Lower die structure of semiconductor plastic packaging press

Abstract

The utility model discloses a lower die structure of a semiconductor plastic packaging press, and relates to the field of semiconductor plastic packaging, the lower die structure comprises a box body, the bottom of the inner surface of the box body is provided with a fixing mechanism, and the top of the inner surface of the box body is provided with a stamping mechanism matched with the fixing mechanism; the fixing mechanism comprises limiting plates symmetrically installed on the top of the box body, supporting plates are slidably installed on the opposite sides of the two limiting plates, and a longitudinal fixing plate and a transverse fixing plate are fixedly arranged on the tops of the supporting plates. Through the effect of the fixing mechanism, an irregular mold can be clamped, and when the output end of the clamping telescopic cylinder pushes the clamping plate to move towards one side of the longitudinal fixing plate and the adaptive pins touch the irregular mold, the lengths of the adaptive pins stretching into the groove are different, so that the irregular mold is clamped, and the clamping plate is clamped. The spring applies outward thrust to the adaptive pin, and the irregular mold is clamped under the action of the multiple fixing plates and the longitudinal fixing plates.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor molding technology, and in particular to a lower mold structure for a semiconductor molding press. Background Technology

[0002] In the current booming development of the semiconductor industry, semiconductor devices are constantly evolving towards miniaturization, integration, and high performance, which puts forward stringent requirements on the precision, reliability, and production efficiency of packaging processes. The lower mold structure of the semiconductor molding press is a core component of the molding process.

[0003] The semiconductor molding die is placed in the clamping structure, the raw material is placed in the die, and the stamping structure seals the die to encapsulate the semiconductor.

[0004] The existing lower mold structure of semiconductor molding presses has limited fixing options, which makes it inconvenient to fix irregular semiconductors, thus reducing the efficiency of semiconductor molding. Therefore, a lower mold structure for semiconductor molding presses is proposed. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] To address the problems existing in the prior art, this utility model provides a lower mold structure for a semiconductor molding press.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model is implemented through the following technical solution: a lower mold structure for a semiconductor molding press, comprising a housing, a fixing mechanism being provided at the bottom of the inner surface of the housing, and a stamping mechanism adapted to the fixing mechanism being provided at the top of the inner surface of the housing.

[0009] As a preferred embodiment of the lower mold structure of the semiconductor molding press described in this utility model, the fixing mechanism includes limiting plates symmetrically installed on the top of the housing, a support plate slidably installed on one side of the two limiting plates opposite to each other, two longitudinal and transverse fixing plates fixedly provided on the top of the support plate, and a clamping plate movably installed on the top of the support plate.

[0010] As a preferred embodiment of the lower mold structure of the semiconductor molding press described in this utility model, the stamping mechanism includes semi-circular plates symmetrically installed on the top of the inner surface of the housing, an L-shaped slider is provided on one side of the two semi-circular plates opposite each other, a T-shaped slider is provided on one side of the L-shaped slider, and a pressure plate is provided at the bottom of the T-shaped slider.

[0011] In a preferred embodiment of the lower mold structure of the semiconductor molding press described in this utility model, a clamping telescopic cylinder is fixedly installed on one side of the clamping plate, an L-shaped plate is fixedly connected to the top of the clamping plate, and several adapter pins are symmetrically distributed on one side of the clamping plate.

[0012] In a preferred embodiment of the lower mold structure of the semiconductor molding press described in this utility model, a plurality of grooves are symmetrically provided on one side of the clamping plate, and a spring is provided in the inner cavity of the groove, with the other end of the spring being fixedly connected to an adapter pin.

[0013] In a preferred embodiment of the lower mold structure of the semiconductor molding press described in this utility model, the clamping plate is slidably connected to the inside of the support plate, the clamping telescopic cylinder is fixedly installed on the top of the L-shaped plate, and the adapter pin is slidably connected to the inner cavity of the groove.

[0014] In a preferred embodiment of the lower mold structure of the semiconductor molding press described in this utility model, a motor is fixedly installed on one side of the semicircular plate, and a lead screw is fixedly connected to the output end of the motor. First slide rods are symmetrically installed on opposite sides of the two semicircular plates.

[0015] In a preferred embodiment of the lower mold structure of the semiconductor molding press described in this utility model, a transverse telescopic cylinder is fixedly connected to one side of the T-shaped slider, a second slide rod is symmetrically slidably arranged inside the T-shaped slider, and a longitudinal telescopic cylinder is fixedly installed at the bottom of the T-shaped slider.

