Capacitor module with optimized air-cooled heat dissipation structure

Abstract

The utility model relates to a capacitor module for optimizing an air-cooled heat dissipation structure, the capacitor module comprises a plurality of capacitor banks, each capacitor bank is composed of a plurality of capacitor monomers, the positive and negative electrodes of the capacitor monomers are electrically connected through a connecting sheet group, and the connecting sheet group comprises a plurality of first connecting sheets and second connecting sheets. The parallel connection and the series connection between the capacitor monomers are realized by adopting the first connecting sheet with a claw-shaped structure; the air cooling module is composed of a plurality of cooling fans, a temperature sensor and a speed regulation control system, the air speed of the cooling fans is regulated through the intelligent frequency conversion technology, regulation is conducted according to real-time data fed back by the temperature sensor, and therefore precise cooling control is achieved; the capacitor module is internally provided with a main air channel and an auxiliary air channel, the size and layout design of the air channels optimizes an airflow path, and the heat exchange area between air and the surface of the capacitor monomer is increased; the design can effectively reduce the heat dissipation efficiency, reduce the system energy consumption, prolong the service life of the capacitor module, and is suitable for the fields of energy storage systems, power equipment and the like.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of electric energy storage modules, and particularly relates to a capacitor module with optimized air-cooled heat dissipation structure. BACKGROUND

[0002] In electronic devices and power electronic systems, capacitor modules serve as important energy storage and power regulation components. Their performance has a significant impact on the stability and efficiency of the entire system. However, during high-frequency charging and discharging, capacitor modules generate a large amount of heat, especially at the pole parts of the capacitor cells. Due to their special location and small contact area with the outside world, heat is often difficult to dissipate quickly, causing local overheating. This heat accumulation not only affects the operational stability of the capacitor module, but also accelerates the aging of the capacitor cells, reducing the overall reliability and service life of the device.

[0003] Currently, traditional energy storage battery packs mainly use liquid cooling and air cooling heat management technologies. Liquid cooling technology removes heat from the inside of the battery pack through the circulation of cooling liquid in pipes or cooling plates. Liquid cooling systems have high heat management efficiency and can maintain the operating temperature of the battery within a reasonable range under high power and high heat density conditions. However, liquid cooling systems require additional equipment such as cooling liquid, circulating pumps, pipelines, and radiators, making the system structure complex and the installation and maintenance costs high. In addition, there is a risk of cooling liquid leakage, further increasing the uncertainty of system operation.

[0004] Air cooling technology removes heat from the surface of the battery pack through the air flow guided by the fan, which is simpler and easier to maintain than liquid cooling technology. However, in traditional air-cooled heat dissipation structures, capacitor modules are usually connected in series and parallel using flat connection plates. However, this structure has deficiencies in current conduction and heat dissipation. The flat connection plate covers the top surface of the capacitor cell, with a small heat receiving area and a small gap between the plate and the bracket, making it difficult for heat to be quickly conducted to the outside through the connection plate on the pole. In addition, traditional air-cooled designs usually rely on relay switches to control air volume. This control method is relatively simple and cannot dynamically adjust the speed and air volume of the fan according to the internal temperature changes of the battery pack. With fluctuations in the load of the battery pack, the heat dissipation demand may change, but the traditional air-cooled system cannot respond to these changes in real time, resulting in unstable heat dissipation efficiency and affecting the service life and safety of the battery.

