Heat dissipation anti-static mobile phone mainboard

Abstract

The utility model relates to the field of mobile phone mainboards, and discloses a heat dissipation anti-static mobile phone mainboard which comprises a mainboard body, and a heat dissipation assembly is arranged on the outer side of the mainboard body. The heat dissipation assembly comprises a heat dissipation hole penetrating through the upper portion of the main board, a heat dissipation barrel is arranged on the inner wall of the heat dissipation hole, the bottom end of the heat dissipation barrel is fixedly connected with a heat dissipation base, a heat dissipation gasket is arranged on the inner wall of the upper portion of the heat dissipation base, the heat dissipation assembly further comprises a heat dissipation square column, and the heat dissipation square column is fixedly connected to the lower portion of the heat dissipation base. According to the utility model, through the use of the heat dissipation assembly, the heat dissipation holes penetrate through the upper part of the mainboard, heat is rapidly transmitted to the heat dissipation base through the heat dissipation cylinder, the heat dissipation base increases the heat dissipation area and improves the heat dissipation efficiency through the heat dissipation square columns, and the graphene film in the heat dissipation gasket has strong thermal conductivity; heat of the mainboard can be quickly absorbed and transmitted to the nanofiber composite layer and the ultrathin metal foil, and then is dissipated by the heat dissipation base and the heat dissipation square columns, so that the temperature of the mainboard is effectively reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of mobile phone mainboard especially relates to a heat dissipation anti -static mobile phone mainboard. BACKGROUND

[0002] In today's digital age, mobile phones have become an indispensable tool in people's lives, with the wide application of 5G communication technology, high-performance chips and various complex application programs, the functions of mobile phones are increasingly powerful, but this also makes the running load of mobile phone mainboard increasing, and the heat dissipation and anti-static problem caused thereby is increasingly prominent.

[0003] At present, the existing mobile phone mainboard heat dissipation and anti-static measures on the market have certain limitations, some mobile phones adopt traditional heat dissipation methods, such as simple metal heat dissipation sheet, the heat dissipation efficiency is low, it is difficult to meet the increasing heat dissipation demand of high-performance chips, therefore, a heat dissipation anti-static mobile phone mainboard is proposed to solve the above problems. UTILITY MODEL CONTENTS

[0004] In order to make up for the above shortcomings, the utility model provides a heat dissipation anti-static mobile phone mainboard, which aims at improving the problems of "low heat dissipation efficiency and poor anti-static effect of mobile phone mainboard" in the prior art.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme: a heat dissipation anti-static mobile phone mainboard, comprising a mainboard, a heat dissipation assembly is arranged outside the mainboard; the heat dissipation assembly comprises a heat dissipation hole arranged through the upper part of the mainboard, a heat dissipation cylinder is arranged on the inner wall of the heat dissipation hole, a heat dissipation base is fixedly connected to the bottom end of the heat dissipation cylinder, and a heat dissipation gasket is arranged on the inner wall of the upper part of the heat dissipation base.

[0006] As a further description of the above technical scheme:

[0007] The heat dissipation assembly further comprises a heat dissipation square column, the heat dissipation square column is fixedly connected to the lower part of the heat dissipation base, and a plurality of groups of heat dissipation square columns are arranged in a rectangular array in the lower part of the heat dissipation base.

[0008] As a further description of the above technical scheme:

[0009] The inner side of the heat dissipation base is provided with an insulating frame, and the insulating frame is attached to the outer side of the mainboard.

[0010] As a further description of the above technical scheme:

[0011] The lower part of the insulating frame is in contact with the upper part of the heat dissipation gasket.

[0012] As a further description of the above technical scheme:

[0013] A through hole is arranged through the outer side of the heat dissipation cylinder.

[0014] As a further description of the above technical solutions:

[0015] The heat dissipation gasket comprises a graphene film, which is arranged on an upper layer of the heat dissipation gasket and is in contact with the insulating frame and the mainboard.

[0016] As a further description of the above technical solutions:

[0017] The lower part of the graphene film is fixedly connected with a nanofiber composite layer.

[0018] As a further description of the above technical solutions:

[0019] The lower side of the nanofiber composite layer is fixedly connected with an ultrathin metal foil, which is attached to the surface of the heat dissipation base.

[0020] The utility model has the advantages of the following beneficial effects:

[0021] 1、 the utility model discloses, through the use of heat dissipation assembly, the heat dissipation hole penetrates the upper part of mainboard, and the heat is rapidly transferred to the heat dissipation base through the heat dissipation cylinder, and the heat dissipation base increases the heat dissipation area through the heat dissipation square column, and the heat dissipation efficiency is promoted, and the graphene film in the heat dissipation gasket has strong thermal conductivity, can rapidly absorb the mainboard heat and is transferred to nanofiber composite layer and ultrathin metal foil, and then is radiated by the heat dissipation base and the heat dissipation square column, and the temperature of mainboard is effectively reduced.

