Silicon rod positioning carrier for rod sticking process

Abstract

The utility model provides a silicon rod positioning carrier for a rod sticking process. The carrier comprises a base plate, a reference assembly and a positioning assembly, the reference assembly and the positioning assembly are arranged at the two ends of the base plate, and a silicon rod is arranged between the reference assembly and the positioning assembly; the reference assembly comprises a first positioning part, and the first positioning part is fixedly arranged on the substrate; the positioning assembly comprises a second positioning part, the second positioning part is movably arranged on the base plate through the moving assembly, the second positioning part comprises a first positioning piece and a second positioning piece, and under the condition that the silicon rod is arranged on the connecting plate, the first positioning piece corresponds to the silicon rod, and the second positioning piece corresponds to the connecting plate. The silicon rod positioning carrier for the rod sticking procedure can be compatible with silicon rods with small sizes, and the rod sticking procedure of the silicon rods is completed; the silicon rod positioning carrier for the rod sticking process is simple in overall structure and convenient to assemble, silicon rods of different specifications can be positioned, rod sticking of the silicon rods is completed in a limited space, and displacement of the silicon rods before curing is avoided.

Description

Technical Field

[0001] This application relates to the field of photovoltaic silicon wafer production equipment technology, and in particular to a silicon rod positioning carrier for the rod bonding process. Background Technology

[0002] Currently, the main processes for silicon wafer slicing in the photovoltaic silicon wafer industry are: silicon rod arrival - rod bonding - slicing - degumming - cleaning - sorting - packaging and shipping. Among them, the rod bonding process involves applying adhesive to the silicon rod and connecting plate and bonding them to the crystal holder. The rod bonding process is completed on a carrier, whose main function is to support the silicon rod and move and position it on the production line to prevent displacement of the silicon rod before it is cured.

[0003] However, due to structural limitations, existing adhesive rod carriers can only be compatible with silicon rods of certain sizes, and cannot position and fix smaller silicon rods.

[0004] Therefore, it is necessary to design a silicon rod positioning carrier for the rod bonding process to solve the above problems. Utility Model Content

[0005] In view of this, in order to overcome the shortcomings of the prior art, this utility model provides a silicon rod positioning carrier for the rod bonding process, which effectively solves the problem that the existing rod bonding carriers can only be compatible with silicon rods of certain sizes due to structural limitations, and cannot position and fix silicon rods of smaller sizes.

[0006] According to this utility model, a silicon rod positioning carrier for a bonding process is provided for positioning a silicon rod and a connecting plate with adhesive. The silicon rod positioning carrier includes a substrate, a reference component, and a positioning component. The reference component and the positioning component are disposed at opposite ends of the substrate, and the silicon rod is disposed between the reference component and the positioning component. The reference component includes a first positioning part, which is fixedly disposed on the substrate. The positioning component includes a second positioning part, which is movably disposed on the substrate via a moving component. The second positioning part includes a first positioning element and a second positioning element. When the silicon rod is disposed on the connecting plate, the first positioning element corresponds to the silicon rod, and the second positioning element corresponds to the connecting plate.

[0007] Preferably, the moving component is disposed on the substrate, and the moving component includes a slide rail limiting part, a lead screw driving part and a positioning plate. The positioning plate is disposed on the substrate through a support member. The slide rail limiting part and the lead screw driving part are both disposed on the substrate, and the second positioning part is connected to the slide rail limiting part and the lead screw driving part.

[0008] Preferably, the lead screw drive includes a lead screw, a movable block, a gear, a first rack, and a second rack. The lead screw is disposed on the positioning plate, the movable block is movably disposed on the lead screw, the gear is connected to the movable block, the first rack is fixedly disposed on the positioning plate, the second rack is connected to the second positioning part, and the first rack and the second rack mesh with the gear.

[0009] Preferably, the slide rail limiting part includes a limiting plate, a first slide rail and a first slider. The first slide rail is disposed on the positioning plate, the limiting plate is disposed at the end of the first slide rail and the positioning plate, the first end of the first slider is slidably disposed on the first slide rail, and the second end of the first slider is connected to the second positioning part.

[0010] Preferably, the first positioning part includes a transfer plate, a movable positioning member, and a third positioning member. The transfer plate is disposed on the substrate by a support member. The movable positioning member is slidably disposed on the transfer plate and corresponds to the connecting plate. The third positioning member is fixedly disposed on the substrate and corresponds to the silicon rod.