[0005] Therefore, there is an urgent need for an improved capacitor module with optimized air-cooled heat dissipation structure to improve the heat dissipation efficiency of its pole and reduce costs and facilitate assembly. SUMMARY

[0006] The application aims to provide a capacitor module with optimized air-cooled heat dissipation structure, which uses a claw-shaped first connection plate to achieve better heat dissipation. The application achieves the following technical solutions:

[0007] The application provides a capacitor module with optimized air cooling heat dissipation structure, which comprises:

[0008] a plurality of capacitor groups, each capacitor group comprising a plurality of capacitor units, the shell of each capacitor unit being connected with the positive electrode, and the negative electrode column of each capacitor unit extending from the center of the top surface of the shell;

[0009] a support assembly, wherein the capacitor groups are arranged in the support assembly;

[0010] a connecting sheet group, which is electrically connected to the top of the capacitor groups, the connecting sheet group comprising a plurality of first connecting sheets and at least two second connecting sheets at the leading end, one first connecting sheet being arranged in each capacitor group, and the first connecting sheets being used to connect adjacent capacitor groups; the first connecting sheet is used to connect at least two capacitor units in parallel in one capacitor group, and connect the at least two capacitor units in parallel with another at least two capacitor units in series; the at least two second connecting sheets are respectively connected with the positive electrode of the capacitor unit in the first capacitor group and the negative electrode of the capacitor unit combined in parallel in the last capacitor group;

[0011] an air cooling module, which comprises at least one heat dissipation fan and at least one temperature sensor;

[0012] the first connecting sheet is in the form of a claw structure with a height difference, comprising at least two positive electrode connecting parts, at least two negative electrode connecting parts and a bridge waist part, the positive electrode connecting parts and the negative electrode connecting parts being arranged on the two sides of the bridge waist part respectively; the negative electrode connecting part of the first connecting sheet is connected with the negative electrode column of one capacitor unit, and the positive electrode connecting part is connected with the top surface of the shell of the next adjacent capacitor unit.

[0013] Preferably, the capacitor module with optimized air cooling heat dissipation structure comprises 10 capacitor groups, and the capacitor groups are arranged in a horizontal and vertical distribution structure of 2*5; the connecting sheet group comprises four second connecting sheets, and the connecting sheet group further comprises a third connecting sheet, two second connecting sheets being arranged at the opposite tail ends of the leading end, and the two second connecting sheets at the opposite tail ends being electrically connected through the third connecting sheet.

[0014] Further, the capacitor group comprises eight capacitor units, the first connecting sheet comprises four positive electrode connecting parts and four negative electrode connecting parts, and a capacitor group structure in which four capacitor units are connected in parallel and another four capacitor units are connected in series is formed.

[0015] Further, the air cooling module comprises three heat dissipation fans and three temperature sensors, the heat dissipation fans are uniformly distributed at the opposite tail ends in the horizontal direction, and the rotating speed of the heat dissipation fans comprises at least three gears.

[0016] Further, the capacitor module with the optimized air cooling heat dissipation structure further comprises a flexible circuit board group, the flexible circuit board group is located above the connecting piece group, the flexible circuit board group comprises a plurality of FPC boards arranged longitudinally, a plurality of sampling pieces are arranged on the FPC boards, the sampling pieces are connected with the first connecting pieces and / or the second connecting pieces, and the temperature sensor is arranged on the sampling pieces.

[0017] Further, the heat dissipation fan comprises an axial flow fan adopting intelligent frequency conversion technology, the real-time temperature data in the module are sampled by the three temperature sensors on the FPC board, are fed back to the terminal CMS for judgment processing, and the rotation speed of the fan is controlled through the PWM technology, according to the different temperature rise sampling data in the capacitor module, the high, medium and low gear rotation speeds of the axial flow fan are preset.

[0018] Preferably, the support assembly comprises a lower support group and an upper support group, the lower support group comprises a plurality of lower supports arranged side by side, adjacent lower supports are connected through a plug-in structure, the upper support group comprises a plurality of upper supports arranged side by side, the lower supports and the corresponding upper supports are fixedly connected through fasteners, a plurality of lower support columns are arranged on the lower supports, corresponding upper support columns are arranged on the upper supports, the lower support columns and the upper support columns are plug-in connected and fixed through the fasteners, a slot or a hole is arranged on one of the lower support columns or the upper support columns, and a plug-in connector is arranged on the other one, the plug-in connector is plug-in connected with the slot or the hole.

