Assembled upside-down mounting bracket

Abstract

The utility model provides an assembly type flip-chip support, which comprises a lower substrate and an upper cover plate, the lower substrate comprises a frame part and a plurality of BT substrates arranged in the middle of the frame part in an array mode, a chip assembly is welded on one side of each BT substrate, a plurality of positioning grooves are formed in one side of the frame part, the upper cover plate is arranged on one side of the lower substrate, and protruding blocks matched with the positioning grooves are arranged on one side of the upper cover plate. The upper cover plate is connected with the lower substrate in a clamped mode through the protruding block, the upper cover plate is provided with a light reflecting hole matched with the BT substrate, the diameter of the side, close to the lower substrate, of the light reflecting hole is larger than that of the side, away from the lower substrate, of the light reflecting hole, and first epoxy glue and second epoxy glue arranged in the light reflecting hole are arranged between the lower substrate and the upper cover plate. The upside-down mounting support capable of being assembled is composed of the upper cover plate and the lower base plate, the flatness of one side of the lower base plate facilitates rapid welding of the chip assembly, the upper cover plate and the lower base plate are designed in a modularized mode, the lower base plate and the upper cover plate are easier and more convenient to assemble, the upside-down mounting support is suitable for large-scale production, and the assembling cost is reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of RGB and LED lamp bead manufacturing, and in particular to an assemblable flip bracket. Background Technology

[0002] As display products are constantly being updated and iterated, the development trend is to make LED chips smaller and smaller, resulting in smaller module spacing, achieving mini or even micro LEDs, and thus clearer display effects and higher resolution. However, corresponding outdoor products still use traditional top-type brackets with upright chip manufacturing processes. The reason why flip-chip technology cannot be used is mainly because the top-type bracket contains cups, which makes it difficult to apply solder or solder paste to the BT ("Bismaleimide Triazine") substrate, leading to unstable solder paste, which in turn affects the die bonding accuracy and whether the LED chips can emit light normally.

[0003] Currently, top-type brackets with a cup-shaped structure are injection molded using plastic die casting, bent, and then coated with ink on all five sides. During the packaging process, die bonding is performed on the cup-shaped pads, wire bonding is completed according to the pin settings, and then glue is applied for encapsulation. This die bonding, soldering, and tinning process is difficult, and the glue application requires high precision, making mass production challenging. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an assemblable flip bracket, which aims to solve the technical problem that the LED beads are not easy to manipulate during the packaging process, resulting in difficulty in mass production.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: an assemblable flip-chip bracket, comprising a lower substrate and an upper cover plate, wherein the lower substrate includes a frame portion and a plurality of BT substrates arranged in an array in the middle of the frame portion, wherein a chip assembly for light emission is soldered to one side of the BT substrate, and the frame portion is recessed inward on the side near the chip assembly to form a plurality of positioning grooves, wherein the upper cover plate is provided on the side of the lower substrate facing the chip assembly, and the upper cover plate is provided on the side near the lower substrate with a protrusion adapted to the positioning groove, the upper cover plate being snapped to the lower substrate through the protrusion, and the upper cover plate having a reflective hole that cooperates with the BT substrate for light dispersion by the chip assembly, wherein the diameter of the reflective hole on the side near the lower substrate is larger than the diameter of the reflective hole on the side away from the lower substrate, wherein a first epoxy adhesive is provided between the lower substrate and the upper cover plate, and a second epoxy adhesive is provided on one side of the lower substrate and within the reflective hole.

[0006] Compared with the prior art, the beneficial effects of this utility model are as follows: Several BT substrates are combined to form a flat lower substrate, and an upper cover plate is bonded to one side of the lower substrate. During packaging, tin is first applied to the flat lower substrate to solder the chip components. It is understood that tinning on a flat lower substrate is more convenient than die bonding and tinning on a substrate with a cup structure. Then, the upper cover plate is inverted, and a layer of first epoxy adhesive is applied to one side of the upper cover plate. Next, the positioning groove of the lower substrate is aligned with the protrusion of the upper cover plate, and the lower substrate and the upper cover plate are snapped together to form a whole. After the first epoxy adhesive is cured, a second epoxy adhesive is poured into the reflective hole for dispensing, and the second epoxy adhesive is cured again, thereby realizing the mass packaging of LED chips.

[0007] According to one aspect of the above technical solution, the upper cover plate is made of black plastic.

[0008] According to one aspect of the above technical solution, the BT substrate is rectangular in shape.

[0009] According to one aspect of the above technical solution, the diameter of the side of the reflective hole away from the lower substrate is smaller than the side length of the BT substrate.

