Anti-surge thick film resistor

Abstract

The utility model relates to the technical field of thick-film resistors, in particular to an anti-surge thick-film resistor which comprises a resistor box, a first resistor plate is arranged in the resistor box, the bottom surface of the first resistor plate is mounted on the inner wall of the resistor box, a first resistor film is fixedly mounted on the upper surface of the first resistor plate, and a second resistor film is fixedly mounted on the lower surface of the first resistor plate. The upper surface of the first resistive film is fixedly provided with a second resistive plate, and the upper surface of the second resistive plate is fixedly provided with a second resistive film. By adopting the multi-layer resistive film structure, the surge current is dispersed to different resistive film layers, and when the surge current enters the resistor, each resistive film shares a part of current, so that the energy density borne by each film is reduced, the overall surge endurance capability is improved, and the service life of the resistor is prolonged. And heat dissipation can be effectively enhanced through the reasonably designed heat dissipation channels, so that the effect of improving the surge endurance capability through the arrangement of the multiple layers of resistive films and the arrangement of the heat dissipation grooves is achieved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of thick-film resistors, in particular to a surge-resistant thick-film resistor. BACKGROUND

[0002] A thick-film resistor is a resistor characterized by having a thick-film resistor layer on a ceramic substrate. The construction of the thick-film resistor can be completed by applying a silk-printed conductive paste on an insulating substrate, and the paste can be fired to form a permanent connection, and the paste contains inorganic ceramic base material (resistor element), glass powder and fine particles of silver. The paste is applied to a ceramic substrate made of alumina powder mixed with glass powder and a small amount of organic binder to hold the powder together during the firing process.

[0003] Through retrieval, the patent announcement No. CN219642613U discloses a surge-resistant thick-film resistor, which comprises a tin plating layer, a shell, a conductor, a nickel plating layer, a resistor element and a ceramic substrate. One side surface of the ceramic substrate is provided with the resistor element, one side of the ceramic substrate is wrapped with the conductor, the resistor element is covered with the shell, the outer side of the ceramic substrate is wrapped with the tin plating layer, and the nickel plating layer is arranged between the ceramic substrate and the conductor. The utility model shortens the contact position of the conductor and the resistor element, thereby increasing the effective resistance area.

[0004] For the related technology in the above, the inventors find that the following defects exist: the above-mentioned scheme shortens the contact position of the conductor and the resistor element, thereby increasing the effective resistance area, but this device cannot improve the surge resistance, and the internal resistance film is easily burned out or irreversibly physically damaged when the thick-film resistor is subjected to surge impact, because it cannot effectively absorb or disperse surge energy. UTILITY MODEL CONTENTS

[0005] In order to improve the surge resistance, the application provides a surge-resistant thick-film resistor.

[0006] The surge-resistant thick-film resistor provided by the application adopts the following technical scheme: a resistor box is provided, the inside of the resistor box is provided with a first resistor plate, the bottom surface of the first resistor plate is mounted on the inner wall of the resistor box, the upper surface of the first resistor plate is fixedly provided with a first resistor film, the upper surface of the first resistor film is fixedly provided with a second resistor plate, the upper surface of the second resistor plate is fixedly provided with a second resistor film, the upper surface of the second resistor film is fixedly provided with a third resistor plate, and the upper surfaces of the first resistor plate, the second resistor plate and the third resistor plate are all provided with heat dissipation grooves.

[0007] Optionally, the inner wall of the resistor box is fixedly connected with four connecting columns, and the upper surface of each connecting column is provided with a fixing groove.

[0008] Optionally, the outer surfaces of the first, second and third resistance plates are in sliding connection with the resistance box, and the outer surface of each connecting column is in sliding connection with the first, second and third resistance plates.

[0009] Optionally, the upper surface of the resistance box is provided with a resistance cover, the bottom surface of the resistance cover is fixedly connected with four fixed rods, and the outer surface of each fixed rod is in plug connection with a corresponding fixed slot.

[0010] Optionally, the bottom surface of the resistance cover is fixedly installed with a resistance block, and the outer surface of the resistance block is in plug connection with the resistance box.

[0011] Optionally, the outer surface of the resistance box is fixedly installed with a first epoxy resin film, the outer surface of the first epoxy resin film is fixedly installed with two second epoxy resin films, and the outer surface of each second epoxy resin film is fixedly connected with the resistance box.

[0012] Optionally, the upper surface of the resistance cover is fixedly installed with a ceramic plate, and the outer surface of the ceramic plate is fixedly connected with the two second epoxy resin films and the first epoxy resin film.

[0013] In summary, the present application has the following beneficial technical effects:

[0014] 1. The utility model discloses a first resistance plate, second resistance plate, third resistance plate, first resistance film, second resistance film, heat dissipation groove and other components are set up, and the surge current is dispersed to different resistance film layers by adopting multilayer resistance film structure, when the surge current enters the resistor, each layer of resistance film shares a part of current, and the energy density that each layer of film bears is reduced, thereby improve the overall surge resistance capacity, and the reasonable heat dissipation channel of design can effectively enhance the heat dissipation, and then reach the effect that the device can improve the surge resistance capacity by the setting of multilayer resistance film and the setting of heat dissipation groove.