[0019] Further, the flexible circuit board group further comprises a bridge support, and the bridge support is located between the connecting piece group and the FPC board.

[0020] Preferably, the positive electrode connecting part is an arc-shaped concave structure, and the concave structure surrounds the negative electrode column.

[0021] Preferably, the bridge waist part is fixed to the support assembly, and the first connecting piece is sequentially provided with the bridge waist part, the negative electrode connecting part and the positive electrode connecting part from high to low.

[0022] Compared with the prior art, the above at least one technical solution adopted by the embodiments of the present application can achieve at least the following beneficial effects:

[0023] Firstly, the first connecting piece in the application adopts a claw-shaped design with a height difference structure, so that cold air can pass through the gap with a height difference, increasing the heat dissipation area and enabling the heat of the pole to be quickly conducted to the outside through the gap between the claw-shaped connecting piece and the support assembly. The reasonable layout of the positive connection part, the negative connection part and the bridge waist part of the claw-shaped connecting piece not only ensures the series and parallel connection between the capacitor monomers, but also further optimizes the conductivity and heat dissipation path, significantly improving the overall heat dissipation efficiency and current conduction capacity of the module. Since the gap between the capacitor bodies is the auxiliary air duct of the application, the bridge waist part of the first connecting piece cooperates with the auxiliary air duct to form a better flow space, so that the cold air can fully contact the bridge waist part and the outer surface of the capacitor body, cooling the capacitor body while achieving good cooling of the pole.

[0024] Secondly, the application precisely positions the capacitor monomers by the plastic support, reasonably controls the gap between the capacitor monomers, and makes the air duct size uniform. The optimized air duct design increases the heat exchange area between the circulating air and the surface of the capacitor monomers, ensuring smooth circulation of cooling air inside the module, thereby effectively improving the heat dissipation efficiency. At the same time, the support structure provides stable support for the capacitor monomers, enhancing the anti-vibration performance and overall structural reliability of the module.

[0025] Thirdly, the air-cooled module of the application adopts intelligent frequency conversion technology, which collects temperature data inside the module in real time through the set temperature sensor and feeds back the data to the terminal CMS for judgment and processing. The PWM control technology is used to dynamically adjust the fan speed, providing high, medium and low wind speed outputs according to different temperature rises, ensuring the balance between heat dissipation performance and energy efficiency ratio. Compared with the traditional fixed-speed air-cooled system, this design avoids unnecessary energy consumption, prolongs the service life of the fan, and further improves the heat dissipation efficiency.

[0026] Fourthly, the application optimizes the gap between the capacitor groups, the gap between the capacitor groups and the box, and the gap between the capacitor monomers, fully considers the balance of the battery arrangement and the air duct distribution, so that the air flow covers all the capacitor monomers more evenly, avoiding the problem of local insufficient heat dissipation. Through optimization of heat dissipation and intelligent control, the temperature gradient of the capacitor module during operation is effectively reduced, the service life of the capacitor monomers is prolonged, and the overall reliability and stability of the system are improved.

[0027] Fifthly, the capacitor module of the application adopts a same-end lead-out design, arranging the positive and negative lead-out ends of the module on the same side, simplifying the connection structure of the module and reducing the complexity of external wiring. This design facilitates the installation and maintenance of the module, improves the modular assembly efficiency, and reduces the cost and process complexity of system integration. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0029] Figure 1 Structure diagram of the capacitor module with the optimized air-cooling heat dissipation structure according to the first embodiment of the present application;

[0030] Figure 2 Structure diagram of the capacitor module with the optimized air-cooling heat dissipation structure according to the first embodiment of the present application;

[0031] Figure 3 Structure diagram of the capacitor module with the optimized air-cooling heat dissipation structure according to the first embodiment of the present application;

