Adsorption waste removal device

By combining the adsorption and cutting components, the problem of waste residue and adhesion in laser-cut films is solved, achieving efficient and non-destructive waste removal while ensuring product precision and shape remain unchanged.

CN224088221UActive Publication Date: 2026-04-07WUHAN DR LASER TECH CORP LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-22
Publication Date
2026-04-07

AI Technical Summary

Technical Problem

During the laser cutting of thin films, waste residue or adhesion can damage the product, and existing waste removal methods are inefficient or affect the product positioning accuracy.

Method used

The system employs an adsorption component and a cutting component. The adsorption head generates negative pressure to suck up the waste material, and the cutting component cuts off the connection between the waste material and the product, ensuring that the waste removal process does not affect the product's position or shape.

Benefits of technology

It achieves efficient removal of waste without damaging the product, maintaining the product's positional accuracy and morphological integrity.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an adsorption waste removal device. The adsorption waste removal device comprises an adsorption assembly and a mounting plate, the adsorption assembly comprises a waste discharge pipeline and an adsorption head which are mounted on the mounting plate, the adsorption head communicates with the waste discharge pipeline, the adsorption head corresponds to the machining area, the preset height is formed between the adsorption head and the plane of the machining area, and the adsorption head cannot make contact with a product obtained through machining in the waste removing process; the adsorption head generates negative pressure to suck waste generated by machining into the adsorption head, and the waste is conveyed into the waste discharge pipeline; a moving assembly is arranged at one end of the mounting plate and drives the mounting plate to move in the length direction of the mounting plate, and the machined part moves in the width direction of the mounting plate. Therefore, waste materials in the machining area are removed, and products obtained through machining cannot be damaged.
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Description

Technical Field

[0001] This application belongs to the field of laser processing technology, specifically relating to an adsorption waste removal device. Background Technology

[0002] Laser cutting of thin films generates waste material, which typically remains in the processing area. Manual cleaning is inefficient and can easily cause secondary damage to the finished product (the pattern formed after laser cutting). If an air blowing device is used to blow the waste away from the processing area, it may cause the waste to scatter, affecting the working environment and product positioning, especially for complex or thin materials.

[0003] Furthermore, during the laser cutting of films, waste material edges may melt and then solidify, adhering to the product. Insufficient pattern cutting during processing can result in the finished product and the waste material being connected. If roller clamps are used to remove the waste material, it may pull the product, causing damage. Moreover, if the waste material is not lifted, the roller clamps cannot effectively remove it, resulting in a low waste removal rate.

[0004] If the waste is removed by suction under negative pressure, and then clamping parts are used to remove the waste that is attached to the product, it is easy to pull the product and cause damage, which may lead to the product being scrapped in severe cases. Utility Model Content

[0005] In view of this, this application provides an adsorption waste removal device with high waste removal efficiency, and the waste removal process does not affect the positional accuracy and shape of the processed product.

[0006] An adsorption waste removal device includes an adsorption component and a mounting plate;

[0007] The adsorption assembly includes a waste discharge pipe and an adsorption head mounted on the mounting plate. The adsorption head is connected to the waste discharge pipe and is set to correspond to the processing area. The adsorption head has a preset height relative to the plane of the processing area. The adsorption head generates negative pressure to suck the waste material in the processing area into the adsorption head and then transfer it to the waste discharge pipe.

[0008] A moving component is provided at one end of the mounting plate. The moving component drives the mounting plate to move along the length direction of the mounting plate, and the workpiece moves along the width direction of the mounting plate.

[0009] Preferably, the workpiece has multiple processing areas, and each processing area is provided with at least one adsorption head during waste removal.

[0010] Preferably, the adsorption assembly includes a gas distribution block, which is connected to each adsorption head.

[0011] Preferably, the waste discharge pipe is located above the mounting plate, the adsorption head is located below the mounting plate, and the adsorption head penetrates the mounting plate and is connected to the waste discharge pipe.

