Thermosiphon heat exchanger

Abstract

The utility model relates to a thermosyphon heat exchanger which comprises a first plate, a plurality of first heat exchangers and at least one second heat exchanger, each first heat exchanger is provided with a heat exchange cavity, and the heat exchange cavities of the first heat exchangers communicate with cavities of the second heat exchangers to form a circulation loop; the first plate is provided with a plurality of mounting cavities, at least part of the mounting cavities are arranged at intervals in the length direction of the first plate, at least part of the first heat exchanger is located in the mounting cavities, and the first heat exchanger is fixedly or detachably connected with the first plate; the thermosyphon heat exchanger has better adaptability.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic components, specifically to a thermosiphon heat exchanger. Background Technology

[0002] A thermosiphon heat exchanger utilizes the phase change of the refrigerant and the thermosiphon principle to exchange heat with electronic components. The electronic components are arranged on the surface of the evaporator. When the electronic components dissipate heat during operation, the liquid refrigerant in the evaporator absorbs heat, evaporates, and continuously flows upwards. At the top of the evaporator, it becomes a refrigerant with high dryness but not completely vaporized. This incompletely vaporized refrigerant enters the condenser, exchanges heat with the air, and then condenses into a subcooled liquid. The subcooled liquid returns to the bottom of the evaporator, starting the next cycle. In related technologies, a single evaporator in a thermosiphon heat exchanger often simultaneously exchanges heat with multiple electronic components. However, the number and location of electronic components vary between different models. This means that an evaporator of the same size cannot be adapted to multiple different models simultaneously, resulting in poor adaptability of thermosiphon heat exchangers. Therefore, evaporators of different sizes need to be designed and manufactured according to different models. Utility Model Content

[0003] This application provides a thermosiphon heat exchanger with better adaptability.

[0004] The thermosiphon heat exchanger provided in this application includes a first plate, a plurality of first heat exchangers and at least one second heat exchanger. The first heat exchanger has a heat exchange cavity, and the heat exchange cavity of the first heat exchanger is connected to the cavity of the second heat exchanger to form a circulation loop. The first plate has a plurality of mounting cavities, at least some of which are spaced apart along the length of the first plate. The first heat exchangers are at least partially located in the mounting cavities, and the first heat exchangers are fixedly connected to or detachably connected to the first plate.

[0005] The first plate of the thermosiphon heat exchanger has multiple mounting cavities, and the first heat exchanger can be at least partially located within the mounting cavities. In use, a corresponding number of mounting cavities can be pre-set on the first plate according to the number of electronic components. The first heat exchanger is then placed in the mounting cavity and connected to the first plate, thereby enabling the thermosiphon heat exchanger to better adapt to the heat exchange requirements of different numbers of electronic components and improving its adaptability. Attached Figure Description

[0006] Figure 1 A schematic diagram of the structure of the thermosiphon heat exchanger provided in this application in a specific embodiment;

[0007] Figure 2 This is a structural schematic diagram of the first plate component in one specific embodiment;

[0008] Figure 3 This is a schematic diagram of the structure of the first heat exchanger in a specific embodiment;

[0009] Figure 4 This is a schematic diagram of the structure of the first heat exchanger in another specific embodiment;

[0010] Figure 5 A schematic diagram of the structure of the thermosiphon heat exchanger provided in this application in a second specific embodiment;

[0011] Figure 6 for Figure 5 A schematic diagram of the thermosiphon heat exchanger on the other side;

[0012] Figure 7 This is a schematic diagram showing the connection between the first heat exchanger and the second heat exchanger in one specific embodiment;

[0013] Figure 8 A schematic diagram of the structure of the thermosiphon heat exchanger provided in this application in a third specific embodiment;

[0014] Figure 9 This is a schematic diagram showing the connection between the first heat exchanger and the second heat exchanger in another specific embodiment;

[0015] Figure 10 A schematic diagram of the structure of the thermosiphon heat exchanger provided in this application in the fourth specific embodiment.