[0032] Figure 4 Structure diagram of the capacitor module with the optimized air-cooling heat dissipation structure according to the first embodiment of the present application;

[0033] Figure 5 Structure diagram of the capacitor module with the optimized air-cooling heat dissipation structure according to the first embodiment of the present application;

[0034] Figure 6 Structure diagram of the capacitor module with the optimized air-cooling heat dissipation structure according to the first embodiment of the present application;

[0035] Figure 7 Structure diagram of the capacitor module with the optimized air-cooling heat dissipation structure according to the first embodiment of the present application;

[0036] Figure 8 Structure diagram of the capacitor module with the optimized air-cooling heat dissipation structure according to the first embodiment of the present application.

[0037] Explanation of reference signs

[0038] 1, capacitor module; 11, capacitor unit; 12, negative pole; 2, first connecting plate; 21, negative pole connecting part; 22, positive pole connecting part; 23, bridge waist part; 3, support assembly; 31, upper support group; 311, plug; 312, slot; 32, lower support group; 4, heat dissipation fan; 5, FPC board; 51, sampling sheet; 52, bridge support; 6, leading end; 7, second connecting plate; 8, third connecting plate. DETAILED DESCRIPTION

[0039] The embodiments of the present application will be described in detail below with reference to the drawings.

[0040] Following, the embodiments of the present application are described through specific, concrete examples, and other advantages and effects of the present application can be easily understood by those skilled in the art from the disclosure of the present specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific embodiments, and each detail in the present specification can be modified or changed based on different views and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor also belong to the protection scope of the present application.

[0041] It is to be appreciated that various aspects of the embodiments described below are within the scope of the claims. It should be apparent that the aspects described herein can be embodied in a wide variety of forms and that any specific structure and / or function described herein is merely illustrative. Based on the teachings herein one skilled in the art should appreciate that an aspect described herein can be implemented independently of any other aspects and that an aspect described herein can be implemented both as any number of software and / or hardware structures and as any number of combinations of software and / or hardware structures. For example, an apparatus can be implemented using any number and combination of the aspects described herein. Additionally, the features described herein can be implemented using software and / or hardware structures that are not expressly described herein. Many modifications and other embodiments of the present application set forth herein will come to mind to one skilled in the art to which the present application pertains upon reading the foregoing description. Accordingly, all such modifications and other embodiments are intended to be included within the scope of the application. The goals of the present application are to provide a wind-cooling heat dissipation structure with good heat dissipation effect and low cost, and to solve the problem of high cost and high maintenance difficulty of liquid cooling and low heat dissipation efficiency of air cooling in the prior art.

[0042] In the prior art, in order to achieve the heat dissipation effect of the super capacitor group 1, liquid cooling and air cooling are usually used. The liquid cooling has a relatively high cost and high maintenance difficulty, and the air cooling has a relatively low heat dissipation efficiency. Under the premise, how to use the air cooling heat dissipation structure with good heat dissipation effect and low cost has become an urgent problem to be solved in the industry. Based on this, the embodiment of the present specification proposes an air cooling heat dissipation structure solution. The solution uses a claw-shaped first connecting sheet 2 to increase the heat dissipation area to enhance the heat dissipation effect.

[0043] Embodiment 1:

[0044] Reference Figure 1 - Figure 5The embodiment provides a capacitor module with an optimized air-cooled heat dissipation structure, which comprises: a plurality of capacitor groups 1, each capacitor group 1 comprising at least four capacitor units 11, the shell of each capacitor unit 11 being connected with the positive electrode thereof, the negative electrode column 12 of each capacitor unit 11 extending from the central top surface of the shell, and the negative electrode columns 12 of the plurality of capacitor units 11 extending towards the same side; a support assembly 3, wherein the capacitor groups 1 are arranged in the support assembly 3; a connecting sheet group, which is electrically connected to the top of the capacitor groups 1, and wherein the plurality of capacitor groups 1 are arranged in series through a plurality of connecting sheets; the connecting sheet group comprises a plurality of first connecting sheets 2 and at least two second connecting sheets 7 located at the leading end 6, one first connecting sheet 2 is arranged in each capacitor group 1, the first connecting sheets 2 are arranged between adjacent capacitor groups 1, adjacent capacitor units 11 are connected through the first connecting sheets 2, the first connecting sheets 2 are arranged at the same end of the top end, are welded at the same end, and are fixed in series at the same end, compared with the prior art in which the top end and the bottom end are arranged at both ends, the processing procedure is simplified, the processing timeliness and efficiency are improved, the consistency of processing is improved, the assembly cost is effectively reduced, and the product maintainability is more convenient; the connecting sheet group is integrally punched through sheet metal forming process, and 1-series or 3-series aluminum material is selected; the first connecting sheet 2 connects at least two capacitor units 11 in parallel in one capacitor group 1, and connects the at least two capacitor units 11 in parallel with another at least two capacitor units 11 in series; the at least two second connecting sheets 7 are connected to the positive electrode of the capacitor unit 11 in the first capacitor group 1 and the negative electrode of the capacitor unit 11 in parallel combination in the last capacitor group 1, respectively; an air-cooled module, which comprises at least one heat dissipation fan 4 and at least one temperature sensor; the first connecting sheet 2 is a claw-shaped structure with a height difference, comprising at least two positive electrode connecting parts 22, at least two negative electrode connecting parts 21 and one bridge waist part 23, and the positive electrode connecting parts 22 and the negative electrode connecting parts 21 are arranged on the two sides of the bridge waist part 23, respectively; the negative electrode connecting part 21 of the first connecting sheet 2 is connected to the negative electrode column 12 of one capacitor unit 11, and the positive electrode connecting part 22 is connected to the top surface of the shell of the adjacent next capacitor unit 11.

[0045] In the scheme, the eight capacitor bodies of a single capacitor group are connected in series-parallel mode through laser welding of the claw-shaped conductive aluminum row to be fixed, the basic structure of four capacitor bodies 11 in parallel and another four capacitor bodies 11 in series is realized, and then fixed through the upper / lower plastic support.

[0046] In a preferred embodiment, the bracket assembly 3 comprises a lower bracket group 32 and an upper bracket group 31, the lower bracket group 32 comprises a plurality of lower brackets arranged side by side, adjacent lower brackets are connected by a plug-in structure, the upper bracket group 31 comprises a plurality of upper brackets arranged side by side, the lower bracket and the corresponding upper bracket are fixedly connected by a fastener; a plurality of lower struts are arranged on the lower bracket, and a corresponding upper strut is arranged on the upper bracket, the lower strut and the upper strut are plugged in and fixed by the fastener; a slot 312 or a jack is arranged on one of the lower strut or the upper strut, and a plug 311 is arranged on the other one, the plug 311 is plugged into the slot 312 or the jack.