[0012] Preferably, the adsorption head and the waste discharge pipe are connected by a connecting pipe, which includes a bend and a hose that are connected to each other. The end of the bend away from the hose is connected to the waste discharge pipe, and the end of the hose away from the bend is connected to the adsorption head.

[0013] Preferably, it also includes a cutting component, which includes a cutting part. When the waste material in the processing area is sucked into the adsorption head, if the waste material is connected to the processed product, the cutting part cuts off the waste material connected to the processed product.

[0014] Preferably, the cutting assembly further includes a push-pull member located below the mounting plate and a connector mounted on the push-pull member;

[0015] The cutting section is installed at the lower end of the suction head. The cutting section includes two cutting blades arranged opposite each other. The cutting blades are connected to the push-pull component through the connector. The push-pull component drives the two cutting blades to move closer or further apart.

[0016] Preferably, the push-pull component includes a drive module, an upper push plate, and a lower push plate located below the upper push plate. The connector includes an upper connector mounted on the upper push plate and a lower connector mounted on the lower push plate. The suction head passes through the gap between the upper connector and the lower connector.

[0017] The cutting section also includes an adapter plate with a through hole communicating with the suction head. Two oppositely arranged cutting blades pass through the adapter plate and can extend into the through hole. The portion of the cutting blade located on the outside of the adapter plate has a connecting hole. The upper connector is inserted into the connecting hole of one of the cutting blades, and the lower connector is inserted into the connecting hole of the other oppositely arranged cutting blade.

[0018] The drive module drives the upper and lower push plates to move in opposite directions, causing the two cutting blades, which are positioned opposite each other, to move closer or further apart.

[0019] Preferably, along the length of the mounting plate, the drive module includes parallel cylinders installed at both ends of the bottom of the mounting plate. Each parallel cylinder has two sliders at its bottom, and the parallel cylinder drives the corresponding two sliders to move closer or further apart from each other.

[0020] In one parallel cylinder, the inner slider is connected to the upper push plate, and the outer slider is connected to the lower push plate. In the other parallel cylinder, the inner slider is connected to the lower push plate, and the outer slider is connected to the upper push plate.

[0021] Preferably, both ends of the mounting plate are provided with lifting components, which drive the mounting plate to move up and down; and / or,

[0022] It also includes a detection component, which detects whether the waste material is connected to the processed product after being sucked into the adsorption head. If a connection is found, the waste material connected to the processed product is cut off by the cutting part.

[0023] The beneficial effects of this application are as follows: the adsorption head is correspondingly set to the processing area and has a preset height relative to it. During the waste removal process, the adsorption head will not come into contact with the processed product. The adsorption head generates negative pressure to draw the waste from the processing area into the adsorption head and transmit it to the waste discharge pipe, thereby removing the waste from the processing area without damaging the processed product. After the adsorption head draws the waste from the processing area into the adsorption head, if the waste is connected to the processed product, the cutting part cuts off the waste connected to the processed product, so that the product will not be pulled when moving it after the waste is removed, thus avoiding affecting the position and shape of the product. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0025] The structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0026] Figure 1 A schematic diagram of the adsorption waste removal device provided in this application;

[0027] Figure 2 This is a schematic diagram of one possible structure of the adsorption component provided in this application;

[0028] Figure 3 This is another structural schematic diagram of the adsorption component provided in this application;

[0029] Figure 4 A structural schematic diagram of the push-pull component provided in this application;

[0030] Figure 5 for Figure 1 Partial cross-sectional view of the structure shown;

[0031] Figure 6A schematic diagram of the cutting section provided in this application.

