Kovar alloy substrate bottom shell for layering communication mainboard

Abstract

The utility model relates to the field of precise instrument processing, in particular to a kovar alloy substrate bottom shell for layering a communication mainboard. The bottom shell comprises a bottom shell body, a limiting protrusion, a fixed connecting piece, a turning limiting piece, a first containing area, a second mainboard containing area, a fixing piece and a lead screw. Limiting protrusions are arranged on the top faces of the two sides of the bottom shell body, the two limiting protrusions are different in length, the fixed connecting piece is arranged on one side of the bottom shell body, and the turning limiting piece is located between the two limiting protrusions and divides the top of the bottom shell body into a first mainboard containing area and a second mainboard containing area. The two sets of fixing pieces are installed on the limiting protrusions and the turning limiting piece correspondingly, and the lead screw penetrates through the two sets of fixing pieces. Due to the design of the limiting clamping plate and the extending cover plate, the movement range of the main board is limited, additional protection is provided, accidental movement or damage of the main board in the layering process is prevented, and safety of the main board is ensured.

Description

Technical Field

[0001] This utility model relates to the field of precision instrument processing, and in particular to a Kovar alloy substrate bottom shell for layering communication motherboards. Background Technology

[0002] A communication motherboard typically refers to the core circuit board in electronic communication equipment, responsible for signal processing, data transmission, and device control. In communication devices such as mobile phones, routers, and base stations, the motherboard is its heart, undertaking crucial computing, storage, and communication functions. A mobile phone motherboard, for example, includes key components such as a central processing unit (CPU), memory, radio frequency (RF) module, power management unit, audio processor, camera interface, and display interface, forming the foundation for the phone's functions such as calls, data transmission, and multimedia processing. In broader communication fields, such as network equipment, the motherboard may include a high-performance processor, network interface controller (NIC), ample memory and storage, and various dedicated chips for packet processing and routing, ensuring high-speed and stable data transmission within the network.

[0003] However, existing traditional mobile phone motherboards often encounter the following problems during use:

[0004] In traditional mobile phone motherboards, the motherboard needs to be manually placed onto the substrate bottom shell during the layering process. Since the motherboard is a precision instrument and is small and thin, it can only be placed little by little with tweezers to ensure that it does not wobble or lift up on the substrate bottom shell before layering. Finally, the edges of the motherboard are rubbed little by little with tweezers to create gaps in order to complete the layering. The whole process is time-consuming, laborious, and prone to errors. Utility Model Content

[0005] The main objective of this invention is to provide a Kovar alloy substrate bottom shell for layering communication motherboards, so as to effectively solve the problem mentioned in the background art that the traditional mobile phone motherboard layering process is time-consuming and laborious, and prone to errors.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A Kovar alloy substrate bottom shell for a layered communication motherboard, comprising:

[0008] The bottom shell body has limit protrusions on the top surfaces of both sides;

[0009] The limiting protrusion is provided in two parts, and the two limiting protrusions have different lengths;

[0010] A fixing connector is provided on one side of the bottom shell body;

[0011] A turning limiter is located between the two limiting protrusions, and the turning limiter divides the top of the bottom shell body into a first motherboard placement area and a second motherboard placement area.

[0012] The fastener is provided in two sets, and the two sets of fasteners are respectively installed on one of the limiting protrusions and the turning limiting member;

[0013] A lead screw, which passes through two sets of the fixing members;

[0014] A deflector, which is sleeved onto the body of the lead screw;

[0015] A push plate, which is installed at one end of the lead screw;

[0016] The motherboard slot is provided in both the first motherboard placement area and the second motherboard placement area.

[0017] Also includes:

[0018] A limiting snap-fit ​​plate, wherein the limiting snap-fit ​​plate is hinged to any one of the limiting protrusions;

[0019] Card interface, wherein the card interface is provided on the limiting card receiving plate;

[0020] A snap-fit ​​protrusion is provided at one of the limiting protrusions.

[0021] The second motherboard is placed in an area smaller than the first motherboard placement area.

[0022] The fixed connector has a connecting through hole.

[0023] The deflector is provided in a set, and the bottom end of the deflector is the deflection end.

[0024] The snap-fit ​​protrusion and the limiting snap-fit ​​plate are respectively disposed on two different limiting protrusions.

[0025] An extension cover is provided on one side of the limiting snap plate.

[0026] Compared with existing technologies, the beneficial effects of this utility model are as follows: The design of the limiting latch plate and extension cover plate not only restricts the range of motion of the motherboard but also provides additional protection to prevent accidental movement or damage to the motherboard during the layering process, ensuring the safety of the motherboard. Furthermore, the design of the folding lever and push plate greatly reduces the need for fine adjustments during the layering process. Through the linkage of the mechanical structure, the layering process is completed automatically, improving efficiency and reducing errors caused by human operation. Attached Figure Description

[0027] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the specific embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof.

[0028] Figure 1 This is a schematic diagram of the overall shape of the present utility model.

[0029] Figure 2 For Figure 1 A magnified view of A in the middle.

