Low-thickness alloy resistor

Abstract

The utility model discloses a low-thickness alloy resistor, which comprises electrodes, a first solder mask layer, a second solder mask layer and a third solder mask layer which are positioned on an alloy sheet, the first solder mask layer, the second solder mask layer and the third solder mask layer are positioned between the two electrodes, the second solder mask layer and the third solder mask layer are positioned above the first solder mask layer, and the third solder mask layer is positioned above the second solder mask layer. The second solder mask layer comprises a first part and a second part, and the third solder mask layer is located between the first part and the second part. According to the low-thickness alloy resistor provided by the utility model, although the low-thickness alloy resistor contains three solder mask layers, the second solder mask layer is divided into the first part and the second part which are separated from each other, and the third solder mask layer is arranged between the first part and the second part, so that the overall thickness of the alloy resistor is effectively reduced, and the application scene of the alloy resistor is increased.

Description

TECHNICAL FIELD

[0001] The utility model belongs to alloy resistance technical field, concretely relates to a kind of alloy resistance of low resistance (1~3mΩ), wide electrode spacing (1.4~1.8mm), low thickness ultra-thin (0.4~0.45mm). BACKGROUND

[0002] Compared with other types of resistance, alloy resistance has low temperature coefficient, high stability and oxidation resistance, making its application in electronic circuit more and more widely.

[0003] The existing alloy resistance with multiple layers of solder mask often has layer-by-layer superimposed solder mask, resulting in high total height of the solder mask. Since the height of the electrode is higher than the height of the solder mask, the thickness of the entire alloy resistance is large, which limits the application.

[0004] The disclosure of the above background art content is only used to assist in understanding the utility model concept and technical solutions of the utility model, and it does not necessarily belong to the prior art of the present application. In the absence of explicit evidence that the above content has been disclosed before the filing date of the present application, the above background art should not be used to evaluate the novelty and inventiveness of the present application. UTILITY MODEL CONTENT

[0005] In view of this, in order to overcome the defects of the prior art, the purpose of the utility model is to provide a low-thickness ultra-thin alloy resistance, which realizes low resistance, wide electrode spacing and low overall thickness of the alloy resistance.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] An alloy resistance includes electrodes on an alloy sheet, a first solder mask, a second solder mask and a third solder mask. The first solder mask, the second solder mask and the third solder mask are located between two electrodes. The second solder mask and the third solder mask are located above the first solder mask. The second solder mask includes a first part and a second part, and the third solder mask is located between the first part and the second part. That is, when the second solder mask is prepared, two mutually separated first part and second part are formed, and the third solder mask is accommodated between the first part and the second part to reduce the thickness.

[0008] The first solder mask in the utility model is used to determine the length of the effective resistance area of the product, to make the resistance value of the resistance body, to prevent the alloy area from being oxidized or damaged. The second solder mask is used to widen the distance between the two electrodes of the product to achieve the target electrode spacing. The third solder mask is used to cover the solder mask damage caused by the blocking knife, to prevent the alloy in the blocking area from being abnormal and oxidized.

[0009] According to some preferred embodiments of the present application, the bottom surfaces of the second and third solder mask layers are flush, and the top surface of the second solder mask layer is higher than the top surface of the third solder mask layer.

[0010] According to some preferred embodiments of the present application, the length of the third solder mask layer is less than the distance between the first and second portions.

[0011] According to some preferred embodiments of the present application, the distance between the end of the third solder mask layer and the end of the first or second portion is 0.04-0.06 mm.

[0012] According to some preferred embodiments of the present application, each electrode comprises a first electrode and a second electrode stacked together, and the first electrode is located between the alloy sheet and the second electrode. The length of the third solder mask layer is less than the distance between the two second electrodes.

[0013] According to some preferred embodiments of the present application, the distance between the two second electrodes is greater than the distance between the two first electrodes.

[0014] According to some preferred embodiments of the present application, the distance between the two second electrodes is 1.4-1.8 mm.

[0015] Further preferably, the distance between the two first electrodes is 0.8-1.2 mm.

[0016] According to some preferred embodiments of the present application, the two second electrodes are located at the two ends of the second solder mask layer, i.e. at the ends of the first and second portions away from each other and directly contacting the ends of the second solder mask layer. Specifically, the end of the first and second portions close to each other is located above the first solder mask layer, and the other end extends above the first electrode and is embedded in the second electrode, between the first and second electrodes.

