Case of switch and switch
By adopting a flat bottom plate structure in the switch chassis and adding a power supply top plate and a bottom plate that are tightly attached to the EMI spring, the cost and deformation problems caused by the bulge are solved, better sealing and anti-interference effects are achieved, and the appearance quality is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2026-04-03
AI Technical Summary
The existing method of setting bulges on the top and bottom plates of switch chassis to reduce electromagnetic interference increases production costs and the risk of deformation, while also affecting the appearance.
The chassis adopts a flat bottom plate structure. By adding a power supply top plate and a power supply bottom plate to fit the EMI springs, a tight gap is formed to replace the convex bulge. The power supply top plate and bottom plate are respectively fitted to the EMI springs on the power supply module to achieve airtightness and anti-interference capability.
It reduced processing costs, prevented chassis deformation, improved airtightness and anti-interference capabilities, and enhanced the appearance.
Smart Images

Figure CN224083633U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of switches, and more particularly to switch chassis and switches. Background Technology
[0002] A switch is a network device used for forwarding electrical signals, providing a dedicated electrical signal path for any two network nodes connected to the switch. Existing switches mainly consist of a chassis and components such as the motherboard, CPU, heatsink module, and power supply module installed inside. To reduce the impact of electromagnetic interference (EMI), EMI springs are typically installed on various components, such as on the power supply module. The principle of EMI springs is to seal gaps, diverting high-frequency electromagnetic interference to ground, achieving a short circuit and thus reducing EMI. To achieve this, the top and bottom plates of the chassis are often fitted with bumps to tightly seal the EMI springs. However, adding bumps to the top and bottom plates of the chassis requires additional processing steps, increasing production costs. Furthermore, adding bumps to the top and bottom plates significantly increases the risk of deformation and affects the appearance.
[0003] Therefore, there is an urgent need for a switch chassis and switch that do not require a convex hull to overcome the above-mentioned defects. Utility Model Content
[0004] The purpose of this invention is to provide a switch chassis that does not require a convex hull.
[0005] Another objective of this invention is to provide a switch that does not require the installation of a convex hull.
[0006] To achieve the above objectives, the chassis of the switch of this utility model includes a chassis bottom plate, a power supply bottom plate, and a power supply top plate. The chassis bottom plate is a flat plate structure. The power supply bottom plate is installed on the chassis bottom plate. The power supply top plate is connected to the power supply bottom plate and is located above the power supply bottom plate. The power supply top plate and the power supply bottom plate together form a cavity for the installation of the power supply module, which is a through cavity. EMI springs are installed on the top and bottom of the power supply module. The power supply top plate and the power supply bottom plate are respectively attached to the EMI springs on the power supply module installed in the cavity.
[0007] Preferably, the power supply base plate includes a horizontally arranged bottom side plate and a vertically arranged connecting plate, the lower end of the connecting plate being connected to one side of the bottom side plate, and the power supply top plate being fixed to the upper end of the connecting plate.
[0008] Preferably, the system has two accommodating chambers arranged side by side in the left-right direction, with a power supply top plate spanning the two accommodating chambers, and the two accommodating chambers are separated by a power supply partition installed on the chassis bottom plate.
[0009] Preferably, the power supply top plate is also fixed to the top of the power supply partition.
[0010] Preferably, one side of the power supply top plate is bent downward to form a connecting part, and the connecting part is fixed to the upper end of the connecting plate.
[0011] Preferably, the top of the connecting plate is folded up to form a joining platform, and the other side of the power supply top plate is fixed to the joining platform.
[0012] Preferably, the bottom side plate and the top power supply plate are flat plate structures.
[0013] Preferably, the chassis of the switch of this utility model also includes multiple fan baffles installed on the bottom plate of the chassis. The multiple fan baffles are arranged at intervals in the left and right direction, and an installation space for the heat dissipation module is formed between each pair of fan baffles.
[0014] Preferably, the chassis of the switch of this utility model also includes a chassis top plate, which is a flat plate structure. The left and right sides of the chassis bottom plate are provided with vertically arranged chassis side plates. The top of the chassis side plates is flush with the power supply top plate. The chassis top plate is connected to the chassis side plates and is located directly above the chassis bottom plate.
[0015] To achieve the second objective mentioned above, this utility model also provides a switch, which includes the aforementioned chassis, power supply module, heat dissipation module, CPU, and motherboard.
