Polishing pad for thinning processing of glass substrate

Abstract

The utility model discloses a polishing pad for thinning processing of a glass substrate, which comprises a bonding layer, a buffer layer is arranged on the lower surface of the bonding layer, a polishing layer is arranged on the lower surface of the buffer layer, the bonding layer comprises an interface layer, a conductive layer and a temperature-resistant layer, the interface layer is made of epoxy resin, the conductive layer is made of epoxy resin, and the temperature-resistant layer is made of epoxy resin. The conductive layer is made of a silver nanowire film, the temperature-resistant layer is made of polyimide, the interface layer is located above the conductive layer, the temperature-resistant layer is located below the conductive layer, the upper surface of the conductive layer is attached to the lower surface of the interface layer, and the lower surface of the conductive layer is attached to the upper surface of the temperature-resistant layer. According to the polishing pad, the silver nanowire film capable of conducting electricity is arranged in the bonding layer of the polishing pad to serve as the conducting layer, the temperature-resistant layer is arranged below the conducting layer, the conducting layer can lead out electrostatic charges to avoid adsorbing chippings, the temperature-resistant layer can enable the polishing pad to endure high temperature generated in the polishing process for a long time, and the functions of the polishing pad are more comprehensive.

Description

Technical Field

[0001] This utility model relates to the field of glass substrate polishing technology, and in particular to a polishing pad for glass substrate thinning. Background Technology

[0002] Existing polishing pads for glass substrate thinning are prone to attracting debris during use and cannot withstand high temperatures. The high temperatures generated after prolonged use can easily damage the polishing pads, and the polishing pads are not comprehensive enough.

[0003] A Chinese patent discloses a "2.5D glass-metal grinding and polishing pad" (application number CN202022987466.9). When a polishing base plate is fixed to a driving device, the glass to be polished is placed at the bottom of the polishing pad and pressed against it until the adjusting column and spring within the groove are squeezed. The spring compresses, causing a localized indentation in the polishing pad, while the un-indented portion of the pad fully adheres to the glass edge. This achieves more precise and efficient polishing, significantly improving the device's ability to polish curved glass edges, making it more suitable for polishing 2.5D glass. However, this polishing pad easily attracts debris during use and has insufficient temperature resistance; the high temperatures generated after use can easily damage it, indicating insufficient functionality. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide a polishing pad for glass substrate thinning. A conductive silver nanowire film is disposed inside the adhesive layer of the polishing pad as a conductive layer, and a heat-resistant layer is disposed below the conductive layer. The conductive layer can discharge electrostatic charges to avoid attracting debris, and the heat-resistant layer allows the polishing pad to withstand the high temperatures generated during the polishing process for a long time, making the polishing pad more functional. Both the elastic layer and the polishing layer of the polishing pad adopt a multi-layer composite structure, which improves the polishing ability and structural durability of the polishing pad, ensuring polishing quality and making it more comfortable to use.

[0005] This utility model also provides a polishing pad for glass substrate thinning processing as described above, comprising: an adhesive layer, a buffer layer disposed on the lower surface of the adhesive layer, a polishing layer disposed on the lower surface of the buffer layer, the adhesive layer comprising an interface layer, a conductive layer and a heat-resistant layer, the interface layer being made of epoxy resin, the conductive layer being made of silver nanowire film, the heat-resistant layer being made of polyimide, the interface layer being located above the conductive layer, the heat-resistant layer being located below the conductive layer, the upper surface of the conductive layer being bonded to the lower surface of the interface layer, and the lower surface of the conductive layer being bonded to the upper surface of the heat-resistant layer.

[0006] According to the present invention, a polishing pad for thinning glass substrates has an upper surface of a buffer layer that adheres to the lower surface of an adhesive layer, resulting in a compact and tight structure for the polishing pad. The lower surface of the buffer layer adheres to the upper surface of the polishing layer, further enhancing the compact and tight structure of the polishing pad.

[0007] According to the present invention, a polishing pad for thinning glass substrates includes a buffer layer comprising an elastic layer, a support layer, and an anti-fatigue layer. This facilitates compensation for micro-undulations in the substrate.

[0008] According to the present invention, a polishing pad for thinning glass substrates includes an elastic layer located above a support layer, resulting in a rational structure for the polishing pad. An anti-fatigue layer is located below the support layer, further contributing to the rational structure of the polishing pad. The upper surface of the support layer is in contact with the lower surface of the elastic layer, ensuring a compact and tight structure for the polishing pad. Similarly, the lower surface of the support layer is in contact with the upper surface of the anti-fatigue layer, also contributing to a compact and tight structure for the polishing pad.

[0009] A polishing pad for thinning glass substrates according to this utility model includes a polishing layer comprising a reinforcing layer, a grinding layer, and an ultra-thin coating. This facilitates the fine polishing of glass substrates.

