Universal hanging rack for wafer production

Abstract

The utility model discloses a universal hanging rack for wafer production, which comprises a front hanging plate and a rear hanging plate which are symmetrically arranged, the main bodies of the front hanging plate and the rear hanging plate are respectively provided with a through hole, the opposite inner sides of the front hanging plate and the rear hanging plate are respectively provided with a placing groove with the same outline as the through hole, and the placing grooves are used for placing wafers with different sizes. The top end of the rectangular groove is located in the top end face of the front hanging plate and the top end face of the rear hanging plate, a plurality of connecting holes are formed in the left side and the right side of the containing groove respectively, the connecting holes penetrate through main bodies of the front hanging plate and the rear hanging plate, and connecting pieces are arranged in the connecting holes in a penetrating mode. The front hanging plate and the rear hanging plate are fixedly connected through the connecting piece. According to the utility model, by utilizing the size and shape characteristics of the wafer, the carrier with the triangular structure can be produced corresponding to wafers with different sizes from small to large, so that the development or purchase cost of different hangers is reduced.

Description

Technical Field

[0001] This utility model relates to a universal mounting bracket for wafer manufacturing, belonging to the field of wafer manufacturing technology. Background Technology

[0002] Wafer manufacturing requires the use of chemical plating or electroplating techniques to meet the performance and manufacturing requirements of advanced semiconductor devices. During chemical or electroplating, wafers must be held in place in the plating solution using racks to prevent displacement or damage due to flow or mechanical vibration. Using racks ensures uniform plating, improves production efficiency, and guarantees process stability.

[0003] Current wafer production methods, such as chemical plating or electroplating, require wafers of different sizes. Different sizes of wafers require different sizes of racks for support, and the development or purchase of different racks is costly.

[0004] In conclusion, the existing technology obviously has inconveniences and defects in practical use, so it is necessary to improve it. Utility Model Content

[0005] This invention addresses the shortcomings of the prior art by providing a universal wafer production rack. Utilizing the characteristics of wafer size and shape, a triangular structure carrier can be built to accommodate wafers of different sizes, reducing the development or purchase costs of different racks.

[0006] To solve the above technical problems, the present invention adopts the following technical solution:

[0007] A universal wafer manufacturing rack includes a symmetrically arranged front rack and a rear rack. Both the front rack and the rear rack have through holes on their main bodies. The front rack and the rear rack have placement slots with the same outline as the through holes on their opposing inner sides. The placement slots are used to place wafers of different sizes. The placement slots are composed of a rectangular slot, an inverted trapezoidal slot, and a semi-circular slot arranged sequentially from top to bottom. The top of the rectangular slot is located inside the top surface of the front rack and the rear rack.

[0008] Furthermore, the through hole is composed of a rectangular hole, an inverted trapezoidal hole, and a semi-circular hole arranged sequentially from top to bottom. The top end of the inverted trapezoidal hole is connected to the rectangular hole, and the bottom end of the inverted trapezoidal hole is connected to the semi-circular hole.

[0009] Furthermore, the size of the placement groove is larger than the size of the through hole.

[0010] Furthermore, the top of the inverted trapezoidal groove is connected to the rectangular groove, and the bottom of the inverted trapezoidal groove is connected to the semi-circular groove.

[0011] Furthermore, the left and right sides of the placement slot are provided with multiple connection holes, which penetrate the main body of the front and rear mounting plates.

[0012] Furthermore, the multiple connecting holes are evenly distributed at equal intervals along the vertical direction.

[0013] Furthermore, a connector is inserted through the connection hole, which fixes the front mounting plate and the rear mounting plate together.

[0014] Furthermore, the top of both the front and rear mounting plates are provided with ear plates integrally formed therewith, and each ear plate is provided with a hanging hole.

[0015] Compared with the prior art, the present invention, by adopting the above technical solution, has the following advantages:

[0016] The front and rear mounting plates are provided with placement slots for placing wafers on their inner sides. The placement slots are composed of rectangular slots, inverted trapezoidal slots and semi-circular slots arranged from top to bottom. They can clamp and fix wafers of different sizes, and facilitate chemical plating or electroplating of wafers of different sizes.

[0017] This invention utilizes the characteristics of wafer size and shape to build a triangular structure carrier that can be adapted to the production of wafers of different sizes, reducing the development or purchase costs of different mounting brackets.

[0018] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a structural diagram of the rear mounting plate;

[0021] Figure 3 This is a schematic diagram of wafer placement.

[0022] In the diagram, 1-front mounting plate, 2-rear mounting plate, 3-ear plate, 4-hanging hole, 5-through hole, 51-rectangular hole, 52-inverted trapezoidal hole, 53-semi-circular hole, 6-placement slot, 61-rectangular slot, 62-inverted trapezoidal slot, 63-semi-circular slot, 7-connection hole, 8-wafer. Detailed Implementation

[0023] To provide a clearer understanding of the technical features, objectives, and effects of this utility model, the specific embodiments of this utility model are now described with reference to the accompanying drawings.

[0024] like Figures 1-3As shown in the figure, this utility model provides a universal rack for wafer production, including a front rack 1 and a rear rack 2 symmetrically arranged. Both the front rack 1 and the rear rack 2 have through holes 5 on their main bodies for the flow of plating solution. The front rack 1 and the rear rack 2 have placement grooves 6 with the same outline as the through holes 5 on their opposing inner sides for placing wafers 8 of different sizes.

