Heat dissipation structure of master control box of optical fiber scanning equipment

Abstract

The optical fiber scanning equipment main control box heat dissipation structure comprises a cylindrical shell with an upper opening, a heat dissipation cavity defined by a heat dissipation bottom plate and a heat dissipation cover plate is formed in the inner side of the cylindrical side wall of the cylindrical shell, a first circuit board is installed in the heat dissipation cavity, and a first fin set extending towards the interior of the cylindrical side wall is arranged on the outer surface of the heat dissipation cover plate; a heating element of the first circuit board on the heat dissipation cover plate side is attached to the heat dissipation cover plate through a heat conduction piece for heat conduction; a cooling fan is installed on the top of the cylindrical shell, and a plurality of ventilation openings are formed in the bottom of the cylindrical side wall. According to the utility model, heat dissipation of a plurality of circuit boards is completed by using a group of heat dissipation fans. On the premise that the heat dissipation effect is guaranteed, the multiple circuit boards are installed in the same box body, the structure is compact, the occupied size and circuit line consumption are reduced, circuits are clear, follow-up maintenance and management are very convenient, and protectiveness is high.

Description

Technical Field

[0001] This application relates to the field of fiber optic scanning display equipment technology, and in particular to a heat dissipation structure for the main control box of a fiber optic scanning equipment. Background Technology

[0002] The imaging principle of scanning projection technology is to modulate the light corresponding to each pixel of the image to be displayed by a light source, and then drive the scanning fiber or the scanning mirror of the microelectromechanical system to scan and output the light corresponding to each pixel, thereby projecting the light corresponding to each pixel of the image to be displayed onto the projection screen one by one to form a projected image.

[0003] It should be noted that fiber optic scanning technology, as one of the new scanning projection technologies, is usually a fiber optic scanning system consisting of a fiber optic scanner and a light source. The light source input to the fiber optic scanner is usually a bundle of multiple color light-emitting units (such as red, green and blue light-emitting units).

[0004] The main control box is a housing for control components. These components primarily include a circuit board, which integrates a processor, image storage unit, light source control module, scan drive module, readable storage medium, and a first-in-first-out (FIFO) memory. The circuit board sends electrical control signals (i.e., drive signals) to the scan drive module to drive the fiber optic scanner, controlling the fiber optic cantilever in the scanner to perform scanning motion along a predetermined two-dimensional scanning trajectory (e.g., helical scan, raster scan, Lissajous scan). It also sends electrical control signals to the light source control module to control the light source unit, which outputs light corresponding to each pixel in the currently displayed image sequentially according to the image data in the FIFO. This ensures that the light output from the light source perfectly matches the fiber optic scan trajectory, forming an image on the projection surface.

[0005] Good heat dissipation performance of the main control box is the foundation for ensuring stable operation of the fiber optic scanner and light source. Utility Model Content

[0006] This application provides a heat dissipation structure for the main control box of a fiber optic scanning device to at least ensure heat dissipation effect.

[0007] To achieve the above-mentioned application objectives, this application provides a heat dissipation structure for the main control box of a fiber optic scanning device, including a cylindrical shell with an open top. The cylindrical sidewall of the cylindrical shell is surrounded by multiple side plates. Each side plate has a heat dissipation cavity surrounded by a heat dissipation base plate and a heat dissipation cover plate on its inner side. A first circuit board is installed in the heat dissipation cavity. The outer surface of the heat dissipation cover plate is provided with a first fin group extending into the cylindrical sidewall. The heat-generating element of the first circuit board located on the side of the heat dissipation cover plate conducts heat through a heat-conducting component in contact with the heat dissipation cover plate.

[0008] A cooling fan is installed on the top of the cylindrical shell, and the cooling fan is located above each of the first fin groups;

[0009] The bottom of the cylindrical sidewall is provided with multiple ventilation openings, and the air inlet is located below each first fin group. The shape of the heat dissipation base plate and the heat dissipation cover plate is designed to not block the ventilation openings, so that the external space and the internal space of the cylindrical shell can be connected through the ventilation openings.

[0010] This invention can dissipate heat from multiple circuit boards using a single cooling fan.

[0011] The fins of the first fin group are arranged in a generally vertical direction so that adjacent fins form a heat dissipation airflow channel that extends in a generally vertical direction. Cooling airflow is drawn in through the vents, passes through the heat dissipation airflow channel, and is then discharged to the external space by the top cooling fan. Preferably, the heat dissipation airflow channel is inclined in the vertical direction to cooperate with the rotating airflow of the fan and improve the heat dissipation effect.

[0012] Preferably, a second circuit board is installed at the bottom of the cylindrical shell. The second circuit board is arranged in a horizontal direction. The edges of each first fin group near the axis of the cylindrical shell form a mounting cavity for accommodating the central heat sink. The central heat sink is installed in the mounting cavity, and the bottom of the central heat sink is in contact with the heating element on the second circuit board for heat conduction through a heat-conducting component.

