Circuit board with self-heating function, electronic component and pressure transmitter

Abstract

The utility model provides a circuit board with a self-heating function, an electronic assembly and a pressure transmitter, which are used for heat preservation of electronic components, and the circuit board comprises a self-heating board body suitable for installation of the electronic components; the auxiliary heating module is arranged on the self-heating plate body and is suitable for wrapping the electronic element together with the self-heating plate body; the self-heating plate body and the auxiliary heating module can convert electric energy into heat so as to preserve the heat of the electronic element; the electronic assembly comprises the circuit board and the electronic assembly. According to the utility model, the operation stability and the service reliability of the pressure transmitter in an extreme temperature environment can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to low temperature environment pressure transmitter technical field, concretely relates to a circuit board, electronic assembly and pressure transmitter with self heating function. BACKGROUND

[0002] The existing pressure transmitter in the face of extreme low temperature environment, the electronic component performance in the circuit board will drop significantly, result in the stability and reliability of measurement result greatly reduce. Especially when the temperature drops to-45 DEG C below, this problem is particularly prominent. At present, the working temperature range of most pressure transmitters is limited to-45 DEG C above, below this temperature threshold, the working state of the electronic component on the circuit board will be affected due to low temperature, and then influence the performance of the whole transmitter. In addition, since the pressure transmitter generally adopts the current signal based on HART communication protocol, the size is 4-20mA for data transmission, which means that the current supplied to the heating device is very limited. If you try to heat the circuit board by external heating device, not only it may not be enough to generate enough heat, but also it may cause the pressure transmitter to work abnormally, and even be damaged.

[0003] Therefore, the existing pressure transmitter faces the double challenges of performance decline and reliability reduction in low temperature environment, which limits their application possibility in more extensive environmental conditions. SUMMARY

[0004] The utility model discloses a circuit board, electronic assembly and pressure transmitter with self heating function to improve the running stability and service reliability of pressure transmitter in extreme temperature environment.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A circuit board with self heating function for heat preservation electronic component, characterized in that, the circuit board includes:

[0007] Self heating plate body is suitable for installing the electronic component;

[0008] Sub heating module is located on the self heating plate body, and is suitable for wrapping the electronic component with the self heating plate body;

[0009] Wherein, the self heating plate body and sub heating module can convert electric energy into heat to heat preservation electronic component.

[0010] Some embodiments of the utility model, the self heating plate body includes:

[0011] Base plate;

[0012] A substrate green oil layer at least partially covers the substrate, and the electronic component is adapted to be disposed on the substrate green oil layer.

[0013] A substrate heating body includes a first substrate heating body and a second substrate heating body, wherein one side of the first substrate heating body is covered by the substrate green oil layer, and the other side is covered by the substrate, and one side of the second substrate heating body is fixed on the substrate, and the other side penetrates through the substrate green oil layer to be adapted to contact the electronic component.

[0014] The first substrate heating body and the second substrate heating body can both convert electric energy into heat, the first substrate heating body is adapted to keep the self-heating plate body warm, and the second substrate heating body is adapted to keep the electronic component warm.

[0015] In some embodiments of the utility model, the self-heating plate body has at least one of the following characteristics:

[0016] The material of the substrate is glass fiber reinforced epoxy resin, and the thickness is 1.6-2 μm.

[0017] The material of the substrate green oil layer is epoxy resin or acrylic resin or acrylic resin, and the thickness is 9-11 μm.

[0018] The substrate heating body is a copper foil with a thickness of 30-40 μm and prepared by a calendering process, or an aluminum foil, or a silver foil.

[0019] In some embodiments of the utility model, the wiring form of the substrate heating body is a snake-shaped wiring.

[0020] In some embodiments of the utility model, the secondary heating module includes, in sequence, a flexible substrate, a secondary heating body, a film layer, and a secondary heating silk screen layer.

[0021] The flexible substrate;

[0022] The secondary heating body;

[0023] The film layer;

[0024] The side of the flexible substrate, which is away from the secondary heating body, is adapted to contact the electronic component.

[0025] In some embodiments of the utility model, the secondary heating module further includes a secondary heating silk screen layer.

[0026] The secondary heating silk screen layer is disposed on the side of the film layer, which is away from the flexible substrate.

