High-temperature-resistant long-life thin-film capacitor packaging structure
By using a high-performance thermoplastic resin shell and conductive mechanism in the film capacitor encapsulation structure, the problems of temperature difference resistance and heat accumulation in the encapsulation structure are solved, thereby achieving high-temperature durability and extended lifespan of the capacitor.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-21
- Publication Date
- 2026-04-03
AI Technical Summary
Existing high-temperature, long-life film capacitor packaging structures have poor temperature resistance, and excessively thick packaging films cause heat accumulation, shortening capacitor lifespan, requiring frequent replacements, and increasing expenses.
It adopts a high-performance thermoplastic resin shell and is equipped with heat dissipation vents, cover plates, grooves, insulating sealing rings and insulating sealing rings. Combined with a conductive mechanism, including a wound conductive foil sheet and a rubber insulating ring, it can achieve effective heat dissipation and protection.
It extends the lifespan of the capacitor, prevents heat buildup, improves the capacitor's high-temperature resistance, and reduces the need for frequent replacements.
Smart Images
Figure CN224082330U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of capacitor-related technology, and in particular to the packaging structure of high-temperature resistant, long-life thin-film capacitors. Background Technology
[0002] Capacitor packaging serves as a bridge between design requirements and practical applications. During production, transportation, and use, capacitors may be subjected to mechanical forces such as impacts and compression. Packaging provides protection for the internal structure of the capacitor, preventing damage to components such as electrodes and dielectrics due to external mechanical forces, ensuring stable capacitor performance. Appropriate packaging can reduce interference from external electric and magnetic fields on the internal electric field distribution of the capacitor, making the capacitor's electrical properties such as capacitance and loss tangent more stable and unaffected by external factors. Packaging can keep the capacitor in a fixed position on the circuit board or other equipment, preventing it from loosening or shifting due to vibration or shaking during use, thereby ensuring circuit reliability.
[0003] However, most existing high-temperature long-life film capacitor packages have poor temperature resistance, and the excessively thick capacitor film causes heat accumulation. The heat generated during use cannot be properly dissipated, resulting in a shortened capacitor lifespan and frequent replacements, which increases expenses. Summary of the Invention
[0004] The purpose of this invention is to provide a high-temperature resistant, long-life film capacitor packaging structure to solve the problems mentioned in the background art. Most of the existing high-temperature resistant, long-life film capacitor packaging structures have poor temperature resistance, and the capacitor packaging film is too thick, which leads to heat accumulation. The heat generated by the capacitor during use cannot be handled, resulting in a shortened capacitor life and frequent replacement, which increases expenses.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-temperature resistant, long-life film capacitor encapsulation structure, comprising a high-performance thermoplastic resin shell, wherein a sealing mechanism is provided on the outside of the high-performance thermoplastic resin shell, and a conductive mechanism is provided inside the high-performance thermoplastic resin shell.
[0006] The sealing mechanism includes a heat dissipation vent, a cover plate, a groove, an insulating sealing ring, and an insulating sealing ring. The heat dissipation vent is provided at the bottom of the outer side of the high-performance thermoplastic resin shell. A cover plate is installed on the upper surface of the high-performance thermoplastic resin shell. A groove is provided on the inner wall of the cover plate. An insulating sealing ring is installed inside the cover plate. An insulating sealing ring is fixedly installed on the outside of the cover plate.
[0007] Preferably, the conductive mechanism includes a wound positive conductive foil, an insulating separator, a wound negative conductive foil, a first conductive outer foot, a second conductive outer foot, a first conductive inner foot, a second conductive inner foot, a first rubber insulating ring, and a second rubber insulating ring. The wound positive conductive foil is installed inside the high-performance thermoplastic resin shell. An insulating separator is installed on one side surface of the wound positive conductive foil. The wound negative conductive foil is installed on one side surface of the insulating separator. The first conductive outer foot is installed on the upper surface of the wound positive conductive foil. The second conductive outer foot is installed on the upper surface of the wound negative conductive foil. The first conductive inner foot is installed at the outer bottom end of the first conductive outer foot. The second conductive inner foot is installed at the outer bottom end of the second conductive outer foot. The first rubber insulating ring is fixedly installed on the outside of the first conductive outer foot. The second rubber insulating ring is fixedly installed on the outside of the second conductive outer foot.
