Paste preparation stirrer capable of automatically vacuumizing

Abstract

The utility model discloses an automatic vacuumizing paste-making stirrer which comprises a kettle body, a stirring shaft, a feeding pipe, a discharging pipe, a vacuum pipe and a heat exchange structure, a temperature and air pressure sensor is arranged in the kettle body, and the vacuum pipe is externally connected with a vacuum pump. An inner jacket and an outer jacket are respectively arranged on the inner side wall and the outer side wall of the kettle body, semiconductor refrigeration plates are connected between the inner jacket and the outer jacket, a cold end is connected to the inner side of the inner jacket, a circulating cold source is arranged in the outer jacket, the bottom end of the stirring shaft is connected to the inner side of the inner jacket, and the semiconductor refrigeration plates are distributed along the axis of the kettle body at equal angles; a heat exchange sleeve detachably sleeves the outer wall of the kettle body and is arranged in the circulating cold source; the heat exchange sleeve is divided into a bottom sleeve and a top sleeve; a heat exchange groove is formed in the outer side wall of the heat exchange sleeve. The stirrer can accurately control the vacuum degree, improve the paste quality and accurately evaluate indexes; the temperature is accurately controlled, and the quality of the paste is stable; the heat exchange structure is unique, cost is saved, and heat exchange efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of ointment mixing devices, and in particular to an automatic vacuum ointment mixer. Background Technology

[0002] In the mixing of dicalcium phosphate paste, manual vacuuming is typically used. This method makes it difficult to precisely control the vacuum level, causing air bubbles to easily get mixed into the paste, resulting in an uneven internal structure and a grainy texture, which seriously affects the quality of the paste. Frequent manual operation of related equipment, monitoring and adjusting the vacuum level not only requires employees to have certain skills and experience, but also greatly increases labor intensity and reduces production efficiency. Moreover, because the uniformity and stability of the paste are difficult to guarantee, air bubbles and unevenness can cause deviations in the test results when testing indicators such as viscosity and ductility, making it impossible to accurately assess the quality of the paste. There are many shortcomings that urgently need to be improved. Summary of the Invention

[0003] The technical problem to be solved by this invention is that manually vacuuming the paste mixer can easily reduce the quality of the paste.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: an automatic vacuum ointment stirring device, including a vessel body, a stirring shaft arranged vertically and rotatingly inside the vessel body, a feeding pipe and a discharging pipe respectively connected to the top and bottom of the vessel body, a vacuum tube connected to the top of the vessel body, and a heat exchange structure fitted in the middle of the outer wall of the vessel body. A temperature detection sensor and a pressure sensor are installed inside the vessel body, and a vacuum pump is connected to the vacuum tube.

[0005] Preferably, an inner jacket is fixedly installed on the inner side wall of the vessel body, and the inner jacket is coaxially arranged with the stirring shaft. An outer jacket is fixedly installed on the outer side wall of the vessel body. A semiconductor cooling plate is connected between the inner jacket and the outer jacket. The cold end of the semiconductor cooling plate is located inside the inner jacket. A circulating cold source is installed inside the outer jacket.

[0006] Preferably, a U-shaped stirring blade is fixedly connected to the bottom end of the stirring shaft, and the stirring blade is located inside the inner jacket.

[0007] Preferably, the semiconductor cooling plates are distributed at equal angles along the axis of the vessel.

[0008] Preferably, an annular groove is formed on the outer wall of the inner jacket, the cold end of the semiconductor cooling plate is located in the annular groove, and a metal mesh is arranged in the heat exchange groove.

[0009] Preferably, a heat exchange jacket is detachably fitted on the outer wall of the vessel body. The heat exchange jacket is located inside the outer jacket and is immersed in the circulating cold source. A drain pipe and a water inlet pipe are respectively connected to the bottom and top of the outer jacket. The hot end of the semiconductor cooling plate is located inside the heat exchange jacket.