[0032] In the diagram: 1-Adsorption component; 11-Waste discharge pipe; 12-Adsorption head; 13-Connecting pipe; 131-Bend; 132-Hose; 2-Cutting component; 21-Cutting part; 211-Cutting blade; 212-Adapter plate; 213-Through hole; 214-Connecting hole; 22-Push-pull component; 221-Drive module; 2211-Slider; 222-Upper push plate; 223-Lower push plate; 224-First adapter block; 225-Second adapter block; 23-Connector; 231-Upper connector; 232-Lower connector; 3-Mounting plate; 31-Bracket; 4-Moving component; 5-Gas distribution block; 6-Detection component; 7-Lifting component; 8-Observation port. Detailed Implementation

[0033] The embodiments of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0034] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] The process of laser cutting thin films (usually metal foils) to form patterned products (hereinafter referred to as the processed products, or simply products) generates waste. In order to carry out subsequent processes, the waste in the processed area needs to be removed after laser cutting, while retaining the processed products without affecting their position or shape.

[0036] This application provides an adsorption waste removal device, referenced... Figure 1-6 It includes an adsorption component 1 and a mounting plate 3.

[0037] The adsorption assembly 1 includes a waste discharge pipe 11 and an adsorption head 12 installed on the mounting plate 3. The adsorption head 12 is connected to the waste discharge pipe 11. The adsorption head 12 is set in relation to the processing area and has a preset height relative to the plane of the processing area. The adsorption head 12 generates negative pressure to suck the waste material in the processing area into the adsorption head 12 and then transfer it to the waste discharge pipe 11.

[0038] In this embodiment, the preset height between the adsorption head 12 and the processing area is not specifically limited, as long as the adsorption head 12 does not contact the product and the adsorption head 12 can suck the waste into the waste discharge pipe 11.

[0039] It is understandable that the waste discharge pipe 11 is also connected to the waste collection device (not shown in the figure), and the waste is sequentially transported to the waste collection device for unified treatment via the adsorption head 12 and the waste discharge pipe 11.

[0040] In one of the feasible methods, refer to Figure 1 The waste discharge pipe 11 is located above the mounting plate 3, and the adsorption head 12 is located below the mounting plate 3. The adsorption head 12 penetrates the mounting plate 3 and is connected to the waste discharge pipe 11.

[0041] For details, please refer to Figure 2-3 The mounting plate 3 is provided with multiple brackets 31. The waste discharge pipe 11 is fixedly installed on the brackets 31. The adsorption head 12 passes through the mounting plate 3 and is connected to the waste discharge pipe 11 through a connecting pipe 13. The connecting pipe 13 includes a bend 131 and a hose 132 that are connected to each other. The end of the bend 131 away from the hose 132 is connected to the waste discharge pipe 11, and the end of the hose 132 away from the bend 131 is connected to the adsorption head 12, so that the waste can be smoothly transferred to the waste discharge pipe 11 through the adsorption head 12.

[0042] The adsorption head 12 in this embodiment can be a vacuum generator, which generates negative pressure to draw waste into the waste discharge pipe 11. Alternatively, a dust extraction mechanism or a vacuum pump can be used to directly transport the waste to the waste discharge pipe 11.

[0043] In a preferred embodiment, a moving component 4 is provided at one end of the mounting plate 3. The moving component 4 drives the mounting plate 3 to move along the length direction of the mounting plate 3, and the workpiece moves along the width direction of the mounting plate 4.

[0044] This embodiment does not limit the specific structure of the moving component 4, as long as it can drive the mounting plate 3 to move along the length of the mounting plate 3.

[0045] In this embodiment, the processed parts refer to the thin film formed by laser cutting to create patterned products and waste.

[0046] In order to better remove waste from the processing area, this embodiment moves the mounting plate 3 along the length direction of the mounting plate 3 and moves the processing part along the width direction of the mounting plate 3, so that the adsorption head 12 can remove the waste from each position of the corresponding processing area.

