Non-contact cleaning device for electrode of reduction furnace

Abstract

The utility model provides a non-contact cleaning device for electrodes of a reduction furnace, and relates to the field of dust removal of reduction furnaces. The device is used for cleaning an electrode on a base plate, and the base plate is in a circular ring shape and comprises a guide rail, a rotating frame and a laser silicon removal structure. The guide rail is in a circular ring shape, extends in the circumferential direction of the base plate and is used for being detachably connected with the base plate. The rotating frame comprises a middle connecting plate and two rotating plates, and the two rotating plates are oppositely arranged in a spaced mode and connected through the middle connecting plate. The middle connecting plate is in sliding fit with the two rotating plates and can longitudinally move along the two rotating plates; the two rotating plates are matched with the guide rails and can rotate along the guide rails; and the laser silicon removal structure is arranged on the middle connecting plate. Non-contact and rapid laser silicon layer removal of the electrode of the polycrystalline silicon reduction furnace can be realized, so that the surface treatment uniformity of the electrode is good, and the silicon layer removal quality is improved.

Description

Technical Field

[0001] This utility model relates to the field of dust removal in reduction furnaces, and more specifically, to a non-contact cleaning device for electrodes in reduction furnaces. Background Technology

[0002] The modified Siemens process is the mainstream technology for producing polycrystalline silicon internationally. Its core equipment is the reduction furnace. The working principle of the reduction furnace is to react a mixture of trichlorosilane and hydrogen gas with a high-temperature silicon core through an electric current to generate polycrystalline silicon, which is then deposited on the silicon core. The reactants enter the reduction furnace from the bottom plate, and the reaction inside the furnace uses the silicon core at around 1050°C as a carrier to undergo chemical vapor deposition on the surface, generating polycrystalline silicon rods.

[0003] During the production process, a hard scale layer continuously forms on the electrodes and chassis, which seriously affects the insulation performance of the reduction furnace. At the same time, the reflection efficiency of the furnace's reflective surface decreases, affecting its energy consumption index and seriously impacting product quality. Therefore, the scale layer must be cleaned in a timely manner.

[0004] Currently, the main method for removing the scale layer is by having operators use sandpaper or hand-held polishing tools to remove the silicon layer. However, this cleaning method is inefficient, ineffective, poses a health threat to operators, and affects product quality. Utility Model Content

[0005] The purpose of this invention is to provide a non-contact cleaning device for reduction furnace electrodes, which can achieve non-contact and rapid laser removal of silicon layer from polycrystalline silicon reduction furnace electrodes, resulting in good uniformity of electrode surface treatment and improved quality of the removed silicon layer.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0007] A contactless electrode cleaning device for a reduction furnace is provided for cleaning electrodes on a chassis. The chassis is annular and includes a guide rail, a rotating frame, and a laser silicon removal structure. The guide rail is annular and extends circumferentially along the chassis. The guide rail is detachably connected to the chassis.

[0008] The rotating frame includes a central connecting plate and two rotating plates, which are arranged at intervals relative to each other and connected by the central connecting plate; the central connecting plate is slidably engaged with the two rotating plates and can move longitudinally along the two rotating plates; both rotating plates are engaged with the guide rail and can rotate along the guide rail.

[0009] The laser silicon removal structure is mounted on the central connecting plate.

[0010] Furthermore, in this utility model, the guide rail includes a gear ring and multiple fixing plates, the multiple fixing plates are arranged circumferentially along the gear ring, and the gear ring is detachably connected to the chassis through the multiple fixing plates.

[0011] Furthermore, in this utility model, the rotating plate is sleeved on the gear ring, and the rotating plate is provided with a first gear that meshes with the gear ring;

[0012] At least one of the rotating plates is provided with a rotation drive for driving the first gear to rotate.