[0047] In a preferred embodiment, referring again to Figure 2 and Figure 3 , the capacitor module with an optimized air-cooled heat dissipation structure further comprises a flexible circuit board group, the flexible circuit board group is located above the connecting piece group, the flexible circuit board group comprises a plurality of FPC boards 5 arranged longitudinally, a plurality of sampling pieces are arranged on the FPC board 5, the sampling piece is connected with the first connecting piece 2 and / or the second connecting piece 7, and a temperature sensor is arranged on the sampling piece 51; the capacitor cell 11 uses the FPC board 5 as a sampling circuit, the FPC board 5 collects the electrical control signal of the capacitor cell 11 through the sampling piece and the connecting piece, realizes wireless harnessing of the module, simplifies the structure, reduces the weight, and has better heat dissipation and weldability; when designing, there is no need to reserve space for accommodating the harness, which is more conducive to integrated design, reduces the space volume of the module, and reduces the installation space requirement of the module; moreover, the connection position of the sampling piece and the connecting piece can be adjusted arbitrarily according to requirements, the space of each part is reasonably utilized, the position arrangement of the sampling piece is more flexible and has no limitations, the module can be designed to be minimized to the greatest extent, and the space volume of the module is reduced; the sampling piece and the connecting piece are fixed by welding, which improves the contact reliability and sampling accuracy, reduces the risk of contact failure caused by loose plug-in, loose plug-in, and the like, and ensures the reliability of sampling signal transmission; the flexible circuit board group further comprises a bridge bracket 52, the bridge bracket 52 is located between the connecting piece group and the FPC board 5; the positive electrode connecting part 22 is an arc-shaped concave structure, the concave structure surrounds the negative electrode column 12, the negative electrode connecting part 21 is a round head shape, and is connected to the negative electrode column 12 of the adjacent capacitor cell 11; the bridge waist part 23 is fixed to the bracket assembly 3, and the bridge waist part 23, the negative electrode connecting part 21, and the positive electrode connecting part 22 are sequentially arranged from high to low in the first connecting piece 2.

[0048] In this scheme, the first fin 2 in the shape of a claw has two advantages: 1. The heat dissipation area is large, because the negative electrode connecting part is an arc-shaped concave structure, the upper surface has a large contact area with the cold air, and can quickly dissipate heat; 2. Referring again to Figure 3 and Figure 5The first fin 2 has a large gap between the bridge waist 23 and the support assembly 3, so that the cold air can pass through the lower surface of the bridge waist, which not only improves the flow of the air flow, but also enhances the conduction and emission of heat, further optimizes the heat dissipation effect, and helps to maintain the temperature stability of the capacitor module under high efficiency operation.

[0049] Embodiment 2:

[0050] Referring to Figure 6 and Figure 7 Compared with embodiment 1, the air-cooled module in this embodiment includes three heat dissipation fans 4 and three temperature sensors. The heat dissipation fans 4 are uniformly distributed in the relative tail end, and the rotating speed of the heat dissipation fans 4 includes at least three gears, which can quickly and uniformly discharge heat to the outside of the module. The heat dissipation fan 4 adopts an intelligent variable frequency technology axial flow fan. The three temperature sensors on the FPC board 5 sample the real-time temperature data inside the module, feed back to the terminal CMS for judgment processing, and then control the fan speed through the PWM technology. According to the different temperature sampling data inside the capacitor module, the high, medium and low gear rotating speeds of the axial flow fan are preset. The three gear rotating speeds of the heat dissipation fan 4 are controllable, and the rotating speed of the heat dissipation fan 4 can be adjusted in real time according to the sampling data of the temperature sensor to quickly and effectively dissipate heat from the capacitor body 11. The heat dissipation fan 4 has built-in locked-rotor protection, overcurrent / overvoltage protection and other related safety regulations, and has long service life and easy maintenance. It avoids the uneven heat dissipation and large temperature difference between individual capacitors due to the position difference of the heat dissipation fan 4.

[0051] In this scheme, the single fan procurement cost is less than 10 yuan, and the whole air-cooled system procurement cost can be controlled within 40 yuan. The procurement cost of the water-cooled coil + aluminum fin + sealed water pipe joint is estimated to be about 450 yuan, and the mold cost is not included. Therefore, this scheme greatly reduces the heat dissipation cost of the capacitor module, and the air-cooled fan 4 installation structure design is simple and easy to disassemble, and does not occupy much internal space of the capacitor module, so as to realize higher energy efficiency ratio and strong maintainability in the later period.

