembly comprising a mainboard and a processor arranged on the mainboard; a screen assembly arranged on the frame, a heat dissipation cavity being arranged between the screen assembly and the mainboard assembly, the processor being arranged on a side of the mainboard facing the screen assembly; a heat dissipation assembly arranged in the frame, the heat dissipation assembly being configured to suck gas outside the electronic device into the heat dissipation cavity and discharge gas in the heat dissipation cavity to the outside of the electronic device.

2. The electronic device of claim 1, wherein, The mainboard assembly further comprises: a heat dissipation plate arranged on a side of the processor facing the screen assembly, the heat dissipation cavity being arranged between the screen assembly and the heat dissipation plate.

3. The electronic device of claim 1, wherein, The frame comprises a shelf and a surrounding frame connected to each other, the surrounding frame being arranged around the shelf, an air inlet gap being arranged between the surrounding frame and the screen assembly, the air inlet gap being in communication with the heat dissipation cavity.

4. The electronic device of claim 3, wherein, The surrounding frame is provided with an air outlet, the air inlet gap and the air outlet being in communication through the heat dissipation cavity.

5. The electronic device of claim 3, wherein, The electronic device further comprises: a first sealing member arranged between the shelf and the screen assembly, the first sealing member being provided with a slot, the air inlet gap and the heat dissipation cavity being in communication through the slot.

6. The electronic device of claim 5, wherein, The electronic device further comprises electronic components. The first sealing member comprises: a first annular sealing portion provided with the slot; a second annular sealing portion connected to the first annular sealing portion, a sealing area being formed between the shelf, the screen assembly and the second annular sealing portion, at least part of the electronic components being arranged in the sealing area.

7. The electronic device of claim 4, wherein, The frame further comprises a support connected to the shelf, a gap being arranged between the support and the screen assembly, the heat dissipation cavity and the air outlet being in communication through the gap, the heat dissipation assembly being connected to the support, at least part of the heat dissipation assembly being arranged in the gap.

8. The electronic device of claim 7, wherein, The frame further comprises: a second sealing member, a first side of the support facing the gap, a second side of the support being provided with a sealing cavity, the second sealing member being arranged between the support and the shelf, the second sealing member being configured to seal the sealing cavity.

9. The electronic device of claim 8, wherein, The heat dissipation assembly comprises: a fan blade and a magnetic member arranged in the gap; a rotating shaft connected to the fan blade, two ends of the rotating shaft being arranged in the gap and the sealing cavity, respectively; a coil and a circuit board arranged in the sealing cavity, the circuit board being electrically connected to the coil, under the condition that the coil is electrified, a magnetic field generated by the coil interacts with a magnetic field of the magnetic member, so that the coil drives the rotating shaft to rotate.

10. The electronic device of claim 7, wherein, The support comprises: a mounting portion connected to the heat dissipation assembly; a bent portion connected to the mounting portion and the shelf, the bent portion being bent compared to the mounting portion, a maximum distance between the mounting portion and the screen assembly being smaller than a maximum distance between the bent portion and the screen assembly.

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