Packaging structure of jack-type power module

Abstract

The application provides a packaging structure of a jack type power module, comprising: a first lead copper bar and a second lead copper bar, wherein the first and second lead copper bars are arranged on two sides of an inner surface of a plastic packaging shell; an integrated heat dissipation copper bottom plate is arranged in parallel with the lead copper bar group; each power chip group comprises a first power chip and a second power chip, wherein the first power chip and the second power chip are respectively welded on the first lead copper bar and the integrated heat dissipation copper bottom plate; each support group comprises a first metal frame and a second metal frame, one end of the first metal frame is connected with the corresponding first power chip, the other end of the first metal frame is connected with the integrated heat dissipation copper bottom plate, one end of the second metal frame is connected with the corresponding second lead copper bar, and the other end of the second metal frame is connected with the second power chip; and an embedded jack group is embedded in the packaging structure and is respectively welded on the lead copper bar group and the integrated heat dissipation copper bottom plate.

Description

Technical Field

[0001] This invention relates to the field of power device packaging technology, and more specifically to a socket-type power module packaging structure. Background Technology

[0002] In related technologies, the terminals of double-sided heat dissipation power modules are usually designed with a protruding shape, which takes up a large volume of space. Moreover, the bending of the terminals at the top and bottom adds one or more processes, which reduces the reliability of the product. At the same time, the use of DBC boards on both the top and bottom layers results in higher costs and poorer heat dissipation efficiency. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a socket-type power module packaging structure. The heat dissipation base plate adopts an integrated structure, and the top plate adopts a plastic-encapsulated shell. This ensures heat dissipation efficiency while reducing costs. Furthermore, the socket-type design not only reduces the cutting and bending processes, saving time and labor costs, but also facilitates the release of thermal stress, further improving heat dissipation efficiency.

[0004] The technical solution adopted in this invention is as follows:

[0005] A socket-type power module packaging structure includes: a plastic encapsulated shell; a copper busbar assembly, the copper busbar assembly including a first copper busbar and a second copper busbar, wherein the first copper busbar is disposed on one side of the inner surface of the plastic encapsulated shell, and the second copper busbar is disposed on the other side of the inner surface of the plastic encapsulated shell; an integrated heat dissipation copper base plate, the integrated heat dissipation copper base plate being arranged parallel to the copper busbar assembly; and N power chip groups, each power chip group including a first power chip and a second power chip, wherein the first power chip is soldered to a corresponding first copper busbar, and the second power chip is soldered to... On the integrated heat dissipation copper base plate, where N is an integer greater than or equal to 3; N support groups, each support group including a first metal frame and a second metal frame, one end of the first metal frame being connected to the corresponding first power chip, and the other end of the first metal frame being connected to the integrated heat dissipation copper base plate, one end of the second metal frame being connected to the corresponding second lead copper busbar, and the other end of the second metal frame being connected to the second power chip; embedded socket groups, the embedded socket groups being embedded in the packaging structure, and the embedded socket groups being respectively soldered to the lead copper busbar group and the integrated heat dissipation copper base plate.

[0006] In one embodiment of the present invention, the embedded socket group includes: a first power terminal socket, which is soldered to the first lead copper busbar; a second power terminal socket, which is soldered to the second lead copper busbar; N first gate signal terminal sockets, which are correspondingly connected to N first power chips and are soldered to the first lead copper busbar; and N first signal terminal sockets, which are correspondingly connected to N second power chips and are soldered to the second lead copper busbar.

[0007] In one embodiment of the present invention, the packaging structure of the socket-type power module further includes: N first gate bonding aluminum wires, each of the first gate signal terminal sockets being connected to the corresponding first power chip through one of the first gate bonding aluminum wires.

[0008] In one embodiment of the present invention, the integrated heat dissipation copper base plate includes: N upper copper layers, each upper copper layer having a first power chip soldered on it, and each upper copper layer being connected to the other end of a first metal frame; an intermediate insulating layer, one side of which is connected to the N upper copper layers; and a heat dissipation copper layer, which is connected to the other side of the intermediate insulating layer.