[0030] The diagram shows the following components: 1. Bottom shell body; 2. Limiting protrusion; 3. Fixed connector; 4. Turning limiting component; 41. First placement area; 42. Second mainboard placement area; 5. Fixing component; 6. Lead screw; 7. Turning lever; 8. Push plate; 9. Mainboard slot; 10. Limiting locking plate; 11. Locking interface; 12. Locking protrusion. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] like Figure 1-2As shown, a Kovar alloy substrate bottom shell for layering communication motherboards includes: a bottom shell body 1, limiting protrusions 2, fixing connectors 3, turning limiting connectors 4, a first placement area 41, a second motherboard placement area 42, a fixing component 5, a lead screw 6, a turning lever 7, a push plate 8, and a motherboard mounting slot 9. Limiting protrusions 2 are provided on the top surfaces of both sides of the bottom shell body 1. The bottom shell body 1 is the foundation of the entire structure, used to support and fix the motherboard, ensuring the stability of the motherboard during the layering process. Two limiting protrusions 2 are provided, with different lengths. The fixing connector 3 is located on one side of the bottom shell body 1, and has a connecting through hole. The connector and the through hole are used to fix the bottom shell body 1 to the device, ensuring stability during operation. Stainless steel is recommended due to its high strength and corrosion resistance. The turning limiting connector 4 is located between the two limiting protrusions 2, dividing the top of the bottom shell body 1 into the first motherboard placement area and the second motherboard placement area 42.

[0034] Preferably, two sets of fixing members 5 are provided, and the two sets of fixing members 5 are respectively installed on a limiting protrusion 2 and a turning limiting member 4. The lead screw 6 passes through the two sets of fixing members 5, and the turning lever 7 is sleeved on the body of the lead screw 6. One set of turning levers 7 is provided, and the bottom end of the set of turning levers 7 is the turning end. The turning lever 7 is relatively thin and light, so it is made of high-strength plastic, such as polycarbonate PC, which has good toughness and can withstand repeated bending. The push plate 8 is installed at one end of the lead screw 6, and both the first main board placement area and the second main board placement area 42 are provided with main board locking slots 9.

[0035] In this embodiment, the limiting latching plate 10 is hinged to any one of the limiting protrusions 2, and an extension cover is provided on one side of the limiting latching plate 10. The extension cover is provided so that when the limiting latching plate 10 is closed to restrict the longitudinal movement of the first motherboard placement area, the extension cover located on one side of the limiting latching plate 10 will also cover the second motherboard placement area 42, providing conditions for two motherboards of different sizes to be layered simultaneously. Here, the limiting latching plate 10 is made of stainless steel to enhance durability; the extension cover can be made of lightweight aluminum alloy to ensure the balance of the flip cover. The latching interface 11 is opened on the limiting latching plate 10, and the latching protrusion 12 is provided on one of the limiting protrusions 2. The latching protrusion 12 and the limiting latching plate 10 are respectively provided on two different limiting protrusions 2.

[0036] It should be noted that the Kovar alloy substrate bottom shell for layering communication motherboards designed in this utility model is used in the following way: When layering a mobile phone motherboard requires layering, the corresponding size of the mobile phone motherboard is placed in the motherboard placement slot, and the bottom shell body 1 is fixed by screws through the fixing connector 3 to ensure the stability of the layering process. After fixing, the locking interface 11 of the limiting locking plate 10 is covered and engages with the locking protrusion 12 to restrict the vertical movement range of the mobile phone motherboard. Then, the push plate 8 is moved by tweezers. The push plate 8 rotates and drives the lead screw 6. The rotation of the lead screw 6 will drive a set of turning paddles 7 on the rod body. The turning end of the turning paddle 7 will hook the thin layer of the mobile phone motherboard, making it lift up and create a gap with the mobile phone motherboard. At this time, the limiting locking plate 10 is flipped open, and the layering is completed by clamping it with tweezers. It is simple and quick. There is no need to make many manual fine adjustments and then layer by layer.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations may be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A Kovar alloy substrate base shell for layered communication main boards, characterized by, Including: The bottom shell body (1), the top surface of both sides of the bottom shell body (1) is provided with a limiting protrusion (2); The limiting protrusion (2) is provided with two, the lengths of the two limiting protrusions (2) are different; The fixed connecting piece (3) is arranged on one side of the bottom shell body (1); The turning limiting piece (4) is located between the two limiting protrusions (2), and the turning limiting piece (4) divides the top of the bottom shell body (1) into a first mainboard placement area and a second mainboard placement area (42); The fixing piece (5) is provided with two groups, and the two groups of fixing pieces (5) are respectively installed on the limiting protrusion (2) and the turning limiting piece (4); The lead screw (6) is provided with two groups of fixing pieces (5); The turning tab (7) is sleeved on the rod body of the lead screw (6); The push plate (8) is installed on one end of the lead screw (6); The mainboard clamping groove (9) is provided in the first mainboard placement area and the second mainboard placement area (42).

2. The Kovar alloy base plate chassis for layered communication main boards according to claim 1, characterized in that, Also including: The limiting clamping plate (10) is hinged with any one of the limiting protrusions (2); The clamping port (11) is provided on the limiting clamping plate (10); The clamping protrusion (12) is provided on one of the limiting protrusions (2).

3. The Kovar alloy base plate chassis for layered communication main boards of claim 1, wherein The second mainboard placement area is smaller than the first mainboard placement area.

4. The Kovar alloy base plate chassis for layered communication main boards of claim 1, wherein The fixed connecting piece (3) is provided with a connecting through hole.

5. The Kovar alloy base plate chassis for layered communication main boards of claim 1, wherein The turning tab (7) is provided with a group, and the bottom end of one of the turning tabs (7) is a turning end.

6. The Kovar alloy base plate chassis for layered communication main boards of claim 2, wherein The clamping protrusion (12) and the limiting clamping plate (10) are respectively provided on two different limiting protrusions (2).

7. The Kovar alloy base plate chassis for layered communication main boards of claim 2, wherein One side of the limiting clamping plate (10) is provided with an extension cover plate.

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