[0010] According to the present invention, a polishing pad for thinning glass substrates comprises a reinforcing layer located above a grinding layer, resulting in a rational structure for the polishing pad. An ultra-thin coating layer is located below the grinding layer, further contributing to the rational structure of the polishing pad. The upper surface of the grinding layer is in contact with the lower surface of the reinforcing layer, resulting in a compact and tight structure for the polishing pad. Similarly, the lower surface of the grinding layer is in contact with the upper surface of the ultra-thin coating layer, also contributing to the compact and tight structure of the polishing pad.

[0011] According to the present invention, a polishing pad for thinning glass substrates comprises an elastic layer made of silicone rubber, a support layer made of polyurethane foam, and an anti-fatigue layer made of aramid fiber. This improves the structural durability of the polishing pad.

[0012] According to the present invention, a polishing pad for thinning glass substrates is provided, wherein the reinforcing layer is made of glass fiber, the abrasive layer is made of nano-cerium oxide, and the ultra-thin coating is made of polytetrafluoroethylene. This improves the polishing ability of the polishing pad.

[0013] Beneficial effects:

[0014] 1. Compared with the prior art, the polishing pad for glass substrate thinning process has a conductive silver nanowire film inside the adhesive layer of the polishing pad as a conductive layer, and a heat-resistant layer is provided below the conductive layer. The conductive layer can discharge electrostatic charge to avoid adsorbing debris, and the heat-resistant layer can make the polishing pad withstand the high temperature generated during the polishing process for a long time, making the polishing pad more comprehensive in function.

[0015] 2. Compared with the prior art, the polishing pad for thinning glass substrates adopts a multi-layer composite structure for both the elastic layer and the polishing layer, which improves the polishing ability and structural durability of the polishing pad, ensures the polishing quality, and makes it more comfortable to use. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 This is an exploded view of the polishing pad for thinning glass substrates according to the present invention.

[0018] Figure 2 This is a schematic diagram of the overall structure of a polishing pad for thinning glass substrates according to the present invention;

[0019] Figure 3 This is a three-dimensional cross-sectional structural diagram of a polishing pad for thinning glass substrates according to the present invention;

[0020] Figure 4 This is a partially enlarged three-dimensional cross-sectional view of a polishing pad for thinning glass substrates according to the present invention.

[0021] Legend:

[0022] 1. Adhesive layer; 2. Buffer layer; 3. Polishing layer; 4. Interface layer; 5. Conductive layer; 6. Temperature resistant layer; 7. Elastic layer; 8. Support layer; 9. Fatigue resistant layer; 10. Reinforcing layer; 11. Abrasive layer; 12. Ultra-thin coating. Detailed Implementation

[0023] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0024] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4This utility model discloses a polishing pad for thinning glass substrates, comprising an adhesive layer 1, a buffer layer 2 disposed on the lower surface of the adhesive layer 1, a polishing layer 3 disposed on the lower surface of the buffer layer 2, the upper surface of the buffer layer 2 being bonded to the lower surface of the adhesive layer 1, and the lower surface of the buffer layer 2 being bonded to the upper surface of the polishing layer 3. The adhesive layer 1 includes an interface layer 4, a conductive layer 5, and a heat-resistant layer 6. The interface layer 4 is made of epoxy resin, the conductive layer 5 is made of silver nanowire film, and the heat-resistant layer 6 is made of polyimide. The interface layer 4 is located above the conductive layer 5, and the heat-resistant layer 6 is located below the conductive layer 5. The upper surface of the conductive layer 5 is bonded to the lower surface of the interface layer 4, and the lower surface of the conductive layer 5 is bonded to the upper surface of the heat-resistant layer 6. The buffer layer 2 includes an elastic layer 7, a support layer 8, and an anti-fatigue layer 9. The material of the elastic layer 7 is silicone rubber, the material of the support layer 8 is polyurethane foam, the material of the fatigue-resistant layer 9 is aramid fiber, the elastic layer 7 is located above the support layer 8, the fatigue-resistant layer 9 is located below the support layer 8, the upper surface of the support layer 8 is in contact with the lower surface of the elastic layer 7, the lower surface of the support layer 8 is in contact with the upper surface of the fatigue-resistant layer 9, the polishing layer 3 includes a reinforcing layer 10, a grinding layer 11 and an ultra-thin coating layer 12, the material of the reinforcing layer 10 is glass fiber, the material of the grinding layer 11 is nano-cerium oxide, the material of the ultra-thin coating layer 12 is polytetrafluoroethylene, the reinforcing layer 10 is located above the grinding layer 11, the ultra-thin coating layer 12 is located below the grinding layer 11, the upper surface of the grinding layer 11 is in contact with the lower surface of the reinforcing layer 10, and the lower surface of the grinding layer 11 is in contact with the upper surface of the ultra-thin coating layer 12;

