Wafer particle processing screening device capable of collecting particles according to diameters
By designing a screening device with a multi-layer screening structure and a stable connection method, the problem that existing devices cannot meet the screening of different particle sizes has been solved, achieving efficient screening and stable collection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-04-03
AI Technical Summary
Existing screening devices for wafer particle processing can only be equipped with a single screen, which cannot meet the screening requirements for different particle sizes, resulting in increased operational complexity and time costs.
A screening device comprising a bearing sleeve, a vibrating motor, a rotating sleeve, and a rotating screw is designed. The vibrating motor drives the screening box to vibrate, and the rotating and fixing structure of the rotating sleeve and the rotating screw realizes multi-layer screening. The device is stabilized by limiting protrusions and buffer springs to prevent components from loosening and impurities from entering.
It achieves efficient separation based on particle diameter, improves screening effect and device stability, reduces operational complexity and the possibility of impurity contamination, and ensures the integrity and purity of the collected samples.
Smart Images
Figure CN224072588U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer particle processing technology, and in particular to a screening device for wafer particle processing that can collect particles according to their diameter. Background Technology
[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seed crystals, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon crystal ingot forms a silicon wafer, also known as a crystal. Wafer particles refer to defective or discarded wafers generated during the semiconductor manufacturing process due to various reasons.
[0003] An existing screening device for wafer particle processing can collect particles according to their diameter. Traditional screening devices for wafer particle processing may only be equipped with a single screen structure, which cannot meet the screening requirements of different particle sizes. This means that when processing wafer particles of various sizes, it may be necessary to change screens with different aperture sizes, which increases the complexity of operation and time cost. Utility Model Content
[0004] To solve the above-mentioned technical problems, this utility model provides a screening device for wafer particle processing that can collect particles according to their diameter.
[0005] This utility model is achieved by the following technical solution: a screening device for processing wafer particles that can be collected according to their diameter, including a bearing sleeve, a support frame fixedly connected to the inner wall of the bearing sleeve, a vibration motor fixedly connected to the top of the support frame, a limit protrusion fixedly connected to the top of the bearing sleeve, and a buffer spring fixedly connected to the top of the bearing sleeve.
[0006] A fixing plate is fixedly connected to the top of the buffer spring, an installation sleeve is fixedly connected to the top of the fixing plate, a rotating sleeve is fixedly connected to the top of the fixing plate, a rotating screw is threaded inside the rotating sleeve, a limit nut is threaded on the upper surface of the rotating screw, a collection box is inserted inside the installation sleeve, a screening box one is inserted into the top of the collection box, a screening box two is inserted into the top of the screening box one, a screening box three is inserted into the top of the screening box two, and a sealing top plate is inserted into the top of the screening box three.
[0007] With the above technical solution, the vibration motor is located inside the bearing sleeve and fixedly connected to the bottom of the fixed plate. When the vibration motor works, it will drive the entire fixed plate and its components to vibrate. This vibration will be transmitted to the screening box, so that the wafer particles will be vibrated and screened in the screening box. This is beneficial for the particles to be separated in different layers of screening boxes according to their diameter, thus improving the screening effect.
[0008] As a further improvement to the above solution, the number of the limiting protrusions and buffer springs is set to several, and the several limiting protrusions and buffer springs are symmetrically distributed around the bearing sleeve. The limiting protrusions are located at the bottom of the fixed plate, and the bottom of the collection box is in contact with the top surface of the fixed plate.
[0009] As a further improvement to the above solution, the vibration motor is located inside the bearing sleeve, and the vibration motor is fixedly connected to the bottom of the fixed plate.
[0010] As a further improvement to the above solution, the number of the rotating sleeve and rotating screw is set to two, and the two rotating sleeves and rotating screws are symmetrically distributed on the left and right sides with the fixed plate as the center.
[0011] As a further improvement to the above scheme, the rotating screw extends through the sealing top plate, screening box three, screening box two, screening box one and collection box into the interior of the rotating sleeve.
[0012] Through the above technical solution, the setting of the sealed top plate makes the entire screening and collection process in a relatively sealed environment, which helps to prevent the splashing and loss of wafer particles during the screening process, ensures the integrity of the collection, and also reduces the possibility of external impurities mixing in, thereby improving the purity of the collected wafer particles.
[0013] As a further improvement to the above scheme, the number of limiting nuts is set to two, and the two limiting nuts are symmetrically distributed on the left and right sides with the sealing top plate as the center.
[0014] As a further improvement to the above solution, the bottom of the limiting nut contacts the top surface of the sealing top plate, and the fixing plate is located at the top of the bearing sleeve.
[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0016] This invention features two rotating sleeves and rotating screws symmetrically distributed around a fixed plate. The rotating screws extend through the sealing top plate, screening box three, screening box two, screening box one, and collection box into the interior of the rotating sleeve. This rotating and fixing structure makes the connection between the various components more stable, effectively fixing the sealing top plate, screening box, and collection box together, preventing the components from loosening or separating during vibration, and ensuring the normal operation of the screening device.