[0013] Furthermore, in this utility model, a rack is provided on one side of the rotating plate along its longitudinal direction, and a second gear that meshes with the rack is provided at both ends of the middle connecting plate;

[0014] At least one end of the central connecting plate is provided with a longitudinal driving member, which is used to drive the second gear to rotate.

[0015] Furthermore, in this utility model, the two ends of the central connecting plate are provided with sliders; one side of the rotating plate is provided with a groove along its longitudinal direction that cooperates with the sliders; the top of the groove is provided with a high limit stop, and the bottom of the groove is provided with a low limit stop.

[0016] Furthermore, in this utility model, the central connecting plate is provided with a slide rail along its transverse direction; the laser silicon removal structure is slidably connected to the slide rail via a guide block, and the guide block is locked to the slide rail by a locking member.

[0017] Furthermore, in this utility model, the laser silicon removal structure includes an infrared locator and a laser, the infrared locator being fixedly connected to the guide block; the laser is connected to one side of the infrared locator via a folding arm.

[0018] Furthermore, this utility model also includes a dust-collecting structure, which is disposed on the central connecting plate.

[0019] Furthermore, in this utility model, the dust collection structure includes a dust collection pump body and a dust collection pipe. One end of the dust collection pipe passes through the middle connecting plate and extends downward with multiple branch pipes. The other end of the dust collection pipe is connected to the dust collection pump body.

[0020] Furthermore, in this utility model, the bottom of the guide rail is provided with multiple horizontal feet, and the horizontal feet are provided with a first horizontal ruler; the middle connecting plate is provided with a second horizontal ruler.

[0021] This utility model has at least the following advantages or beneficial effects:

[0022] This invention utilizes a guide rail, a rotating frame, and a laser silicon removal structure. The guide rail is designed as a ring extending circumferentially along the chassis, allowing for easy installation. The rotating frame includes a central connecting plate and two rotating plates spaced apart. The laser silicon removal structure is connected to the central connecting plate, facilitating silicon removal operations on the chassis and electrodes. The central connecting plate slides along the two rotating plates and can move longitudinally, enabling the laser silicon removal structure to thoroughly remove silicon along the electrode height. Both rotating plates engage with the guide rail and rotate along it, allowing the laser silicon removal structure to rotate to a predetermined position for silicon removal, achieving efficient and rapid laser silicon removal. This application enables non-contact, rapid laser silicon removal of the polycrystalline silicon reduction furnace electrodes. The use of laser silicon removal results in good surface uniformity of the electrodes, improving the quality of the silicon removal layer. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the overall structure of the non-contact cleaning device for the electrodes of the reduction furnace provided in the application embodiment;

[0025] Figure 2 A schematic diagram of the structure of the middle connecting plate provided in the application embodiment;

[0026] Figure 3 A partial structural cross-sectional view of the rotating plate provided in the embodiment of the application;

[0027] Figure 4 A front view of the rotating plate provided in the embodiment of the application.

[0028] Reference numerals: 1-Chassis, 2-Guide rail, 21-Gear ring, 22-Fixing plate, 23-Horizontal foot, 24-First horizontal ruler, 3-Rotating frame, 31-Rotating plate, 311-Drive slot, 312-Rack, 313-Slide groove, 314-Motor clearance slot, 315-High limit stop, 316-Low limit stop, 317-First gear, 32-Middle connecting plate, 321-Slider, 322-Second horizontal ruler, 323-Second gear, 324-Slide rail, 325-Guide block, 4-Laser silicon removal structure, 41-Infrared locator, 42-Laser, 43-Folding arm, 5-Dust suction structure, 51-Dust suction pipe, 52-Branch pipe. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0031] The inventors analyzed existing technologies and found that current methods primarily rely on operators using sandpaper or hand-held polishing tools to remove the silicon layer. However, this approach results in uncontrollable precision in removing the silicon layer and polishing the surfaces of the electrodes, magnetic rings, and furnace bottom of the reduction furnace. This affects the installation of silicon cores in subsequent batches, impacting not only the verticality of the silicon cores but also potentially causing furnace collapse during silicon rod growth due to insufficient polishing precision. Furthermore, manual polishing exposes operators to dust and toxic substances that can harm them; additionally, manual operation is inefficient, and the polishing force is difficult to control, easily damaging the electrode heads and causing problems with the graphite base installation. Example

[0032] Please refer to Figures 1-4 The figure shown is a schematic diagram of the non-contact cleaning device for the electrode of the reduction furnace in this embodiment of the present invention.