[0011] Preferably, the movable positioning component includes a second slide rail, a second slider, and a positioning pin. The second slide rail is disposed on the transfer plate, the second slider is slidably disposed on the second slide rail, and the positioning pin is disposed at the end of the second slider facing the connecting plate.

[0012] Preferably, there are two movable positioning components, which are respectively disposed at both ends of the transfer plate. At least one movable positioning component includes two positioning pins, which face two adjacent sides of the connecting plate.

[0013] Preferably, the silicon rod positioning carrier for the rod bonding process further includes a base, which is disposed on the upper part of the substrate, and the crystal holder is disposed on the base, with a limiting member provided at the first end of the base.

[0014] Preferably, the second positioning part further includes a driving plate, the first end of the driving plate being connected to the moving component, and the second end of the driving plate being provided with the first positioning element.

[0015] Preferably, the second positioning member is movably disposed on the drive plate.

[0016] The silicon rod positioning carrier for the bonding process according to this utility model, through the cooperation of a substrate, a reference component, and a positioning component, enables the carrier to accommodate small-sized silicon rods and complete the bonding process. This silicon rod positioning carrier for the bonding process has a simple overall structure, is easy to assemble, and convenient to operate. Since the first positioning part is fixedly mounted on the substrate, while the second positioning part is movably mounted on the substrate, silicon rods of different specifications can be positioned, completing the bonding process within a limited space and preventing displacement of the silicon rod before curing.

[0017] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the structure of a silicon rod positioning carrier for a rod bonding process according to an embodiment of the present invention is shown;

[0020] Figure 2 A schematic diagram of the positioning component according to an embodiment of the present invention is shown;

[0021] Figure 3 A partial structural schematic diagram of the positioning component according to an embodiment of the present invention is shown;

[0022] Figure 4 A schematic diagram of the structure of a lead screw drive according to an embodiment of the present invention is shown;

[0023] Figure 5 A schematic diagram of the structure of the first positioning part according to an embodiment of the present invention is shown;

[0024] Figure 6 A bottom view of the first positioning part according to an embodiment of the present invention is shown;

[0025] Figure 7 A schematic diagram of the substrate and base according to an embodiment of the present invention is shown;

[0026] Figure 8 A schematic diagram of the clamping structure of a silicon rod positioning carrier for a rod bonding process according to an embodiment of the present invention is shown.

[0027] Figure 9This is a front view of the silicone rod positioning carrier for the sticking process according to an embodiment of the present invention after clamping.

[0028] Reference numerals: 1-substrate; 101-support member; 2-reference assembly; 201-transfer plate; 202-second slide rail; 203-second slider; 204-positioning pin; 205-third positioning member; 3-positioning assembly; 301-first positioning member; 302-second positioning member; 303-positioning plate; 304-lead screw; 305-moving block; 306-gear; 307-first rack; 308-second rack; 309-limiting plate; 310-first slide rail; 311-first slider; 312-driving plate; 313-slide groove; 4-base; 401-limiting member; 5-silicon rod; 6-connecting plate; 7-crystal holder. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0030] In the description of the embodiments of this application, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0032] In the description of the embodiments of this application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] According to the present invention, a silicon rod positioning carrier for a rod bonding process is provided, such as... Figures 1 to 9 As shown, the silicon rod positioning carrier for the bonding process is used on the production line of photovoltaic silicon wafers. The silicon rod positioning carrier for the bonding process can move and transport silicon rods on the production line. The silicon rod positioning carrier for the bonding process includes a substrate 1, a reference component 2, and a positioning component 3.

[0034] In the following description, reference will be made to Figures 1 to 9 The detailed structure of the substrate 1, reference assembly 2, and positioning assembly 3 of the silicon rod positioning carrier used in the rod bonding process is described in detail. Furthermore, as... Figure 8 and Figure 9 As shown in the following embodiments, the silicon rod 5, connecting plate 6, and crystal holder 7 mentioned are all common components in the field of photovoltaic silicon wafer technology, and their structures are known to those skilled in the art, and will not be described in detail here. In the rod bonding process, the crystal holder 7 is placed on the carrier, then the connecting plate 6 is coated with adhesive and placed on top of the crystal holder 7, and then the silicon rod 5 is coated with adhesive and placed on top of the connecting plate 6. Since the silicon rod 5 and the connecting plate 6 will shift as the carrier moves before the adhesive dries, the reference component 2 and the positioning component 3 are needed for fixation.

