Printed circuit board bonding pad structure, printed circuit board debugging assembly and printed circuit board

Abstract

The utility model provides a printed circuit board bonding pad structure. The printed circuit board bonding pad structure comprises a first bonding pad and a second bonding pad which are oppositely arranged; the first connecting part is arranged between the first bonding pad and the second bonding pad, and the first connecting part is electrically connected with the first bonding pad; the first connecting part comprises at least one first lug boss, and the first lug boss extends from the position of the first bonding pad to the direction of the second bonding pad; the second connecting part is arranged between the first bonding pad and the second bonding pad, and the second connecting part is electrically connected with the second bonding pad; the second connecting part comprises at least one second lug boss, and the second lug boss extends from the position of the second bonding pad to the direction of the first bonding pad; wherein the first connecting part and the second connecting part are arranged at an interval. The printed circuit board bonding pad structure provided by the utility model is beneficial to reducing the cost and improving the reliability. The utility model also provides a printed circuit board debugging assembly and a printed circuit board.

Description

Technical Field

[0001] This application relates to printed circuit board pad structures, including printed circuit board debugging components and printed circuit boards of the printed circuit board pad structures. Background Technology

[0002] Zero-ohm resistors are widely used in printed circuit boards (PCBs), for example, as current measurement nodes during debugging or as components for verifying circuit parameters. However, zero-ohm resistors have no actual electrical function in the circuit, leading to increased product costs. One solution is to retain the zero-ohm resistor pads, connecting the two pads with copper foil. During debugging, the copper foil is cut with a blade before soldering the resistor. However, this method is inconvenient, and cutting the PCB with a blade may also cut inner layer traces, rendering the entire PCB unusable. Utility Model Content

[0003] Therefore, it is necessary to provide a printed circuit board pad structure that is both highly reliable and low in cost.

[0004] The first aspect of this application provides a printed circuit board pad structure, which includes:

[0005] The first and second pads are set relative to each other;

[0006] A first connecting portion is disposed between the first pad and the second pad, and the first connecting portion is electrically connected to the first pad; the first connecting portion includes at least one first protrusion extending from the position of the first pad toward the second pad; and

[0007] A second connection portion is disposed between the first pad and the second pad, and the second connection portion is electrically connected to the second pad; the second connection portion includes at least one second protrusion, and the second protrusion extends from the position of the second pad toward the first pad;

[0008] The first connecting portion and the second connecting portion are spaced apart.

[0009] The printed circuit board pad structure provided in this application embodiment, by setting a first connecting part and a second connecting part between the first pad and the second pad, allows the connection and disconnection between the first pad and the second pad to be achieved through the electrical connection and disconnection between the first connecting part and the second connecting part. This eliminates the need to damage the structure of the printed circuit board pad structure itself, and also eliminates the need to set an additional zero-ohm resistor, which helps to improve the reliability of the printed circuit board pad structure and reduce costs.

[0010] In one embodiment, the projections of the first protrusion and the second protrusion at least partially overlap in a first direction, which is perpendicular to the arrangement direction of the first pad and the second pad.

[0011] In one embodiment, a plurality of first protrusions are spaced apart along a first direction; the second connecting portion includes a plurality of second protrusions spaced apart, each second protrusion being disposed between two adjacent first protrusions.

[0012] In one embodiment, the first protrusions are arranged in parallel along a first direction, the second protrusions are arranged in parallel along the first direction, and each second protrusion is disposed between two adjacent first protrusions.

[0013] In one embodiment, a plurality of first protrusions are continuously arranged along the second direction, and a first recess is formed between two adjacent first protrusions. The second connecting portion includes a plurality of second protrusions continuously arranged, and each second protrusion is disposed opposite to a first recess.