[0047] During the process of laser cutting thin films to form products, the waste generated may melt at the edges and solidify, sticking to the product, or the cutting may be insufficient, causing the waste to partially connect with the product. As a result, after the waste is sucked into the adsorption head 12, one end of it is still connected to the product and cannot be separated from the product. If the product is moved directly after the waste removal is completed, it may cause the product to be damaged or its position to be shifted.

[0048] Therefore, the adsorption waste removal device in this application embodiment also includes a cutting component 2, which includes a cutting part 21. When the waste material in the processing area is sucked into the adsorption head 12, if the waste material is connected to the processed product, the waste material connected to the product is cut off by the cutting part 21.

[0049] After the waste material is sucked into the adsorption head 12, the waste material connected to the product is cut off by the cutting part 21 to separate the product from the waste material. The adsorption waste removal device of this embodiment can ensure that the processed product is not subjected to a large impact when removing waste material, and can ensure that the positional accuracy and shape of the product are not affected during the process of removing waste material and when moving the product after removing waste material.

[0050] In a further specific implementation, please refer to Figure 1 , 4 -6, the cutting assembly 2 also includes a push-pull member 22 located below the mounting plate 3 and a connector 23 mounted on the push-pull member 22;

[0051] The cutting part 21 is installed at the lower end of the adsorption head 12. The cutting part 21 includes two cutting blades 211 arranged opposite each other. The cutting blades 211 are connected to the push-pull member 22 through the connector 23. The push-pull member 22 drives the two cutting blades 211 to move closer or further away from each other.

[0052] When the waste is sucked into the suction head 12, if the waste is connected to the product, the push-pull component 22 drives the two cutters 211 to move closer to each other. The waste is cut off by the cooperation of the two cutters 211 so that the product position will not be moved when the product is moved later and the product will not be damaged.

[0053] In this embodiment, the push-pull component 22 can be a cylinder, hydraulic cylinder, etc. For example, each cutter 211 is connected to a cylinder, and the cylinder drives the cutter 211 connected to it to move, so that the two cutters 211 cooperate with each other to cut the waste material.

[0054] In the process of cutting large-size films to form patterns, the processing area of ​​the film is often divided into multiple processing areas. If only one adsorption head 12 is set up, and the waste in each processing area is removed by moving the adsorption head 12 and moving the film, the waste removal efficiency will be low, which will affect the production capacity.

[0055] Therefore, in a preferred embodiment of this application, the workpiece to be de-wasted has multiple processing areas, and each processing area is provided with at least one adsorption head 12 during de-wasting, through which the waste material of the corresponding processing area is removed. More preferably, each processing area is provided with one adsorption head 12.

[0056] Taking the processing of copper backsheets for solar cell modules as an example, a detailed explanation is provided. Copper foil is adsorbed and fixed onto a carrier plate, and then laser-cut to form multiple patterned areas. Each patterned area contains the product to be retained and the waste to be removed. Each patterned area corresponds to one solar cell in the solar cell module. The processing area in this embodiment includes 1 to 4 patterned areas.

[0057] In a preferred embodiment, refer to Figure 4-6 The push-pull component 22 includes a drive module 221, an upper push plate 222 and a lower push plate 223 located below the upper push plate 222. The connector 23 includes an upper connector 231 mounted on the upper push plate 222 and a lower connector 232 mounted on the lower push plate 223. The adsorption head 12 passes through the gap between the upper connector 231 and the lower connector 232.

[0058] The cutting section 21 also includes an adapter plate 212. The adapter plate 212 has a through hole 213 communicating with the suction head 12. Two oppositely arranged cutting blades 211 pass through the adapter plate 212 and can extend into the through hole 213. The portion of the cutting blade 211 located on the outside of the adapter plate 212 has a connecting hole 214. The upper connector 231 is inserted into the connecting hole 214 of one of the cutting blades 211, and the lower connector 232 is inserted into the connecting hole 214 of the other oppositely arranged cutting blade 211.

