Industrial equipment instrument circuit board convenient to install

Abstract

The utility model belongs to the technical field of circuit boards, and particularly relates to an industrial equipment instrument circuit board convenient to install, which comprises a substrate, and a protective cover is arranged on the outer side of the substrate. The substrate comprises a circuit board main body, a semiconductor chilling plate is arranged on the lower side of the circuit board main body, and a heat dissipation plate is arranged on the lower side of the semiconductor chilling plate; the circuit board body is located on the inner side of the protective cover, and the lower side of the heat dissipation plate extends out of the protective cover. A rectifier is mounted on the upper side of the circuit board main body; the rectifier is electrically connected with the semiconductor chilling plate and the circuit board main body; the lower side of the heat dissipation plate is provided with an interface row, and the interface row is electrically connected with the circuit board main body. According to the device, the protective cover, the circuit board main body and the semiconductor chilling plate are integrated, and a bolt only needs to penetrate through a counterbore in the protective cover and a central column on the substrate to be in threaded connection with an instrument shell during installation, so that the circuit board and the auxiliary protective structure thereof are more convenient to install.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to an industrial equipment instrument circuit board that is easy to install. Background Technology

[0002] A circuit board (PCB) is a carrier that uses copper plating on an insulating substrate to form conductive patterns, enabling electrical interconnection of components instead of traditional wires. It features high wiring density, light weight, thinness, and good flexibility. PCBs allow for compact connections of complex circuits, meeting the miniaturization design requirements of industrial instruments.

[0003] In the transfer and storage of oil, industrial equipment and instruments are required for quantitative oil handling. However, the high concentration of oil mist in oil depots can penetrate into these equipment and instruments, corroding the copper on the circuit boards. Adding a protective cover to the outside of the circuit boards can effectively prevent oil mist from entering. However, even with the protective cover, the heat inside the circuit board cannot be dissipated in time. Therefore, heat dissipation equipment is also needed to lower the circuit board temperature and prevent overheating of electrolytic capacitors.

[0004] The addition of protective covers, heat sinks, and other structures increases the size of industrial equipment and instruments; moreover, the sequential installation of these structures makes the circuit board installation more complex. Therefore, we propose an integrated circuit board with a protective cover and heat sink to facilitate rapid circuit board installation. Utility Model Content

[0005] The purpose of this utility model is to provide an industrial equipment instrument circuit board that is easy to install, so as to solve the problem mentioned in the background art that the circuit board in the oil depot needs to be installed with a separate auxiliary protective structure.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an industrial equipment instrument circuit board that is easy to install, comprising a substrate, wherein a protective cover is provided on the outer side of the substrate; the substrate comprises a circuit board body, wherein a semiconductor cooling chip is provided on the lower side of the circuit board body, and a heat sink is provided on the lower side of the semiconductor cooling chip; the circuit board body is located inside the protective cover, and the lower side of the heat sink extends out of the protective cover.

[0007] A rectifier is mounted on the upper side of the circuit board body, and the rectifier is electrically connected to the semiconductor cooling chip and the circuit board body; an interface bar is mounted on the lower side of the heat sink, and the interface bar is electrically connected to the circuit board body.

[0008] Preferably, an insulating matrix is ​​filled between the heat sink and the circuit board body.

[0009] Preferably, rectifiers are provided on both the front and rear sides above the main body of the circuit board, and multiple sets of thermoelectric coolers are provided, with each rectifier electrically connected to a set of thermoelectric coolers.

[0010] Preferably, a positioning hole is provided through the upper side of the substrate, a positioning post is inserted into the inner side of the positioning hole, and a central hole is provided through the upper side of the positioning post.

[0011] Preferably, the positioning post is T-shaped, with the upper side of the protruding lower end of the positioning post fixedly connected to the lower side of the substrate, and a placement groove concentric with the central hole is opened at the lower end of the positioning post, the diameter of the placement groove being larger than the diameter of the central hole.

[0012] Preferably, a central post is provided on the upper side of the inner cavity of the protective cover, and the lower end of the central post extends into the central hole of the positioning post;

[0013] A sealing post is provided on the outer side of the central post, and a sealing groove concentric with the central hole is opened on the upper side of the positioning post, with the sealing post abutting against the sealing groove.

[0014] Preferably, the upper side of the protective cover has a countersunk hole, and the lower end of the countersunk hole passes through the central column.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1) This device integrates the protective cover, the main body of the circuit board and the semiconductor cooling chip into one unit. During installation, it is only necessary to screw the bolts through the countersunk holes on the protective cover and the center post on the substrate to the instrument housing to complete the installation of the circuit board, the protective cover and the heat sink. By reducing the number of installation structures, the installation of the circuit board and its auxiliary protective structure is more convenient.

[0017] 2) This device integrates the protective cover, the main body of the circuit board and the semiconductor cooling chip into one unit, which makes the circuit board and its auxiliary protective structure occupy less space and facilitates the miniaturization of industrial equipment and instruments.