[0016] Reference numerals: First plate 1, mounting cavity 11, first gap 12, first sub-gap 13, second sub-gap 14, first heat exchanger 2, heat exchange cavity 21, first sub-heat exchanger 22, second sub-heat exchanger 23, protrusion 24, first fin 25, protrusion 26, second fin 27, first heat exchange surface 28, second heat exchange surface 29, second heat exchanger 3, third sub-heat exchanger 31, fourth sub-heat exchanger 32, first manifold 33, second manifold 34, first connecting pipe 35, second connecting pipe 36, first heat exchange tube 37, third manifold 38, second heat exchange tube 39.

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Detailed Implementation

[0018] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0019] It should be understood that the described embodiments are merely a part of the technical solutions of this application, and not all of them. All other technical solutions obtained by those skilled in the art based on the technical solutions in this application without inventive effort are within the scope of protection of this application.

[0020] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0021] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0022] It should be noted that the directional terms such as "upper," "lower," "left," and "right" described in the embodiments of this application are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when it is mentioned that an element is connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected to the other element "upper" or "lower" through an intermediate element.

[0023] like Figure 1-10 As shown, this application embodiment provides a thermosiphon heat exchanger with better adaptability. Specifically, the thermosiphon heat exchanger includes a first plate 1, a plurality of first heat exchangers 2, and at least one second heat exchanger 3. The first heat exchangers 2 have heat exchange chambers 21, which are connected to the chambers of the second heat exchangers 3 to form a circulation loop. When the thermosiphon heat exchanger is working, the refrigerant can circulate back and forth in the circulation loop formed by the heat exchange chambers 21 of the first heat exchangers 2 and the chambers of the second heat exchangers 3. The first plate 1 has a plurality of mounting chambers 11, at least some of which are spaced apart along the length of the first plate 1. The first heat exchangers 2 are at least partially located in the mounting chambers 11, and are fixedly or detachably connected to the first plate 1.

[0024] It should be noted that in this embodiment, at least some of the mounting cavities 11 are arranged at intervals along the length direction of the first plate 1. This means that all of the mounting cavities 11 can be arranged at intervals along the length direction of the first plate 1, or only some of the mounting cavities 11 can be arranged at intervals along the length direction of the first plate 1, while the other part can be arranged in other ways as required. The specific arrangement can be determined according to the arrangement of electronic components, and this article does not make specific limitations.

[0025] In this embodiment, the first plate 1 of the thermosiphon heat exchanger includes multiple mounting cavities 11, and the first heat exchanger 2 can be at least partially located within the mounting cavity 11. During use, a corresponding number of mounting cavities 11 can be set at preset positions on the first plate 1 according to the number and location of electronic components. Then, a corresponding number of first heat exchangers 2 are placed in the mounting cavities 11 and connected to the first plate 1, thereby enabling the thermosiphon heat exchanger to better adapt to the heat exchange requirements of different numbers of electronic components and improving its adaptability. It should be noted that the mounting cavity 11 can completely penetrate the first plate 1, or it can only partially penetrate or be recessed within the first plate 1, as long as the first heat exchanger 2 can be at least partially located within the mounting cavity 11. After installation, the surface of the first heat exchanger 2 can be flush with the outer surface of the first plate 1, or it can bulge outwards or be recessed inwards, depending on the actual usage requirements. This will not be elaborated upon further in this paper.

[0026] When the thermosiphon heat exchanger is working, the first heat exchanger 2 can be installed close to the heat dissipation surface of the electronic components. The first heat exchanger 2 works as an evaporator. The refrigerant in its heat exchange chamber 21 absorbs the heat emitted by the electronic components and evaporates and vaporizes, continuously flowing upward into the second heat exchanger 3. The second heat exchanger 3 works as a condenser. The refrigerant in its chamber exchanges heat with the air and then condenses into a subcooled liquid. The subcooled liquid circulates back into the heat exchange chamber 21 of the first heat exchanger 2, and then the next cycle begins.