[0059] The drive module 221 drives the upper push plate 222 and the lower push plate 223 to move in opposite directions, causing the upper connector 231 and the lower connector 232 to move closer or further away from each other, thereby causing the two oppositely positioned cutting blades 211 to move closer or further away from each other.

[0060] When a workpiece has multiple processing areas, each processing area is equipped with an adsorption head 12 for waste removal. That is, when multiple adsorption heads 12 are installed on the mounting plate 3, each adsorption head 12 is equipped with an upper connector 231 and a lower connector 232, such that the lower end of each adsorption head 12 is inserted into the gap between the corresponding upper connector 231 and lower connector 232. Furthermore, each adsorption head 12 has a cutting portion 21 at its lower end, corresponding to the upper connector 231 and lower connector 232. Insert them into the corresponding connecting holes 214 respectively. When the upper push plate 222 and the lower push plate 223 move in opposite directions, all the upper connecting parts 231 on the upper push plate 222 and all the lower connecting parts 232 on the lower push plate 223 move at the same time, causing the two cutting blades 211 arranged opposite each other in each cutting part 21 to move closer to each other and cut the waste material located in the through hole 213, or after the waste material is cut off, the two cutting blades 211 arranged opposite each other in each cutting part 21 move away from each other in preparation for cutting the waste material next time.

[0061] In this embodiment, after the waste material at each location in each processing area is sucked into the corresponding adsorption head 12, the waste material connected to the product in the through hole 213 is cut off by the cutting component 2.

[0062] In a further preferred embodiment, continue to refer to Figure 4-5 Along the length of the mounting plate 3, the drive module 221 can be a parallel cylinder installed at both ends of the bottom of the mounting plate 3. Each parallel cylinder has two sliders 2211 at its bottom. The parallel cylinder drives the corresponding two sliders 2211 to move closer or further away from each other.

[0063] In one parallel cylinder, the inner slider 2211 is connected to the upper push plate 222, and the outer slider 2211 is connected to the lower push plate. In the other parallel cylinder, the inner slider 2211 is connected to the lower push plate 223, and the outer slider 2211 is connected to the upper push plate 222.

[0064] Specifically, in one of the parallel cylinders, the inner slider 2211 is directly connected to the upper push plate 222, and the outer slider 2211 is connected to the lower push plate 223 through the first adapter block 224. In the other parallel cylinder, the outer slider 2211 is directly connected to the upper push plate 222, and the inner slider 2211 is connected to the lower push plate 223 through the second adapter block 225.

[0065] In one embodiment, the second adapter block 225 passes through the upper push plate 222, with its top connected to the corresponding slider 2211 and its bottom connected to the lower push plate 223. Alternatively, the second adapter block 225 can be positioned on one side of the upper push plate 222, and connected to both the corresponding slider 2211 and the lower push plate 223.

[0066] For example Figure 2 The following example illustrates the arrangement of six sets of adsorption heads 12, each set including two adsorption heads 12 arranged side-by-side along the width of the mounting plate 3. This further illustrates the embodiment, where the entire surface of the laser-cut film is divided into 12 processing areas. Correspondingly, the upper push plate 222 is provided with six sets of upper connectors 231, each set including two upper connectors 231 arranged side-by-side along the width of the upper push plate 222. The lower push plate 223 is provided with six sets of lower connectors 232, each set including two lower connectors 231 arranged side-by-side along the width of the lower push plate 223. Each set of upper connectors 231 and the corresponding set of lower connectors 232 cooperate to form two gaps capable of accommodating one set of adsorption heads 12 (e.g., ...). Figure 4 (As shown). In this implementation, it can be as follows: Figure 6As shown, an adapter plate 212 is provided at the lower end of each set of adsorption heads 12. A through hole 213 is provided at each of the opposite ends of the adapter plate 212. Two cutters 211 that can be inserted into each through hole 213 are provided opposite to each other. The two adsorption heads 12 of the same set are respectively connected to the through holes 213 at both ends of the same adapter plate 212.