[0017] According to some preferred embodiments of the present application, the top surface of the first electrode is higher than the top surface of the first solder mask layer.

[0018] According to some preferred embodiments of the present application, the end of the second solder mask layer covers the end of the two first electrodes close to each other, i.e. the top surface of the second solder mask layer is higher than the top surface of the first electrode.

[0019] According to some preferred embodiments of the present application, the overall length of the second solder mask layer is greater than the length of the first solder mask layer. The overall length of the second solder mask layer in the present application refers to the distance between the ends of the first and second portions away from each other.

[0020] According to some preferred embodiments of the present application, the top surface of the second electrode is higher than the top surface of the second solder resist layer and also higher than the top surface of the third solder resist layer.

[0021] According to some preferred embodiments of the present application, the resistance of the alloy resistor is 1-3 mΩ and the thickness is 0.4-0.45 mm.

[0022] Due to the above technical solutions, compared with the prior art, the low-thickness alloy resistor of the present application has the following advantages: although the low-thickness alloy resistor of the present application has three solder resist layers, by setting the second solder resist layer as a separated first part and a second part and setting the third solder resist layer between the first part and the second part, the overall thickness of the alloy resistor is effectively reduced and the application scenarios of the alloy resistor are increased. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows: obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0024] Figure 1 The figure is a cross-sectional structure diagram of the low-thickness alloy resistor in the embodiments of the present application.

[0025] Among them, the figure marks are: base material-1, alloy sheet-2, first solder resist layer-3, second solder resist layer-4, third solder resist layer-5, first electrode-6, second electrode-7. DETAILED DESCRIPTION

[0026] In order to make the person skilled in the art better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should belong to the scope of protection of the present application.

[0027] By adopting the mode of multiple anti-soldering and multiple electroplating, although the electrode spacing of the product can be effectively increased under the condition of the same resistance of the product, the thickness of the anti-soldering layer and the electrode is increased due to the multiple anti-soldering and electroplating, the overall thickness of the alloy resistor is increased, and the application of the alloy resistor in the ultra-thin product is limited, therefore, the low-thickness alloy resistor of the utility model re-designs the structure of the anti-soldering layer, divides the second anti-soldering layer into the first part and the second part which are separated from each other, and makes the third anti-soldering layer be contained between the first part and the second part of the second anti-soldering layer, thereby reducing the thickness of the anti-soldering layer and the electrode and reducing the overall thickness of the alloy resistor.

[0028] Specifically, the low-thickness alloy resistor of the application comprises a substrate, an alloy sheet, electrodes on the alloy sheet, a first anti-soldering layer, a second anti-soldering layer, and a third anti-soldering layer, the first anti-soldering layer, the second anti-soldering layer, and the third anti-soldering layer are located between the two electrodes, the second anti-soldering layer and the third anti-soldering layer are located above the first anti-soldering layer, the second anti-soldering layer comprises a first part and a second part, and the third anti-soldering layer is located between the first part and the second part. That is, when the second anti-soldering layer is prepared, two first part and second part which are separated from each other are formed, and the third anti-soldering layer is contained between the first part and the second part to reduce the thickness.

[0029] The first anti-soldering layer in the utility model is used to determine the length of the effective resistance area of the product, to make the resistance value of the resistance body, and to prevent the alloy area from being oxidized or damaged; the second anti-soldering layer is used to widen the distance between the two electrodes of the product to achieve the target electrode spacing; and the third anti-soldering layer is used to cover the anti-soldering damage caused by the resistance repair knife, to prevent the alloy in the resistance repair area from being abnormal and oxidized.

[0030] The bottom surfaces of the second anti-soldering layer and the third anti-soldering layer are flush, and the top surface of the second anti-soldering layer is higher than the top surface of the third anti-soldering layer. That is, the bottom surfaces of the second anti-soldering layer and the third anti-soldering layer are in contact with the top surface of the first anti-soldering layer. The length of the third anti-soldering layer is less than the distance between the first part and the second part. The distance between the end of the third anti-soldering layer and the end of the first part or the second part is 0.04-0.06mm.