[0027] It should be further noted that when multiple electronic components are heat-exchanged simultaneously in a single evaporator, in addition to the poor adaptability of the thermosiphon heat exchanger, the shared evaporator also increases the manufacturing cost. This is because sharing an evaporator necessitates a larger refrigerant chamber. From a manufacturing perspective, machining the internal flow channels of an evaporator increases processing time, while forging increases technical difficulty and cost. An excessively large aluminum plate evaporator also reduces the amount of vacuum brazing required, increasing costs, and makes it difficult to ensure the flatness of the heating module mounting surface. Conversely, a smaller evaporator (first heat exchanger 2) can alleviate these problems to some extent. Therefore, the thermosiphon heat exchanger in this embodiment improves adaptability while reducing manufacturing costs and making it easier to maintain flatness.

[0028] Furthermore, since there are always gaps between adjacent electronic components, and these gaps do not require heat exchange, when an evaporator simultaneously exchanges heat with multiple electronic components, the refrigerant in the evaporator chamber flows through the heating and non-heating zones (the gaps between electronic components). The refrigerant in the non-heating zones does not play a role, thus the refrigerant charge is relatively wasteful, increasing the refrigerant charge without sufficient heat exchange. In contrast, the thermosiphon heat exchanger in this embodiment can pre-set the mounting cavity 11 according to the position and spacing of the electronic components, and then install the first heat exchanger 2, thereby avoiding the gaps between electronic components. That is, in such a thermosiphon heat exchanger, the refrigerant does not need to pass through the non-heating zone during heat exchange, thereby reducing the refrigerant charge and improving the utilization rate of the refrigerant in the first heat exchanger 2.

[0029] like Figure 5 As shown, in one specific embodiment, the plurality of first heat exchangers 2 include at least one first sub-heat exchanger 22 and at least one second sub-heat exchanger 23. The internal volume of the heat exchange chamber 21 of the first sub-heat exchanger 22 is defined as V1, and the internal volume of the heat exchange chamber 21 of the second sub-heat exchanger 23 is defined as V2. Then V1 > V2, the internal volume of the heat exchange chamber 21 of the first sub-heat exchanger 22 is larger, and it can be used to charge more refrigerant.

[0030] It is understandable that different electronic components generate different amounts of heat, i.e., their heat flux densities differ, due to variations in their constituent modules or power. Therefore, when using a single evaporator to exchange heat between multiple electronic components, the evaporator cannot be precisely designed according to the heat flux density of each individual component, resulting in poor temperature uniformity among the components.

[0031] In this embodiment, the plurality of first heat exchangers 2 include at least one first sub-heat exchanger 22 and at least one second sub-heat exchanger 23, and the internal volume of the heat exchange cavity 21 of the first sub-heat exchanger 22 is larger than the internal volume of the heat exchange cavity 21 of the second sub-heat exchanger 23. Therefore, the positions of the first sub-heat exchanger 22 and the second sub-heat exchanger 23 can be adjusted according to the heat flux density of the electronic components, thereby better adapting to the heat exchange requirements of different electronic components. For example, if a certain electronic component has a higher heat flux density and a higher heat exchange requirement, the first sub-heat exchanger 22 with a larger internal volume can be arranged at that position, while other electronic components with lower heat exchange requirements can be correspondingly arranged with the second sub-heat exchanger 23.

[0032] It should be noted that when there are a large number of electronic components and a large difference in heat flux density, other corresponding first heat exchangers 2 with different sizes of heat exchange chambers 21 can be arranged according to the heat dissipation requirements of the electronic components. The principle is the same as that between the first sub-heat exchanger 22 and the second sub-heat exchanger 23, so this article will not elaborate further.