[0017] This invention features limiting protrusions and buffer springs symmetrically distributed around the bearing sleeve. The limiting protrusions are located at the bottom of the fixed plate. During vibration, the limiting protrusions can restrict the displacement of the fixed plate, preventing excessive shaking that could affect the accuracy of screening. At the same time, the buffer springs can absorb some of the energy during vibration, playing a buffering role and reducing the impact of vibration on the entire device structure, thus improving the stability and service life of the device. The limiting nuts are symmetrically distributed around the sealing top plate, ensuring more uniform force distribution when fixing and connecting various components. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0019] Figure 2 This is a schematic diagram of the anatomical structure of the present invention;
[0020] Figure 3 This is a schematic diagram of the structure of this utility model from below;
[0021] Figure 4 This is a schematic diagram of the disassembled structure of the bearing sleeve of this utility model;
[0022] Figure 5 This is a schematic diagram of the right-side structure of this utility model.
[0023] Explanation of key symbols:
[0024] 1. Bearing sleeve; 2. Support frame; 3. Vibration motor; 4. Limiting protrusion; 5. Buffer spring; 6. Fixing plate; 7. Mounting sleeve; 8. Rotating sleeve; 9. Rotating screw; 10. Limiting nut; 11. Collection box; 12. Screening box one; 13. Screening box two; 14. Screening box three; 15. Sealing top plate. Detailed Implementation
[0025] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0026] Example:
[0027] Please combine Figure 1-5 The present embodiment of a screening device for processing wafer particles that can be collected according to diameter includes a bearing sleeve 1, a support frame 2 fixedly connected to the inner wall of the bearing sleeve 1, a vibration motor 3 fixedly connected to the top of the support frame 2, a limit protrusion 4 fixedly connected to the top of the bearing sleeve 1, and a buffer spring 5 fixedly connected to the top of the bearing sleeve 1.
[0028] A fixing plate 6 is fixedly connected to the top of the buffer spring 5. A mounting sleeve 7 is fixedly connected to the top of the fixing plate 6. A rotating sleeve 8 is fixedly connected to the top of the fixing plate 6. A rotating screw 9 is threadedly connected inside the rotating sleeve 8. A limit nut 10 is threadedly connected to the upper surface of the rotating screw 9. A collection box 11 is inserted inside the mounting sleeve 7. A screening box one 12 is inserted into the top of the collection box 11. A screening box two 13 is inserted into the top of the screening box one 12. A screening box three 14 is inserted into the top of the screening box two 13. A limit nut 10 is inserted into the top of the screening box three 14. The sealing top plate 15 is equipped with two rotating sleeves 8 and two rotating screws 9, which are symmetrically distributed on the left and right sides with the fixed plate 6 as the center. The rotating screws 9 extend through the sealing top plate 15, screening box 3 14, screening box 2 13, screening box 1 12 and collection box 11 into the interior of the rotating sleeve 8. This rotating fixing structure makes the connection between the various components more stable and can effectively fix the sealing top plate 15, screening box and collection box 11 together, preventing the components from loosening or separating during vibration and ensuring the normal operation of the screening device.
[0029] The vibration motor 3 is located inside the bearing sleeve 1 and is fixedly connected to the bottom of the fixed plate 6. When the vibration motor 3 works, it will drive the entire fixed plate 6 and its components to vibrate. This vibration will be transmitted to the screening box, so that the wafer particles will be vibrated and screened in the screening box. This is beneficial for the particles to be separated in different layers of screening boxes according to their diameter, thus improving the screening effect.
[0030] The number of limiting protrusions 4 and buffer springs 5 is set to several. The several limiting protrusions 4 and buffer springs 5 are symmetrically distributed around the bearing sleeve 1. The limiting protrusions 4 are located at the bottom of the fixing plate 6, and the bottom of the collection box 11 is in contact with the top surface of the fixing plate 6.
[0031] The vibration motor 3 is located inside the bearing sleeve 1 and is fixedly connected to the bottom of the fixed plate 6.
[0032] The number of rotating sleeves 8 and rotating screws 9 is set to two, and the two rotating sleeves 8 and rotating screws 9 are symmetrically distributed on the left and right sides with the fixed plate 6 as the center.
[0033] The rotating screw 9 extends through the sealing top plate 15, screening box three 14, screening box two 13, screening box one 12 and collection box 11 into the interior of the rotating sleeve 8.
[0034] The sealing top plate 15 ensures that the entire screening and collection process is in a relatively sealed environment, which helps prevent the splashing and loss of wafer particles during screening, ensuring the integrity of the collection, while also reducing the possibility of external impurities entering and improving the purity of the collected wafer particles.