[0016] In a preferred embodiment of the lower mold structure of the semiconductor molding press described in this utility model, the outer side of the lead screw is connected to the L-shaped slider through a threaded sleeve, the L-shaped slider is slidably connected to the outer side of the first slide rod, the transverse telescopic cylinder is fixedly installed inside the L-shaped slider, one end of the second slide rod is fixedly connected to the L-shaped slider, and the pressure plate is fixedly installed at the output end of the longitudinal telescopic cylinder.

[0017] (III) Beneficial Effects

[0018] This invention provides a lower mold structure for a semiconductor molding press. It offers the following advantages:

[0019] 1. Through the action of the fixing mechanism, irregular molds can be clamped. When the output end of the clamping telescopic cylinder pushes the clamping plate to move to one side of the longitudinal fixing plate, when several adapter pins touch the irregular mold, at this time, the lengths of the several adapter pins extending into the groove are different. The spring applies an outward pushing force to the adapter pins. Under the action of several fixing plates and the longitudinal fixing plate, the irregular mold is clamped.

[0020] 2. Through the action of the stamping mechanism, the longitudinal and transverse directions of the pressure plate can be adjusted, thereby cooperating with the mold to perform semiconductor encapsulation. Under the action of the two first slide rods, the lead screw driven by the output end of the motor pushes and pulls the L-shaped slider, thereby controlling the position of the transverse telescopic cylinder. Controlling the operation of the transverse telescopic cylinder drives the T-shaped slider to move on the two second slide rods. The two directions are adjusted according to the clamping position of the mold, and the longitudinal telescopic cylinder is controlled to push the pressure plate downward to encapsulate the semiconductor placed in the mold. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0023] Figure 2 This is a schematic diagram showing the installation positions of the fixing mechanism and the stamping mechanism of this utility model.

[0024] Figure 3 This is a schematic diagram of the overall structure of the fixing mechanism of this utility model.

[0025] Figure 4 This is a partial cross-sectional schematic diagram of the fixing mechanism of this utility model.

[0026] Figure 5 This is a utility model Figure 4 Enlarged diagram of point A in the middle.

[0027] Figure 6 This is a schematic diagram of the overall structure of the stamping mechanism of this utility model.

[0028] In the diagram, 1. Box body; 2. Fixing mechanism; 201. Limiting plate; 202. Support plate; 203. L-shaped plate; 204. Clamping plate; 205. Clamping telescopic cylinder; 206. Adapter pin; 207. Fixing plate; 208. Groove; 209. Spring; 3. Stamping mechanism; 301. Semicircular plate; 302. Motor; 303. Lead screw; 304. First slide bar; 305. L-shaped slider; 306. Lateral telescopic cylinder; 307. Second slide bar; 308. T-shaped slider; 309. Longitudinal telescopic cylinder; 310. Pressure plate. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0030] Example 1

[0031] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 This is the first embodiment of the present invention. This embodiment provides a lower mold structure for a semiconductor molding press, including a housing 1. A fixing mechanism 2 is provided at the bottom of the inner surface of the housing 1, and a stamping mechanism 3 adapted to the fixing mechanism 2 is provided at the top of the inner surface of the housing 1.

[0032] The fixing mechanism 2 includes a limiting plate 201 symmetrically installed on the top of the box 1. A support plate 202 is slidably installed on one side of the two limiting plates 201. Two fixing plates 207 are fixedly installed on the top of the support plate 202. A clamping plate 204 is movably installed on the top of the support plate 202.

[0033] Specifically, the support plate 202 has protruding parts on both sides. When the support plate 202 slides in the limiting plate 201, there are locking blocks on the limiting plate 201. When the support plate 202 is pulled outward in the limiting plate 201, the support plate 202 will not be pulled out of the limiting plate 201, which has the function of limiting the length of the support plate 202 pulled out.

[0034] A clamping telescopic cylinder 205 is fixedly installed on one side of the clamping plate 204, an L-shaped plate 203 is fixedly connected to the top of the clamping plate 204, and several adapter pins 206 are symmetrically distributed on one side of the clamping plate 204.

[0035] Specifically, the operation of the clamping telescopic cylinder 205 is controlled. The output end of the clamping telescopic cylinder 205 can push the clamping plate 204 to move inside the support plate 202 towards one side of the longitudinal fixing plate 207, so that the mold is first pushed against the inner side of the transverse fixing plate 207. With the cooperation of the clamping plate 204 and the fixing plate 207, the mold is clamped.