[0033] like Figure 5-6 As shown, in one specific embodiment, there are multiple second heat exchangers 3, and one second heat exchanger 3 is connected to the heat exchange cavity 21 of at least one first heat exchanger 2; the multiple second heat exchangers 3 include at least one third sub-heat exchanger 31 and at least one fourth sub-heat exchanger 32, the heat exchange area of ​​the third sub-heat exchanger 31 is defined as S1, the heat exchange area of ​​the fourth sub-heat exchanger 32 is defined as S2, then S1 > S2.

[0034] In this embodiment, there are multiple second heat exchangers 3, and each second heat exchanger 3 can be connected to the heat exchange chamber 21 of at least one first heat exchanger 2. For example, one second heat exchanger 3 can connect to two first heat exchangers 2. The second heat exchangers 3 can be interconnected, so that if one of them malfunctions, the electronic components will not dry-burn due to the refrigerant not flowing. Generally, to facilitate the modularization of the thermosiphon heat exchanger, one second heat exchanger 3 can be connected to 1 to 3 first heat exchangers 2.

[0035] This embodiment is similar in principle to the previous embodiment. When the heat exchange requirements of electronic components are different, in addition to setting the first heat exchanger 2 with heat exchange chambers of different sizes, the temperature uniformity can also be improved by increasing the heat exchange area of ​​the condenser (second heat exchanger 3). For example, when a certain electronic component has a large heat flux density and a large heat exchange requirement, a third sub-heat exchanger 31 can be arranged at the corresponding position of the electronic component, and a fourth sub-heat exchanger 32 can be arranged at the position of another electronic component with a smaller heat exchange requirement. Since the heat exchange areas of the two are different, their heat exchange performance will also be different. This arrangement method based on the heat dissipation requirements of electronic components can better meet the heat dissipation requirements of different electronic components and improve the overall temperature uniformity.

[0036] like Figure 5 As shown, in one specific embodiment, the third sub-heat exchanger 31 is connected to the heat exchange cavity 21 of the first sub-heat exchanger 22, and / or the fourth sub-heat exchanger 32 is connected to the heat exchange cavity 21 of the second sub-heat exchanger 23. When the first sub-heat exchanger 22, with its larger heat exchange cavity 21, is connected to the third sub-heat exchanger 31, with its larger heat exchange area, the thermosiphon heat exchanger has the best heat exchange performance at that location, and therefore can be matched and installed at the location of the electronic component with the highest heat flux density. Correspondingly, when the second sub-heat exchanger 23, with its smaller heat exchange cavity 21, is connected to the fourth sub-heat exchanger 32, with its smaller heat exchange area, the thermosiphon heat exchanger has relatively weaker heat exchange performance at that location, and can be matched and installed at the location of the electronic component with the lowest heat flux density. This differentiated arrangement and installation method according to heat exchange requirements can better heat exchange the electronic components, thereby improving the temperature uniformity between different electronic components.

[0037] In addition to increasing the internal volume of the first heat exchanger 2 to increase the refrigerant charge and increasing the heat exchange area of ​​the second heat exchanger 3, heat exchange efficiency can also be improved by increasing the air volume, or by sandblasting and sintering the inner wall of the heat exchange chamber 21 of the first heat exchanger 2 corresponding to a high heat flux density. Of course, these methods of increasing heat exchange efficiency can be used individually or in combination, which will not be elaborated on in this article.

[0038] like Figure 3 As shown, in one specific embodiment, the heat exchange cavity 21 is provided with a plurality of protrusions 24 and a plurality of first fins 25. The length direction of the protrusions 24 extends at least partially along the length direction of the first heat exchanger 2, and the plurality of protrusions 24 are arranged at intervals along the width direction of the first heat exchanger 2. The first fins 25 are located between at least a portion of adjacent protrusions 24.

[0039] In this embodiment, the gaps between the multiple protrusions 24 form channels for refrigerant flow. The protrusions 24 can be of various shapes, such as rectangular, polygonal, or cylindrical, etc., and are not specifically limited herein. After heat exchange with the electronic components, the refrigerant can enter the second heat exchanger 3 along the channels. The first fins 25 between at least some of the protrusions 24 can increase the heat exchange effect of the refrigerant in the heat exchange cavity 21, making the heat exchange between the first heat exchanger 2 and the electronic components more complete.