[0013] The central heat sink includes a central heat sink body and a second fin group arranged circumferentially on the outer side of the heat sink body, with the fins of the second fin group extending outward from the heat sink body. Preferably, the heat sink body has an accommodating cavity with at least a bottom opening, and the accommodating cavity is filled with a copper heat conductor to improve the heat conduction effect of the heat sink body by utilizing the good thermal conductivity of copper.

[0014] Similarly, the fins of the second fin group are arranged in a generally vertical direction so that adjacent fins form a heat dissipation airflow channel that extends in a generally vertical direction. Cooling airflow is drawn in through the vents, passes through the heat dissipation airflow channel, and is then discharged to the external space by the top cooling fan. Preferably, the heat dissipation airflow channel is inclined in the vertical direction to cooperate with the rotating airflow of the fan and improve the heat dissipation effect.

[0015] Preferably, a heat-conducting element is disposed between the lower surface of the second circuit board and the bottom plate of the cylindrical housing, so as to conduct the heat of the second circuit board to the cylindrical housing, thereby improving heat dissipation. More preferably, the heat-conducting element is disposed at the location on the second circuit board where the heating element is disposed.

[0016] One or more technical solutions in this application have at least the following technical effects or advantages:

[0017] This invention utilizes a set of cooling fans to dissipate heat from multiple circuit boards. While ensuring effective heat dissipation, multiple circuit boards are mounted in the same enclosure, resulting in a compact structure that reduces space requirements and wiring consumption. The wiring is clear, making subsequent maintenance and management extremely convenient, and providing strong protection. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 A schematic diagram of the installation structure of the heat dissipation base plate and heat dissipation cover plate;

[0020] Figure 3 This is a schematic diagram of the mounting structure of the first circuit board;

[0021] Figure 4 This is a schematic diagram of the mounting structure for the second circuit board;

[0022] Figure 5 A schematic diagram of the central radiator installation structure;

[0023] Figure 6 This is a cross-sectional structural diagram of the present invention. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0025] like Figure 1 , Figure 2 , Figure 3 As shown, this application provides a heat dissipation structure for the main control box of a fiber optic scanning device, including a cylindrical shell 100 with an upper opening. The cylindrical sidewall of the cylindrical shell 100 is surrounded by multiple side plates. Each side plate has a heat dissipation cavity surrounded by a heat dissipation base plate 201 and a heat dissipation cover plate 202 on its inner side. A first circuit board 203 is installed in the heat dissipation cavity. A first fin group 204 extending into the cylindrical sidewall is provided on the outer surface of the heat dissipation cover plate 202. The heat-generating element of the first circuit board 203 located on the side of the heat dissipation cover plate 202 conducts heat to the heat dissipation cover plate 202 through a heat-conducting component.

[0026] A cooling fan 300 is installed on the top of the cylindrical housing 100, and the cooling fan 300 is located above each of the first fin groups 204;

[0027] The bottom of the cylindrical sidewall is provided with multiple ventilation openings 101, and the air inlet is located below each first fin group 204. The shape of the heat dissipation base plate 201 and the heat dissipation cover plate 202 is set to not block the ventilation openings 101, so that the external space and the internal space of the cylindrical shell 100 can be connected by the ventilation openings 101.

[0028] The cooling fan 300 of this invention can operate in either suction or blowing mode, depending on the actual working conditions. When operating in suction mode, the cooling fan 300 guides the cooling airflow through the vent 101, carrying away the heat conducted by the first fin assembly 204, thereby dissipating heat from the heat-generating components on the first circuit board 203. When operating in blowing mode, the cooling fan 300 guides the cooling airflow towards the first fin assembly 204, carrying away the heat conducted by the first fin assembly 204, and the heat-laden airflow is discharged through the vent 101, thus dissipating heat from the heat-generating components on the first circuit board 203. A single cooling fan 300 can dissipate heat from multiple circuit boards.

[0029] The fins of the first fin group 204 are arranged in a generally vertical direction so that adjacent fins form a heat dissipation airflow channel that extends in a generally vertical direction. Cooling airflow is drawn in through the vent 101, passes through the heat dissipation airflow channel, and is then discharged to the external space by the top cooling fan 300. Preferably, the heat dissipation airflow channel is inclined in the vertical direction to match the rotating airflow of the fan and improve the heat dissipation effect.

[0030] The heat dissipation base plate 201 and heat dissipation cover plate 202 are both designed not to block the air inlet. This means that both the heat dissipation base plate 201 and heat dissipation cover plate 202 are provided with clearance structures to connect to the air inlet, such as notches at the edges or in the middle. The notches do not affect the sealing of the heat dissipation cavity. The heat dissipation base plate 201 and / or heat dissipation cover plate 202 are provided with baffles at the notch locations that form the sidewalls of the heat dissipation cavity.