[0036] A number of grooves 208 are symmetrically provided on one side of the clamping plate 204. A spring 209 is provided in the inner cavity of the groove 208. The other end of the spring 209 is fixedly connected to the adapter pin 206.

[0037] Specifically, when several adapter pins 206 touch the mold, and then the adapter pins 206 are moved into the inner cavity of the groove 208, the springs 209 corresponding to the adapter pins 206 are compressed. Under the action of the springs 209, there is an outward pushing force on the adapter pins 206. At this time, the mold is clamped. If the lengths of the several adapter pins 206 extending into the groove 208 are different, irregular molds can be clamped.

[0038] The clamping plate 204 is slidably connected inside the support plate 202, the clamping telescopic cylinder 205 is fixedly installed on the top of the L-shaped plate 203, and the adapter pin 206 is slidably connected to the inner cavity of the groove 208.

[0039] Furthermore, the mold is first placed against the inner side of the transverse fixing plate 207, and the operation of the clamping telescopic cylinder 205 is controlled. The output end of the clamping telescopic cylinder 205 can push the clamping plate 204 to move towards one side of the longitudinal fixing plate 207 inside the support plate 202. The clamping plate 204 drives several adapter pins 206 to move. When the adapter pins 206 touch the mold, and then move the adapter pins 206 into the inner cavity of the groove 208, the spring 209 corresponding to the adapter pin 206 is compressed. Under the action of the spring 209, there is an outward pushing force on the adapter pin 206. At this time, the mold is clamped, which has the function of clamping irregular molds.

[0040] Example 2

[0041] Reference Figure 2 and Figure 6 This is the second embodiment of the present invention, which is based on the previous embodiment and is capable of stamping mechanism 3 for semiconductor plastic encapsulation.

[0042] The stamping mechanism 3 includes semi-circular plates 301 symmetrically installed on the top of the inner surface of the housing 1. An L-shaped slider 305 is provided on one side of the two semi-circular plates 301, a T-shaped slider 308 is provided on one side of the L-shaped slider 305, and a pressure plate 310 is provided at the bottom of the T-shaped slider 308.

[0043] Specifically, when the L-shaped slider 305 and the T-shaped slider 308 are pushed, the L-shaped slider 305 and the T-shaped slider 308 move in coordination in both longitudinal and transverse directions, thereby adjusting the fit between the pressure plate 310 and the mold, which facilitates stamping.

[0044] A motor 302 is fixedly installed on one side of the semicircular plate 301, and a lead screw 303 is fixedly connected to the output end of the motor 302. A first slide rod 304 is symmetrically installed on the opposite side of the two semicircular plates 301.

[0045] Specifically, the operation of the motor 302 is controlled, which drives the lead screw 303 to rotate. With the assistance of the two first slide rods 304, the L-shaped slider 305 is moved stably. By controlling the forward and reverse operation of the motor 302, the lateral movement of the L-shaped slider 305 is controlled, which has the function of controlling the lateral position.

[0046] A transverse telescopic cylinder 306 is fixedly connected to one side of the T-shaped slider 308. A second slide rod 307 is symmetrically slidably arranged inside the T-shaped slider 308. A longitudinal telescopic cylinder 309 is fixedly installed at the bottom of the T-shaped slider 308.

[0047] Specifically, the operation of the transverse telescopic cylinder 306 is controlled. With the assistance of the two second slide rods 307, the output end of the transverse telescopic cylinder 306 drives the T-shaped slider 308 to move longitudinally in a stable manner. When the T-shaped slider 308 moves, it drives the longitudinal telescopic cylinder 309 to move, thereby adjusting the position of the pressure plate 310 and cooperating with the mold to perform semiconductor encapsulation.

[0048] The outer side of the lead screw 303 is connected to the L-shaped slider 305 through a threaded sleeve. The L-shaped slider 305 is slidably connected to the outer side of the first slide rod 304. The transverse telescopic cylinder 306 is fixedly installed inside the L-shaped slider 305. One end of the second slide rod 307 is fixedly connected to the L-shaped slider 305. The pressure plate 310 is fixedly installed at the output end of the longitudinal telescopic cylinder 309.

[0049] Furthermore, the output end of the motor 302 drives the lead screw 303 to rotate, which in turn controls the movement of the L-shaped slider 305 under the action of the two first slide rods 304. This controls the position of the transverse telescopic cylinder 306, and the operation of the transverse telescopic cylinder 306 drives the T-shaped slider 308 to move on the two second slide rods 307. The two directions are adjusted according to the clamping position of the mold, and the longitudinal telescopic cylinder 309 is controlled to push the pressure plate 310 downward, pressing the pressure plate 310 onto the top of the mold containing the semiconductor, thus encapsulating the semiconductor.