[0033] This embodiment provides a non-contact electrode cleaning device for a reduction furnace, used to clean the electrodes on a chassis 1. The chassis 1 is annular and includes a guide rail 2, a rotating frame 3, and a laser silicon removal structure 4. The guide rail 2 is annular and extends along the circumference of the chassis 1. The guide rail 2 is used for detachable connection with the chassis 1.

[0034] The rotating frame 3 includes a central connecting plate 32 and two rotating plates 31. The two rotating plates 31 are arranged at intervals relative to each other and are connected by the central connecting plate 32. The central connecting plate 32 is slidably engaged with the two rotating plates 31 and can move longitudinally along the two rotating plates 31. Both rotating plates 31 are engaged with the guide rail 2 and can rotate along the guide rail 2.

[0035] The laser silicon removal structure 4 is mounted on the central connecting plate 32.

[0036] The following will further describe a contactless cleaning device for reduction furnace electrodes according to this exemplary embodiment.

[0037] In some embodiments of this application, reference is made to Figure 1 The aforementioned chassis 1 is annular and serves as the reduction furnace chassis 1, connected to the bottom of the reduction furnace. Electrodes are mounted on chassis 1. The aforementioned guide rail 2 is annular and extends circumferentially along chassis 1. Guide rail 2 is used for detachable connection with chassis 1, so that when silicon removal is required, the cleaning device can be installed on the reduction furnace chassis 1, and removed after cleaning without affecting the use of the reduction furnace.

[0038] In a preferred embodiment, the guide rail 2 is provided with multiple level feet 23 at its bottom, and a first level ruler 24 is provided on each level foot 23; a second level ruler 322 is provided on the middle connecting plate 32. By providing level feet 23 and level rulers, the balance of the entire device can be adjusted during installation by adjusting the adjustment knobs on the level feet 23. The first level ruler 24 and the second level ruler 322 are used to determine and adjust the device to a level state. At least three level feet 23 are provided to improve stability and accuracy.

[0039] In a preferred embodiment, the guide rail 2 includes a gear ring 21 and multiple fixing plates 22. The fixing plates 22 are arranged circumferentially along the gear ring 21, and the gear ring 21 is detachably connected to the chassis 1 via the fixing plates 22. The fixing plates 22 are L-shaped, with the longitudinal plates of the fixing plates 22 fixedly connected to the outer wall of the gear ring 21, and the transverse plates of the fixing plates 22 detachably connected to the chassis 1 via bolts or other fasteners. Specifically, the fixing plates 22 have fixing holes. After leveling, the chassis 1 is fixed by inserting bolts or other fasteners. After the laser silicon removal layer is completed, the operator removes the bolts fixing the fixing plates 22 to the chassis 1, and the entire device can be removed.

[0040] In some embodiments of this application, reference is made to Figure 1 The aforementioned rotating frame 3 includes a central connecting plate 32 and two rotating plates 31. The two rotating plates 31 are arranged at intervals relative to each other and connected by the central connecting plate 32, forming a U-shaped structure. The laser silicon removal structure 4 is mounted on the central connecting plate 32 and can be positioned opposite the electrode to perform silicon removal operations. The central connecting plate 32 slides with the two rotating plates 31 and can move longitudinally along the two rotating plates 31, allowing the laser silicon removal structure 4 to move up and down according to the height of the electrode for thorough and efficient laser silicon removal. Both rotating plates 31 are engaged with the guide rail 2 and can rotate along the guide rail 2, allowing the laser silicon removal structure 4 to rotate along a preset trajectory to a designated position for laser silicon removal, achieving efficient and non-contact laser silicon removal.