[0014] A second aspect of this application provides a printed circuit board debugging assembly, comprising:

[0015] The above-described printed circuit board pad structure;

[0016] A first feeding mesh, wherein the first feeding mesh has a first through hole, the first through hole being configured such that when the first feeding mesh covers the printed circuit board pad structure, the first pad, the second pad, and the gap between the first pad and the second pad are exposed through the first through hole; and

[0017] The second feeding screen has a second through hole and a third through hole spaced apart. The second through hole and the third through hole are configured such that when the second feeding screen covers the printed circuit board pad structure, the first pad is exposed through the second through hole and the second pad is exposed through the third through hole.

[0018] The printed circuit board debugging assembly provided in this application embodiment, by setting a first connecting portion and a second connecting portion between a first pad and a second pad, allows the connection between the first pad and the second pad to be switched on or off through the electrical connection between the first connecting portion and the second connecting portion. By setting a first feeding mesh, conductive material can be filled into the first through-hole to electrically connect the first connecting portion and the second connecting portion, thereby achieving the electrical connection between the first pad and the second pad. By setting a second feeding mesh, solder can be applied to the first pad and the second pad through the second through-hole and the third through-hole, thereby placing components on the printed circuit board pad structure. This does not require damaging the printed circuit board pad structure itself, nor does it require additional zero-ohm resistors, which helps improve the reliability of the printed circuit board pad structure and reduces costs.

[0019] In one embodiment, the printed circuit board debugging assembly further includes a debugging component for electrically connecting to the first pad and the second pad.

[0020] In one embodiment, the printed circuit board debugging assembly further includes a feeding assembly for filling solder into the first through hole or the second through hole and the third through hole, so that the solder adheres to the printed circuit board pad structure.

[0021] A third aspect of this application provides a printed circuit board, comprising:

[0022] The above-described printed circuit board pad structure.

[0023] The printed circuit board provided in this application embodiment, by providing a first connection portion and a second connection portion between the first pad and the second pad, enables the connection and disconnection between the first pad and the second pad to be achieved through the electrical connection and disconnection between the first connection portion and the second connection portion. This eliminates the need to damage the structure of the printed circuit board itself and eliminates the need to set an additional zero-ohm resistor, which is beneficial to improving the reliability of the printed circuit board pad structure and reducing costs.

[0024] In one embodiment, the printed circuit board further includes solder that at least covers the gap between the first pad and the second pad to enable electrical connection between the first connection portion and the second connection portion. Attached Figure Description

[0025] Figure 1 This is a common printed circuit board pad structure.

[0026] Figure 2 This is a schematic diagram of the printed circuit board pad structure in one embodiment of this application.

[0027] Figure 3This is a schematic diagram of the printed circuit board pad structure in another embodiment of this application.

[0028] Figure 4 This is a schematic diagram of the printed circuit board pad structure covered by the first feeding mesh in an embodiment of this application.

[0029] Figure 5 for Figure 4 A schematic diagram of the printed circuit board pad structure after material loading.

[0030] Figure 6 This is a schematic diagram of the printed circuit board pad structure covered by the second feeding mesh in an embodiment of this application.

[0031] Figure 7 for Figure 6 A schematic diagram of the printed circuit board pad structure after material loading.

[0032] Explanation of main component symbols

[0033] Printed circuit board pad structure 100

[0034] First pad: 10

[0035] First connecting part: 20

[0036] First protrusion: 21

[0037] First depression: 22

[0038] Second pad: 30

[0039] Second connecting part: 40

[0040] Second protrusion: 41

[0041] Second recess: 42

[0042] First Material Feeding Network: 50

[0043] First through hole: 51

[0044] Solder: 60

[0045] Second feeding screen: 70

[0046] Second through hole: 71

[0047] Third through hole: 73

[0048] Connection layer: 90.

[0049] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0050] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0051] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0052] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0053] Please see Figure 1 To avoid setting a zero-ohm resistor, a common printed circuit board pad structure typically includes a first pad 10, a second pad 30, and a connection layer 90 disposed between the first pad 10 and the second pad 30. The connection layer 90 is electrically connected to the first pad 10 and the second pad 30. The connection layer 90, electrically connected to the first pad 10 and the second pad 30, can be equivalent to a zero-ohm resistor. When debugging is required, the connection layer 90 can be cut with a blade to break the circuit between the first pad 10 and the second pad 30, thus facilitating testing. After testing, a zero-ohm resistor or other components can be soldered between the first pad 10 and the second pad 30.