[0018] 3) This device combines a semiconductor cooling chip and a circuit board body, transferring heat from the circuit board body to reduce its temperature, preventing capacitor electrolysis, and thus extending the lifespan of the circuit board body. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the substrate structure of this utility model;

[0021] Figure 3 This is a schematic cross-sectional view of the main view of the substrate of this utility model;

[0022] Figure 4 This is a schematic diagram of the protective cover structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the left cross-sectional structure of the protective cover of this utility model.

[0024] In the diagram: 10 Protective cover, 11 Center post, 12 Countersunk hole; 21 Substrate, 22 Rectifier, 23 Interface bar, 24 Positioning post; 211 Circuit board body, 212 Insulating matrix, 213 Semiconductor cooling chip, 214 Heat sink. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Example

[0027] Please see Figures 1-5 This utility model provides a technical solution: an easy-to-install industrial equipment instrument circuit board, including a substrate 21 and a protective cover 10, with the protective cover 10 located on the outside of the substrate 21. A slot is provided on the lower side of the protective cover 10, and the substrate 21 is glued to the slot. The substrate 21 is sealed to the protective cover 10 around its perimeter to prevent oil mist from entering. Through the initial protection of the industrial equipment instrument casing, plus the secondary protection of the protective cover 10, the possibility of oil mist contacting the copper foil traces and solder joints on the substrate 21 can be reduced, thereby preventing oil mist from corroding the substrate 21. Other electronic components on the substrate 21 can be added as needed, and will not be elaborated here.

[0028] The substrate 21 includes a circuit board body 211, an insulating matrix 212, a thermoelectric cooler 213, and a heat sink 214. The circuit board body 211 utilizes existing technology and will not be described in detail here. A thermoelectric cooler 213 (using the existing TEC1-12703 semiconductor, mainly composed of N-type and P-type semiconductors connected in series, will not be described in detail here) is bonded to the underside of the circuit board body 211. The cold end of the thermoelectric cooler 213 is attached to the circuit board body 211, and the hot end of the thermoelectric cooler 213 is attached to the heat sink 214. The heat sink 214 is bonded to the underside of the thermoelectric cooler 213 and is made of anodized aluminum alloy. An insulating matrix 212, made of insulating silicone, fills the space between the heat sink 214 and the circuit board body 211. During the composite process, the electronic components on the upper side of the circuit board body 211 are first soldered to the circuit board body 211, and then the semiconductor cooling chip 213 is bonded to the circuit board body 211. After that, the insulating matrix 212 is filled, and then the heat sink 214 is bonded. Finally, the interface row 23 is soldered to the heat sink 214, and the pins of the interface row 23 are soldered to the copper foil lines on the circuit board body 211.

[0029] The circuit board body 211 is located inside the protective cover 10, and the lower side of the heat sink 214 extends out of the protective cover 10. The heat on the circuit board body 211 inside the protective cover 10 is transferred to the heat sink 214 for heat dissipation by the semiconductor cooling chip 213, which can prevent the temperature of the circuit board body 211 from getting too high.

[0030] A rectifier 22 is soldered to the upper side of the circuit board body 211. The rectifier 22 is electrically connected to the thermoelectric cooler 213 and the circuit board body 211. After the circuit board body 211 is connected to an external power source, the current enters the thermoelectric cooler 213 through the circuit board body 211 and the rectifier 22. The current is rectified by the rectifier 22, so that the current entering the thermoelectric cooler 213 is stable and unidirectional. When the current flows from the N-type semiconductor to the P-type semiconductor of the thermoelectric cooler 213, it will absorb the heat of the cold end, thereby reducing the temperature of the circuit board body 211 inside the protective cover 10.

[0031] The ambient temperature in a sealed oil depot can reach over 60℃. Under normal heat dissipation conditions, the circuit board will heat up by about 20℃, which can lead to overheating and capacitor electrolysis. This device uses a semiconductor cooling chip 213 to reduce the temperature of the circuit board body 211, transferring heat away and preventing overheating of the circuit board body 211, thus avoiding capacitor electrolysis and extending the service life of the circuit board body 211. An interface strip 23 is installed on the lower side of the heat sink 214, and the interface strip 23 is electrically connected to the circuit board body 211.

[0032] A controller is integrated on the main body 211 of the circuit board. Rectifiers 22 are installed on both the front and rear sides of the main body 211. All rectifiers 22 are electrically connected to the controller. Multiple sets of thermoelectric coolers 213 are provided, and each rectifier 22 is electrically connected to a set of thermoelectric coolers 213. The controller controls whether each set of thermoelectric coolers 213 is working, thereby cooling each area individually. When the controller controls the electronic components in a certain area to work, the controller controls the corresponding thermoelectric cooler 213 in that area to perform cooling operations.