[0009] In one embodiment of the present invention, the embedded socket group further includes: N third power terminal sockets, the N third power terminal sockets being respectively soldered onto the N upper copper layers; N second gate signal terminal sockets, the N second gate signal terminal sockets being correspondingly connected to the N second power chips, the N second gate signal terminal sockets being respectively soldered onto the N upper copper layers; and N second signal terminal sockets, the N second signal terminal sockets being correspondingly connected to the N first power chips, the N second signal terminal sockets being respectively soldered onto the N upper copper layers.

[0010] In one embodiment of the present invention, the packaging structure of the socket-type power module further includes: N second gate bonding aluminum wires, each second gate signal terminal socket being connected to the corresponding second power chip through a second gate bonding aluminum wire.

[0011] In one embodiment of the present invention, the package structure of the socket-type power module further includes: an NTC resistor, wherein the NTC resistor is soldered to the first lead copper busbar.

[0012] In one embodiment of the present invention, the embedded socket group includes: a first resistor signal terminal socket and a second signal terminal socket, wherein the first resistor signal terminal socket and the second signal terminal socket are soldered to the first lead copper busbar and are respectively connected to the two ends of the NTC resistor.

[0013] In one embodiment of the present invention, the metal frames in the N bracket groups are all star-shaped.

[0014] The beneficial effects of this invention are:

[0015] The heat dissipation base plate of this invention adopts an integrated structure, and the top plate adopts a plastic-sealed shell. While ensuring heat dissipation efficiency, it reduces costs. At the same time, the interlocking design not only reduces the cutting and bending process, saving time and labor costs, but also facilitates the release of thermal stress, further improving heat dissipation efficiency. Attached Figure Description

[0016] Figure 1 This is an exploded view of the packaging structure of the socket-type power module according to an embodiment of the present invention;

[0017] Figure 2 This is a cross-sectional view of the package structure of a socket-type power module according to an embodiment of the present invention, on the side near the lead busbar group.

[0018] Figure 3 This is a cross-sectional view of the package structure of a socket-type power module according to an embodiment of the present invention, on the side near the integrated heat dissipation copper base plate. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Figure 1 This is a schematic diagram of the packaging structure of a socket-type power module according to an embodiment of the present invention.

[0021] like Figure 1 As shown, the packaging structure of the socket-type power module in this embodiment of the invention may include: a plastic encapsulation shell 100, a copper busbar group 200, an integrated heat dissipation copper base plate 300, N power chip groups 400, N bracket groups 500, and an embedded socket group ( Figure 1 (Not specifically shown in the text).

[0022] The copper busbar assembly 200 includes a first copper busbar 210 and a second copper busbar 220. The first copper busbar 210 is disposed on one side of the inner surface of the plastic-encapsulated housing 100, and the second copper busbar 220 is disposed on the other side of the inner surface of the plastic-encapsulated housing 100. An integrated heat dissipation copper base plate 300 is disposed parallel to the copper busbar assembly 200. Each power chip group 400 includes a first power chip 410 and a second power chip 420 (e.g., ...). Figure 1 Only one power chip group 400 is shown in the diagram, wherein a first power chip 410 is soldered to a first copper busbar 210 (e.g., the first power chip 410 can be sintered with the first copper busbar 210 by a silver sintering process), and a second power chip 420 is soldered to an integrated heat dissipation copper base plate 300 (e.g., the second power chip 420 can be sintered with the integrated heat dissipation copper base plate 300 by a silver sintering process), wherein N is an integer greater than or equal to 3; each support group 500 includes a first metal frame 510 and a second metal frame 520, one end of the first metal frame 510 is connected to the corresponding first power chip 410, and the other end of the first metal frame 510 is connected to the integrated heat dissipation copper base plate 300 (e.g., ...). One end of the first metal frame 510 can be bonded to the corresponding first power chip 410 with silver paste, and the other end of the first metal frame 510 can be bonded to the integrated heat dissipation copper base plate 300 with silver paste. One end of the second metal frame 520 is connected to the corresponding second lead copper busbar 220, and the other end of the second metal frame 520 is connected to the second power chip 420 (for example, one end of the second metal frame 520 can be bonded to the corresponding second lead copper busbar 220 with silver paste, and the other end of the second metal frame 520 can be bonded to the second power chip 420 with silver paste). The embedded socket group is embedded in the package structure, and the embedded socket group is respectively soldered to the lead copper busbar group 200 and the integrated heat dissipation copper base plate 300.

