Composite film for heat dissipation and electromagnetic shielding of electronic product

Abstract

The utility model discloses a composite film for heat dissipation and electromagnetic shielding of an electronic product. The composite film comprises a graphene film layer (1), the ultrathin stainless steel protective layer (2) is arranged on one side or two sides of the graphene film layer (1) in an attached mode. According to the utility model, the ultrathin stainless steel and the graphene film are compounded, so that the heat conductivity, the shielding property and the flexible structural strength are considered, and the heat dissipation efficiency and the use reliability of an electronic product are effectively improved.

Description

Technical Field

[0001] This utility model relates to a composite film, specifically a composite film used for heat dissipation and electromagnetic shielding of electronic products. Background Technology

[0002] As electronic products continue to evolve towards higher performance, miniaturization, and thinner designs, the integration of electronic components is constantly increasing, leading to more prominent issues such as heat concentration and electromagnetic interference. To effectively address these problems, the research and application of thermally conductive and electromagnetically shielding materials are receiving increasing attention from the industry.

[0003] Graphite films or graphene films are widely used in electronic devices such as mobile phones, tablets, and laptops due to their excellent thermal conductivity and certain electromagnetic shielding capabilities. However, graphite or graphene materials are inherently fragile and easily break or crumble. Graphite powder is prone to detachment during use or processing. If graphite powder enters the electronic component area, it can easily cause short circuits, breakdowns, or performance failures.

[0004] To prevent graphite powder from falling off, Mylar film (PET film) is often used to coat the surface of graphene film for protection. However, Mylar film is a polymer material with poor thermal conductivity, which severely restricts the utilization of the high thermal conductivity of graphene film; at the same time, its mechanical properties are still limited compared with metal materials, and it is easily deformed or aged by temperature changes and stress.

[0005] Some solutions use double-sided adhesive to bond copper foil and graphene film together, providing thermal conductivity, protection, and some shielding. However, copper foil has limited ductility and fatigue strength, and is prone to cracking or delamination when bent, affecting its overall service life and material stability.

[0006] Therefore, how to improve the mechanical strength, bending resistance and shielding ability of graphene films without affecting their thermal conductivity has become an urgent problem for those skilled in the art. Utility Model Content

[0007] To address the aforementioned problems, this invention provides a composite film for heat dissipation and electromagnetic shielding in electronic products, which uses a stainless steel film and effectively overcomes the shortcomings of existing technologies.

[0008] This utility model is achieved through the following technical solution: a composite film for heat dissipation and electromagnetic shielding of electronic products, comprising:

[0009] Graphene film;

[0010] At least one ultra-thin stainless steel protective layer is attached to one or both sides of the graphene film layer;

[0011] As a preferred technical solution, the thickness of the ultra-thin stainless steel protective layer is 5 micrometers to 50 micrometers.

[0012] As a preferred technical solution, the graphene film layer and the ultrathin stainless steel protective layer are compositely connected by an adhesive layer.

[0013] As a preferred technical solution, the ultra-thin stainless steel protective layer is composited with the graphene film layer by a roll forming composite method.

[0014] As a preferred technical solution, the graphene film is a continuous graphene sheet, an expanded graphene film, or a graphene thermally conductive film.

[0015] As a preferred technical solution, the composite membrane material has a laminated structure with an overall thickness of less than 100 micrometers and a bending radius of less than 5 millimeters.

[0016] The beneficial effects of this utility model are: This utility model provides a composite film material for heat dissipation and electromagnetic shielding of electronic products. By combining an ultra-thin stainless steel protective layer with a thickness of 5 to 50 micrometers with a graphene film layer, the graphene film can achieve better mechanical strength and bending performance while maintaining its excellent thermal conductivity, and significantly reduce the risk of short circuits caused by powder shedding.

[0017] Compared to traditional Mylar film or copper foil composite structures, ultra-thin stainless steel has superior strength, oxidation resistance and dimensional stability, which can effectively enhance the durability of materials under high temperature and repeated bending conditions.

[0018] Ultra-thin stainless steel has better strength, which can increase the bending resistance of graphene film, and has broad application scenarios in foldable phones in the future.

[0019] Compared to graphene and copper foil composites, ultrathin stainless steel can be thinner than copper foil. Under the same material thickness conditions, a thicker graphene film can be used. Graphene stainless steel composites have better thermal conductivity and structural strength than graphene copper foil composites.