[0008] Preferably, the heat dissipation vents are equally spaced on the outer bottom surface of the high-performance thermoplastic resin shell, and the grooves are formed inside the cover plate.
[0009] Preferably, the inner wall dimensions of the cover plate match the outer wall dimensions of the insulating sealing ring.
[0010] Preferably, the first conductive outer pin is electrically connected to the first conductive inner pin, and the second conductive outer pin is electrically connected to the second conductive inner pin.
[0011] Preferably, an insulating separator is installed between the wound positive conductive foil and the wound negative conductive foil, and the inner wall size of the first rubber insulating ring matches the outer wall size of the first conductive outer foot.
[0012] Preferably, the inner wall dimension of the second rubber insulating ring matches the outer wall dimension of the second conductive outer foot.
[0013] Compared with the prior art, the beneficial effects of this utility model are: the high temperature resistant and long life film capacitor encapsulation structure uses PPS high temperature resistant material for its heat dissipation shell, which further extends the service life in extreme environments. The heat dissipation vents in the shell can dissipate the heat generated by the internal capacitor during use, effectively increasing the life of the capacitor. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall appearance and structure of the present utility model;
[0015] Figure 2 This is a schematic diagram of the structure of the insulating sealing ring and the cover plate used in conjunction with this utility model;
[0016] Figure 3 This is a schematic diagram of the structure of the insulating sealing ring and the cover plate used in conjunction with this utility model;
[0017] Figure 4 This is a schematic diagram of the structure of the wound positive conductive foil and the first conductive outer leg of this utility model.
[0018] Figure 5 This is a schematic diagram of the structure of the second conductive inner foot and the second conductive outer foot of this utility model in use.
[0019] In the diagram: 1. High-performance thermoplastic resin shell; 2. Sealing mechanism; 21. Heat dissipation vent; 22. Cover plate; 23. Groove; 24. Insulating sealing ring; 25. Insulating sealing ring; 3. Conductive mechanism; 31. Wound positive conductive foil; 32. Insulating insulating sheet; 33. Wound negative conductive foil; 34. First conductive outer pin; 35. Second conductive outer pin; 36. First conductive inner pin; 37. Second conductive inner pin; 38. First rubber insulating ring; 39. Second rubber insulating ring. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0021] Please see Figure 1-5 This utility model provides a technical solution: a high-temperature resistant long-life film capacitor encapsulation structure, including a high-performance thermoplastic resin shell 1, a sealing mechanism 2 provided on the outside of the high-performance thermoplastic resin shell 1, and a conductive mechanism 3 provided inside the high-performance thermoplastic resin shell 1.
[0022] The sealing mechanism 2 includes a heat dissipation vent 21, a cover plate 22, a groove 23, an insulating sealing ring 24, and an insulating sealing ring 25. A heat dissipation vent 21 is provided at the bottom outer end of the high-performance thermoplastic resin shell 1. A cover plate 22 is installed on the upper surface of the high-performance thermoplastic resin shell 1. A groove 23 is provided on the inner wall of the cover plate 22. An insulating sealing ring 24 is installed inside the cover plate 22, and an insulating sealing ring 25 is fixedly installed on the outside of the cover plate 22. Through the arrangement of the heat dissipation vent 21, cover plate 22, groove 23, insulating sealing ring 24, and insulating sealing ring 25, the high-performance thermoplastic resin shell 1 can effectively withstand high temperatures and extend the life of the capacitor when using it. The heat dissipation vent 21 on the high-performance thermoplastic resin shell 1 allows the heat generated during capacitor use to dissipate. The insulating sealing ring 24 installed in the groove 23 of the cover plate 22 prevents the capacitor from falling off, while the insulating sealing ring 25 reinforces the installation between the cover plate 22 and the high-performance thermoplastic resin shell 1, further preventing the capacitor from falling off.