[0023] In this design, the metal frames in the N bracket groups 500 are all star-shaped. This star-shaped metal frame configuration significantly increases the current-carrying area, greatly enhancing the short-circuit withstand capability of the power module. Unlike traditional aluminum wire bonding, the failure of a single aluminum wire does not accelerate the overall module failure. Furthermore, unlike bonded aluminum wires which primarily serve an electrical connection function, the star-shaped metal frame provides bidirectional heat transfer in addition to electrical connection. The single-specification star-shaped metal frame has a simple, triangular structure with high structural strength and stability, maintaining the parallelism of the upper and lower surfaces. This ensures a highly consistent heat dissipation path for the power chips, reducing the operating temperature of the power module and preventing uneven temperature rises in individual power chips due to different heat dissipation paths. Moreover, compared to traditional aluminum wire bonding, the star-shaped metal frame connection used in this patent eliminates the need for numerous aluminum wires bonded to the power chip emitter, simplifying the structure, significantly increasing packaging efficiency, and reducing stray inductance within the power module.

[0024] Each power chip in the power chipset 400 integrates the functions of IGBT and FWD, and is an RC-IGBT (inverter chip).

[0025] Among them, epoxy resin or other thermoforming materials can be transformed into a plastic-encapsulated shell 100 through a molding process, which provides protection and insulation for the power module.

[0026] In one embodiment of the present invention, such as Figure 2 As shown, the embedded socket group 600 may include: a first power terminal socket 610, a second power terminal socket 620, N first gate signal terminal sockets 630 and N first signal terminal sockets 640.

[0027] The first power terminal socket 610 is soldered to the first lead copper bus 210, wherein the first power terminal socket 610 can be soldered to the first lead copper bus 210 by ultrasonic welding process; the second power terminal socket 620 is soldered to the second lead copper bus 220, wherein the second power terminal socket 620 can be soldered to the second lead copper bus 220 by ultrasonic welding process; N first gate signal terminal sockets 630 ( Figure 2 Only three first gate signal terminal sockets 630 are shown, corresponding to N first power chips 510. The N first gate signal terminal sockets 630 are soldered onto the first copper busbar 210. These N first gate signal terminal sockets 630 can be soldered to the first copper busbar 210 using an ultrasonic welding process. N first signal terminal sockets 640 are correspondingly connected to N second power chips 420. These N first signal terminal sockets are soldered onto the second copper busbar 220. These N first signal terminal sockets can be soldered to the second copper busbar 220 using an ultrasonic welding process. Figure 2 Only three first power chips 410, three first metal frames 510, and three second metal frames 520 are shown.

[0028] The first power terminal jack 610 can be a DC+ power terminal jack, and the second power terminal jack 620 can be a DC- power terminal jack.

[0029] In one embodiment of the present invention, such as Figure 2 As shown, the package structure of the socket-type power module also includes N first gate bonding aluminum wires 700. Each first gate signal terminal socket 630 is connected to the corresponding first power chip 410 through a first gate bonding aluminum wire 700.

[0030] In one embodiment of the present invention, such as Figure 3 and 1 As shown, the integrated heat dissipation copper base plate 300 includes: N upper copper layers 310 ( Figure 3 Only three layers are shown: the upper copper layer 310, the middle insulating layer 320, and the heat dissipation copper layer 330.

[0031] Each upper copper layer 310 has a first power chip 410 soldered on it, and each upper copper layer 310 is connected to the other end of a first metal frame 510; one side of the intermediate insulating layer 320 is connected to N upper copper layers 310; and the heat dissipation copper layer 330 is connected to the other side of the intermediate insulating layer 320.