[0015] 2. The utility model discloses a first epoxy resin film, second epoxy resin film, ceramic plate and other components are set up, and the epoxy resin film and ceramic plate and other encapsulating materials with good heat conductivity and insulation are adopted, so that it can protect the internal structure of the resistor from the influence of external environment, can also rapidly dissipate heat when surge occurs, avoids the damage of resistor due to overheating, and then reaches the effect that the device can protect the resistor by the setting of insulating material. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is the overall structure schematic diagram in the embodiment of the present application.

[0017] Figure 2This is a schematic diagram of the resistor box structure in an embodiment of this application;

[0018] Figure 3 This is a schematic diagram of the first resistor plate structure in the embodiments of this application;

[0019] Figure 4 This is a schematic diagram of the resistor cover structure in an embodiment of this application.

[0020] Reference numerals in the attached figures: 1. Resistor box; 2. Resistor cover; 3. Second epoxy resin film; 4. First epoxy resin film; 5. Ceramic plate; 6. Fixing rod; 7. Connecting post; 8. First resistor plate; 9. Second resistor plate; 10. Third resistor plate; 11. Heat dissipation groove; 12. Resistor block; 13. First resistor film; 14. Fixing groove; 15. Second resistor film. Detailed Implementation

[0021] The following is in conjunction with the appendix Figure 1 - Figure 4 This application will be described in further detail.

[0022] This application discloses a surge-resistant thick-film resistor. For example... Figure 3 As shown, the device includes a resistor box 1. Four connecting posts 7 are fixedly connected to the inner wall of the resistor box 1. Each connecting post 7 has a fixing groove 14 on its upper surface. Each connecting post 7 is evenly arranged on the inner wall of the resistor box 1, and each fixing groove 14 is a tension groove, which facilitates the wrapping and fixing of the fixing rod 6.

[0023] In this embodiment, a first resistor plate 8 is provided inside the resistor box 1. The bottom surface of the first resistor plate 8 is installed on the inner wall of the resistor box 1, and a first resistor film 13 is fixedly installed on the upper surface of the first resistor plate 8. The first resistor plate 8 is installed on the inner bottom wall of the resistor box 1, and then the first resistor film 13 is installed on the first resistor plate 8.

[0024] In a preferred embodiment, a second resistance plate 9 is fixedly mounted on the upper surface of the first resistive film 13, a second resistive film 15 is fixedly mounted on the upper surface of the second resistive plate 9, and a third resistive plate 10 is fixedly mounted on the upper surface of the second resistive film 15. The process involves mounting the second resistive plate 9 above the first resistive film 13, then mounting the second resistive film 15 on the second resistive plate 9, and finally mounting the third resistive plate 10 on the upper surface of the second resistive film 15. The first resistive film 13 and the second resistive film 15 are made of resistive film materials with higher energy absorption characteristics. For example, special ceramic particles or metal oxides are added to the traditional thick-film resistor material. These additives can absorb excess energy through their own physical and chemical changes, such as crystal phase transformation and redox reactions, when surge current passes through, thereby improving the resistor's surge tolerance.

[0025] Looking back Figure 3The outer surfaces of the first resistance plate 8, the second resistance plate 9 and the third resistance plate 10 are in sliding connection with the resistance box 1, and the outer surface of each connecting column 7 is in sliding connection with the first resistance plate 8, the second resistance plate 9 and the third resistance plate 10. Specifically, by adopting a multi-layer resistance film structure, the inrush current is dispersed to different resistance film layers. When the inrush current enters the resistor, each layer of resistance film shares a part of the current, reducing the energy density borne by each layer of film, thereby improving the overall surge resistance capacity. Moreover, the thickness and resistivity of each layer of film are accurately calculated, so that the surge energy can be uniformly distributed.

[0026] In the embodiment, the upper surfaces of the first resistance plate 8, the second resistance plate 9 and the third resistance plate 10 are provided with heat dissipation grooves 11. Specifically, by designing reasonable heat dissipation grooves 11 inside the resistor, for example, reserving a small air gap between the resistance film and the packaging material or adding high-thermal-conductivity filling materials such as aluminum nitride ceramic particles, these channels can effectively enhance the heat dissipation effect, so that the resistor can quickly recover to the normal working temperature after bearing the surge impact.