[0041] As a preferred implementation method, refer to Figure 3 The aforementioned rotating plate 31 is sleeved on the gear ring 21, and the rotating plate 31 is provided with a first gear 317 that meshes with the gear ring 21. Preferably, a drive groove 311 is formed on the outer bottom of the aforementioned rotating plate 31, and the first gear 317 is rotatably disposed in the drive groove 311. The drive groove 311 is engaged with the gear ring 21, and the inner side of the gear ring 21 is provided with teeth that mesh with the first gear 317. There is a certain gap between the aforementioned gear ring 21 and the chassis 1 so that the bottom of the rotating plate 31 can be engaged in the gap.

[0042] At least one of the rotating plates 31 is equipped with a rotary drive component to drive the first gear 317 to rotate. This drive component can be a motor mounted on the rotating plate 31, with its output shaft connected to the first gear 317. The rotation of the first gear 317 applies a driving force to the gear ring 21. Since the gear ring 21 is fixed, it applies a reaction driving force to the first gear 317, thus driving the first gear 317 to rotate circumferentially along the gear ring 21. Alternatively, the rotary drive component can be installed on both rotating plates 31, with both drives operating simultaneously to drive the two rotating plates 31 to rotate synchronously. The rotating plates 31 rotate circumferentially along the chassis 1, causing the connected central connecting plate 32 to rotate, thereby rotating the laser silicon removal structure 4. This allows the laser silicon removal structure 4 to rotate to a designated position along a pre-set trajectory for laser silicon removal, achieving multi-point laser silicon removal operation over a large area.

[0043] As a preferred implementation method, refer to Figure 4 A rack 312 is longitudinally arranged on one side of the rotating plate 31, and a second gear 323 meshing with the rack 312 is respectively arranged at both ends of the middle connecting plate 32. At least one end of the middle connecting plate 32 is provided with a longitudinal driving member, which drives the second gear 323 to rotate. The longitudinal driving member can be a motor, which drives the second gear 323 to rotate. The rotation of the second gear 323 applies a driving force to the rack 312. Since the rack 312 is fixed on the rotating plate 31, the rack 312 will give the second gear 323 a reaction driving force, thereby driving the second gear 323 to move the middle connecting plate 32 up and down along the rack 312, realizing the lifting and lowering of the laser silicon removal structure 4. This allows the laser silicon removal structure 4 to perform laser silicon removal operation on the electrode along its axial direction according to the height of the electrode, and can fully remove silicon from both the electrode and the chassis 1, improving the silicon removal effect and efficiency.

[0044] In a preferred embodiment, the central connecting plate 32 has sliders 321 at both ends; one side of the rotating plate 31 has a groove 313 along its longitudinal direction that cooperates with the sliders 321. By setting the sliders 321 and the grooves 313 to cooperate, the vertical movement of the central connecting plate 32 can be guided, ensuring its stability during vertical movement. Preferably, the rack 312 and the grooves 313 are both located on opposite sides of the two rotating plates 31, with the rack 312 and the grooves 313 spaced apart.

[0045] The top of the aforementioned chute 313 is equipped with a high limit stop 315, and the bottom of the chute 313 is equipped with a low limit stop 316, which can limit the vertical movement of the laser silicon removal structure 4. Specifically, when the laser silicon removal structure 4 moves downward to remove the silicon layer, the slider 321 touches the low limit stop 316, the laser silicon removal is completed, and the slider 321 drives the laser silicon removal structure 4 to rise, stopping when it reaches the high limit stop 315. Both the low limit stop 316 and the high limit stop 315 can be adjusted according to the height of the reduction furnace electrode, and the adjustment method and structure can adopt any adjustable structure available in the prior art.