[0032] Therefore, an integrated heat dissipation copper base plate 300 is formed by an integrated structure of heat dissipation copper layer 330, intermediate insulation layer 320 and multiple upper copper layers 310. It integrates the functions undertaken by DBC and copper substrate in power module. Compared with the traditional method of welding DBC and copper substrate together, this heat dissipation base plate does not have the problem of welding voids, and the thermal resistance will be reduced accordingly.

[0033] In one embodiment of the present invention, such as Figure 3 As shown, the embedded socket group 600 also includes: N third power terminal sockets 650 ( Figure 3 Only three are shown in the image), and N second gate signal terminal jacks 660 ( Figure 3 Only three are shown in the image) and N second signal terminal jacks 670 ( Figure 3 Only three are shown in the image.

[0034] Among them, N third power terminal sockets 650 are respectively soldered to N upper copper layers, and the N third power terminal sockets 650 can be soldered to the N upper copper layers by ultrasonic welding process; N second gate signal terminal sockets 660 are correspondingly connected to N second power chips 420, and the N second gate signal terminal sockets 660 are respectively soldered to N upper copper layers 310, and the N second gate signal terminal sockets 660 can be respectively soldered to the N upper copper layers 310 by ultrasonic welding process; N second signal terminal sockets 670 are correspondingly connected to N first power chips 410, and the N second signal terminal sockets 670 are respectively soldered to N upper copper layers, and the N second signal terminal sockets 670 can be respectively soldered to the N upper copper layers by ultrasonic welding process.

[0035] In one embodiment of the present invention, such as Figure 3 As shown, the package structure of the socket-type power module also includes: N second gate bonding aluminum wires 800, wherein each second gate signal terminal socket 660 is connected to the corresponding second power chip 420 through a second gate bonding aluminum wire 800.

[0036] In one embodiment of the present invention, such as Figure 1 and 2 As shown, the package structure of the socket-type power module also includes an NTC resistor 900, wherein the NTC resistor 900 is soldered onto the first lead copper busbar 210.

[0037] In one embodiment of the present invention, such as Figure 1 and 2 As shown, the embedded socket group 600 further includes: a first resistor signal terminal socket 680 and a second signal terminal socket 690, wherein the first resistor signal terminal socket 680 and the second signal terminal socket 690 are soldered to the first lead copper busbar 210 and are respectively connected to the two ends of the NTC resistor 900, wherein the first resistor signal terminal socket 680 and the second signal terminal socket 690 can be soldered together with the first lead copper busbar 210 by ultrasonic welding process.

[0038] Therefore, this invention adopts a novel socket-type design, which reduces the cutting and bending processes compared to traditional terminals, saving time and labor costs. The socket-type design facilitates connection, assembly, and disassembly, simplifying the packaging process and also promoting the release of thermal stress. The socket achieves electrical connection to the power module internally via ultrasonic bonding, providing strong current carrying capacity. The socket, copper frame, and heat sink base plate are made of the same material, resulting in higher consistency of physical properties, better reliability, and longer lifespan compared to traditional solder-based packaging.

[0039] In summary, the packaging structure of the socket-type power module according to embodiments of the present invention includes: a plastic encapsulated shell, a copper busbar group, an integrated heat dissipation copper base plate, N power chip groups, N bracket groups, and an embedded socket group. The copper busbar group includes a first copper busbar and a second copper busbar, wherein the first copper busbar is disposed on one side of the inner surface of the plastic encapsulated shell, and the second copper busbar is disposed on the other side of the inner surface of the plastic encapsulated shell. The integrated heat dissipation copper base plate is arranged parallel to the copper busbar group. Each power chip group includes a first power chip and a second power chip, wherein the first power chip is soldered on the first copper busbar, and the second power chip is soldered on the integrated heat dissipation copper base plate. Each bracket group includes a first metal frame and a second metal frame, one end of the first metal frame is connected to the corresponding first power chip, and the other end of the first metal frame is connected to the integrated heat dissipation copper base plate. One end of the second metal frame is connected to the corresponding second copper busbar, and the other end of the second metal frame is connected to the second power chip. The embedded socket group is embedded in the packaging structure and is soldered to the copper busbar group and the integrated heat dissipation copper base plate, respectively. Therefore, the heat dissipation base plate adopts an integrated structure, and the top plate adopts a plastic-sealed shell. While ensuring heat dissipation efficiency, it reduces costs. At the same time, the use of a plug-in design not only reduces the cutting and bending process, saving time and labor costs, but also facilitates the release of thermal stress, further improving heat dissipation efficiency.