[0027] Please refer to Figure 1 、 Figure 2 , the outer surface of the resistance box 1 is fixedly installed with the first epoxy resin film 4, the outer surface of the first epoxy resin film 4 is fixedly installed with two second epoxy resin films 3, the outer surface of each second epoxy resin film 3 is fixedly connected with the resistance box 1, the upper surface of the resistance box 1 is provided with the resistance cover 2, the upper surface of the resistance cover 2 is fixedly installed with the ceramic plate 5, the outer surface of the ceramic plate 5 is fixedly connected with the two second epoxy resin films 3 and the first epoxy resin film 4, the ceramic plate 5 is connected with the two second epoxy resin films 3 and the first epoxy resin film 4 to wrap the resistance box 1 and the resistance cover 2, and by adopting the packaging material with good thermal conductivity and insulation, not only the internal structure of the resistor can be protected from the external environment, but also the heat can be quickly dissipated when the surge occurs, avoiding damage to the resistor due to overheating.

[0028] In the embodiment, the bottom surface of the resistance cover 2 is fixedly installed with the resistance block 12, the outer surface of the resistance block 12 is inserted with the resistance box 1, the bottom surface of the resistance cover 2 is fixedly connected with four fixing rods 6, the outer surface of each fixing rod 6 is inserted with the corresponding fixing groove 14, and by inserting the resistance cover 2 with the fixing rod 6 into the resistance box 1, the fixing rod 6 is inserted into the corresponding fixing groove 14 in the process, so as to seal the resistor.

[0029] The implementation principle of the anti-surge thick film resistor of the embodiment of the present application is as follows: first, the first resistance plate 8, the first resistance film 13, the second resistance plate 9, the second resistance film 15 and the third resistance plate 10 are alternately installed, and the resistance is installed on the inner wall of the resistance box 1, so that the multi-layer resistance film structure is adopted, the surge current is dispersed to different resistance film layers, when the surge current enters the resistor, each layer of resistance film shares a part of the current, the energy density borne by each layer of film is reduced, thereby the overall surge resistance capacity is improved, through the reasonable design of the heat dissipation groove 11 in the resistor, the channels can effectively enhance the heat dissipation effect, so that the resistor can quickly recover to the normal working temperature after bearing the surge impact, then the resistance cover 2 is installed in the resistance box 1, at this time, the resistance box 1 and the resistance cover 2 are wrapped by the first epoxy resin film 4, the second epoxy resin film 3 and the ceramic plate 5, through the adoption of the packaging material with good heat conductivity and insulation, they not only can protect the internal structure of the resistor from the influence of the external environment, but also can quickly dissipate the heat when the surge occurs, so as to avoid the damage of the resistor due to overheating.

[0030] The above are the preferred embodiments of the present application, and do not limit the protection scope of the present application, so that: all equivalent changes made according to the structure, shape, principle of the present application should be covered in the protection scope of the present application.

Claims

1. A surge-resistant thick-film resistor, comprising a resistor housing (1), characterized in that: The resistor box (1) is provided with a first resistor plate (8) inside. The bottom surface of the first resistor plate (8) is installed on the inner wall of the resistor box (1). A first resistor film (13) is fixedly installed on the upper surface of the first resistor plate (8). A second resistor plate (9) is fixedly installed on the upper surface of the first resistor film (13). A second resistor film (15) is fixedly installed on the upper surface of the second resistor plate (9). A third resistor plate (10) is fixedly installed on the upper surface of the second resistor film (15). Heat dissipation grooves (11) are provided on the upper surfaces of the first resistor plate (8), the second resistor plate (9) and the third resistor plate (10).

2. The surge-resistant thick-film resistor according to claim 1, characterized in that: The inner wall of the resistor box (1) is fixedly connected with four connecting posts (7), and each connecting post (7) has a fixing groove (14) on its upper surface.

3. A surge-resistant thick-film resistor according to claim 2, characterized in that: The outer surfaces of the first resistor plate (8), the second resistor plate (9) and the third resistor plate (10) are all slidably connected to the resistor box (1), and the outer surface of each of the connecting posts (7) is slidably connected to the first resistor plate (8), the second resistor plate (9) and the third resistor plate (10).

4. A surge-resistant thick-film resistor according to claim 2, characterized in that: The upper surface of the resistor box (1) is provided with a resistor cover (2), and the bottom surface of the resistor cover (2) is fixedly connected with four fixing rods (6), and the outer surface of each fixing rod (6) is inserted into the corresponding fixing groove (14).

5. A surge-resistant thick-film resistor according to claim 4, characterized in that: A resistor block (12) is fixedly installed on the bottom surface of the resistor cover (2), and the outer surface of the resistor block (12) is inserted into the resistor box (1).

6. A surge-resistant thick-film resistor according to claim 5, characterized in that: A first epoxy resin film (4) is fixedly installed on the outer surface of the resistor box (1). Two second epoxy resin films (3) are fixedly installed on the outer surface of the first epoxy resin film (4). The outer surface of each second epoxy resin film (3) is fixedly connected to the resistor box (1).

7. A surge-resistant thick-film resistor according to claim 6, characterized in that: A ceramic plate (5) is fixedly installed on the upper surface of the resistor cover (2), and the outer surface of the ceramic plate (5) is fixedly connected to two second epoxy resin films (3) and a first epoxy resin film (4).

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