[0035] Two limit nuts 10 are provided, symmetrically distributed around the sealing top plate 15. Limiting protrusions 4 and buffer springs 5 are symmetrically distributed around the bearing sleeve 1. The limiting protrusions 4 are located at the bottom of the fixed plate 6. During vibration, the limiting protrusions 4 can limit the displacement of the fixed plate 6 to prevent excessive shaking and affect the accuracy of screening. At the same time, the buffer springs 5 can absorb some of the energy during vibration, playing a buffering role, reducing the impact of vibration on the entire device structure, and improving the stability and service life of the device. The symmetrical distribution of the limit nuts 10 around the sealing top plate 15 makes the force more uniform when fixing and connecting various components.
[0036] The bottom of the limiting nut 10 contacts the top surface of the sealing top plate 15, and the fixing plate 6 is located on the top of the bearing sleeve 1.
[0037] The implementation principle of a wafer particle screening device that can collect particles according to their diameter in this embodiment is as follows: Two rotating sleeves 8 and two rotating screws 9 are symmetrically distributed around a fixed plate 6. The rotating screws 9 extend through the sealing top plate 15, screening boxes 14, 13, 12, and collection box 11 into the interior of the rotating sleeve 8. This rotating and fixing structure makes the connection between the components more stable, effectively fixing the sealing top plate 15, screening boxes, and collection box 11 together, preventing loosening or separation of components during vibration, and ensuring the screening process is successful. The normal operation of the device is achieved by setting limiting protrusions 4 and buffer springs 5 symmetrically distributed around the bearing sleeve 1. The limiting protrusions 4 are located at the bottom of the fixed plate 6. During vibration, the limiting protrusions 4 can limit the displacement of the fixed plate 6 to prevent it from shaking excessively and affecting the accuracy of screening. At the same time, the buffer springs 5 can absorb some of the energy during vibration, playing a buffering role, reducing the impact of vibration on the entire device structure, and improving the stability and service life of the device. The two limiting nuts 10 are symmetrically distributed around the sealing top plate 15, making the force more uniform when fixing and connecting various components.
[0038] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.
Claims
1. A screening device for processing wafer particles that can be collected according to their diameter, characterized in that, Includes a bearing sleeve (1), a support frame (2) is fixedly connected to the inner wall of the bearing sleeve (1), a vibration motor (3) is fixedly connected to the top of the support frame (2), a limit protrusion (4) is fixedly connected to the top of the bearing sleeve (1), and a buffer spring (5) is fixedly connected to the top of the bearing sleeve (1). A fixing plate (6) is fixedly connected to the top of the buffer spring (5), an installation sleeve (7) is fixedly connected to the top of the fixing plate (6), a rotating sleeve (8) is fixedly connected to the top of the fixing plate (6), a rotating screw (9) is threadedly connected to the inside of the rotating sleeve (8), a limit nut (10) is threadedly connected to the upper surface of the rotating screw (9), a collection box (11) is inserted inside the installation sleeve (7), a screening box one (12) is inserted to the top of the collection box (11), a screening box two (13) is inserted to the top of the screening box one (12), a screening box three (14) is inserted to the top of the screening box two (13), and a sealing top plate (15) is inserted to the top of the screening box three (14).
2. The screening device for processing wafer particles that can be collected according to diameter size as described in claim 1, characterized in that: The number of the limiting protrusions (4) and buffer springs (5) is set to several. The several limiting protrusions (4) and buffer springs (5) are symmetrically distributed around the bearing sleeve (1). The limiting protrusions (4) are located at the bottom of the fixing plate (6). The bottom of the collection box (11) is in contact with the top surface of the fixing plate (6).
3. The screening device for wafer particle processing that can collect particles according to their diameter as described in claim 1, characterized in that: The vibration motor (3) is located inside the bearing sleeve (1) and is fixedly connected to the bottom of the fixing plate (6).
4. The screening device for processing wafer particles that can be collected according to diameter size as described in claim 3, characterized in that: The number of the rotating sleeve (8) and rotating screw (9) is set to two, and the two rotating sleeves (8) and rotating screws (9) are symmetrically distributed on the left and right sides with the fixed plate (6) as the center.
5. A screening device for processing wafer particles that can be collected according to diameter, as described in claim 1, characterized in that: The rotating screw (9) extends through the sealing top plate (15), screening box three (14), screening box two (13), screening box one (12) and collection box (11) into the interior of the rotating sleeve (8).
6. A screening device for processing wafer particles that can be collected according to diameter, as described in claim 5, characterized in that: The number of the limiting nuts (10) is set to two, and the two limiting nuts (10) are symmetrically distributed on the left and right sides with the sealing top plate (15) as the center.
7. A screening device for processing wafer particles that can be collected according to diameter, as described in claim 6, characterized in that: The bottom of the limiting nut (10) is in contact with the top surface of the sealing top plate (15), and the fixing plate (6) is located at the top of the bearing sleeve (1).