[0067] When the mounting plate 3 is equipped with multiple suction heads 12, such as Figure 1-2 As shown in Figure 5, the adsorption assembly 1 may also include a gas distribution block 5, and each adsorption head 12 is connected to the gas distribution block 5 (for example, the adsorption head 12 can be connected to the gas distribution block 5 by connecting pipes). The gas distribution block 5 is connected to a gas source or a gas storage tank, thereby causing the adsorption head 12 to generate negative pressure.

[0068] To detect whether there is a connection between the waste and the product after the adsorption head 12 sucks the waste into the waste discharge pipe 11, this embodiment of the application also provides a detection component 6 on the mounting plate 3. (See reference...) Figure 1 The detection components 6 are respectively disposed at both ends of the mounting plate 3 along its length. The detection components 6 can be through-beam sensors, other types of sensors, or visual inspection cameras; this embodiment does not limit them.

[0069] After all the waste in each processing area has been removed by the adsorption head 12, the detection component 6 detects whether the waste is connected to the product. If some of the waste is connected to the product, the cutting component 2 cuts off the waste. If there is no connection, the cutting component 2 does not need to be activated, and the product can be moved directly to the next process.

[0070] In a further preferred embodiment, continue to refer to Figure 1 Both ends of the mounting plate 3 are equipped with lifting components 7 (such as cylinders or hydraulic cylinders). The lifting components 7 drive the mounting plate 3 to move up and down, thereby adjusting the distance between the adsorption head 12 and the workpiece to adapt to different workpieces.

[0071] After laser cutting, the processed parts are conveyed to the lower part of the adsorption waste removal device of this application embodiment, or after laser cutting, the adsorption waste removal device of this application embodiment moves to the upper part of the processed parts, so that there is at least one adsorption head 12 above each processing area. The longitudinal distance between the adsorption head 12 and the processed parts is adjusted to a preset height by the lifting component 7. The adsorption head 12 generates negative pressure to suck the waste of the corresponding processing area into the adsorption head 12, and then conveys it to the waste discharge pipe 11 through the adsorption head 12, and then to the waste collection device through the waste discharge pipe 11.

[0072] In this embodiment, there are no specific limitations on the preset height between the adsorption head 12 and the workpiece, or on the negative pressure value generated by the adsorption head 12. As long as there is a suitable distance between the adsorption head 12 and the workpiece, the negative pressure generated by the adsorption head 12 can remove the waste.

[0073] During the process of adsorbing and removing waste materials by the adsorption head 12, the moving mechanism 4 can move the mounting plate 3 in conjunction with the movement of the workpiece so that the adsorption head 12 can cover the entire width of the corresponding processing area and remove all the waste materials in the processing area corresponding to the adsorption head 12.

[0074] Since waste material may remain connected to the product after laser cutting, directly moving the product after the waste material is picked up by the suction head 12 may cause the product to shift or be damaged due to the pulling between the waste material and the product. Therefore, in this embodiment, after the suction head 12 picks up the waste material from the processing area, the detection component 6 detects whether the product and the waste material are connected. If the product and the waste material are connected, the parallel cylinder is activated, causing the upper push plate 222 and the lower push plate 223 to move. This causes the upper connecting piece 231 and the lower connecting piece 232 on both sides of each suction head 12 to move closer to each other, thereby causing the two cutting blades 211 at the bottom of each suction head 12 to move closer to each other and cooperate to cut the waste material.

[0075] In addition, it can also be like Figure 3 An observation port 8 is provided at one end of the waste discharge pipe 11 to facilitate observation and waste cleaning during the adsorption of waste materials.

[0076] The various embodiments in this specification are described in a progressive, parallel, or combined manner. Each embodiment focuses on its differences from other embodiments, and similar or identical parts between embodiments can be referred to interchangeably. For the apparatuses disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and relevant parts can be referred to the method section.