[0046] In a preferred embodiment, the aforementioned groove 313 is disposed on one side of the rack 312, and a motor clearance groove 314 is also provided on the other side of the rack 312 to allow the motor installed at the end of the central connecting plate 32 to pass through, thereby preventing interference and mutual obstruction between the slider 321, the motor, and the second gear 323. Alternatively, two racks 312 can be provided, spaced apart on both sides of the motor clearance groove 314. The motor is connected to two second gears 323 via a dual-shaft reducer, and the two second gears 323 mesh with the two racks 312 respectively.

[0047] As a preferred implementation method, refer to Figure 2 The aforementioned central connecting plate 32 is provided with a slide rail 324 along its transverse direction. The laser silicon removal structure 4 is slidably engaged with the slide rail 324 via a guide block 325, and the guide block 325 is locked to the slide rail 324 by a locking member. This facilitates adjustment of the position of the laser silicon removal structure 4 on the central connecting plate 32 and increases the silicon removal range, resulting in more comprehensive silicon removal. After adjustment to a suitable position, the guide block 325 can be locked and fixed to the slide rail 324 by inserting locking bolts or other locking members to prevent slippage during silicon removal.

[0048] As a preferred implementation method, refer to Figure 2The aforementioned laser silicon removal structure 4 includes an infrared positioner 41 and a laser 42. The infrared positioner 41 is fixedly connected to the guide block 325; the laser 42 is connected to one side of the infrared positioner 41 via a folding arm 43. During laser silicon removal, the infrared positioner 41 emits infrared light to accurately position the electrode to be removed, and the laser emitted by the laser 42 is adjusted to the positioning position via the folding arm 43 to start the device for laser silicon removal.

[0049] It's important to note that the principle of laser silicon removal mainly involves two aspects. From an optical perspective, as a monochromatic light, the wavelength of a laser determines its interaction with the material. When a laser beam irradiates a silicon layer, energy is divided into absorption, reflection, and scattering. Among these, the absorbed energy is the key factor determining the removal efficiency. Silicon selectively absorbs specific wavelengths of laser light because the vibrational frequency of electrons within the silicon material matches the laser frequency, inducing a resonance phenomenon. This resonance causes silicon atoms to absorb sufficient energy, rapidly increasing their temperature and ultimately leading to the vaporization or sublimation of the silicon layer. To optimize this process, laser wavelengths with high absorption coefficients for silicon and low absorption for electrode materials are typically selected. For example, using ultraviolet lasers (such as the 248nm or 193nm wavelengths generated by an excimer laser) can effectively reduce damage to the substrate material while efficiently removing the silicon layer.

[0050] From a mechanical perspective, when the laser pulse energy density is sufficiently high, the silicon layer rapidly heats up and undergoes localized vaporization. Simultaneously, because the laser pulse duration is extremely short, the heat does not have time to conduct to the electrode material, thus avoiding damage to the electrode. This step involves controlling the laser parameters so that the laser energy density is just sufficient to remove the silicon layer without damaging the electrode. This is because the silicon layer and the electrode have different vaporization temperatures; the laser can selectively vaporize the silicon layer, creating cavities on the electrode surface. The subsequent explosion effect caused by air entering these cavities helps separate the silicon layer and the electrode.

[0051] In summary, by utilizing laser silicon removal layers and precisely controlling the energy and parameters of the laser, combined with the structural design of this device, a highly efficient and non-destructive cleaning effect on the electrodes of the reduction furnace is achieved.

[0052] In some embodiments of this application, reference is made to Figure 2 The device also includes a dust suction structure 5, which is located on the central connecting plate 32 to collect and process the explosive dust during the cleaning of the silicon layer, thus preventing dust from splashing and causing damage.