[0033] A positioning hole is formed through the upper side of the substrate 21. A positioning post 24 is inserted into the inner side of the positioning hole. The positioning post 24 is T-shaped, with its upper end passing through the positioning hole and its lower end protruding at the upper side abutting against the lower side of the substrate 21, thus bonding the positioning post 24 to the substrate 21. A central hole is formed through the upper side of the positioning post 24. The positioning post 24 is made of silicone rubber. When installing this device, the lower end of the positioning post 24 can support the substrate 21, allowing the substrate 21 to detach from the mounting plane, thereby facilitating airflow below the substrate 21 and improving heat dissipation. A placement groove concentric with the central hole is formed at the lower end of the positioning post 24. The diameter of the placement groove is larger than the diameter of the central hole. When the housing of the industrial equipment instrument has connecting posts, the placement groove can fit over the outside of the connecting posts, facilitating installation.

[0034] A central post 11 is provided on the upper side of the inner cavity of the protective cover 10, and the protective cover 10 and the central post 11 are integrally formed. The lower end of the central post 11 extends into the central hole of the positioning post 24, and a sealing post is provided on the outer side of the central post 11. A sealing groove concentric with the central hole is opened on the upper side of the positioning post 24. After the protective cover 10 and the substrate 21 are bonded together, the sealing post is pressed into the sealing groove to form a seal. A countersunk hole 12 is provided through the upper side of the protective cover 10, and the lower end of the countersunk hole 12 passes through the central post 11. When installing this device, the device can be fixed by screwing through the countersunk hole 12 and the central post 11 and screwing them into the screw holes of the connecting post on the industrial equipment instrument housing.

[0035] Working principle: When installing this device, align the placement groove on the lower side of the central column 11 with the connecting column on the industrial equipment instrument housing, or align the central column 11 with the threaded hole on the industrial equipment instrument housing; then, by bolting through the countersunk hole 12 and the central column 11 and screwing it into the threaded hole on the industrial equipment instrument housing, the base plate 21 and the protective cover 10 can be fixed.

[0036] The pins of the electronic components of this device are integrated on the main body of the circuit board, which is provided with copper foil lines. However, the outer side of the main body of the circuit board 211 is protected by a protective cover 10. A semiconductor cooling chip 213 and a heat sink 214 are provided on the lower side of the main body of the circuit board 211 for heat dissipation. At the same time, the heat sink 214 is located below the main body of the circuit board 211, which can also protect the main body of the circuit board 211 and prevent oil from contacting the main body of the circuit board 211.

[0037] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description. Therefore, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this utility model, and no reference numerals in the claims should be considered as limiting the scope of the claims.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An easy-to-install industrial equipment instrument circuit board, comprising a substrate (21), wherein a protective cover (10) is disposed on the outer side of the substrate (21); characterized in that: The substrate (21) includes a circuit board body (211), a semiconductor cooling chip (213) is disposed on the lower side of the circuit board body (211), and a heat sink (214) is disposed on the lower side of the semiconductor cooling chip (213); the circuit board body (211) is located inside the protective cover (10), and the lower side of the heat sink (214) extends out of the protective cover (10). A rectifier (22) is installed on the upper side of the circuit board body (211), and the rectifier (22) is electrically connected to the semiconductor cooling chip (213) and the circuit board body (211); an interface bar (23) is installed on the lower side of the heat sink (214), and the interface bar (23) is electrically connected to the circuit board body (211).

2. The industrial equipment instrument circuit board that is easy to install according to claim 1, characterized in that: An insulating matrix (212) is filled between the heat sink (214) and the circuit board body (211).

3. The industrial equipment instrument circuit board that is easy to install according to claim 1, characterized in that: A rectifier (22) is provided on the front and rear sides of the circuit board body (211), and multiple sets of semiconductor cooling chips (213) are provided. Each rectifier (22) is electrically connected to a set of semiconductor cooling chips (213).

4. The industrial equipment instrument circuit board that is easy to install according to claim 1, characterized in that: The upper side of the substrate (21) is provided with a positioning hole, and a positioning post (24) is inserted into the inner side of the positioning hole. A center hole is provided on the upper side of the positioning post (24).

5. The industrial equipment instrument circuit board that is easy to install according to claim 4, characterized in that: The positioning post (24) is T-shaped. The upper side of the protruding part of the lower end of the positioning post (24) is fixedly connected to the lower side of the substrate (21). The lower end of the positioning post (24) is provided with a placement groove concentric with the central hole. The diameter of the placement groove is larger than the diameter of the central hole.

6. The industrial equipment instrument circuit board that is easy to install according to claim 4, characterized in that: A central column (11) is provided on the upper side of the inner cavity of the protective cover (10), and the lower end of the central column (11) extends into the central hole of the positioning column (24); A sealing post is provided on the outer side of the central post (11), and a sealing groove concentric with the central hole is provided on the upper side of the positioning post (24), with the sealing post abutting against the sealing groove.

7. The industrial equipment instrument circuit board that is easy to install according to claim 6, characterized in that: The upper side of the protective cover (10) is provided with a countersunk hole (12), and the lower end of the countersunk hole (12) passes through the central column (11).

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