[0077] It should be noted that, in the description of this application, the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0078] It should also be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or apparatus that includes the aforementioned element.

[0079] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An adsorption waste removal device, characterized in that, Includes adsorption components and mounting plate; The adsorption assembly includes a waste discharge pipe and an adsorption head mounted on the mounting plate. The adsorption head is connected to the waste discharge pipe and is set to correspond to the processing area of ​​the workpiece. The adsorption head has a preset height relative to the plane of the processing area. The adsorption head generates negative pressure to suck the waste material in the processing area into the adsorption head and transfer it to the waste discharge pipe. A moving component is provided at one end of the mounting plate. The moving component drives the mounting plate to move along the length direction of the mounting plate, and the workpiece moves along the width direction of the mounting plate.

2. The adsorption waste removal device according to claim 1, characterized in that, The workpiece has multiple processing areas, and each processing area is equipped with at least one adsorption head during waste removal.

3. The adsorption waste removal device according to claim 2, characterized in that, The adsorption assembly includes a gas distribution block, which is connected to each adsorption head.

4. The adsorption waste removal device according to claim 1, characterized in that, The waste discharge pipe is located above the mounting plate, and the adsorption head is located below the mounting plate, with the adsorption head penetrating the mounting plate and communicating with the waste discharge pipe.

5. The adsorption waste removal device according to claim 4, characterized in that, The adsorption head is connected to the waste discharge pipe via a connecting pipe, which includes a bend and a hose that are connected to each other. The end of the bend away from the hose is connected to the waste discharge pipe, and the end of the hose away from the bend is connected to the adsorption head.

6. The adsorption waste removal device according to any one of claims 1-5, characterized in that, It also includes a cutting component, which includes a cutting section. When waste material from the processing area is sucked into the adsorption head, if the waste material is connected to the processed product, the cutting section cuts off the waste material connected to the processed product.

7. The adsorption waste removal device according to claim 6, characterized in that, The cutting assembly also includes a push-pull member located below the mounting plate and a connector mounted on the push-pull member; The cutting section is installed at the lower end of the suction head. The cutting section includes two cutting blades arranged opposite each other. The cutting blades are connected to the push-pull component through the connector. The push-pull component drives the two cutting blades to move closer or further apart.

8. The adsorption waste removal device according to claim 7, characterized in that, The push-pull component includes a drive module, an upper push plate, and a lower push plate located below the upper push plate. The connector includes an upper connector mounted on the upper push plate and a lower connector mounted on the lower push plate. The suction head passes through the gap between the upper connector and the lower connector. The cutting section also includes an adapter plate with a through hole communicating with the suction head. Two oppositely arranged cutting blades pass through the adapter plate and can extend into the through hole. The portion of the cutting blade located on the outside of the adapter plate has a connecting hole. The upper connector is inserted into the connecting hole of one of the cutting blades, and the lower connector is inserted into the connecting hole of the other oppositely arranged cutting blade. The drive module drives the upper and lower push plates to move in opposite directions, causing the two cutting blades, which are positioned opposite each other, to move closer or further apart.

9. The adsorption waste removal device according to claim 8, characterized in that, Along the length of the mounting plate, the drive module includes parallel cylinders installed at both ends of the bottom of the mounting plate. Each parallel cylinder has two sliders at its bottom. The parallel cylinder drives the corresponding two sliders to move closer or further apart from each other. In one parallel cylinder, the inner slider is connected to the upper push plate, and the outer slider is connected to the lower push plate. In the other parallel cylinder, the inner slider is connected to the lower push plate, and the outer slider is connected to the upper push plate.

10. The adsorption waste removal device according to claim 6, characterized in that, Both ends of the mounting plate are equipped with lifting components, which drive the mounting plate to move up and down; and / or, It also includes a detection component, which detects whether the waste material is connected to the processed product after being sucked into the adsorption head. If a connection is found, the waste material connected to the processed product is cut off by the cutting part.