[0010] Preferably, the heat exchange jacket includes a bottom jacket and a top jacket, which are connected by bolts. A receiving cavity is provided at the joint between the bottom jacket and the top jacket, and the hot end of the semiconductor cooling plate is located in the receiving cavity.

[0011] Preferably, heat exchange grooves are vertically formed on the outer wall of the heat exchange jacket, and the heat exchange grooves are evenly distributed around the outer wall of the heat exchange jacket.

[0012] This invention provides an automatic vacuum paste-making mixer, which has the following beneficial effects.

[0013] 1. Automatic vacuuming is achieved through the vacuum tube of an external vacuum pump. Compared with the traditional manual vacuuming method, it can precisely control the vacuum level inside the vessel, effectively avoid the inclusion of air bubbles in the paste, and solve the problems of uneven internal structure and grainy texture in the paste, greatly improving the quality of the paste. Since the uniformity and stability of the paste are guaranteed, there will be no deviation due to air bubbles and unevenness when testing the paste viscosity, extensibility and other indicators, which can accurately assess the quality of the paste and provide a reliable basis for product quality control.

[0014] 2. A temperature sensor is installed inside the reactor, which, together with the inner and outer jackets, semiconductor cooling plate, and circulating cold source, enables precise temperature control within the reactor. The cold end of the semiconductor cooling plate is located inside the inner jacket, allowing for rapid cooling of the materials inside the reactor. Its even distribution along the reactor axis ensures more uniform cooling, preventing the paste from losing water, decomposing, or undergoing other chemical reactions due to excessively high temperatures, thus maintaining its quality and stability.

[0015] 3. The heat exchange structure differs from that of conventional jacketed cold sources. Conventional vacuum stirrers, after setting up a heat exchange jacket, use a thicker inner wall to ensure structural stability, resulting in an excessively large overall mass of the vessel and low heat exchange efficiency. In contrast, this paste-making stirrer uses a uniformly distributed semiconductor cooling plate. While ensuring heat exchange performance, the embedded semiconductor cooling plate enhances structural integrity, reduces the overall wall thickness of the vessel, saves material costs, and improves heat exchange efficiency. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0017] Figure 1 This is a structural front view of an embodiment of the present utility model.

[0018] Figure 2 This is a schematic diagram of the internal structure of an embodiment of the present utility model.

[0019] Figure 3 This is a schematic diagram of the heat exchange jacket in an embodiment of the present invention.

[0020] Figure 4 This is a schematic diagram of the back structure of the heat exchange jacket in an embodiment of this utility model.

[0021] In the diagram: 1. Reactor body; 2. Feed pipe; 3. Discharge pipe; 4. Stirring component; 5. Vacuum tube; 6. Outer jacket; 7. Stirring shaft; 8. Stirring blade; 9. Inner jacket; 10. Semiconductor cooling plate; 11. Heat exchange jacket; 12. Drain pipe; 13. Bottom sleeve; 14. Top sleeve; 15. Receiving cavity; 16. Heat exchange tank. Detailed Implementation

[0022] like Figure 1-4 As shown, this utility model provides an automatic vacuum paste mixing device, including a vessel body 1, a stirring shaft 7 vertically rotating inside the vessel body 1, a feeding pipe 2 and a discharging pipe 3 respectively connected to the top and bottom of the vessel body 1, a vacuum tube 5 connected to the top of the vessel body 1, and a heat exchange structure fitted in the middle of the outer wall of the vessel body 1. A temperature detection sensor and a pressure sensor are installed inside the vessel body 1, and a vacuum pump is connected to the vacuum tube 5.