[0027] In some embodiments of the utility model, the secondary heating module has at least one of the following characteristics:

[0028] The material of the flexible substrate is polyimide, and the thickness is 32-36 μm.

[0029] The auxiliary heating heating body is a copper foil with a thickness of 30-40 μm prepared by a calendering process, or an aluminum foil, or a silver foil;

[0030] The material of the film layer is polyimide, and the thickness is 8-12 μm;

[0031] The material of the auxiliary heating silk printing layer is heat-cured text ink, and the thickness is 18-22 μm.

[0032] In some embodiments of the utility model, the wiring form of the auxiliary heating heating body is a snake-shaped wiring.

[0033] In some embodiments of the utility model, the circuit board further comprises:

[0034] The heat preservation module is arranged on the side of the auxiliary heating module away from the self-heating plate body.

[0035] Preferably, the material of the heat preservation module is aerogel or polyurethane, and the thickness is 16-20 mm.

[0036] In some embodiments of the utility model, the circuit board further comprises:

[0037] The temperature control circuit module is arranged on the self-heating plate body and is used for monitoring the temperature of the electronic element to adjust the heating power of the self-heating plate body and / or the auxiliary heating module.

[0038] In some embodiments of the utility model, the temperature control circuit module comprises:

[0039] At least one of an STM32 series microcontroller and an MSP430 series microcontroller is used for realizing the logic control of the whole circuit.

[0040] The metal film resistor is used for forming a voltage division with the thermistor to enable the microcontroller to read the temperature value and is also used as a pull-down resistor to avoid the base being suspended.

[0041] The thermistor is used for adjusting the resistance value according to the temperature to combine with the metal film resistor and output different voltages.

[0042] The STM32 series microcontroller and the MSP430 series microcontroller, the metal film resistor and the thermistor are electrically connected, the resistance value of the thermistor changes according to the ambient temperature, and the thermistor and the metal film resistor jointly form a voltage division circuit to output a voltage signal to the STM32 series microcontroller and the MSP430 series microcontroller, and the STM32 series microcontroller and the MSP430 series microcontroller convert the voltage signal into a set temperature.

[0043] To achieve the above objectives, the present invention also provides the following technical solutions:

[0044] An electronic component, the electronic component comprising:

[0045] The aforementioned circuit board; and

[0046] Electronic components are encased between the self-heating plate and the auxiliary heating module of the circuit board.

[0047] In some embodiments of this invention, the electronic component is at least one of a chip and a crystal oscillator.

[0048] To achieve the above objectives, the present invention also provides the following technical solutions:

[0049] A pressure transmitter, characterized in that the pressure transmitter includes the circuit board described above, or includes the electronic components described above;

[0050] The pressure transmitter also includes a pressure sensing component, which is electrically connected to electronic components disposed on the circuit board.

[0051] Other applicable areas will become apparent from the description provided in this disclosure.

[0052] The descriptions and specific examples in this utility model are intended to be illustrative only and are not intended to limit the scope of this disclosure.

[0053] Compared with the prior art, the technical solution provided by this utility model has the following beneficial effects:

[0054] 1. This utility model provides a circuit board, electronic components, and pressure transmitter with self-heating function. The circuit board can achieve self-heating to heat the chip and crystal oscillator and keep them at a healthy operating temperature range. Even under extreme low temperature conditions, the heating method provided by this utility model can ensure that the circuit board of the pressure transmitter has strong operational stability and service reliability, thereby expanding the application scenarios of the pressure transmitter using this self-heating technology and enhancing the performance of the pressure transmitter under harsh climatic conditions.

[0055] 2. This utility model uses circuit board self-heating technology to directly heat the chip, which can effectively maintain the chip and crystal oscillator within a healthy operating temperature range, thereby enhancing the operational stability and reliability of the pressure transmitter in extreme low temperature environments such as below -45℃.

[0056] 3. Compared with traditional external heating equipment, the self-heating technology provided by this utility model generates heat directly on the circuit board, which effectively reduces the energy dissipation loss that may occur during long transmission and significantly reduces the overall energy consumption.

[0057] 4. Because the self-heating circuit board technology provided by this utility model can keep the chip in a healthy operating temperature range, it can significantly reduce the disturbance of the pressure transmitter measurement results due to temperature fluctuations, thereby significantly improving the measurement accuracy of the pressure transmitter that uses this self-heating technology.