[0023] Furthermore, the conductive mechanism 3 includes a wound positive conductive foil 31, an insulating separator 32, a wound negative conductive foil 33, a first conductive outer lead 34, a second conductive outer lead 35, a first conductive inner lead 36, a second conductive inner lead 37, a first rubber insulating ring 38, and a second rubber insulating ring 39. The wound positive conductive foil 31 is installed inside the high-performance thermoplastic resin shell 1. An insulating separator 32 is installed on one side surface of the wound positive conductive foil 31, and a wound negative conductive foil 33 is installed on one side surface of the insulating separator 32. A negative conductive foil 33 and a wound positive conductive foil 31 are provided with a first conductive outer foot 34 on their upper surfaces. A second conductive outer foot 35 is provided on the upper surface of the wound negative conductive foil 33. A first conductive inner foot 36 is provided at the outer bottom end of the first conductive outer foot 34, and a second conductive inner foot 37 is provided at the outer bottom end of the second conductive outer foot 35. A first rubber insulating ring 38 is fixedly installed on the outside of the first conductive outer foot 34, and a second rubber insulating ring 39 is fixedly installed on the outside of the second conductive outer foot 35. The foil is wound... The arrangement of the positive conductive foil 31, insulating separator 32, wound negative conductive foil 33, first conductive outer pin 34, second conductive outer pin 35, first conductive inner pin 36, second conductive inner pin 37, first rubber insulating ring 38, and second rubber insulating ring 39, ensures that the first conductive inner pin 36, mounted on the wound positive conductive foil 31, firstly transfers positive electrons to the first conductive outer pin 34, thereby filling the first conductive outer pin 34 with positive electrons. Meanwhile, the wound negative conductive foil 33... The second conductive inner pin 37 of 3 will deliver negative electrons to the second conductive outer pin 35, thereby filling the second conductive outer pin 35 with negative electrons. An insulating separator (32) will be inserted between the wound positive conductive foil (31) and the wound negative conductive foil (33) to prevent the two foils from reacting first and losing electrons. The first rubber insulating ring (38) and the second rubber insulating ring (39) protect the external connection between the first conductive outer pin (34) and the second conductive outer pin (35) to prevent poor contact and damage to the capacitor.
[0024] Furthermore, heat dissipation vents 21 are evenly spaced on the outer bottom surface of the high-performance thermoplastic resin shell 1, and grooves 23 are formed inside the cover plate 22. Through the function of heat dissipation vents 21, the heat generated during capacitor operation can be dissipated.
[0025] Furthermore, the inner wall dimensions of the cover plate 22 match the outer wall dimensions of the insulating sealing ring 24, thus preventing the capacitor from having undesirable contact with the outside world through the function of the insulating sealing ring 24.
[0026] Furthermore, the first conductive outer pin 34 is electrically connected to the first conductive inner pin 36, and the second conductive outer pin 35 is electrically connected to the second conductive inner pin 37. Through the setting of the first conductive outer pin 34, the positive electrons on the wound positive conductive foil (31) can be transported to the first conductive outer pin 34.
[0027] Furthermore, an insulating separator 32 is installed between the wound positive conductive foil 31 and the wound negative conductive foil 33. The inner wall size of the first rubber insulating ring 38 matches the outer wall size of the first conductive outer foot 34. By setting the insulating separator 32, contact between the wound positive conductive foil 31 and the wound negative conductive foil 33 is prevented, thus preventing electron deactivation.
[0028] Furthermore, the inner wall size of the second rubber insulating ring 39 matches the outer wall size of the second conductive outer foot 36. The setting of the second rubber insulating ring 39 prevents poor contact between the second conductive outer foot 36 and external equipment.