[0050] Working principle: Manually pull the support plate 202 outward from the opposite side of the two limiting plates 201, placing the irregular semiconductor molding die on top of the support plate 202. Control the operation of the clamping telescopic cylinder 205, which pushes the clamping plate 204 towards one side of the longitudinal fixing plate 207. When the several adapter pins 206 contact the die, the adapter pins 206 retract into the groove 208 by different lengths. Under the action of the spring 209, an outward pushing force is applied to the adapter pins 206. Under the action of the several adapter pins 206, the irregular die is clamped. According to the shape of the die, rotate and remove the pressure plate 310 from the bottom of the longitudinal telescopic cylinder 309, and replace it with one that matches the die. The pressure plate 310 controls the operation of the motor 302. The output end of the motor 302 drives the lead screw 303 to rotate. With the assistance of the two first slide rods 304, the L-shaped slider 305 moves laterally. The operation of the transverse telescopic cylinder 306 is controlled. With the assistance of the two second slide rods 307, the output end of the transverse telescopic cylinder 306 drives the T-shaped slider 308 to slide longitudinally on the outer surface of the second slide rod 307. By adjusting the moving positions of the L-shaped slider 305 and the T-shaped slider 308, the longitudinal and transverse directions are adjusted so that the pressure plate 310 is completely pressed onto the mold. At this time, the operation of the longitudinal telescopic cylinder 309 is controlled. The longitudinal telescopic cylinder 309 drives the pressure plate 310 to move towards the top of the mold to perform semiconductor encapsulation.

[0051] It should be noted that in this paper, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

Claims

1. A lower die structure of a semiconductor plastic packaging press, comprising a box, characterized in that: The inner surface bottom of the box is provided with a fixing mechanism, and the inner surface top of the box is provided with a punching mechanism matched with the fixing mechanism; The fixing mechanism comprises limiting plates symmetrically mounted on the top of the box, and support plates slidably mounted on the opposite sides of the limiting plates, and two fixed plates longitudinally and transversely arranged on the top of the support plates, and clamping plates movably mounted on the top of the support plates; The punching mechanism comprises semicircular plates symmetrically mounted on the top of the inner surface of the box, L-shaped sliders arranged on the opposite sides of the semicircular plates, T-shaped sliders arranged on one side of the L-shaped sliders, and pressing plates arranged on the bottom of the T-shaped sliders.

2. The lower die structure of a semiconductor plastic packaging press according to claim 1, wherein: A clamping telescopic cylinder is fixedly installed on one side of the clamping plate, an L-shaped plate is fixedly connected to the top of the clamping plate, and a plurality of matching pins are symmetrically distributed on one side of the clamping plate.

3. The lower die structure of a semiconductor plastic packaging press according to claim 2, wherein: A plurality of grooves are symmetrically formed on one side of the clamping plate, springs are arranged in the inner cavities of the grooves, and the other ends of the springs are fixedly connected with the matching pins.

4. The lower die structure of a semiconductor plastic packaging press according to claim 3, wherein: The clamping plate is slidably connected inside the support plate, the clamping telescopic cylinder is fixedly installed on the top of the L-shaped plate, and the matching pins are slidably connected in the inner cavities of the grooves.

5. The lower die structure of a semiconductor plastic packaging press according to claim 4, wherein: A motor is fixedly installed on one side of the semicircular plate, a lead screw is fixedly connected to the output end of the motor, and first slide rods are symmetrically mounted on the opposite sides of the semicircular plates.

6. The lower die structure of a semiconductor plastic packaging press according to claim 5, wherein: A transverse telescopic cylinder is fixedly connected to one side of the T-shaped slider, second slide rods are symmetrically slidably arranged inside the T-shaped slider, and a longitudinal telescopic cylinder is fixedly installed on the bottom of the T-shaped slider.

7. The lower die structure of a semiconductor plastic packaging press according to claim 6, wherein: The outer side of the lead screw is connected with the L-shaped slider through a threaded sleeve, the L-shaped slider is slidably connected to the outer side of the first slide rod, the transverse telescopic cylinder is fixedly installed inside the L-shaped slider, one end of the second slide rod is fixedly connected with the L-shaped slider, and the pressing plate is fixedly installed on the output end of the longitudinal telescopic cylinder.

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