[0058] 5. The self-heating circuit board technology provided by this utility model reduces the reliance on external heating devices, thereby reducing the risk of overall system failure caused by the failure of external heating devices, and thus enhancing the durability and maintainability of the overall system.

[0059] 6. The circuit board self-heating technology provided by this utility model can quickly respond to changes in ambient temperature through the control circuit module, thereby adjusting the heating state of the circuit board in a timely manner to ensure that the pressure transmitter can respond quickly when the ambient temperature fluctuates and thus always maintain the best working state. Attached Figure Description

[0060] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some implementation schemes of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0061] Figure 1 A cross-sectional view of a circuit board with self-heating function and electronic components provided for the first embodiment of this utility model;

[0062] Figure 2 A top view of a circuit board and electronic components with self-heating function provided for the second embodiment of this utility model;

[0063] Figure 3 A circuit diagram of a self-heating circuit board provided in the third embodiment of this utility model.

[0064] Explanation of reference numerals in the attached figures

[0065] 1-Circuit board; 11-Self-heating board body; 111-Substrate; 112-Substrate green solder mask layer; 113-Substrate heating element; 1131-First substrate heating element; 1132-Second substrate heating element; 114-Substrate silkscreen layer; 12-Secondary heating module; 121-Flexible substrate; 122-Auxiliary heating element; 123-Coating layer; 124-Auxiliary heating silkscreen layer; 13-Insulation module; 14-Temperature control circuit module;

[0066] 2-Electronic components. Detailed Implementation

[0067] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model. It should be understood that the specific embodiments described herein are only for illustration and explanation of this utility model, and are not intended to limit this utility model.

[0068] Any specific numerical values ​​disclosed herein (including the endpoints of numerical ranges) are not limited to their exact values, but should be understood to also include values ​​close to the exact value, such as all possible values ​​within ±5% of the exact value. Furthermore, with respect to the disclosed numerical ranges, one or more new numerical ranges can be obtained by arbitrarily combining the endpoint values ​​of the range, the endpoint values ​​with specific point values ​​within the range, and the specific point values ​​themselves; these new numerical ranges should also be considered as specifically disclosed herein.

[0069] The terminology used in this disclosure is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” as used in this disclosure are intended to include the plural forms as well. The terms “comprising,” “including,” “containing,” and “having” are inclusive and thus describe the presence of said features, elements, compositions, steps, integers, operations, and / or components, but do not exclude the presence or inclusion of one or more other features, integers, steps, operations, elements, components, and / or sets thereof. Although the open-ended term “comprising” should be understood as a non-limiting term used to describe and claim the various embodiments described in this disclosure, in some aspects it may instead be understood as a more restrictive and limiting term, such as “consisting of” or “substantially consisting of.” Thus, for any given embodiment describing a composition, material, component, element, feature, integer, operation, and / or process step, this disclosure also particularly includes embodiments consisting of or substantially consisting of such compositions, materials, components, elements, features, integers, operations, and / or process steps. In the case of “consisting of…”, the alternative embodiments exclude any additional compositions, materials, components, elements, features, integers, operations and / or process steps. In the case of “essentially composed of…”, any additional compositions, materials, components, elements, features, integers, operations and / or process steps that substantially affect the essential and novel characteristics are excluded from such embodiments. However, any compositions, materials, components, elements, features, integers, operations and / or process steps that do not substantially affect the essential and novel characteristics may be included in the embodiments.

[0070] Any method steps, processes, and operations described in this disclosure should not be construed as necessarily requiring them to be performed in a particular order as discussed or shown, unless explicitly specified. It should also be understood that additional or alternative steps may be used unless otherwise stated.

[0071] In this application, except where expressly stated, any matters or issues not mentioned are directly applicable to those known in the art without any modification. Furthermore, any implementation described in this disclosure may be freely combined with one or more other implementations described in this disclosure, and the resulting technical solutions or concepts shall be considered part of the original disclosure or original record of this application, and should not be regarded as new content not disclosed or anticipated in this disclosure, unless those skilled in the art consider the combination to be clearly unreasonable.

[0072] Unless otherwise stated, the terms used herein have the same meaning as commonly understood by those skilled in the art, and if a term is defined herein and its definition differs from the common understanding in the art, the definition herein shall prevail.