[0031] Each electrode comprises a first electrode and a second electrode which are stacked, and the first electrode is located between the alloy sheet and the second electrode. The length of the third anti-soldering layer is less than the distance between the two second electrodes. The distance between the two second electrodes is greater than the distance between the two first electrodes. The distance between the two second electrodes is 1.4-1.8mm, and the distance between the two first electrodes is 0.8-1.2mm.

[0032] The top surface of the first electrode is higher than the top surface of the first solder resist layer. The top surface of the second solder resist layer is higher than the top surface of the first electrode. The end of the second solder resist layer covers the ends of the two first electrodes that are close to each other. The first and second portions of the second solder resist layer are located above the first solder resist layer, and the other end extends above the first electrode and is embedded in the second electrode. The second solder resist layer covers the first electrode and is in direct contact with the second electrode to widen the actual electrode spacing of the product to the target value.

[0033] The overall length of the second solder resist layer is greater than the length of the first solder resist layer. In this invention, the overall length of the second solder resist layer refers to the distance between the ends of the first and second parts that are far apart from each other. The top surface of the second electrode is higher than the top surface of the second solder resist layer and also higher than the top surface of the third solder resist layer.

[0034] The ultrathin alloy resistors with the above structure have low resistance (1-3 mΩ), wide electrode spacing (1.4-1.8 mm), and low thickness (0.4-0.45 mm).

[0035] Example 1

[0036] like Figure 1 As shown, the low-thickness alloy resistor in this embodiment includes an alloy sheet 2, a substrate 1, a first solder resist layer 3, a second solder resist layer 4, a third solder resist layer 5, two first electrodes 6, and two second electrodes 7. The two first electrodes 6 are located at the two ends of the first solder resist layer 3. The second solder resist layer 4 and the third solder resist layer 5 are located above the first solder resist layer 3. The bottom surfaces of the second and third solder resist layers are in contact with the top surface of the first solder resist layer, and the bottom surfaces of the second and third solder resist layers are flush. The top surface of the second solder resist layer is higher than the top surface of the third solder resist layer.

[0037] The end of the second solder resist layer 4 covers the ends of the two first electrodes 6 that are close to each other; the two second electrodes 7 are located at the two ends of the second solder resist layer 4; the third solder resist layer 5 is located above the first solder resist layer 3 and between the first and second parts of the second solder resist layer 4; the distance between the end of the third solder resist layer 5 and the end of the first or second part is 0.04 mm. The overall length of the second solder resist layer 4 is greater than the length of the first solder resist layer 3; the length of the third solder resist layer 5 is less than the distance between the two second electrodes 7. The overall length of the second solder resist layer refers to the distance between the ends of the first and second parts that are far apart from each other.

[0038] The end of the second solder resist layer covers the two first electrodes that are close to each other. That is, the first part and the second part of the second solder resist layer are located above the first solder resist layer, and the other end extends above the first electrode and is embedded in the second electrode. The second solder resist layer is in direct contact with the second electrode to widen the actual electrode spacing of the product to the target value.

[0039] The semi-finished plate comprises an alloy sheet 2 and a base material 1, and the alloy sheet 2 has a set circuit pattern. A first anti-soldering layer 3 and a first electrode 6 are located above the alloy sheet 2. The first anti-soldering layer 3, a second anti-soldering layer 4, a third anti-soldering layer 5, two first electrodes 6 and two second electrodes 7 are located on the side of the alloy sheet 2 away from the base material 1.

[0040] The distance between the two second electrodes 7 is greater than the distance between the two first electrodes 6. The distance between the two first electrodes 6 is 1.2 mm; the distance between the two second electrodes 7 is 1.8 mm. The thickness of the first electrode 6 is 0.04 mm; the thickness of the second electrode 7 is 0.04 mm.

[0041] The top surface of the first electrode 6 is higher than the top surface of the first anti-soldering layer 3; the top surface of the second anti-soldering layer 4 is higher than the top surface of the first electrode 6; and the top surface of the second electrode 7 is higher than the top surface of the second anti-soldering layer 4 and the third anti-soldering layer 5.

[0042] The alloy resistor with low resistance, wide electrode spacing and low thickness in the above structure has a resistance of 1.5 mΩ, an electrode spacing of 1.8 mm and a thickness of 0.4 mm.