[0052] In a preferred embodiment, the capacitor module of the optimized air-cooled heat dissipation structure is provided with a first air duct 41, a second air duct 42 and a third air duct 43, the first air duct 41 and the third air duct 43 are located between the capacitor group 1 as a whole and the box body, and the second air duct 42 is located between the laterally adjacent capacitor groups 1; preferably, the gap between the capacitor bodies is controlled by the support assembly 3 to be d1, the size of the first air duct 41, the second air duct 42 and the third air duct 43 is d2, and the height of the box body is preferably h1; the height of the capacitor monomer 11 is preferably h2; further, d1 is 4mm, d2 is 10mm, h1 is 110mm, and h2 is 95mm; the cooperation of the gap between the capacitor bodies (d1=4mm) and the width of the air duct (d2=10mm) makes the air flow moderate and smooth, avoids high air resistance and air retention, and improves the heat dissipation efficiency; there is sufficient space between the height of the box body (h1=110mm) and the height of the capacitor monomer 11 (h2=95mm) to accommodate the first connecting plate 2 and the FPC plate 5 and other structures, which saves the space in the vertical direction while ensuring the heat dissipation performance.

[0053] In the scheme, three main air ducts (the first air duct 41, the second air duct 42 and the third air duct 43) and a plurality of auxiliary air ducts are arranged inside the capacitor module to increase the heat exchange area between air and the surface of the electric core, effectively improving the heat dissipation efficiency; the cross-sectional size of the three main air ducts is 10x115mm, and the cross-sectional size of the rest auxiliary air ducts is 4x95mm; the support assembly 3 is reasonably arranged to ensure that the air flow exchanges heat with the surface of the capacitor monomer 11 to the greatest extent, thereby greatly improving the heat dissipation efficiency; compared with the traditional air-cooled system, the increased auxiliary air ducts and the reasonable main air duct configuration can effectively reduce the local overheating phenomenon caused by uneven air ducts or insufficient heat dissipation, improve the working stability and service life of the capacitor module; at the same time, the auxiliary air ducts and the lower surface of the waist part 23 form a heat dissipation space, which can make the cold air flow fully in the heat dissipation space, further improving the heat dissipation efficiency.

[0054] Example 3:

[0055] Reference Figure 8Compared with the embodiments 1 and 2, the capacitor module with the optimized air-cooling heat dissipation structure in the embodiment comprises 10 capacitor groups 1, the capacitor group 1 is a horizontal and vertical distribution structure of 2*5, which ensures that each capacitor cell 11 can be fully covered by the cooling air flow, avoids local overheating phenomenon, and improves the heat dissipation uniformity and efficiency; the connecting sheet group comprises 4 second connecting sheets 7, the connecting sheet group further comprises a third connecting sheet 8, two second connecting sheets 7 are located at opposite tail ends of the lead-out end 6, the two second connecting sheets 7 located at the opposite tail ends are electrically connected through the third connecting sheet 8, the third connecting sheet 8 is connected or welded on the two second connecting sheets 7 through bolts, which simplifies the external wiring, reduces the resistance of the connection path, and improves the electrical stability of the whole module; the capacitor group 1 comprises 8 capacitor cells 11, the first connecting sheet 2 comprises 4 positive connecting parts 22 and 4 negative connecting parts 21, and the capacitor group 1 structure of 4 capacitor cells 11 in parallel and another 4 capacitors in series is formed.

[0056] In the specification, the same or similar parts between various embodiments can be referred to each other, and each embodiment focuses on the difference from other embodiments. Especially, for the embodiments described later, the description is relatively simple, and the relevant parts can be referred to the part of the foregoing embodiments.

[0057] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A capacitor module with an optimized air-cooled heat dissipation structure, characterized in that, include: Several capacitor banks, with the casing of each capacitor cell connected to its positive terminal, and the negative terminal of each capacitor cell extending from the center of the top surface of the casing; A bracket assembly, wherein the capacitor bank is arranged within the bracket assembly; A connecting tab assembly is electrically connected to the top of a capacitor bank. The connecting tab assembly includes several first connecting tabs and at least two second connecting tabs located at the leads. Each first connecting tab is a claw-shaped structure with a height difference, including at least two positive electrode connecting portions, at least two negative electrode connecting portions, and a bridge waist portion. The positive and negative electrode connecting portions are respectively located on both sides of the bridge waist portion. The negative electrode connecting portion of the first connecting tab is connected to the negative terminal of a single capacitor cell, and the positive electrode connecting portion is connected to the top surface of the casing of the next adjacent capacitor cell. An air-cooled module, the air-cooled module including at least one cooling fan and at least one temperature sensor.