[0073] First aspect

[0074] See Figure 1 and Figure 2 This utility model provides a circuit board 1 with a self-heating function for heat preservation of electronic components 2. The circuit board 1 includes: a self-heating plate 11, adapted to mount the electronic components 2; and a secondary heating module 12, disposed on the self-heating plate 11 and adapted to jointly wrap the electronic components 2 with the self-heating plate 11. The self-heating plate 11 and the secondary heating module 12 can convert electrical energy into heat to keep the electronic components 2 warm.

[0075] The self-heating circuit board technology provided by this utility model integrates the heat source with the circuit board, reducing the dependence on external heating devices. This reduces the risk of overall system failure due to failure of external heating devices, thereby enhancing the durability and maintainability of the overall system.

[0076] This invention utilizes self-heating circuit board technology to directly heat the chip, effectively maintaining the chip and crystal oscillator within a healthy operating temperature range. This enhances the operational stability and reliability of the pressure transmitter in extreme low-temperature environments, such as below -45°C. Compared to traditional external heating devices, the self-heating circuit board provided by this invention generates heat directly on the circuit board, effectively reducing energy dissipation losses that may occur during long-term transmission and significantly lowering overall energy consumption.

[0077] See Figure 1In some embodiments of this utility model, the self-heating plate 11 includes: a substrate 111; a substrate green varnish layer 112, at least partially covering the substrate 111, wherein the electronic component 2 is adapted to be disposed on the substrate green varnish layer 112; and a substrate heating element 113, including a first substrate heating element 1131 and a second substrate heating element 1132, wherein one side of the first substrate heating element 1131 is covered by the substrate green varnish layer 112 and the other side is covered by the substrate 111, and one side of the second substrate heating element 1132 is fixed to the substrate 111 and the other side passes through the substrate green varnish layer 112 to be adapted to contact the electronic component 2; wherein both the first substrate heating element 1131 and the second substrate heating element 1132 can convert electrical energy into heat, the first substrate heating element 1131 insulates the self-heating plate 11, and the second substrate heating element 1132 is adapted to insulate the electronic component 2.

[0078] The green oil layer 112 on the substrate serves as insulation and protection.

[0079] In some embodiments of this invention, a silkscreen pattern is provided on the side of the substrate green solder mask layer 112 facing away from the substrate 111 for identification and information recording and transmission. Specifically, the silkscreen pattern can be printed on the substrate green solder mask layer using conventional silkscreen printing technology. It is worth noting that in some embodiments, machine vision recognition technology is used to produce the above-mentioned self-heating circuit board through an automated production line. In this case, equipment with visual recognition capabilities can make corresponding feedback actions based on the silkscreen pattern to achieve efficient and reliable automated production.

[0080] In some embodiments of this utility model, the substrate 111 of the self-heating plate 11 is made of glass fiber reinforced epoxy resin with a thickness of 1.6 to 2 μm.

[0081] In some embodiments of this utility model, the substrate green oil layer 112 of the self-heating plate 11 is made of epoxy resin or acrylic resin, and has a thickness of 9-11 μm.

[0082] In some embodiments of this utility model, the screen printing material on the self-heating plate 11 is thermosetting text ink with a thickness of 18-22 μm.

[0083] In some embodiments of this utility model, the substrate heating element 113 of the self-heating plate 11 is a copper foil with a thickness of 30-40 μm, which is produced by a rolling process and has a good heat generation effect.

[0084] In some embodiments of this utility model, the substrate heating element 113 of the self-heating plate 11 is an aluminum foil with a thickness of 30-40 μm.

[0085] In some embodiments of this utility model, the substrate heating element 113 of the self-heating plate 11 is a silver foil with a thickness of 30-40 μm.

[0086] See Figure 2 In some embodiments of this utility model, the wiring of the substrate heating element 113 is a serpentine pattern, which has a better heat generation effect; of course, in other embodiments, other patterns and forms of wiring can also be used.

[0087] See Figure 1 and Figure 2 In some embodiments of this utility model, the auxiliary heating module 12 includes, in sequence: a flexible substrate 121; an auxiliary heating element 122; and a coating layer 123; wherein, the side of the flexible substrate 121 facing away from the auxiliary heating element 122 is adapted to contact the electronic component 2.