[0040] like Figure 4As shown, in one specific embodiment, the heat exchange cavity 21 is provided with a plurality of protrusions 26 and a plurality of second fins 27. The plurality of protrusions 26 are arranged at intervals along the length and width directions of the first heat exchanger 2. If the plurality of protrusions 26 arranged along the width direction of the first heat exchanger 2 are defined as a protrusion group, then the second fins 27 are located between at least a portion of adjacent protrusion groups. In this embodiment, the plurality of protrusion groups form a channel for refrigerant to flow, and the second fins 27 can increase the heat exchange effect of the refrigerant in the heat exchange cavity 21, making the heat exchange between the first heat exchanger 2 and the electronic components more sufficient, thereby improving the heat exchange performance of the first heat exchanger 2 and achieving a better heat exchange effect.

[0041] like Figure 5-7 As shown, in one specific embodiment, the second heat exchanger 3 includes a first manifold 33, a second manifold 34, a first connecting pipe 35, a second connecting pipe 36, and a plurality of first heat exchange tubes 37. The first heat exchange tubes 37 connect the first manifold 33 and the second manifold 34. The first connecting pipe 35 connects the heat exchange cavity 21 and the cavity of the first manifold 33, and the second connecting pipe 36 connects the heat exchange cavity 21 and the cavity of the second manifold 34. Along the width direction of the first heat exchanger 2, the interface between the first connecting pipe 35 and the heat exchange cavity 21 is closer to the second heat exchanger 3 than the interface between the second connecting pipe 36 and the heat exchange cavity 21.

[0042] like Figure 5-7 As shown, in this embodiment, the first manifold 33 is connected to the heat exchange chamber 21 of the first heat exchanger 2 via the first connecting pipe 35, and the second manifold 34 is connected to the heat exchange chamber 21 of the first heat exchanger 2 via the second connecting pipe 36. Specifically, the first connecting pipe 35 is connected to the upper part of the first heat exchanger 2, while the second connecting pipe 36 is connected to the lower part of the first heat exchanger 2. When the thermosiphon heat exchanger is working, the refrigerant evaporated in the first heat exchanger 2 enters the first manifold 33 through the first connecting pipe 35, and is distributed into each of the first heat exchange tubes 37 for heat exchange. The refrigerant after heat exchange and condensation enters the second manifold 34, and then circulates back to the heat exchange chamber 21 of the first heat exchanger 2 through the second connecting pipe 36.

[0043] It should be noted that in this embodiment, the first manifold 33 and the second manifold 34 can be integral manifolds, or they can be separate plate-type or combined manifolds. Furthermore, the first heat exchange tube 37 can be a conventional single-channel heat exchange tube or a multi-channel microchannel flat tube; this is not specifically limited herein. Generally, microchannel flat tubes have better heat exchange performance; therefore, the first heat exchange tube 37 in this embodiment is preferably a microchannel flat tube, and fins are provided between at least some of the adjacent microchannel flat tubes.

[0044] like Figure 8-9As shown, in another specific embodiment, the second heat exchanger 3 includes a third manifold 38 and a plurality of second heat exchange tubes 39. The plurality of second heat exchange tubes 39 are arranged at intervals along the length direction of the third manifold 38, and the second heat exchange tubes 39 connect the heat exchange chamber 21 and the cavity of the third manifold 38.