[0035] like Figure 1 , Figure 8 and Figure 9 As shown, in this embodiment, the reference component 2 and the positioning component 3 are disposed at both ends of the substrate 1. These two ends can be understood as the two ends of the silicon rod 5 in the width direction. That is, the silicon rod 5 is disposed between the reference component 2 and the positioning component 3, and is positioned at both ends of the silicon rod 5 in the width direction by the reference component 2 and the positioning component 3, preventing the silicon rod 5 from shifting or displacing. Specifically, the reference component 2 may include a first positioning part, which is fixedly disposed on the substrate 1. The positioning component 3 includes a second positioning part, which is movably disposed on the substrate 1 via a movable component. Since the first positioning part is fixedly disposed on the substrate 1, while the second positioning part is movably disposed on the substrate 1, regardless of the width of the silicon rod 5, it can be positioned and fixed by the movable second positioning part.

[0036] Furthermore, such as Figure 9As shown, the second positioning part includes a first positioning member 301 and a second positioning member 302. When the silicon rod 5 is disposed on the connecting plate 6, the first positioning member 301 corresponds to the silicon rod 5 and the second positioning member 302 corresponds to the connecting plate 6.

[0037] The silicon rod positioning carrier used in this bonding process, through the cooperation of substrate 1, reference component 2, and positioning component 3, enables the carrier to accommodate smaller silicon rods 5 and complete the bonding process of the silicon rods 5. The overall structure of this silicon rod positioning carrier is simple, easy to assemble, and convenient to operate. Since the first positioning part is fixedly mounted on substrate 1, while the second positioning part is movably mounted on substrate 1, silicon rods 5 of different specifications can be positioned, completing the bonding of the silicon rods 5 within a limited space and preventing displacement of the silicon rods 5 before curing.

[0038] Preferably, such as Figure 1 , Figure 2 and Figure 4 As shown, in this embodiment, the moving component is disposed on the substrate 1. The moving component includes a slide rail limiting part, a lead screw driving part, and a positioning plate 303. The positioning plate 303 is disposed on the substrate 1 via a support member 101. Figure 7 As shown, four support members 101 are respectively provided at the four corners of the substrate 1. The support members 101 are used to support the positioning plate 303 and the transfer plate 201 described below. The support member 101 can be, for example, a support column formed into an approximately cylindrical structure. The support column has a limiting platform structure. The support column can pass through the positioning plate 303 and the transfer plate 201 and position the positioning plate 303 and the transfer plate 201 on the limiting platform.

[0039] Furthermore, both the slide rail limiting part and the lead screw driving part are disposed on the base plate 1, and the second positioning part is connected to the slide rail limiting part and the lead screw driving part. The lead screw driving part, as a driving part, can drive the second positioning part to move, and the slide rail limiting part, as a sliding auxiliary part, can assist the movement of the second positioning part and restrict the movement of the second positioning part.

[0040] Preferably, such as Figure 1 , Figure 2 and Figure 4 As shown, in this embodiment, the lead screw drive may include a lead screw 304, a movable block 305, a gear 306, a first rack 307, and a second rack 308. The lead screw 304 is disposed on the positioning plate 303, and the movable block 305 is movably disposed on the lead screw 304. The lead screw 304 and the movable block 305 can form a lead screw structure. The gear 306 is connected to the movable block 305. The first rack 307 is fixedly disposed on the positioning plate 303, and the second rack 308 is connected to the second positioning part. The first rack 307 and the second rack 308 mesh with the gear 306.

[0041] Specifically, the lead screw 304 can rotate by an external drive mechanism, such as a drive motor. The rotation of the lead screw 304 causes the movable block 305 to move axially along the lead screw 304, which in turn drives the gear 306 connected to the movable block 305. Since the first rack 307 is fixedly mounted, when the gear 306 changes position due to the movement of the movable block 305, it will rotate under meshing action, driving the second rack 308 located on the other side of the gear 306. This causes the second rack 308 to change position. Because the second rack 308 is fixedly connected to the second positioning part, the second positioning part and the second rack 308 change position together.