[0088] It is worth noting that in some embodiments of this utility model, the substrate 111 in the self-heating plate 11 can also be made of flexible material, just like the flexible substrate 121.

[0089] In some embodiments of this utility model, the auxiliary heating module 12 further includes an auxiliary heating silkscreen layer 124, disposed on the side of the coating layer 123 facing away from the flexible substrate 121. It is worth noting that the auxiliary heating silkscreen layer 124 can be used for identification and information recording and transmission; specifically, the silkscreen pattern can be printed on the coating layer using conventional silkscreen printing technology. It is also worth noting that in some embodiments, machine vision recognition technology is used to produce the aforementioned self-heating circuit board through an automated production line. In this case, equipment with visual recognition capabilities can make corresponding feedback actions based on the silkscreen pattern to achieve efficient and reliable automated production. Furthermore, since the electronic components 2, including chips and crystal oscillators, are covered below by the auxiliary heating module 12, for ease of identification and understanding, the auxiliary heating silkscreen layer 124 can be used to obtain information such as the location, specifications, and model of the chips and crystal oscillators.

[0090] In some embodiments of this utility model, the flexible substrate 121 of the auxiliary heating module 12 is made of polyimide with a thickness of 32-36 μm.

[0091] In some embodiments of this utility model, the auxiliary heating element 122 of the auxiliary heating module 12 is a copper foil with a thickness of 30-40 μm, which is produced by a rolling process.

[0092] In some embodiments of this utility model, the auxiliary heating element 122 of the auxiliary heating module 12 is aluminum foil, preferably with a thickness of 30-40 μm.

[0093] In some embodiments of this utility model, the auxiliary heating element 122 of the auxiliary heating module 12 is silver foil, preferably with a thickness of 30-40 μm.

[0094] In some embodiments of this utility model, the coating layer 123 is made of polyimide and has a thickness of 8-12 μm.

[0095] In some embodiments of this utility model, the auxiliary heat-spraying layer 124 is made of thermosetting text ink and has a thickness of 18-22 μm.

[0096] In some embodiments of this utility model, the wiring of the auxiliary heating element 122 is a serpentine pattern; of course, in other embodiments, other patterns and forms of wiring can also be used.

[0097] In some embodiments of this utility model, the auxiliary heating module 12 and the self-heating plate 11 can be fixed by screws or by adhesive or other means.

[0098] In some embodiments of this utility model, the substrate heating element 113 and the auxiliary heating element 122 can share the same microcontroller and the same power supply; in other embodiments, two independent power supplies and the same microcontroller can be used to control the substrate heating element 113 and the auxiliary heating element 122.

[0099] In some embodiments of this invention, the circuit board 1 further includes a heat insulation module 13, disposed on the side of the auxiliary heating module 12 opposite to the self-heating plate 11. The heat insulation module 13 can prevent heat loss, thereby further improving the heat insulation effect on electronic components 2, including chips and crystal oscillators.

[0100] In some embodiments of this utility model, the insulation module 13 is made of aerogel or polyurethane and has a thickness of 16-20 mm.

[0101] In some embodiments of this utility model, the circuit board 1 further includes a temperature control circuit module 14, which is disposed on the self-heating plate 11 and is used to monitor the temperature of the electronic component 2 in order to adjust the heating power of the self-heating plate 11 and / or the auxiliary heating module 12.

[0102] See Figure 3In some embodiments of this utility model, the temperature control circuit module 14 includes: a microcontroller U1, wherein the microcontroller U1 is at least one of an STM32 series microcontroller and an MSP430 series microcontroller, used to realize the overall logic control of the circuit; a metal film resistor R1, used to form a voltage divider with the thermistor so that the microcontroller can read the temperature value; a metal film resistor R2, used as a pull-down resistor to avoid the base being floating; and a thermistor A, used to adjust its own resistance value according to the temperature, so as to combine with the metal film resistor R1 and output different voltages; wherein the STM32 series microcontroller and the MSP430 series microcontroller, the metal film resistor and the thermistor are electrically connected, the thermistor changes its resistance value according to the ambient temperature, and together with the metal film resistor, forms a voltage divider circuit to output a voltage signal to the STM32 series microcontroller and the MSP430 series microcontroller, and the STM32 series microcontroller and the MSP430 series microcontroller convert the voltage signal into a set temperature. Through the aforementioned microcontroller U1, the self-heating technology of the circuit board provided by this invention allows the chip to always maintain a healthy operating temperature range, significantly reducing the disturbance to the pressure transmitter's measurement results caused by temperature fluctuations, thereby significantly improving the measurement accuracy of the pressure transmitter using this self-heating technology. The self-heating technology of the circuit board provided by this invention can quickly respond to changes in ambient temperature through a control circuit module, thereby adjusting the heating state of the circuit board in a timely manner to ensure that the pressure transmitter can respond quickly to ambient temperature fluctuations and thus always maintain optimal operating conditions.