[0045] In this embodiment, the second heat exchanger 3 and the first heat exchanger 2 are an integral structure, meaning that multiple second heat exchange tubes 39 of the second heat exchanger 3 are directly connected to the heat exchange chamber 21 of the second heat exchanger 3. Generally, the second heat exchange tubes 39 are microchannel flat tubes with multiple channels. During heat exchange in the thermosiphon heat exchanger, most of the refrigerant evaporated in the first heat exchanger 2 enters the second heat exchange tubes 39 through the upper part and undergoes heat exchange. Then, it is collected in the third manifold 38 and, under pressure, circulates back to the heat exchange chamber 21 of the first heat exchanger 2 through the lower part of the second heat exchange tubes 39. This connection structure allows the first heat exchanger 2 and the second heat exchanger 3 to be directly connected without the need for other pipelines, resulting in a more compact overall structure and reducing the need for welding aluminum tubes between the two exchangers, thus reducing welding risks.

[0046] like Figure 2 As shown, in one specific embodiment, if the distance between two adjacent mounting cavities 11 is defined as the first gap 12, then the plurality of first gaps 12 include at least one first sub-gap 13 and at least one second sub-gap 14, wherein the first sub-gap 13 is larger than the second sub-gap 14.

[0047] As mentioned above, there are certain gaps between multiple electronic components, and these gaps are not necessarily completely equal. Therefore, in order to better adapt to this situation, the interval between two adjacent mounting cavities 11 can be preset according to the gap distance between the electronic components, so that the thermosiphon heat exchanger can better adapt to the distance between the electronic components.

[0048] In another specific embodiment, if the thickness of the first heat exchanger 2 is defined as T1 and the thickness of the first plate 1 is defined as T2, then T1 ≤ T2. In this embodiment, the first plate 1 can be an aluminum plate or other plate. Generally, the first plate 1 only needs to have a pre-reserved mounting cavity 11 for the first heat exchanger 2 to be installed. Therefore, the other parts of the first plate 1, except for the mounting cavity 11, can be solid, or they can be hollow or have other structures. This article does not make specific limitations on this, as long as it allows the first heat exchanger 2 to be installed stably. In addition, the specific connection method between the two can be welding, adhesive bonding, or mechanical connection such as screw fastening.

[0049] The main function of the first plate 1 is to pre-set the position of the first heat exchanger 2 according to the electronic components. Therefore, its thickness can be determined according to the actual installation environment without affecting the installation stability. Generally speaking, for cost considerations, the thickness of the first plate 1 can be set to be smaller than the thickness of the first heat exchanger 2, thereby reducing costs.

[0050] like Figure 10 As shown, in one specific embodiment, the first heat exchanger 2 has a first heat exchange surface 28 and a second heat exchange surface 29 on the side facing the first plate 1. The first heat exchange surface 28 and the second heat exchange surface 29 are arranged along the width direction of the first plate 1, and the surface area of ​​the first heat exchange surface 28 is greater than the surface area of ​​the second heat exchange surface 29.

[0051] The arrangement of some electronic components is not necessarily regular. For example, if there are a total of 6 electronic components, and 3 electronic components are grouped together, some of them need to have a large heat dissipation area and others need to have a small heat dissipation area. Therefore, the arrangement of the first heat exchange surface 28 and the second heat exchange surface 29 can be designed according to the requirements to adapt to different combinations of electronic components.

[0052] The above examples illustrate the principles and implementation methods of this application. The descriptions of the embodiments are merely for the purpose of helping to understand the methods and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications should also fall within the protection scope of this application.

Claims

1. A thermosiphon heat exchanger, characterized by The first plate (1), a plurality of first heat exchangers (2) and at least one second heat exchanger (3) are included, the first heat exchanger (2) has a heat exchange cavity (21), the heat exchange cavity (21) of the first heat exchanger (2) is communicated with the cavity of the second heat exchanger (3) and constitutes a circulating loop; the first plate (1) has a plurality of mounting cavities (11), at least part of the mounting cavities (11) are arranged along the length direction of the first plate (1), and the first heat exchanger (2) is at least partially located in the mounting cavity (11), and the first heat exchanger (2) is fixedly connected or detachably connected with the first plate (1).