[0010] According to one aspect of the above technical solution, a receiving groove is provided between two adjacent BT substrates.

[0011] According to one aspect of the above technical solution, the thickness of the upper cover plate is 0.6 mm.

[0012] According to one aspect of the above technical solution, the chip assembly is located in the center of the reflective hole.

[0013] According to one aspect of the above technical solution, the frame portion is provided with three first positioning holes, which penetrate the frame portion. The upper cover plate is provided with three second positioning holes corresponding to the first positioning holes, which penetrate the upper cover plate. The diameter of the first positioning hole is the same as the diameter of the second positioning hole, and the central axis of the first positioning hole and the second positioning hole are on the same straight line. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the assembleable inverted bracket in one embodiment of the present invention;

[0015] Figure 2 This is a schematic diagram of the structure of a single LED bead in one embodiment of the present invention;

[0016] Figure 3 This is a cross-sectional view of a single LED bead in one embodiment of the present invention;

[0017] Explanation of main component symbols: 1-Top cover plate, 11-Reflective hole, 12-Bump, 13-Second positioning hole, 2-Lower substrate, 21-BT substrate, 22-Frame portion, 221-Positioning groove, 23-Receiving groove, 24-First positioning hole, 3-Chip assembly, 4-First epoxy resin;

[0018] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0019] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0020] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] See Figures 1 to 3An embodiment of this utility model provides an assemblable flip-chip support, comprising a lower substrate 2 and an upper cover plate 1. The lower substrate 2 is composed of a frame portion 22 and an array of several BT substrates 21 forming an integral structure. PCB circuitry for soldering chip components 3 is mounted on the BT substrates 21. The frame portion 22 is provided with multiple positioning grooves 221, which are formed by a downward indentation on one side of the frame portion 22. The upper cover plate 1 is mounted on one side of the lower substrate 2. One side of the upper cover plate 1 is provided with a protrusion 12 that engages with the positioning grooves 221. The upper cover plate 1 has reflective holes 11 adapted to the BT substrates 21. The reflective holes 11 have an inverted T-shaped structure. Specifically, the diameter of the reflective hole 11 on the side closer to the lower substrate 2 is larger than the diameter on the side farther from the lower substrate 2. During encapsulation, the chip components 3 are soldered first. Since one side of the lower substrate 2 is flat, the chip components 3 can be quickly soldered by brushing solder, which is simple and efficient. It should be noted that the chip components 3 are not limited to those attached to the lower substrate 2. Figure 2 The chip shown is for emitting light. The chip assembly 3 can be a plurality of unlimited number of light-emitting chips. For example, in some embodiments, the chip assembly 3 is three RGB chips that can emit red, green and blue colors. After all the chip assemblies 3 are soldered, the upper cover plate 1 is then inverted with the protrusion 12 facing upward. A layer of first epoxy adhesive 4 is brushed on the end of the upper cover plate 1 facing the protrusion 12. Then, the positioning groove 221 of the lower substrate 2 with the chip assembly 3 is aligned with the protrusion 12. By pressing, the lower substrate 2 and the upper cover plate 1 are snapped together. After the first epoxy adhesive 4 is cured, the lower substrate 2 and the upper cover plate 1 are bonded together. The reflective hole 11 of the upper cover plate 1 and the lower substrate 2 form a bowl-shaped structure with one end open. Then, the reflective hole 11 is filled with second epoxy adhesive 4. After curing, the batch packaging of the lamp beads is completed.

[0023] Furthermore, in this embodiment, the top cover plate 1 is made of black plastic. Black material has strong light absorption, which can effectively reduce internal light reflection, avoid stray light interference, and improve light output efficiency. Of course, a transparent cover plate can also be used. After the top cover plate 1 is installed, it is coated with black. In addition, in order to improve the overall brightness of the LED, the BT substrate 21 is a white BT double-layer board. White material has high reflectivity and can reflect more light to the light output direction.

[0024] Furthermore, in this embodiment, the BT substrate 21 is rectangular. By setting the BT substrate 21 into a rectangular structure, it is convenient to cut it into several independent LED beads after the new packaging is completed. In addition, since the cut part of the upper cover plate 1 and the BT substrate 21 are an integral structure, it should be noted that the diameter of the side of the reflective hole 11 away from the lower substrate 2 is smaller than the side length of the BT substrate 21.