[0016] Compared to existing technologies, this invention features a flat, straight chassis base plate without any protrusions. Instead, it replaces the protrusions with a top and bottom power supply plate. These plates are then used to tightly seal the EMI springs on the power module, achieving a tight fit. By eliminating the protrusions and using a flat base plate, manufacturing protrusions is unnecessary, effectively reducing manufacturing costs and avoiding deformation issues caused by protrusions. Furthermore, the surface is smoother, improving aesthetics. The tight fit between the top and bottom power supply plates and the EMI springs enhances airtightness and anti-interference capabilities, reducing electromagnetic interference. It is understood that the switch in this invention could also have protrusions to avoid chassis deformation, reduce manufacturing costs, and improve aesthetics. Attached Figure Description
[0017] Figure 1 This is a perspective view of the switch of this utility model after it has been separated from the top panel of the chassis.
[0018] Figure 2 This is a perspective view of the switch of this utility model after it is hidden behind the top panel of the chassis and separated from the top panel of the power supply.
[0019] Figure 3 This is a perspective view of the switch chassis of this utility model behind the hidden top panel.
[0020] Figure 4yes Figure 3 The structure shown is a three-dimensional view after being separated from the power supply top plate. Detailed Implementation
[0021] To explain the technical content and structural features of this utility model in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.
[0022] like Figures 1 to 4 As shown, this utility model provides a switch chassis 100, hereinafter referred to as chassis 100 for ease of description. The chassis 100 of this utility model includes a chassis base plate 10, a power supply base plate 20, and a power supply top plate 30. The chassis base plate 10 is a flat plate structure without any protrusions. The power supply base plate 20 is mounted on the chassis base plate 10, and the power supply top plate 30 is connected to the power supply base plate 20 and positioned above it. The power supply top plate 30 and the power supply base plate 20 together form a through-cavity accommodating chamber 40 for mounting a power supply module 200. EMI springs 210 are mounted on the top and bottom of the power supply module 200, and the power supply top plate 30 and the power supply base plate 20 are respectively abutted against the EMI springs 210 on the power supply module 200 installed in the accommodating chamber 40.
[0023] In this invention, the chassis base plate 10 is designed as a flat plate structure without any protrusions. Instead, a power supply top plate 30 and a power supply base plate 20 are added to replace the protrusions. Specifically, the power supply top plate 30 and power supply base plate 20 are used to press against the EMI spring clips 210 on the power supply module 200 to achieve a tight seal. Since no protrusions are present on the chassis base plate 10, and the chassis base plate 10 is designed as a flat plate structure, there is no need to process protrusions, effectively reducing processing costs and avoiding deformation problems caused by processing protrusions. Furthermore, the appearance is flatter, improving aesthetics. After the power supply top plate 30 and power supply base plate 20 are pressed against the EMI spring clips 210, the gaps are sealed, improving airtightness and anti-interference capabilities, and reducing electromagnetic interference.
[0024] like Figures 1 to 4 As shown, the power supply base plate 20 includes a horizontally arranged bottom side plate 21 and a vertically arranged connecting plate 22. The lower end of the connecting plate 22 is connected to one side of the bottom side plate 21, and the power supply top plate 30 is fixed to the upper end of the connecting plate 22. Preferably, the power supply base plate 20 is a one-piece structure, with the bottom side plate 21 and the connecting plate 22 formed by stamping. The bottom side plate 21 and the connecting plate 22 are arranged approximately orthogonally.
[0025] like Figures 1 to 4As shown, the chassis 100 of this utility model has two accommodating chambers 40 arranged side by side in the left-right direction, which can accommodate two power supply modules 200. A power supply top plate 30 spans the two accommodating chambers 40, and the two accommodating chambers 40 are separated by a power supply partition 50 installed on the chassis bottom plate 10. After separating the two power supply modules 200 using the power supply partition 50, the two power supply modules 200 are independent and do not interfere with each other. Furthermore, the power supply top plate 30 spanning the two accommodating chambers 40 improves the overall integrity. Further, the power supply top plate 30 is also fixed to the top of the power supply partition 50 to enhance the installation stability of the power supply top plate 30. Preferably, the power supply top plate 30 is riveted to the top of the power supply partition 50.
[0026] like Figures 1 to 4 As shown, the right side of the power supply top plate 30 bends downward to form a connecting part 31, which is fixed to the upper end of the connecting plate 22 of the power supply bottom plate 20 located on the right. The connecting part 31 facilitates the connection and fixation of the upper end of the connecting plate 22. Preferably, the connecting part 31 and the upper end of the connecting plate 22 are riveted together, but it is not limited to this; they can also be connected and fixed by welding.
[0027] like Figures 1 to 4 As shown, the top of the connecting plate 22 of the power supply base plate 20 located on the left is folded to form a joining platform 23. The left side of the power supply top plate 30 is fixed to the joining platform 23. The joining platform 23 is provided to facilitate docking and fixing with the left side of the power supply top plate 30. Preferably, the joining platform 23 and the left side of the power supply top plate 30 are riveted to each other, but it is not limited to this. They can also be connected and fixed by welding.