2. The thermosiphon heat exchanger of claim 1, wherein, At least one first sub heat exchanger (22) and at least one second sub heat exchanger (23) are included in a plurality of the first heat exchangers (2), the content volume of the heat exchange cavity (21) of the first sub heat exchanger (22) is defined as V1, the content volume of the heat exchange cavity (21) of the second sub heat exchanger (23) is defined as V2, and V1>V2.

3. The thermosiphon heat exchanger of claim 2, wherein, The number of the second heat exchanger (3) is a plurality, one second heat exchanger (3) is communicated with the heat exchange cavity (21) of at least one first heat exchanger (2); at least one third sub heat exchanger (31) and at least one fourth sub heat exchanger (32) are included in a plurality of the second heat exchangers (3), the heat exchange area of the third sub heat exchanger (31) is defined as S1, the heat exchange area of the fourth sub heat exchanger (32) is defined as S2, and S1>S2.

4. The thermosiphon heat exchanger of claim 3, wherein, The third sub heat exchanger (31) is communicated with the heat exchange cavity (21) of the first sub heat exchanger (22), and / or the fourth sub heat exchanger (32) is communicated with the heat exchange cavity (21) of the second sub heat exchanger (23).

5. The thermosiphon heat exchanger of claim 2, wherein, A plurality of convex strips (24) and a plurality of first fins (25) are arranged in the heat exchange cavity (21), the length direction of the convex strip (24) at least partially extends along the length direction of the first heat exchanger (2), a plurality of the convex strips (24) are arranged along the width direction of the first heat exchanger (2), and the first fin (25) is located between at least part of the adjacent convex strips (24).

6. The thermosiphon heat exchanger of claim 2, wherein, A plurality of convex blocks (26) and a plurality of second fins (27) are arranged in the heat exchange cavity (21), a plurality of the convex blocks (26) are arranged along the length direction and the width direction of the first heat exchanger (2), a plurality of the convex blocks (26) arranged along the width direction of the first heat exchanger (2) are defined as a convex block group, and the second fin (27) is located between at least part of the adjacent convex block groups.

7. The thermosiphon heat exchanger of any of claims 1-6, wherein, The second heat exchanger (3) comprises a first header (33), a second header (34), a first connecting pipe (35), a second connecting pipe (36) and a plurality of first heat exchange pipes (37), the first heat exchange pipes (37) communicating the first header (33) and the second header (34); the first connecting pipe (35) communicates the heat exchange cavity (21) and the lumen of the first header (33), the second connecting pipe (36) communicates the heat exchange cavity (21) and the lumen of the second header (34); along the width direction of the first heat exchanger (2), the interface of the first connecting pipe (35) and the heat exchange cavity (21) is closer to the interface of the second connecting pipe (36) and the heat exchange cavity (21) than the second heat exchanger (3).

8. The thermosiphon heat exchanger of any of claims 1-6, wherein, The second heat exchanger (3) comprises a third header (38) and a plurality of second heat exchange pipes (39), the plurality of second heat exchange pipes (39) are arranged at intervals along the length direction of the third header (38), and the second heat exchange pipes (39) communicate the heat exchange cavity (21) and the lumen of the third header (38).

9. The thermosiphon heat exchanger of any of claims 1-6, wherein, The distance between two adjacent installation cavities (11) is defined as a first gap (12), and the plurality of first gaps (12) include at least one first sub-gap (13) and at least one second sub-gap (14), the first sub-gap (13) is greater than the second sub-gap (14).

10. The thermosiphon heat exchanger of any of claims 1-6, wherein, The first heat exchanger (2) has a first heat exchange surface (28) and a second heat exchange surface (29) on the side facing the first plate (1), the first heat exchange surface (28) and the second heat exchange surface (29) are arranged along the width direction of the first plate (1), and the surface area of the first heat exchange surface (28) is greater than that of the second heat exchange surface (29).

11. The thermosiphon heat exchanger of any of claims 1-6, wherein, The thickness of the first heat exchanger (2) is defined as T1, and the thickness of the first plate (1) is defined as T2, then T1≤T2.

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