[0020] In addition, ultra-thin stainless steel itself has certain thermal conductivity and shielding properties, which can synergistically improve the overall heat dissipation efficiency and electromagnetic interference suppression capability of the composite film. This provides a more reliable, thin, and flexible thermal management and electromagnetic shielding solution for highly integrated and high-heat-generating electronic devices, and has broad application prospects and industrial value. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the exploded structure of this utility model. Detailed Implementation

[0024] All features disclosed in this specification, or steps in all methods or processes disclosed herein, may be combined in any way, except for mutually exclusive features and / or steps.

[0025] Any feature disclosed in this specification (including any appended claims, abstract, and drawings) may be replaced by other equivalent or similar features for a similar purpose, unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is merely one example of a series of equivalent or similar features.

[0026] like Figure 1 and Figure 2 As shown, this utility model discloses a composite film for heat dissipation and electromagnetic shielding of electronic products. Its structure includes a graphene film layer 1 and at least one ultra-thin stainless steel protective layer 2 bonded together. The graphene film layer serves as the main thermal conductivity and shielding carrier of the composite film, and is made of materials with excellent thermal conductivity and certain electromagnetic shielding capabilities, such as continuous graphene sheets, expanded graphene films, or graphene thermally conductive films. This film layer possesses high thermal conductivity, enabling it to rapidly conduct and diffuse the heat generated by electronic devices during operation, alleviating localized overheating problems and preventing electronic components from failing due to overheating.

[0027] To enhance the structural strength of the graphene film and prevent powder shedding during processing, assembly, or use, an ultra-thin stainless steel protective layer is laminated on one or both sides. The thickness of this ultra-thin stainless steel protective layer is controlled between 5 and 50 micrometers, providing excellent mechanical support and protection while ensuring lightness, thinness, and flexibility. Compared to traditionally used copper foil or Mylar film, stainless steel has higher tensile and fatigue resistance, making it particularly suitable for applications involving repeated bending, pressing, or embedded installation in electronic products, effectively improving the durability and safety of the entire composite film material.

[0028] In this embodiment, the graphene film layer and the ultra-thin stainless steel protective layer are compositely connected by an adhesive layer 3. This adhesive layer can be made of a polymer adhesive with good thermal stability and certain thermal conductivity, ensuring a strong bond between the layers while preventing peeling or slippage due to high temperature or prolonged use. A roll forming process is preferably used during the composite process, where the graphene film and stainless steel film are bonded by continuous rolling under constant pressure. This effectively controls the composite thickness and surface flatness, improving overall material consistency and processing efficiency.

[0029] The entire composite membrane material is laminated, with an overall thickness controlled within 100 micrometers. It possesses high flexibility and good adhesion, allowing for cutting, positioning, and attachment according to product structural requirements in specific applications. Due to the inclusion of ultra-thin stainless steel, this composite membrane maintains its thermal conductivity and shielding functions while exhibiting excellent mechanical flexibility with a bending radius of less than 5 millimeters, meeting the requirements of current mainstream portable electronic devices for compact structure and reliability.

[0030] The composite film material provided in this embodiment can be widely used in electronic devices such as mobile phones, tablets, and laptops that have high requirements for heat dissipation performance and electromagnetic shielding, effectively improving the stability, safety, and service life of the devices.

[0031] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A composite film for heat dissipation and electromagnetic shielding of electronic products, characterized in that, Comprise: A graphene film layer (1); At least one layer of ultra-thin stainless steel protective layer (2), the ultra-thin stainless steel protective layer is set on one side or both sides of the graphene film layer (1). 2.The composite film for heat dissipation and electromagnetic shielding of electronic products according to claim 1, characterized in that: The thickness of the ultra-thin stainless steel protective layer is 5-50 microns. 3.The composite film for heat dissipation and electromagnetic shielding of electronic products according to claim 1, characterized in that: The graphene film layer (1) and the ultra-thin stainless steel protective layer (2) are connected by an adhesive layer (3). 4.The composite film for heat dissipation and electromagnetic shielding of electronic products according to claim 1, characterized in that: The ultra-thin stainless steel protective layer (2) is compounded with the graphene film layer by rolling. 5.The composite film for heat dissipation and electromagnetic shielding of electronic products according to claim 1, characterized in that: The graphene film layer (1) is a continuous graphene sheet, expanded graphite film or graphene heat-conducting film. 6.The composite film for heat dissipation and electromagnetic shielding of electronic products according to claim 1, characterized in that: The graphene film layer (1) and the stainless steel protective layer (2) are laminated structures, the overall thickness is less than 100 microns, and the bending radius is less than 5 mm.

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