[0040] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0041] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0044] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0045] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.

[0046] Furthermore, the functional units in the various embodiments of the present invention can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0047] The storage medium mentioned above can be a read-only memory, a disk, or an optical disk, etc. Although embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A socket-type power module packaging structure, characterized in that, include: Plastic-sealed casing; A copper busbar assembly, comprising a first copper busbar and a second copper busbar, wherein the first copper busbar is disposed on one side of the inner surface of the plastic encapsulation housing, and the second copper busbar is disposed on the other side of the inner surface of the plastic encapsulation housing; An integrated heat dissipation copper base plate is arranged parallel to the lead copper busbar assembly; There are N power chip groups, each power chip group including a first power chip and a second power chip, wherein the first power chip is soldered on the first lead copper busbar, and the second power chip is soldered on the integrated heat dissipation copper base plate, wherein N is an integer greater than or equal to 3; N bracket groups, each bracket group includes a first metal frame and a second metal frame, one end of the first metal frame is connected to the corresponding first power chip, the other end of the first metal frame is connected to the integrated heat dissipation copper base plate, one end of the second metal frame is connected to the corresponding second lead copper busbar, and the other end of the second metal frame is connected to the second power chip. An embedded socket assembly is embedded within the packaging structure and is respectively soldered to the lead busbar assembly and the integrated heat dissipation copper base plate; wherein, the embedded socket assembly includes: The first power terminal socket is soldered onto the first lead copper busbar; The second power terminal socket is soldered onto the second lead copper busbar; N first gate signal terminal sockets, each of which is connected to N first power chips, and the N first gate signal terminal sockets are soldered onto the first lead copper busbar; N first signal terminal sockets are connected to N second power chips respectively, and the N first signal terminal sockets are soldered to the second lead copper busbar.

2. The packaging structure of the socket-type power module according to claim 1, characterized in that, Also includes: There are N first gate bonding aluminum wires, and each first gate signal terminal socket is connected to the corresponding first power chip through one of the first gate bonding aluminum wires.

3. The packaging structure of the socket-type power module according to claim 1, characterized in that, The integrated heat dissipation copper base plate includes: There are N upper copper layers, each of which has a second power chip soldered on it, and each of which is connected to the other end of a first metal frame. An intermediate insulating layer, one side of which is connected to the N upper copper layers; A heat-dissipating copper layer is connected to the other side of the intermediate insulating layer.

4. The packaging structure of the socket-type power module according to claim 3, characterized in that, The embedded socket assembly also includes: N third power terminal sockets, each of which is soldered onto the N upper copper layer; N second gate signal terminal sockets are connected to N second power chips respectively, and the N second gate signal terminal sockets are respectively soldered on the N upper copper layers; N second signal terminal sockets are connected to N first power chips respectively, and the N second signal terminal sockets are respectively soldered on the N upper copper layers.

5. The packaging structure of the socket-type power module according to claim 4, characterized in that, Also includes: N second gate bonding aluminum wires, each second gate signal terminal socket is connected to the corresponding second power chip through a second gate bonding aluminum wire.

6. The packaging structure of the socket-type power module according to claim 1, characterized in that, Also includes: An NTC resistor is soldered onto the first lead copper busbar.

7. The packaging structure of the socket-type power module according to claim 6, characterized in that, The embedded socket assembly includes: The first resistor signal terminal socket and the second signal terminal socket are soldered to the first lead copper busbar and are respectively connected to the two ends of the NTC resistor.

8. The packaging structure of the socket-type power module according to claim 1, characterized in that, The metal frames in all N of the aforementioned support groups are star-shaped.

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