[0025] The through hole 5 is composed of a rectangular hole 51, an inverted trapezoidal hole 52 and a semi-circular hole 53 arranged sequentially from top to bottom. The top end of the inverted trapezoidal hole 52 is connected to the rectangular hole 51, and the bottom end of the inverted trapezoidal hole 52 is connected to the semi-circular hole 53.

[0026] The size of the placement slot 6 is larger than the size of the through hole 5.

[0027] The placement groove 6 is composed of a rectangular groove 61, an inverted trapezoidal groove 62 and a semi-circular groove 63 arranged sequentially from top to bottom. The top end of the inverted trapezoidal groove 62 is connected to the rectangular groove 61, and the bottom end of the inverted trapezoidal groove 62 is connected to the semi-circular groove 63.

[0028] The top of the rectangular groove 61 is located inside the top surfaces of the front mounting plate 1 and the rear mounting plate 2, and the wafer 8 is placed into the placement groove 6 from the top of the front mounting plate 1 and the rear mounting plate 2.

[0029] The placement slot 6 has multiple connecting holes 7 on its left and right sides respectively. The connecting holes 7 penetrate the main body of the front hanging plate 1 and the rear hanging plate 2. The multiple connecting holes 7 are evenly distributed at equal intervals along the vertical direction.

[0030] A connector is inserted through the connection hole 7, which fixes the front mounting plate 1 and the rear mounting plate 2 together, so that a clamping and placement space for the wafer 8 is formed between the front mounting plate 1 and the rear mounting plate 2.

[0031] The top of both the front mounting plate 1 and the rear mounting plate 2 is provided with an ear plate 3 integrally formed therewith, and the ear plate 3 is provided with a hanging hole 4. The ear plate 3 and the hanging hole 4 are manufactured according to the requirements of different production lines.

[0032] The specific working principle of this utility model is as follows:

[0033] In this invention, a connector is inserted through the connecting hole 7 to fix the front mounting plate 1 and the rear mounting plate 2 together. The front mounting plate 1 and the rear mounting plate 2 are both provided with placement grooves 6 for placing the wafer 8 on their opposing inner sides. The wafer 8 is placed into the placement groove 6 from the top of the front mounting plate 1 and the rear mounting plate 2. Since the placement groove 6 is composed of a rectangular groove 61, an inverted trapezoidal groove 62 and a semi-circular groove 63 arranged sequentially from top to bottom, it can clamp and fix wafers of different sizes, which is convenient for chemical plating or electroplating of wafers of different sizes.

[0034] This invention utilizes the characteristics of wafer size and shape to construct a triangular carrier that can be adapted to different wafer production sizes, reducing the development costs of different jigs and fixtures.

[0035] The above description provides examples of the preferred embodiments of this utility model. Any aspects not detailed herein are common knowledge to those skilled in the art. The scope of protection of this utility model is determined by the claims. Any equivalent modifications based on the technical teachings of this utility model are also within the scope of protection of this utility model.

Claims

1. A universal mounting bracket for wafer fabrication, characterized in that: The device includes a symmetrically arranged front mounting plate (1) and a rear mounting plate (2). Both the front mounting plate (1) and the rear mounting plate (2) have through holes (5) on their main bodies. Both the front mounting plate (1) and the rear mounting plate (2) have placement slots (6) with the same outline as the through holes (5) on their opposing inner sides. The placement slots (6) are used for placing wafers (8) of different sizes. The placement slots (6) are composed of a rectangular slot (61), an inverted trapezoidal slot (62) and a semi-circular slot (63) arranged from top to bottom. The top of the rectangular slot (61) is located inside the top surface of the front mounting plate (1) and the rear mounting plate (2).

2. The universal wafer fabrication rack as described in claim 1, characterized in that: The through hole (5) is composed of a rectangular hole (51), an inverted trapezoidal hole (52) and a semicircular hole (53) arranged sequentially from top to bottom. The top end of the inverted trapezoidal hole (52) is connected to the rectangular hole (51), and the bottom end of the inverted trapezoidal hole (52) is connected to the semicircular hole (53).

3. The universal wafer fabrication rack as described in claim 2, characterized in that: The size of the placement slot (6) is larger than the size of the through hole (5).

4. The universal wafer fabrication rack as described in claim 1, characterized in that: The top end of the inverted trapezoidal groove (62) is connected to the rectangular groove (61), and the bottom end of the inverted trapezoidal groove (62) is connected to the semi-circular groove (63).

5. The universal wafer fabrication rack as described in claim 1, characterized in that: The placement slot (6) is provided with multiple connection holes (7) on the left and right sides respectively. The connection holes (7) penetrate the main body of the front hanging plate (1) and the rear hanging plate (2).

6. The universal wafer production rack as described in claim 5, characterized in that: Multiple connecting holes (7) are evenly distributed at equal intervals along the vertical direction.

7. The universal wafer production rack as described in claim 5, characterized in that: A connector is inserted through the connection hole (7), which fixes the front mounting plate (1) and the rear mounting plate (2) together.

8. The universal wafer fabrication rack as described in claim 1, characterized in that: The top of the front mounting plate (1) and the rear mounting plate (2) are provided with ear plates (3) integrally formed therewith, and the ear plates (3) are respectively provided with hanging holes (4).

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