[0054] However, after the connection layer 90 is cut, the first pad 10 and the second pad 30 can no longer be electrically connected. Only an additional zero-ohm resistor can be soldered, so it is not very practical. Furthermore, when cutting the connection layer 90, the inner layer traces of the printed circuit board may be cut, resulting in the scrapping of the circuit board.

[0055] Please see Figure 2 The printed circuit board pad structure 100 provided in this application embodiment includes a first pad 10 and a second pad 30 disposed opposite to each other, a first connecting portion 20, and a second connecting portion 40. The first connecting portion 20 is disposed between the first pad 10 and the second pad 30, and is electrically connected to the first pad 10. The first connecting portion 20 includes at least one first protrusion 21 extending from the first pad 10 toward the second pad 30. The second connecting portion 40 is disposed between the first pad 10 and the second pad 30, and is electrically connected to the second pad 30. The second connecting portion 40 includes at least one second protrusion 41 extending from the second pad 30 toward the first pad 10. The first connecting portion 20 and the second connecting portion 40 are spaced apart.

[0056] In this embodiment, the first connecting part 20 and the second connecting part 40 can be copper foil. In other embodiments, the first connecting part 20 and the second connecting part 40 can also be other conductive materials, and this application does not limit them.

[0057] The projections of the first protrusion 21 and the second protrusion 41 in the first direction X at least partially overlap, and the first direction X is perpendicular to the arrangement direction of the first pad 10 and the second pad 30. Specifically, in the first direction X, the first protrusion 21 and the second protrusion 41 at least partially intersect, thereby increasing the length of the junction gap between the first connecting portion 20 and the second connecting portion 40. This increases the probability of electrical connection between the first connecting portion 20 and the second connecting portion 40 when conductive material is applied between the first pad 10 and the second pad 30.

[0058] In one embodiment, the first protrusions 21 are spaced apart along a first direction X, and the second connecting portion 40 includes a plurality of second protrusions 41 spaced apart along the first direction X, each second protrusion 41 being disposed between two adjacent first protrusions 21. Specifically, the plurality of first protrusions 21 are arranged in parallel along the first direction X to form a comb-like structure. The plurality of second protrusions 41 are arranged in parallel along the first direction X to form a comb-like structure, and each second protrusion 41 is disposed between two adjacent first protrusions 21. That is, the plurality of first protrusions 21 and the plurality of second protrusions 41 are arranged alternately. In other embodiments, the first protrusions 21 and the plurality of second protrusions 41 may also have other alternating structures, which are not limited in this application.

[0059] In another embodiment, please refer to Figure 3 A plurality of first protrusions 21 are continuously arranged along a first direction X, and a first recess 22 is formed between two adjacent first protrusions 21. The second connecting portion 40 includes a plurality of continuously arranged second protrusions 41, each second protrusion 41 being disposed opposite to a first recess 22. Specifically, in this embodiment, the first protrusion 21 includes a triangular structure with its apex facing the second pad 30, and the first recess 22 formed between two adjacent first protrusions 21 is specifically a triangular recess with its apex facing the first pad 10. The second protrusion 41 includes a triangular structure with its apex facing the first pad 10, and the protruding portion of the second protrusion 41 matches the shape of the first recess 22, thereby being at least partially located in the first recess 22. A second recess 42 is also formed between two adjacent second protrusions 41, and each first protrusion 21 is disposed opposite to a second recess 42.