[0028] like Figures 1 to 4 As shown, the bottom side plate 21 and the power supply top plate 30 are flat plate structures. The bottom side plate 21 and the power supply top plate 30 function as a kind of "protrusion". The setting of the power supply top plate 30 will eliminate the need for a protrusion on the chassis top plate 80 (see below). Preferably, the bottom side plate 21 is fixed to the chassis bottom plate 10 by riveting.
[0029] like Figures 1 to 4 As shown, the chassis 100 of this utility model also includes multiple fan baffles 60 mounted on the chassis base plate 10. The multiple fan baffles 60 are arranged at intervals in the left-right direction, and a mounting space 70 for the heat dissipation module 300 (see below) is formed between each pair of fan baffles 60. The heat dissipation module 300 is separated by the fan baffles 60. After the heat dissipation module 300 is installed in the mounting space 70, the fan baffles 60 will be in close contact with the EMI springs mounted on the heat dissipation module 300. The chassis base plate 10 and the chassis top plate 80 described below will also be in close contact with the EMI springs mounted on the heat dissipation module 300, sealing the gaps and eliminating electromagnetic interference. Preferably, a total of 3 fan baffles 60 are provided, but it is not limited to this.
[0030] like Figures 1 to 4 As shown, the chassis 100 of this utility model also includes a chassis top plate 80, which is a flat plate structure. The chassis bottom plate 10 has vertically arranged chassis side plates 11 on its left and right sides. The top of the chassis side plates 11 is flush with the power supply top plate 30. The chassis top plate 80 is connected to the chassis side plates 11 and is located directly above the chassis bottom plate 10.
[0031] like Figures 1 to 4 As shown, the chassis 100 of this utility model is applied to a switch 1000. The switch 1000 also includes a power supply module 200, a heat dissipation module 300, a CPU 400, and a motherboard 500, etc. Other structures are not listed in detail. The power supply module 200 is installed in the accommodating chamber 40, and the heat dissipation module 300 is installed in the installation space 70. To facilitate the positioning of the heat dissipation module 300, CPU 400, and motherboard 500 in the chassis 100, positioning pins (not shown) are installed on the chassis base plate 10. The above components are inserted into the positioning pins and move into place along the positioning pins.
[0032] Figure 3 In the diagram, arrow X points from left to right, arrow Z points from top to bottom, and arrow Y points from front to back.
[0033] The above-disclosed examples are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall fall within the scope of the present utility model.
Claims
1. A chassis for a switch, the chassis comprising: The power supply top plate and the power supply bottom plate enclose a containing cavity for installing a power supply module, the top and bottom of the power supply module are respectively installed with EMI elastic sheets, and the power supply top plate and the power supply bottom plate are respectively attached to the EMI elastic sheets on the power supply module installed in the containing cavity.
2. The chassis of a switch according to claim 1, wherein, The power supply bottom plate comprises a bottom side plate arranged horizontally and a connecting plate arranged vertically, the lower end of the connecting plate is connected to one side of the bottom side plate, and the power supply top plate is fixed to the upper end of the connecting plate.
3. The chassis of a switch according to claim 1, wherein, Two containing cavities are arranged side by side along the left-right direction, the power supply top plate spans the two containing cavities, and the two containing cavities are separated by a power supply partition plate installed on the case bottom plate.
4. The chassis of a switch according to claim 3, wherein, The power supply top plate is also fixed to the top of the power supply partition plate.
5. The chassis of a switch according to claim 2, wherein, One side of the power supply top plate is bent downward to form a connecting portion, and the connecting portion is fixed to the upper end of the connecting plate.
6. The chassis of a switch according to claim 2, wherein, The top end of the connecting plate is folded to form a joint platform, and the other side of the power supply top plate is fixed to the joint platform.
7. The chassis of a switch according to claim 2, wherein, The bottom side plate and the power supply top plate are flat plate structures.
8. The chassis of a switch according to claim 1, wherein, A plurality of fan partition plates are installed on the case bottom plate, the plurality of fan partition plates are arranged at intervals along the left-right direction, and an installation space for installing a heat dissipation module is enclosed between every two fan partition plates.
9. The chassis of a switch according to claim 1, wherein, The case top plate is a flat plate structure, vertical case side plates are arranged on the left and right sides of the case bottom plate, the top of the case side plate is flush with the power supply top plate, and the case top plate is connected to the case side plate and arranged directly above the case bottom plate.
10. A switch, characterized by The case, the power supply module, the heat dissipation module, the CPU and the main board as claimed in any one of claims 1-9 are included.