[0025] See Figure 1In this embodiment, in order to make the bonding between the upper cover plate 1 and the lower substrate 2 more secure, a receiving groove 23 is provided between each BT substrate 21 of the lower substrate 2. By providing the receiving groove 23, more first epoxy adhesive 4 can be accommodated, and the contact area between the lower substrate 2 and the first epoxy adhesive 4 is increased, resulting in a wider bonding surface and thus making the bonding between the upper cover plate 1 and the lower substrate 2 more secure.

[0026] In this embodiment, the thickness of the upper cover plate 1 is set between 0.5-0.7mm. By setting an ultra-thin upper cover plate 1, it is beneficial to the heat dissipation of the chip assembly 3, and at the same time, it reduces the light loss caused by the reflection of light through the reflective hole 11. Specifically, the thickness of the upper cover plate 1 is 0.6mm.

[0027] Furthermore, the chip assembly 3 is located in the center of the reflector 11. This design ensures that the LED emits light with uniform and maximized brightness, without producing beam deflection.

[0028] Furthermore, the frame portion 22 is provided with three first positioning holes 24, which penetrate the frame portion 22. The upper cover plate 1 is provided with three second positioning holes 13 corresponding to the first positioning holes 24, which penetrate the upper cover plate 1. The diameter of the first positioning hole 24 is the same as the diameter of the second positioning hole 13. The central axes of the first positioning hole 24 and the second positioning hole 13 are on the same straight line. In this embodiment, by setting the first positioning holes 24 and the second positioning holes 13, when installing the upper cover plate 1 and the lower base plate 2, the positioning groove 221 and the protrusion 12 can be quickly aligned indirectly according to the alignment status of the first positioning holes 24 and the second positioning holes 13, making the inlay alignment operation of the positioning groove 221 and the protrusion 12 easy to visualize.

[0029] In summary, the assemblable flip-chip bracket in the above embodiments of this utility model, by setting the upper cover plate and lower substrate as assemblable, makes soldering chip components on the BT substrate of the lower substrate more convenient, avoiding the inconvenience caused by soldering the cup structure, suitable for mass soldering operations, improving soldering efficiency, and also improving the yield of LED chips. In addition, by setting protrusions on the upper cover plate and positioning grooves on the edge of the lower substrate, the upper cover plate and the lower substrate are positioned and connected by the snap-fit ​​of the protrusions and positioning grooves. This is conducive to each reflector being accurately positioned above the corresponding BT substrate. Under the bonding effect of the first epoxy adhesive, the upper cover plate and the lower substrate are bonded to form a whole, thereby realizing the batch LED chip packaging operation and facilitating mass production.

[0030] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0031] The above-described embodiments are merely illustrative of several implementations of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

Claims

1. An assemblyable inverted stent, characterized by, The application relates to a backlight module, which comprises a lower substrate and an upper cover plate, the lower substrate comprises a frame part and a plurality of BT substrates arranged in the middle part of the frame part, a chip assembly for emitting light is welded on one side of the BT substrate, the frame part is recessed inward near the side of the chip assembly to form a plurality of positioning grooves, the lower substrate is provided with the upper cover plate on the side facing the chip assembly, the upper cover plate is provided with protrusions matched with the positioning grooves on the side close to the lower substrate, the upper cover plate is connected with the lower substrate through the protrusions, the upper cover plate is provided with a light reflection hole matched with the BT substrate and used for light diffusion of the chip assembly, the diameter of the light reflection hole on the side close to the lower substrate is larger than that on the side far from the lower substrate, the first epoxy glue is arranged between the lower substrate and the upper cover plate, and the second epoxy glue is arranged on one side of the lower substrate and in the light reflection hole.

2. The assembly-type inverted bracket according to claim 1, wherein The upper cover plate is made of black plastic.

3. The assembly mountable inverted bracket of claim 1, wherein, The BT substrate is arranged in a rectangular shape.

4. The assembly mountable inverted bracket of claim 2, wherein, The diameter of the light reflection hole on the side far from the lower substrate is smaller than the side length of the BT substrate.

5. The assemblable inverted bracket of claim 1, wherein, A containing groove is arranged between two adjacent BT substrates.

6. The assemblable inverted bracket of claim 1, wherein, The thickness of the upper cover plate is 0.6 mm.

7. The assemblable inverted bracket of claim 1, wherein, The chip assembly is arranged in the middle part of the light reflection hole.

8. The assemblable inverted bracket of claim 1, wherein, The frame part is provided with three first positioning holes, the first positioning holes are arranged through the frame part, the upper cover plate is provided with three second positioning holes corresponding to the first positioning holes, the second positioning holes are arranged through the upper cover plate, the diameter of the first positioning hole is the same as that of the second positioning hole, and the central axes of the first positioning hole and the second positioning hole are on the same line.

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