[0060] The printed circuit board pad structure 100 provided in this application embodiment includes a first connection portion 20 and a second connection portion 40 disposed between a first pad 10 and a second pad 30. When zero-ohm resistance is not required, there is no circuit between the first pad 10 and the second pad 30, and the first pad 10 and the second pad 30 can be soldered to other components. When zero-ohm resistance is required, a conductive material can be disposed on the printed circuit board pad structure 100, the conductive material at least covering the gap between the first pad 10 and the second pad 30, thereby electrically connecting the first connection portion 20 and the second connection portion 40, and further electrically connecting the first pad 10 and the second pad 30. The printed circuit board pad structure 100 of this application has a simple structure, does not require additional zero-ohm resistance, and does not damage the printed circuit board pad structure 100, which is beneficial to improving the reliability of the printed circuit board pad structure 100 and reducing costs.

[0061] This application also provides a printed circuit board debugging assembly, which includes the printed circuit board pad structure 100, the first feeding screen 50, and the second feeding screen 70 in the above embodiments.

[0062] Please see Figure 4 The first feeding mesh 50 has a first through hole 51. The first through hole 51 is configured such that when the first feeding mesh 50 covers the printed circuit board pad structure 100, the first pad 10, the second pad 30, and the gap between the first pad 10 and the second pad 30 are exposed through the first through hole 51.

[0063] Specifically, the printed circuit board debugging assembly also includes a feeding assembly (not shown), and a first feeding mesh 50 is used to cooperate with the feeding assembly to place solder on the printed circuit board pad structure 100. Please refer to... Figure 5 The feeding assembly is used to fill the first through-hole 51 with solder 60, thereby attaching the solder 60 to the printed circuit board pad structure 100. The solder 60 attached to the printed circuit board pad structure 100 through the first through-hole 51 covers the first pad 10, the second pad 30, the first connection portion 20, the second connection portion 40, and the gap between the first connection portion 20 and the second connection portion 40, thereby making the first pad 10 and the second pad 30 approximately form a zero-ohm resistance.

[0064] Please refer to the following: Figure 6 and Figure 7 The second feeding mesh 70 has a second through hole 71 and a third through hole 73 spaced apart. The second through hole 71 and the third through hole 73 are configured such that when the second feeding mesh 70 covers the printed circuit board pad structure 100, the first pad 10 is exposed through the second through hole 71 and the second pad 30 is exposed through the third through hole 73.

[0065] Specifically, the second feed mesh 70 is used in conjunction with the feed assembly to apply solder to the printed circuit board pad structure 100. The feed assembly fills the second through-hole 71 and the third through-hole 73 with solder 60, so that the solder 60 adheres to the printed circuit board pad structure 100. The solder 60 adhering to the printed circuit board pad structure 100 through the second through-hole 71 and the third through-hole 73 respectively covers the first pad 10 and the second pad 30, thereby allowing components to be soldered onto the first pad 10 and the second pad 30 even when there is an open circuit between the first pad 10 and the second pad 30.

[0066] The first feed mesh 50 and the second feed mesh 70 can be surface mount technology (SMT) stencils, which can place solder 60 at specific positions on the printed circuit board pad structure 100, thereby facilitating the fixing of components on the printed circuit board pad structure 100.

[0067] The printed circuit board debugging assembly also includes a debugging component (not shown) for electrically connecting to the first pad 10 and the second pad 30, thereby testing and debugging the printed circuit board pad structure 100. Specifically, the debugging component is used to test the circuit parameters between the first pad 10 and the second pad 30, thereby determining whether the first pad 10 and the second pad 30 are directly electrically connected or whether components are placed between them, and thus determining whether the solder 60 is placed through the first feed screen 50 or the second feed screen 70.

[0068] The printed circuit board debugging assembly provided in this application embodiment has a first through hole 51 on the first feeding mesh 50, which exposes the first connecting part 20, the second connecting part 40, and the gap between the first connecting part 20 and the second connecting part 40. This allows the solder 60 to electrically connect the first connecting part 20 and the second connecting part 40, thereby achieving an electrical connection between the first pad 10 and the second pad 30. When a circuit break is needed between the first pad 10 and the second pad 30, it can be achieved by removing the solder 60. The operation is simple and will not damage the printed circuit board pad structure 100. The second feeding mesh 70 has a second through hole 71 and a third through hole 73 corresponding to the first pad 10 and the second pad 30, respectively. This allows the solder 60 to cover the first pad 10 and the second pad 30, thereby allowing components to be soldered onto the printed circuit board pad structure 100. The printed circuit board debugging assembly is simple to set up and does not require additional zero-ohm resistors, which helps to reduce costs.