[0042] Preferably, such as Figure 1 and Figure 2 As shown, in the embodiment, the slide rail limiting part may include a limiting plate 309, a first slide rail 310 and a first slider 311. The first slide rail 310 is disposed on the positioning plate 303, the limiting plate 309 is disposed at the ends of the first slide rail 310 and the positioning plate 303, the first end of the first slider 311 is slidably disposed on the first slide rail 310, and the second end of the first slider 311 is connected to the second positioning part.

[0043] Preferably, such as Figure 1 and Figure 2 As shown, in this embodiment, the second positioning part may further include a driving plate 312. The first end of the driving plate 312 is connected to the moving component, and the second end of the driving plate 312 is provided with a first positioning member 301. Thus, the driving plate 312, through the driving of the first slider 311 of the slide rail limiting part and the second rack 308 of the lead screw driving member, enables the first positioning member 301 located at the second end of the driving plate 312 to move closer to or further away from the silicon rod 5.

[0044] Preferably, such as Figure 3 As shown in the embodiment, to achieve fine adjustment, the second positioning member 302 is movably disposed on the driving plate 312. A sliding groove 313 is provided at the connection between the driving plate 312 and the second positioning member 302, and the second positioning member 302 is slidably connected to the driving plate 312 through the sliding groove 313. Since different silicon rods 5 have different lengths, the position of the second positioning member 302 needs to be adjusted in order to achieve contact between the second positioning member 302 and the silicon rod 5.

[0045] Preferably, such as Figures 5 to 7As shown, in this embodiment, the first positioning part may include a transfer plate 201, a movable positioning member, and a third positioning member 205. The transfer plate 201 is disposed on the substrate 1 via a support member 101. The movable positioning member is slidably disposed on the transfer plate 201 and corresponds to the connecting plate 6. The third positioning member 205 is fixedly disposed on the substrate 1 and corresponds to the silicon rod 5. The movable positioning member and the third positioning member 205 simultaneously serve as positioning references for the reference component 2, ensuring accurate positioning of the silicon rod 5 and the connecting plate 6.

[0046] Preferably, such as Figure 5 and Figure 6 As shown, in this embodiment, the movable positioning component may include a second slide rail 202, a second slider 203, and a positioning pin 204. The second slide rail 202 is disposed on the transfer plate 201, the second slider 203 is slidably disposed on the second slide rail 202, and the positioning pin 204 is disposed at the end of the second slider 203 facing the connecting plate 6.

[0047] Preferably, such as Figure 5 and Figure 6 As shown, in this embodiment, there are two movable positioning members, which are respectively disposed at both ends of the transfer plate 201. These two ends can be at opposite ends along the length direction. At least one movable positioning member includes two positioning pins 204, each facing two adjacent sides of the connecting plate 6. Thus, the movable positioning members including the two positioning pins 204 can position the connecting plate 6 both laterally and longitudinally, ensuring accurate positioning and preventing displacement.

[0048] Preferably, such as Figure 7 As shown, in this embodiment, the silicon rod positioning carrier for the bonding process may further include a base 4, which is disposed on the upper part of the substrate 1. The crystal holder 7 is disposed on the base 4, and a limiting member 401 is provided at the first end of the base 4. The limiting member 401 can restrict the first end of the crystal holder 7 in the length direction to prevent the crystal holder 7 from shifting. The limiting member 401 may be, for example, a protrusion. At the same time, the base 4 may also serve as the bottom component of the third positioning member 205.

[0049] When the silicon rod positioning carrier operates on the production line in this rod bonding process, the crystal tray 7 reaches the adhesive application station and completes the adhesive application. The connecting plate 6 is placed on the adhesive surface of the crystal tray 7. The movable positioning component is driven by an external drive component (e.g., a cylinder) according to the specifications of the connecting plate 6, pushing the connecting plate 6 to the designated position to form a reference positioning side. Rod adhesive is then applied to the connecting plate 6, and after adhesive application, it reaches the rod loading station. At the rod loading station, the silicon rod 5 is placed close to the third positioning component 205 and on the connecting plate 6. The drive motor drives the moving component to make the first positioning component 301 and the second positioning component 302 move simultaneously, pushing the silicon rod 5 and the connecting plate 6 towards the reference positioning side. After pushing, they are squeezed, finally achieving fixation and positioning, thereby achieving longitudinal and lateral fixation of the silicon rod 5 and the connecting plate 6, ensuring that the silicon rod 5 will not shift due to the movement of the carrier before the adhesive cures.