[0031] Preferred, such as Figure 4 As shown, a second circuit board 400 is mounted on the bottom of the cylindrical housing 100. The second circuit board 400 is arranged horizontally and combined with... Figure 5 As shown, each first fin group 204 forms a mounting cavity for accommodating the central radiator 500 near the edge of the cylindrical housing 100 axis. The central radiator 500 is installed in the mounting cavity, and the bottom of the central radiator 500 is in contact with the heat-generating element on the second circuit board 400 through a heat-conducting component for heat conduction.

[0032] The central heat sink 500 includes a central heat sink body 501 and a second fin group 502 arranged circumferentially on the outer side of the heat sink body 501, with the fins of the second fin group 502 extending outward from the heat sink body 501. Preferably, the heat sink body 501 has an internal receiving cavity with at least a bottom opening, and the receiving cavity is filled with a copper heat conductor to improve the heat conduction effect of the heat sink body 501 by utilizing the good thermal conductivity of copper.

[0033] Similarly, the fins of the second fin group 502 are arranged in a generally vertical direction so that adjacent fins form a heat dissipation airflow channel that extends in a generally vertical direction. Cooling airflow is drawn in through the vent 101, passes through the heat dissipation airflow channel, and is then discharged to the external space by the top cooling fan 300. Preferably, the heat dissipation airflow channel is inclined in the vertical direction to match the rotating airflow of the fan and improve the heat dissipation effect.

[0034] Preferred, such as Figure 6 As shown, a heat-conducting element 600 is disposed between the lower surface of the second circuit board 400 and the bottom plate of the cylindrical housing 100. The heat-conducting element 600 conducts heat from the second circuit board 400 to the cylindrical housing 100, thereby improving heat dissipation. More preferably, the heat-conducting element 600 is disposed at the location on the second circuit board 400 where the heating element is located. Optionally, the heat-conducting element 600 is thermally conductive graphite foam.

[0035] It should be noted that the above embodiments are illustrative of this application and not limiting of it, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The words “comprising” or “including” do not exclude the presence of elements or steps not listed in the claims. The words “a” or “an” preceding an element do not exclude the presence of a plurality of such elements. The use of the words first, second, and third, etc., does not indicate any order and these words can be interpreted as names.

[0036] All features disclosed in this specification, except for mutually exclusive features, can be combined in any way.

[0037] Any feature disclosed in this specification (including any appended claims, abstract, and drawings) may be replaced by other equivalent or similar features, unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is merely one example of a series of equivalent or similar features.

[0038] This application is not limited to the specific embodiments described above. This application extends to any new features or combinations disclosed in this specification, as well as any new steps or combinations of any new methods or processes disclosed.

Claims

1. A heat dissipation structure for the main control box of a fiber optic scanning device, characterized in that, The device includes a cylindrical shell with an opening at the top. The cylindrical sidewall of the cylindrical shell is surrounded by multiple side plates. Each side plate has a heat dissipation cavity surrounded by a heat dissipation base plate and a heat dissipation cover plate on its inner side. A first circuit board is installed in the heat dissipation cavity. The outer surface of the heat dissipation cover plate is provided with a first fin group extending into the cylindrical sidewall. The heat-generating element of the first circuit board located on the side of the heat dissipation cover plate conducts heat to the heat dissipation cover plate through a heat-conducting component. A cooling fan is installed on the top of the cylindrical shell, and the cooling fan is located above each of the first fin groups; The bottom of the cylindrical sidewall is provided with multiple ventilation openings, and the air inlet is located below each first fin group. The ventilation openings connect the external space and the internal space of the cylindrical shell.

2. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 1, characterized in that, The shapes of the heat dissipation base plate and the heat dissipation cover plate are both designed not to block the ventilation openings.

3. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 1, characterized in that, The fins of the first fin group are arranged in a roughly vertical direction, and adjacent fins form a heat dissipation air duct that extends in a roughly vertical direction.

4. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 3, characterized in that, The heat dissipation duct is inclined in the vertical direction to match the rotating airflow of the fan.

5. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 3, characterized in that, The bottom of the cylindrical shell is equipped with a second circuit board, which is arranged in a horizontal direction. The edges of each first fin group near the axis of the cylindrical shell form a mounting cavity for accommodating the central heat sink. The central heat sink is installed in the mounting cavity, and the bottom of the central heat sink is in contact with the heating element on the second circuit board for heat conduction through a heat-conducting component.

6. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 5, characterized in that, The central radiator includes a central radiator body and a second fin group arranged circumferentially on the outer side of the radiator body, with the fins of the second fin group extending outward from the radiator body.

7. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 6, characterized in that, The heat dissipation body has an internal receiving cavity with at least a bottom opening, and the receiving cavity is filled with copper heat conductor.

8. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 5, characterized in that, The fins of the second fin group are arranged in a roughly vertical direction, and the adjacent fins form a heat dissipation air duct that extends in a roughly vertical direction.

9. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 8, characterized in that, The heat dissipation duct is inclined in the vertical direction to match the rotating airflow of the fan.

10. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 5, characterized in that, A heat-conducting element is provided between the lower surface of the second circuit board and the bottom plate of the cylindrical shell.

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