[0025] Specifically, the adhesive layer 1 is divided into an interface layer 4, a conductive layer 5, and a heat-resistant layer 6. The interface layer 4 mainly uses epoxy resin as the material, which can prevent interface corrosion caused by the penetration of polishing fluid. The conductive layer 5 mainly uses silver nanowire film as the material, which can discharge electrostatic charges to avoid adsorbing debris. The heat-resistant layer 6 mainly uses polyimide as the material, so that the polishing pad has long-term temperature resistance. The buffer layer 2 is divided into an elastic layer 7, a support layer 8, and an anti-fatigue layer 9. The elastic layer 7 mainly uses silicone rubber as the material, which can quickly adapt to the micro-undulations of the glass substrate and absorb high-frequency vibration energy. The support layer 8 is mainly made of polyurethane foam, which can prevent local pressure concentration from causing the glass substrate to break. The fatigue-resistant layer 9 is mainly made of aramid fiber, which makes the polishing pad highly durable. The polishing layer 3 is divided into a reinforcement layer 10, a grinding layer 11 and an ultra-thin coating 12. The reinforcement layer 10 is mainly made of glass fiber, which can prevent stress concentration from causing cracks. The grinding layer 11 is mainly made of nano-cerium oxide, which can perform fine cutting. The ultra-thin coating 12 is mainly made of polytetrafluoroethylene, which can reduce the coefficient of friction and prevent local overheating.

[0026] Working principle: The polishing pad for glass substrate thinning process achieves efficient and precise polishing through the synergistic effect of a multi-layer composite structure. The adhesive layer 1 can reduce energy loss, discharge static charge to avoid attracting debris, and enable the polishing pad to withstand the high temperature generated during the polishing process for a long time. The buffer layer 2 absorbs vibration and compensates for the micro-undulations of the glass substrate, ensuring that the polishing pad can make uniform contact with the glass substrate. The polishing layer 3 mainly performs fine cutting on the surface of the glass substrate, so as to complete the surface flattening of the glass substrate.

[0027] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A polishing pad for thinning glass substrates, characterized in that, include: An adhesive layer (1) is provided with a buffer layer (2) on its lower surface and a polishing layer (3) on its lower surface. The adhesive layer (1) includes an interface layer (4), a conductive layer (5), and a heat-resistant layer (6). The interface layer (4) is made of epoxy resin, the conductive layer (5) is made of silver nanowire film, and the heat-resistant layer (6) is made of polyimide. The interface layer (4) is located above the conductive layer (5), and the heat-resistant layer (6) is located below the conductive layer (5). The upper surface of the conductive layer (5) is attached to the lower surface of the interface layer (4), and the lower surface of the conductive layer (5) is attached to the upper surface of the heat-resistant layer (6).

2. The polishing pad for glass substrate thinning according to claim 1, characterized in that, The upper surface of the buffer layer (2) is attached to the lower surface of the adhesive layer (1), and the lower surface of the buffer layer (2) is attached to the upper surface of the polishing layer (3).

3. The polishing pad for glass substrate thinning according to claim 1, characterized in that, The buffer layer (2) includes an elastic layer (7), a support layer (8), and a fatigue-resistant layer (9).

4. The polishing pad for glass substrate thinning according to claim 3, characterized in that, The elastic layer (7) is located above the support layer (8), and the fatigue-resistant layer (9) is located below the support layer (8). The upper surface of the support layer (8) is in contact with the lower surface of the elastic layer (7), and the lower surface of the support layer (8) is in contact with the upper surface of the fatigue-resistant layer (9).

5. A polishing pad for glass substrate thinning according to claim 1, characterized in that, The polishing layer (3) includes a reinforcing layer (10), an abrasive layer (11), and an ultra-thin coating layer (12).

6. A polishing pad for glass substrate thinning according to claim 5, characterized in that, The reinforcing layer (10) is located above the polishing layer (11), and the ultrathin coating (12) is located below the polishing layer (11). The upper surface of the polishing layer (11) is in contact with the lower surface of the reinforcing layer (10), and the lower surface of the polishing layer (11) is in contact with the upper surface of the ultrathin coating (12).

7. A polishing pad for glass substrate thinning according to claim 3, characterized in that, The elastic layer (7) is made of silicone rubber, the support layer (8) is made of polyurethane foam, and the fatigue-resistant layer (9) is made of aramid fiber.

8. A polishing pad for glass substrate thinning according to claim 5, characterized in that, The reinforcing layer (10) is made of glass fiber, the polishing layer (11) is made of nano-cerium oxide, and the ultra-thin coating (12) is made of polytetrafluoroethylene.

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