[0053] In a preferred embodiment, the aforementioned dust collection structure 5 includes a dust collection pump body and a dust collection pipe 51. One end of the dust collection pipe 51 passes through the central connecting plate 32 and extends downwards with multiple branch pipes 52. The other end of the dust collection pipe 51 is connected to the dust collection pump body. The dust collection pump body generates suction, and through the dust collection pipe 51 and the two downwardly extending branch pipes 52, it can quickly suck in and collect the minute amounts of dust generated during the silicon removal process, preventing dust splashing from affecting the equipment and personnel.

[0054] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A non-contact cleaning device for reducing electrodes, for cleaning electrodes on a base plate, the base plate being circular ring-shaped, characterized in that, The device comprises a guide rail, a rotating frame and a laser silicon removal structure; the guide rail is circular and extends along the circumference of the base plate, and is used for detachable connection with the base plate; the rotating frame comprises a middle connecting plate and two rotating plates, the two rotating plates are oppositely spaced and connected through the middle connecting plate; the middle connecting plate is in sliding fit with the two rotating plates and can move longitudinally along the two rotating plates; the two rotating plates are in fit with the guide rail and can rotate along the guide rail; the laser silicon removal structure is arranged on the middle connecting plate.

2. The non-contact cleaning apparatus for reducing furnace electrodes according to claim 1, characterized by, The guide rail comprises a gear ring and a plurality of fixing plates, the plurality of fixing plates are arranged along the circumference of the gear ring, and the gear ring is detachably connected with the base plate through the plurality of fixing plates.

3. The non-contact cleaning apparatus for reducing furnace electrodes according to claim 2, characterized by, The rotating plate is sleeved on the gear ring, and the rotating plate is provided with a first gear in mesh with the gear ring; At least one of the rotating plates is provided with a rotation driving member for driving the first gear to rotate.

4. The non-contact cleaning apparatus for reducing furnace electrodes according to claim 1, characterized by One side of the rotating plate is provided with a rack along the longitudinal direction thereof, and both ends of the middle connecting plate are respectively provided with a second gear in mesh with the rack; At least one end of the middle connecting plate is provided with a longitudinal driving member for driving the second gear to rotate.

5. The non-contact cleaning apparatus for reducing furnace electrodes according to claim 4, characterized by Both ends of the middle connecting plate are provided with sliding blocks; one side of the rotating plate is provided with a sliding groove in fit with the sliding blocks along the longitudinal direction thereof; the top of the sliding groove is provided with a high limiting block, and the bottom of the sliding groove is provided with a low limiting block.

6. The non-contact cleaning apparatus for reducing furnace electrodes according to claim 1, characterized by The middle connecting plate is provided with a sliding rail along the transverse direction thereof; the laser silicon removal structure is in sliding connection with the sliding rail through a guide block, and the guide block is locked to the sliding rail through a locking member.

7. The non-contact cleaning apparatus for reducing furnace electrodes according to claim 6, characterized by The laser silicon removal structure comprises an infrared positioner and a laser, the infrared positioner is fixedly connected with the guide block; the laser is connected to one side of the infrared positioner through a folding arm.

8. The non-contact cleaning apparatus for reducing furnace electrodes according to any one of claims 1 to 7, characterized by Further comprising a dust suction structure, the dust suction structure is arranged on the middle connecting plate.

9. The non-contact cleaning apparatus for reducing furnace electrodes according to claim 8, characterized by The dust suction structure comprises a dust suction pump body and a dust suction pipe, one end of the dust suction pipe is arranged in the middle connecting plate and extends downwardly to have a plurality of branch pipes, and the other end of the dust suction pipe is connected with the dust suction pump body.

10. The non-contact cleaning apparatus for reducing furnace electrodes according to claim 1, characterized by The bottom of the guide rail is provided with a plurality of horizontal feet, and the horizontal feet are provided with a first horizontal ruler; the middle connecting plate is provided with a second horizontal ruler. The bottom of the guide rail is provided with a plurality of horizontal feet, and the horizontal feet are provided with a first horizontal ruler; the middle connecting plate is provided with a second horizontal ruler.

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