[0043] Embodiment 2

[0044] The low-thickness alloy resistor in the embodiment has a structure basically the same as that in Embodiment 1, except that the resistance of the alloy resistor is 1 mΩ and the electrode spacing is 1.6 mm. The distance between the two first electrodes 6 is 0.8 mm; the distance between the two second electrodes 7 is 1.6 mm. The thickness of the first electrode 6 is 0.05 mm; the thickness of the second electrode 7 is 0.03 mm. The distance between the end of the third anti-soldering layer 5 and the end of the first part or the second part is 0.06 mm. The overall thickness of the alloy resistor is 0.4 mm.

[0045] The alloy resistor of the utility model, although containing three anti-soldering layers, by setting the second anti-soldering layer as a separated first part and a second part and setting the third anti-soldering layer between the first part and the second part, the overall thickness of the alloy resistor is effectively reduced, and the application scenarios of the alloy resistor are increased. The second anti-soldering layer covers the first electrode, and the second anti-soldering layer is in direct contact with the second electrode (the end of the second anti-soldering layer is embedded in the second electrode), so as to widen the actual electrode spacing of the product to a target value.

[0046] The above embodiments are only for illustrating the technical concept and characteristics of the utility model, and the purpose is to enable those skilled in the art to understand the content of the utility model and implement it, and cannot limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit and essence of the utility model shall be covered within the protection scope of the utility model.

[0047] The endpoints of the ranges and any values disclosed herein are not limited to the precise values recited as exactly that endpoint point. The endpoints of the ranges and any values are understood to be approximate values. For ranges having an upper and lower limit, the range can be understood to include each integer within the defined range. The upper and lower limits of the range can independently be included in the range, or independently excluded from the range. The range can also be understood to include single values within the range, which can be the upper or lower limit of the range. For ranges having an upper and lower limit, the range can be understood to include each integer within the defined range. The upper and lower limits of the range can independently be included in the range, or independently excluded from the range. The range can also be understood to include single values within the range, which can be the upper or lower limit of the range.

Claims

1. A low-thickness alloy resistor, characterized in that, It includes an electrode located on an alloy sheet, a first solder resist layer, a second solder resist layer, and a third solder resist layer. The first solder resist layer, the second solder resist layer, and the third solder resist layer are located between two electrodes. The second solder resist layer and the third solder resist layer are located above the first solder resist layer. The second solder resist layer includes a first part and a second part, and the third solder resist layer is located between the first part and the second part.

2. The low-thickness alloy resistor according to claim 1, characterized in that, The bottom surfaces of the second and third solder resist layers are flush, and the top surface of the second solder resist layer is higher than the top surface of the third solder resist layer.

3. The low-thickness alloy resistor according to claim 1, characterized in that, The length of the third weld shield is less than the distance between the first part and the second part.

4. The low-thickness alloy resistor according to claim 3, characterized in that, The distance between the end of the third solder resist layer and the end of the first or second part is 0.04 to 0.06 mm.

5. The low-thickness alloy resistor according to any one of claims 1-4, characterized in that, Each of the electrodes includes a stacked first electrode and a second electrode, with the first electrode located between the alloy sheet and the second electrode.

6. The low-thickness alloy resistor according to claim 5, characterized in that, The spacing between the two second electrodes is greater than the spacing between the two first electrodes.

7. The low-thickness alloy resistor according to claim 6, characterized in that, The distance between the two second electrodes is 1.4–1.8 mm; the distance between the two first electrodes is 0.8–1.2 mm.

8. The low-thickness alloy resistor according to claim 5, characterized in that, The two second electrodes are located at opposite ends of the first and second parts, respectively, and are in direct contact with the ends of the second solder resist layer.

9. The low-thickness alloy resistor according to claim 5, characterized in that, The top surface of the first electrode is higher than the top surface of the first solder resist layer.

10. The low-thickness alloy resistor according to claim 5, characterized in that, The end of the second solder resist layer covers the end of the two first electrodes that are close to each other.

11. The low-thickness alloy resistor according to claim 5, characterized in that, The overall length of the second solder resist layer is greater than the length of the first solder resist layer.

12. The low-thickness alloy resistor according to claim 5, characterized in that, The top surface of the second electrode is higher than the top surface of the second solder resist layer.

13. The low-thickness alloy resistor according to claim 1, characterized in that, The low-thickness alloy resistor has a resistance of 1 to 3 mΩ and a thickness of 0.4 to 0.45 mm.

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