[0023] Raw materials are input through the feeding pipe 2 and transported into the interior of the reactor body 1. The stirring shaft 7, driven by the stirring element 4 at the top of the reactor body 1, rotates to stir the raw materials inside. During stirring, the control system adjusts the vacuum level and evacuation time inside the reactor body 1. A pressure sensor detects the internal pressure of the reactor body 1 to ensure the accuracy of the vacuum evacuation. The control system controls the operation of the vacuum pump connected to the vacuum pipe 5 according to the set vacuum level requirements. When the actual pressure exceeds the set value, the vacuum pump is activated to evacuate air. When the pressure approaches or reaches the set value, the control system reduces the speed of the vacuum pump or stops evacuation to maintain a stable vacuum environment. After the set vacuum level and evacuation time are achieved, the stirrer automatically stops, and the laboratory technician proceeds to the next step.

[0024] like Figure 2As shown. An inner jacket 9 is fixedly installed on the inner wall of the vessel body 1, and the inner jacket 9 is coaxially arranged with the stirring shaft 7. An outer jacket 6 is fixedly installed on the outer wall of the vessel body 1. A semiconductor cooling plate 10 is connected between the inner jacket 9 and the outer jacket 6. The cold end of the semiconductor cooling plate 10 is located inside the inner jacket 9, and a circulating cold source is provided in the outer jacket 6. During the stirring process inside the vessel body 1, the main heat generation comes from the area near the stirring blade 8. When stirring the paste, it is necessary to cool the inside of the vessel body 1. The overall structure of the vessel body 1 needs to ensure high sealing. Using a jacket to accommodate the cold source would affect the heat exchange efficiency if there were too much heat in the inner wall. Therefore, a semiconductor cooling plate 10 is installed on the inner wall of the vessel body 1 to cool the inside of the vessel body 1. At the same time, a circulating cold source is used to cool the hot end of the semiconductor cooling plate 10 to ensure the heat exchange efficiency of the semiconductor cooling plate 10. The semiconductor cooling plate 10 exchanges heat with the interior of the vessel body 1 through the inner jacket 9 to cool the raw materials.

[0025] like Figure 2 As shown, to achieve uniform stirring of the raw materials inside the vessel 1, a U-shaped stirring blade 8 is fixedly connected to the bottom end of the stirring shaft 7, and the stirring blade 8 is located inside the inner jacket 9. The U-shaped stirring blade 8 can fit with the structure of the vessel 1, and can better disperse and mix the materials during the stirring process, further improving the uniformity and stability of the paste preparation.

[0026] In a preferred embodiment of this invention, the semiconductor cooling plates 10 are evenly distributed along the axis of the vessel body 1. By uniformly distributing the semiconductor cooling plates 10, heat exchange with the raw materials inside the vessel body 1 can be achieved uniformly, while ensuring efficient heat exchange.

[0027] In a preferred embodiment of this invention, to ensure uniform contact between the cold end of the semiconductor cooling plate 10 and the inner jacket 9, and to improve the heat exchange efficiency of the inner jacket 9, an annular groove is formed on the outer wall of the inner jacket 9. The cold end of the semiconductor cooling plate 10 is located within the annular groove, and a metal mesh is arranged within the heat exchange groove. The metal mesh serves as a heat-conducting structure and is further extended.

[0028] like Figure 2-4 As shown, a heat exchange jacket 11 is detachably fitted onto the outer wall of the vessel body 1. The heat exchange jacket 11 is located inside the outer jacket 6 and is immersed in the circulating cold source. A drain pipe 12 and a water inlet pipe are connected to the bottom and top of the outer jacket 6, respectively. The hot end of the semiconductor refrigeration plate 10 is located inside the heat exchange jacket 11. By covering the semiconductor refrigeration plate 10 with the heat exchange jacket 11, the hot end of the semiconductor refrigeration plate 10 is prevented from being directly placed in the circulating cold source. The circulating cold source uses cold water, and heat exchange occurs between the heat exchange jacket 11 and the hot end of the semiconductor refrigeration plate 10, ensuring the stability of the semiconductor refrigeration plate 10's operation.