[0069] This application embodiment also provides a printed circuit board, which includes the printed circuit board pad structure 100 of the above embodiment. The printed circuit board pad structure 100 is provided with solder 60, which at least covers the gap between the first pad 10 and the second pad 30, so that the first connecting portion 20 and the second connecting portion 40 are electrically connected.

[0070] The printed circuit board provided in this application embodiment, by setting the printed circuit board pad structure 100 in the above embodiment, can adjust the on / off state of the electrical connection between the first pad 10 and the second pad 30 by setting the coverage position of the solder 60. It does not require setting an additional zero-ohm resistor, nor does it require damaging the structure of the printed circuit board, which is beneficial to improving the reliability of the printed circuit board and reducing the cost.

[0071] Those skilled in the art should recognize that the above embodiments are only used to illustrate this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of protection claimed in this application.

Claims

1. A printed circuit board pad structure, characterized by, Comprising: oppositely arranged first and second pads; a first connecting portion arranged between the first and second pads, the first connecting portion being electrically connected with the first pad; the first connecting portion comprising at least one first protruding portion extending from the position of the first pad towards the direction of the second pad; and a second connecting portion arranged between the first and second pads, the second connecting portion being electrically connected with the second pad; the second connecting portion comprising at least one second protruding portion extending from the position of the second pad towards the direction of the first pad; wherein the first and second connecting portions are arranged in a spaced manner.

2. The printed circuit board pad structure of claim 1, wherein, The projections of the first and second protruding portions in a first direction at least partially overlap, the first direction being perpendicular to the arrangement direction of the first and second pads.

3. The printed circuit board pad structure of claim 2, wherein, A plurality of the first protruding portions are arranged in a spaced manner along the first direction; the second connecting portion comprises a plurality of the second protruding portions arranged in a spaced manner, each of the second protruding portions being arranged between two adjacent first protruding portions.

4. The printed circuit board pad structure of claim 3, wherein, The first protruding portions are arranged in parallel along the first direction, and the second protruding portions are arranged in parallel along the first direction, each of the second protruding portions being arranged between two adjacent first protruding portions.

5. The printed circuit board pad structure of claim 1, wherein, A plurality of the first protruding portions are arranged in a continuous manner along the first direction, and a first recess is formed between two adjacent first protruding portions; the second connecting portion comprises a plurality of second protruding portions arranged in a continuous manner, each of the second protruding portions being arranged opposite to one of the first recesses; the first direction being perpendicular to the arrangement direction of the first and second pads.

6. A printed circuit board debug assembly, characterized by, Comprising: the printed circuit board pad structure according to any one of claims 1-5; a first feeding net, the first feeding net being provided with a first through hole, the first through hole being configured to expose the first pad, the second pad, and the gap between the first and second pads through the first through hole when the first feeding net covers the printed circuit board pad structure; and a second feeding net, the second feeding net being provided with a second through hole and a third through hole arranged in a spaced manner; the second and third through holes being configured to expose the first pad through the second through hole and the second pad through the third through hole when the second feeding net covers the printed circuit board pad structure.

7. The printed circuit board debug assembly of claim 6, wherein, Further comprising a debugging assembly for electrically connecting with the first and second pads.

8. The printed circuit board debug assembly of claim 6, wherein, Further comprising a feeding assembly for filling solder into the first through hole or the second and third through holes, so that the solder adheres to the printed circuit board pad structure.

9. A printed circuit board, characterized by Comprising: the printed circuit board pad structure according to any one of claims 1-5.

10. The printed circuit board of claim 9, wherein, Further comprising solder, the solder covering at least the gap between the first and second pads to electrically connect between the first and second connecting portions.

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