[0103] See Figure 2 In some embodiments of this utility model, any one of the STM32 series microcontrollers and the MSP430 series microcontrollers is connected in series with the copper foil; in other embodiments, any one of the STM32 series microcontrollers and the MSP430 series microcontrollers is connected in parallel with the copper foil; the specific configuration can be adjusted and combined according to actual design requirements.

[0104] This invention provides a circuit board with a self-heating function, which can achieve self-heating to heat the chip and crystal oscillator and keep them at a healthy operating temperature range. Even under extreme low temperature conditions, the heating method provided by this invention can ensure that the circuit board of the pressure transmitter has strong operational stability and service reliability, thereby expanding the application scenarios of the pressure transmitter using this self-heating technology and enhancing the performance of the pressure transmitter under harsh climatic conditions.

[0105] It is worth noting that the specific color of the "silk screen printing" and "silk screen printing layer" described in this utility model specification can be white or other colors, in order to serve as a prominent identifier, facilitate human reading, and enable automatic machine recognition according to actual needs.

[0106] Second aspect

[0107] This utility model provides an electronic component, which includes: a circuit board 1 as described above; and electronic components 2, which are enclosed between the self-heating plate 11 and the auxiliary heating module 12 of the circuit board 1.

[0108] In some embodiments of this utility model, the electronic component 2 is at least one of a chip and a crystal oscillator.

[0109] It is worth noting that the pressure transmitter provided by this utility model, by adopting the aforementioned circuit board with self-heating function, enables various electronic components, including chips and crystal oscillators, to be kept at a healthy operating temperature range in extreme low-temperature environments, which significantly improves the overall performance of the electronic components and has good weather resistance and remarkable service robustness.

[0110] Third aspect

[0111] This utility model provides a pressure transmitter, which includes the circuit board 1 described above, or the electronic components described above; the pressure transmitter also includes a pressure measuring component, which is electrically connected to the electronic component 2 disposed on the circuit board 1.

[0112] For example, the pressure measuring component described above can be a pressure measuring diaphragm, which can be used to measure the pressure of the medium to be measured.

[0113] It is worth noting that the pressure transmitter provided by this utility model, by adopting the aforementioned self-heating circuit board, enables various electronic components in the transmitter, including chips and crystal oscillators, to be kept at a healthy operating temperature range even in extreme low-temperature environments. This significantly improves the overall performance of the pressure transmitter and provides excellent weather resistance and remarkable service robustness.

[0114] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims. Furthermore, specific examples have been used in the specification to illustrate the principles and implementation methods of this utility model. The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model, and the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A circuit board (1) with self-heating function for use in heat-insulating electronic components (2), characterized in that, The circuit board (1) includes: Self-heating plate (11), suitable for mounting the electronic component (2); A secondary heating module (12) is disposed on the self-heating plate (11) and is adapted to wrap the electronic component (2) together with the self-heating plate (11). The self-heating plate (11) and the auxiliary heating module (12) can convert electrical energy into heat to keep the electronic components (2) warm.

2. The circuit board (1) according to claim 1, characterized in that, The self-heating plate (11) includes: substrate(111); A substrate green oil layer (112) at least partially covers the substrate (111), and the electronic component (2) is adapted to be disposed on the substrate green oil layer (112); The substrate heating element (113) includes a first substrate heating element (1131) and a second substrate heating element (1132). One side of the first substrate heating element (1131) is covered by the substrate green oil layer (112), and the other side is covered by the substrate (111). One side of the second substrate heating element (1132) is fixed to the substrate (111), and the other side passes through the substrate green oil layer (112) to be suitable for contacting the electronic component (2). The first substrate heating element (1131) and the second substrate heating element (1132) can both convert electrical energy into heat. The first substrate heating element (1131) keeps the self-heating plate (11) warm, and the second substrate heating element (1132) is suitable for keeping the electronic component (2) warm.