[0029] like Figure 3 and Figure 4 As shown. The heat exchange jacket 11 includes a bottom sleeve 13 and a top sleeve 14, which are connected by bolts. A receiving cavity 15 is provided at the joint between the bottom sleeve 13 and the top sleeve 14, and the hot end of the semiconductor refrigeration plate 10 is located in the receiving cavity 15. By removing the bolts, the bottom sleeve 13 and the top sleeve 14 can be separated, exposing the semiconductor refrigeration plate 10. If the semiconductor refrigeration plate 10 fails, it can be removed from the vessel body 1 in this way for repair or replacement; and it also ensures the seal of the heat exchange jacket 11 on the hot end of the semiconductor refrigeration plate 10.

[0030] like Figure 3 As shown, to improve the heat exchange efficiency of the heat exchange jacket 11, heat exchange grooves 16 are vertically formed on the outer wall of the heat exchange jacket 11, and the heat exchange grooves 16 are evenly distributed around the outer wall of the heat exchange jacket 11. The heat exchange grooves 16 increase the surface area of ​​the heat exchange jacket 11, thereby improving the heat exchange efficiency. When cleaning the scale adhering to the surface of the heat exchange jacket 11, it can be directly scrubbed with a brush or rinsed with a high-pressure water gun, and the scale is discharged through the drain pipe 12 at the bottom.

Claims

1. An automatic vacuum paste-making mixer, characterized in that: It includes a vessel body (1), a stirring shaft (7) arranged vertically and rotating inside the vessel body (1), a feeding pipe (2) and a discharge pipe (3) respectively connected to the top and bottom of the vessel body (1), a vacuum tube (5) connected to the top of the vessel body (1), and a heat exchange structure fitted in the middle of the outer wall of the vessel body (1). A temperature detection sensor and a pressure sensor are installed inside the vessel body (1), and a vacuum pump is connected to the vacuum tube (5).

2. The automatic vacuum ointment mixer as described in claim 1, characterized in that: An inner jacket (9) is fixedly installed on the inner side wall of the vessel body (1). The inner jacket (9) is coaxially arranged with the stirring shaft (7). An outer jacket (6) is fixedly installed on the outer side wall of the vessel body (1). A semiconductor cooling plate (10) is connected between the inner jacket (9) and the outer jacket (6). The cold end of the semiconductor cooling plate (10) is located inside the inner jacket (9). A circulating cold source is provided inside the outer jacket (6).

3. The automatic vacuum paste-making mixer as described in claim 2, characterized in that: The bottom end of the stirring shaft (7) is fixedly connected to a U-shaped stirring blade (8), which is located inside the inner jacket (9).

4. The automatic vacuum ointment mixer as described in claim 2, characterized in that: The semiconductor cooling plate (10) is distributed at equal angles along the axis of the vessel body (1).

5. The automatic vacuum paste-making mixer as described in claim 4, characterized in that: An annular groove is provided on the outer wall of the inner jacket (9), the cold end of the semiconductor cooling plate (10) is located in the annular groove, and a metal mesh is arranged in the heat exchange groove.

6. The automatic vacuum paste-making mixer as described in claim 2, characterized in that: A heat exchange sleeve (11) is detachably fitted on the outer wall of the vessel body (1). The heat exchange sleeve (11) is located inside the outer jacket (6) and is immersed in the circulating cold source. The bottom and top of the outer jacket (6) are respectively connected to a drain pipe (12) and a water inlet pipe. The hot end of the semiconductor cooling plate (10) is located inside the heat exchange sleeve (11).

7. The automatic vacuum ointment mixer as described in claim 6, characterized in that: The heat exchange jacket (11) includes a bottom jacket (13) and a top jacket (14), which are connected by bolts. A receiving cavity (15) is provided at the joint between the bottom jacket (13) and the top jacket (14), and the hot end of the semiconductor cooling plate (10) is located in the receiving cavity (15).

8. The automatic vacuum paste-making mixer as described in claim 6 or 7, characterized in that: The heat exchange sleeve (11) has vertically formed heat exchange grooves (16) on its outer side wall, and the heat exchange grooves (16) are evenly distributed around the outer side wall of the heat exchange sleeve (11).

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