2. The capacitor module with optimized air-cooled heat dissipation structure according to claim 1, characterized in that: Each capacitor bank has a first connecting piece, and adjacent capacitor banks are connected through the first connecting piece; the first connecting piece connects at least two capacitor cells in a capacitor bank in parallel, and connects the at least two capacitor cells in parallel with at least two other capacitor cells in series; at least two second connecting pieces are respectively connected to the positive terminal of the capacitor cells in the first capacitor bank and the negative terminal of the capacitor cells in the parallel combination in the last capacitor bank.

3. The capacitor module with optimized air-cooled heat dissipation structure according to claim 2, characterized in that: It includes multiple capacitor groups, which are arranged in a horizontal and vertical distribution structure; the connecting piece group includes multiple second connecting pieces, and the connecting piece group also includes a third connecting piece, with two second connecting pieces located at opposite ends of the lead-out terminal, and the two second connecting pieces located at opposite ends being electrically connected through the third connecting piece.

4. The capacitor module with optimized air-cooled heat dissipation structure according to claim 2 or 3, characterized in that: The air-cooled module includes three cooling fans and three temperature sensors. The cooling fans are evenly distributed laterally at opposite ends, and the speed of the cooling fans includes at least three adjustable speeds.

5. The capacitor module with optimized air-cooled heat dissipation structure according to claim 4, characterized in that, It also includes a flexible circuit board assembly, which is located above the connecting piece assembly. The flexible circuit board assembly includes several FPC boards mounted vertically, and several sampling pieces are disposed on the FPC boards. The sampling pieces are connected to the first connecting piece and / or the second connecting piece, and the temperature sensor is disposed on the sampling piece.

6. The capacitor module with optimized air-cooled heat dissipation structure according to claim 5, characterized in that: The cooling fan includes an axial flow fan using intelligent frequency conversion technology. It samples real-time temperature data inside the module through three temperature sensors on the FPC board, feeds the data back to the terminal CMS for judgment and processing, and then controls the fan speed through PWM technology. Based on the different temperature rise sampling data inside the capacitor module, the axial flow fan is preset with three speed settings: high, medium, and low.

7. The capacitor module with optimized air-cooled heat dissipation structure according to claim 1, characterized in that, The bracket assembly includes a lower bracket group and an upper bracket group. The lower bracket group includes several lower brackets arranged side by side, and adjacent lower brackets are connected by a plug-in structure. The upper bracket group includes several upper brackets arranged side by side. The lower brackets and corresponding upper brackets are fixedly connected by fasteners. The lower brackets are provided with several lower support columns, and the upper brackets are provided with corresponding upper support columns. The lower support columns and upper support columns are plugged into each other and fixed by fasteners. One of the lower support columns or upper support columns is provided with a slot or socket, and the other is provided with a connector, which is plugged into the slot or socket.

8. The capacitor module with optimized air-cooled heat dissipation structure according to claim 5, characterized in that, The flexible circuit board assembly also includes a bridge support, which is located between the connecting piece assembly and the FPC board.

9. The capacitor module with optimized air-cooled heat dissipation structure according to claim 1, characterized in that, The positive electrode connection portion is an arc-shaped concave structure, which surrounds the negative electrode post.

10. The capacitor module with optimized air-cooled heat dissipation structure according to claim 1, characterized in that, The bridge waist is fixed to the bracket assembly, and the first connecting piece is provided with the bridge waist, negative electrode connection part and positive electrode connection part in sequence from high to low.

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