3. The circuit board (1) according to claim 2, characterized in that, The self-heating plate (11) has at least one of the following features: The substrate (111) is made of glass fiber reinforced epoxy resin with a thickness of 1.6~2μm; The substrate green oil layer (112) is made of epoxy resin or acrylic resin and has a thickness of 9~11μm; The substrate heating element (113) is a copper foil, aluminum foil, or silver foil with a thickness of 30~40μm, produced by a rolling process.

4. The circuit board (1) according to claim 2 or 3, characterized in that, The wiring pattern of the substrate heating element (113) is a serpentine pattern.

5. The circuit board (1) according to claim 1, characterized in that, The secondary heating module (12) includes the following components stacked in sequence: Flexible substrate (121); Auxiliary heating element (122); Coating layer (123); The side of the flexible substrate (121) facing away from the auxiliary heating element (122) is adapted to contact the electronic component (2).

6. The circuit board (1) according to claim 5, characterized in that, The auxiliary heating module (12) also includes: A thermally heated screen printing layer (124) is disposed on the side of the coating layer (123) away from the flexible substrate (121).

7. The circuit board (1) according to claim 6, characterized in that, The auxiliary heating module (12) has at least one of the following features: The flexible substrate (121) is made of polyimide and has a thickness of 32~36μm; The auxiliary heating element (122) is a copper foil, aluminum foil, or silver foil with a thickness of 30~40μm, produced by a rolling process. The coating layer (123) is made of polyimide and has a thickness of 8~12μm; The auxiliary heat screen printing layer (124) is made of thermosetting text ink and has a thickness of 18~22μm.

8. The circuit board (1) according to any one of claims 5 to 7, characterized in that, The wiring of the auxiliary heating element (122) is a serpentine pattern.

9. The circuit board (1) according to claim 1, characterized in that, The circuit board (1) also includes: The heat preservation module (13) is located on the side of the auxiliary heating module (12) away from the self-heating plate (11).

10. The circuit board (1) according to claim 9, characterized in that, The insulation module (13) is made of aerogel or polyurethane and has a thickness of 16~20mm.

11. The circuit board (1) according to claim 2 or 5, characterized in that, The circuit board (1) also includes: A temperature control circuit module (14) is provided on the self-heating plate (11) to monitor the temperature of the electronic component (2) in order to adjust the heating power of the self-heating plate (11) and / or the auxiliary heating module (12).

12. The circuit board (1) according to claim 11, characterized in that, The temperature control circuit module (14) includes: At least one of the STM32 series microcontrollers and the MSP430 series microcontrollers is used to implement the overall logic control of the circuit. Metal film resistors are used to form a voltage divider with thermistors so that microcontrollers can read temperature values, and also as pull-down resistors to prevent the base from being left floating. A thermistor is used to adjust its own resistance value according to temperature so as to combine with the metal film resistor and output different voltages by voltage division; The STM32 series microcontroller, the MSP430 series microcontroller, the metal film resistor, and the thermistor are electrically connected. The thermistor changes its resistance value according to the ambient temperature and together with the metal film resistor, they form a voltage divider circuit to output a voltage signal to the STM32 series microcontroller and the MSP430 series microcontroller. The STM32 series microcontroller and the MSP430 series microcontroller then convert this voltage signal into a set temperature.

13. An electronic component, characterized in that, The electronic components include: The circuit board (1) as described in any one of claims 1 to 12; and Electronic component (2) is encased between the self-heating plate (11) and the auxiliary heating module (12) of the circuit board (1).

14. The electronic component according to claim 13, characterized in that, The electronic component (2) is at least one of a chip and a crystal oscillator.

15. A pressure transmitter, characterized in that, The pressure transmitter includes a circuit board (1) as described in any one of claims 1 to 12, or includes electronic components as described in claims 13 or 14; The pressure transmitter also includes a pressure measuring component, which is electrically connected to an electronic component (2) disposed on the circuit board (1).

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