[0050] This silicon rod positioning carrier, through the cooperation of a substrate, a reference assembly, and a positioning assembly, enables the carrier to accommodate small-sized silicon rods and complete the silicon rod bonding process. The overall structure of this silicon rod positioning carrier is simple, easy to assemble, and convenient to operate. Since the first positioning part is fixedly mounted on the substrate, while the second positioning part is movably mounted on the substrate, it can position silicon rods of different specifications, completing the bonding process within a limited space and preventing displacement of the silicon rods before curing.

[0051] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the technical scope disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A silicon rod positioning carrier for a stick-coating process of a silicon rod and a connecting plate, characterized by, The silicon rod positioning carrier for the stick rod process comprises a base plate, a reference assembly and a positioning assembly, the reference assembly and the positioning assembly are arranged at both ends of the base plate, and the silicon rod is arranged between the reference assembly and the positioning assembly; The reference assembly comprises a first positioning part fixedly arranged on the base plate, and the positioning assembly comprises a second positioning part movably arranged on the base plate through a moving assembly, the second positioning part comprises a first positioning member and a second positioning member, the first positioning member corresponds to the silicon rod, and the second positioning member corresponds to the connecting plate when the silicon rod is arranged on the connecting plate.

2. The silicon ingot positioning carrier for a stick process according to claim 1, wherein The moving assembly is arranged on the base plate, and the moving assembly comprises a sliding rail limiting part, a lead screw driving member and a positioning plate, the positioning plate is arranged on the base plate through a support member, the sliding rail limiting part and the lead screw driving member are arranged on the base plate, and the second positioning part is connected with the sliding rail limiting part and the lead screw driving member.

3. The silicon ingot positioning carrier for a stick process according to claim 2, wherein The lead screw driving member comprises a lead screw member, a movable block, a gear member, a first gear rack and a second gear rack, the lead screw member is arranged on the positioning plate, the movable block is movably arranged on the lead screw member, the gear member is connected with the movable block, the first gear rack is fixedly arranged on the positioning plate, the second gear rack is connected with the second positioning part, and the first gear rack and the second gear rack are engaged with the gear member.

4. The silicon ingot positioning carrier for a stick process according to claim 2, wherein The sliding rail limiting part comprises a limiting plate, a first sliding rail and a first sliding block, the first sliding rail is arranged on the positioning plate, the limiting plate is arranged at the end of the first sliding rail and the positioning plate, the first end of the first sliding block is slidably arranged on the first sliding rail, and the second end of the first sliding block is connected with the second positioning part.

5. The silicon ingot positioning carrier for a stick process according to claim 1, wherein The first positioning part comprises a transfer plate, a movable positioning member and a third positioning member, the transfer plate is arranged on the base plate through a support member, the movable positioning member is slidably arranged on the transfer plate, the movable positioning member corresponds to the connecting plate, and the third positioning member is fixedly arranged on the base plate and corresponds to the silicon rod.

6. The silicon ingot positioning carrier for a stick process according to claim 5, wherein The movable positioning member comprises a second sliding rail, a second sliding block and a positioning pin, the second sliding rail is arranged on the transfer plate, the second sliding block is slidably arranged on the second sliding rail, and the positioning pin is arranged at the end of the second sliding block facing the connecting plate.

7. The silicon ingot positioning carrier for a stick process according to claim 6, wherein The number of the movable positioning members is two, the two movable positioning members are arranged at both ends of the transfer plate respectively, at least one movable positioning member comprises two positioning pins, and the two positioning pins respectively face two adjacent sides of the connecting plate.

8. The silicon ingot positioning carrier for a stick process according to claim 1, wherein The silicon rod positioning carrier for the stick rod process further comprises a base, the base is arranged on the upper part of the base plate, a wafer holder is arranged on the base, and the first end of the base is provided with a limiting member.

9. The silicon ingot positioning carrier for a stick process according to claim 1, wherein The second positioning part further comprises a driving plate, the first end of the driving plate is connected with the moving assembly, and the second end of the driving plate is provided with the first positioning member.

10. The silicon ingot positioning carrier for a stick process according to claim 9, wherein The second positioning member is movably arranged on the driving plate.

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