[0022] 2、 the utility model discloses, through the setting of insulating frame, can prevent the mainboard from electric leakage, avoids static electricity, and the graphene film has good conductivity, and can promptly guide the static electricity generated by mainboard and reduce the interference and damage risk of static electricity to mainboard circuit. DETAILED DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is the three-dimensional structure schematic diagram of the whole device in the utility model;

[0024] Figure 2 It is the three-dimensional structure schematic diagram of the whole device in the utility model;

[0025] Figure 3 It is the three-dimensional structure schematic diagram of the whole device in the utility model;

[0026] Figure 4 It is the three-dimensional structure schematic diagram of the heat dissipation gasket in the utility model.

[0027] LEGEND:

[0028] 1, mainboard; 2, heat dissipation assembly; 21, heat dissipation hole; 22, heat dissipation cylinder; 23, heat dissipation base; 24, heat dissipation square column; 25, heat dissipation gasket; 251, graphene film; 252, nanofiber composite layer; 253, ultrathin metal foil; 3, insulating frame. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0030] Referring to Figures 1-3 , the utility model provides an embodiment: a heat dissipation anti-static mobile phone mainboard, including mainboard 1, as the core component of mobile phone, bears numerous electronic elements, is responsible for signal transmission, data processing and the coordination work of each function module of equipment, but will produce heat when operating, it is the key position that needs heat dissipation and anti-static protection, mainboard 1 outside is provided with heat dissipation assembly 2;Heat dissipation assembly 2 includes the heat dissipation hole 21 that is set in the upper portion of mainboard 1 and is penetrated, is the channel of heat transfer, can make the heat in the inside of mainboard 1 quickly conduct to the external heat dissipation structure, accelerates the heat dissipation speed, the inner wall of heat dissipation hole 21 is provided with heat dissipation cylinder 22, is responsible for the heat generated by mainboard 1 is transferred to heat dissipation base 23, the bottom end of heat dissipation cylinder 22 is fixedly connected with heat dissipation base 23, for supporting mainboard 1, receiving the heat transferred from heat dissipation cylinder 22, provides the installation position for heat dissipation gasket 25, simultaneously passes on the heat to heat dissipation square column 24, makes the heat can be dispersed to carry out heat dissipation, the upper inner wall of heat dissipation base 23 is provided with heat dissipation gasket 25, is composed of multiple layers of special material, cooperatively realizes efficient heat transfer.

[0031] Referring to Figures 1-3 , heat dissipation assembly 2 still includes heat dissipation square column 24, heat dissipation square column 24 is fixedly connected in the lower portion of heat dissipation base 23, heat dissipation square column 24 is provided with multiple groups, multiple groups of heat dissipation square column 24 are arranged in the lower portion of heat dissipation base 23 in rectangular array, the inner side of heat dissipation base 23 is provided with insulating frame 3, insulating frame 3 is attached to the outside of mainboard 1, mainly plays the role of insulation and auxiliary heat dissipation, can effectively prevent mainboard 1 from electric leakage, avoids static electricity due to electric leakage, guarantees the operation safety of mainboard 1, simultaneously, the lower portion of insulating frame 3 is in contact with the upper portion of heat dissipation gasket 25, provides support and positioning for heat dissipation gasket 25, optimizes the path of heat transfer from mainboard 1 to heat dissipation base 23 through heat dissipation gasket 25, helps to improve the heat dissipation efficiency, the lower portion of insulating frame 3 is in contact with the upper portion of heat dissipation gasket 25, the outer side of heat dissipation cylinder 22 is provided with through hole and is penetrated, can promote air circulation, so that external air can directly enter around heat dissipation cylinder 22 and take away heat, forms heat convection.