[0029] Working principle: When using this capacitor, the high-performance thermoplastic resin shell 1 effectively withstands high temperatures, extending the capacitor's lifespan. The heat dissipation vent 21 on the high-performance thermoplastic resin shell 1 allows the heat generated during capacitor use to dissipate. The insulating sealing ring 24 installed in the groove 23 of the cover plate 22 prevents the capacitor from falling off, while the insulating sealing ring 25 reinforces the installation between the cover plate 22 and the high-performance thermoplastic resin shell 1, further preventing the capacitor from falling off. The first conductive inner leg 36 installed on the wound positive conductive foil 31 first transports positive electrons through the first conductive inner leg 36 to the first conductive outer leg 3. 4. This allows the first conductive outer foot 34 to be filled with positive electrons, while the second conductive inner foot 37, which is installed on the wound negative conductive foil 33, will deliver negative electrons to the second conductive outer foot 35, thereby filling the second conductive outer foot 35 with negative electrons. An insulating separator (32) will be inserted between the wound positive conductive foil (31) and the wound negative conductive foil (33) to prevent the two foils from reacting first and losing electrons. The first rubber insulating ring (38) and the second rubber insulating ring (39) will protect the external connection between the first conductive outer foot (34) and the second conductive outer foot (35) to prevent poor contact and damage to the capacitor.
Claims
1. A high-temperature-resistant long-life thin film capacitor package structure comprising a high-performance thermoplastic resin housing (1), characterized in that: The high-performance thermoplastic resin shell (1) is externally provided with a sealing mechanism (2), and the high-performance thermoplastic resin shell (1) is internally provided with a conductive mechanism (3). The sealing mechanism (2) comprises a heat dissipation opening (21), a cover plate (22), a groove (23), an insulating sealing rubber ring (24) and an insulating sealing ring (25), the bottom end of the outer surface of the high-performance thermoplastic resin shell (1) is provided with the heat dissipation opening (21), the upper surface of the high-performance thermoplastic resin shell (1) is provided with the cover plate (22), the inner wall of the cover plate (22) is provided with the groove (23), the inside of the cover plate (22) is provided with the insulating sealing rubber ring (24), and the outside of the cover plate (22) is fixedly provided with the insulating sealing ring (25).
2. The high-temperature long-life thin film capacitor package structure of claim 1, wherein: The conductive mechanism (3) comprises a coiled positive electrode conductive foil (31), an insulating isolation sheet (32), a coiled negative electrode conductive foil (33), a first conductive outer leg (34), a second conductive outer leg (35), a first conductive inner leg (36), a second conductive inner leg (37), a first rubber isolation ring (38) and a second rubber isolation ring (39), the inside of the high-performance thermoplastic resin shell (1) is provided with the coiled positive electrode conductive foil (31), one side surface of the coiled positive electrode conductive foil (31) is provided with the insulating isolation sheet (32), one side surface of the insulating isolation sheet (32) is provided with the coiled negative electrode conductive foil (33), the upper surface of the coiled positive electrode conductive foil (31) is provided with the first conductive outer leg (34), the upper surface of the coiled negative electrode conductive foil (33) is provided with the second conductive outer leg (35), the bottom end of the outside of the first conductive outer leg (34) is provided with the first conductive inner leg (36), the bottom end of the outside of the second conductive outer leg (35) is provided with the second conductive inner leg (37), the outside of the first conductive outer leg (34) is fixedly provided with the first rubber isolation ring (38), and the outside of the second conductive outer leg (35) is fixedly provided with the second rubber isolation ring (39).
3. The high-temperature long-life thin film capacitor package structure of claim 1, wherein: The heat dissipation opening (21) is arranged at equal intervals on the outer bottom end surface of the high-performance thermoplastic resin shell (1), and the groove (23) is arranged in the inside of the cover plate (22).
4. The high-temperature long-life thin film capacitor package structure of claim 1, wherein: The inner wall size of the cover plate (22) is consistent with the outer wall size of the insulating sealing rubber ring (24).
5. The high-temperature long-life thin film capacitor package structure of claim 2, wherein: The first conductive outer leg (34) and the first conductive inner leg (36) are electrically connected, and the second conductive outer leg (35) and the second conductive inner leg (37) are electrically connected.
6. The high-temperature long-life thin film capacitor package structure of claim 2, wherein: The insulating isolation sheet (32) is arranged between the coiled positive electrode conductive foil (31) and the coiled negative electrode conductive foil (33), and the inner wall size of the first rubber isolation ring (38) is consistent with the outer wall size of the first conductive outer leg (34).
7. The high-temperature long-life thin film capacitor package structure of claim 2, wherein: The inner wall size of the second rubber isolation ring (39) is consistent with the outer wall size of the second conductive outer leg (35).