[0032] Referring to Figure 3 and Figure 4 The heat dissipation pad 25 includes a graphene film 251 arranged on the upper layer of the heat dissipation pad 25 and in contact with the insulating frame 3 and the mainboard 1, serving as the upper layer material of the heat dissipation pad 25 and having excellent heat conduction performance. It is in close contact with the insulating frame 3 and the mainboard 1, can quickly absorb the heat generated by the mainboard 1, and quickly transfer it to the nanofiber composite layer 252 below. In addition, the good electrical conductivity also makes it have the function of conducting and removing the static electricity of the mainboard 1, reducing the interference and damage risk of static electricity to the circuit of the mainboard 1. The graphene film 251 is fixedly connected with the nanofiber composite layer 252 below, which can receive the heat transferred by the graphene film 251, and further enhance the heat conduction effect through its own structural characteristics, stably transferring the heat to the ultra-thin metal foil 253, while playing a certain buffering and anti-static role. The nanofiber composite layer 252 is fixedly connected with the ultra-thin metal foil 253 below, and the ultra-thin metal foil 253 is attached to the surface of the heat dissipation base 23, quickly and evenly distributing the heat transferred by the nanofiber composite layer 252 to the heat dissipation base 23, so that the heat can be more effectively dissipated through the heat dissipation base 23 and the heat dissipation square column 24, ensuring the efficiency and continuity of heat transfer.

[0033] Working principle: in use, the heat generated by the operation of the mobile phone mainboard 1 is first transferred through the heat dissipation holes 21 penetrating the upper part of the mainboard 1. The heat dissipation cylinder 22 on the inner wall of the heat dissipation hole 21 collects and conducts the heat to the heat dissipation base 23. The heat dissipation base 23 receives the heat transferred by the heat dissipation cylinder 22 on one hand, and provides a mounting position for the heat dissipation pad 25 on the other hand, so that the heat is transferred to the heat dissipation pad 25. The graphene film 251 of the heat dissipation pad 25 quickly absorbs the heat of the mainboard 1 due to its high thermal conductivity, and then transfers the heat to the heat dissipation base 23 through the ultra-thin metal foil 253 after the conduction is enhanced by the nanofiber composite layer 252.

[0034] At the same time, the multiple groups of heat dissipation square columns 24 on the lower part of the heat dissipation base 23 are arranged in a rectangular array to increase the heat dissipation area and dissipate the heat to the surrounding environment. The through holes on the outer side of the heat dissipation cylinder 22 can increase the contact area with air, thereby improving the heat dissipation efficiency.

[0035] The insulating frame 3 is arranged on the inner side of the heat dissipation base 23 and attached to the outer side of the mainboard 1, preventing the mainboard 1 from leaking electricity and avoiding static electricity caused by leakage, thereby ensuring the safety of the operation of the mainboard 1. The graphene film 251 in the heat dissipation pad 25 has good electrical conductivity, which can timely conduct and remove the static electricity generated by the mainboard 1, reducing the interference and damage risk of static electricity to the circuit of the mainboard 1.

[0036] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. A heat-dissipating and anti-static mobile phone motherboard, comprising a motherboard (1), characterized in that: A heat dissipation component (2) is provided on the outside of the motherboard (1); The heat dissipation assembly (2) includes a heat dissipation hole (21) that passes through the upper part of the motherboard (1). A heat dissipation cylinder (22) is provided on the inner wall of the heat dissipation hole (21). A heat dissipation base (23) is fixedly connected to the bottom end of the heat dissipation cylinder (22). A heat dissipation pad (25) is provided on the upper inner wall of the heat dissipation base (23).

2. The heat dissipation and anti-static mobile phone motherboard according to claim 1, characterized in that: The heat dissipation component (2) also includes heat dissipation columns (24), which are fixedly connected to the lower part of the heat dissipation base (23). Multiple sets of heat dissipation columns (24) are arranged in a rectangular array at the lower part of the heat dissipation base (23).

3. The heat dissipation and anti-static mobile phone motherboard according to claim 1, characterized in that: An insulating frame (3) is provided on the inner side of the heat sink base (23), and the insulating frame (3) is attached to the outer side of the motherboard (1).

4. A heat-dissipating and anti-static mobile phone motherboard according to claim 3, characterized in that: The lower part of the insulating frame (3) contacts the upper part of the heat dissipation pad (25).

5. A heat-dissipating and anti-static mobile phone motherboard according to claim 1, characterized in that: A through hole is provided on the outer side of the heat sink (22).

6. A heat-dissipating and anti-static mobile phone motherboard according to claim 1, characterized in that: The heat dissipation pad (25) includes a graphene film (251), which is disposed on the upper layer of the heat dissipation pad (25) and in contact with the insulating frame (3) and the motherboard (1).

7. A heat-dissipating and anti-static mobile phone motherboard according to claim 6, characterized in that: A nanofiber composite layer (252) is fixedly connected to the lower part of the graphene film (251).

8. A heat-dissipating and anti-static mobile phone motherboard according to claim 7, characterized in that: An ultrathin metal foil (253) is fixedly connected to the lower side of the nanofiber composite layer (252), and the ultrathin metal foil (253) is attached to the surface of the heat dissipation base (23).

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