Base material pressing device
By using a staggered design of fixed and movable frames, combined with an elastic pressing unit, the problem of uneven force during wafer pressing is solved, achieving uniform force and planarization of the substrate, and ensuring that the wafer is not damaged or warped during pressing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-15
- Publication Date
- 2026-04-07
AI Technical Summary
Existing wafer pressing equipment results in uneven stress on each wafer when pressing multiple stacked wafers, which may lead to wafer damage or warping.
The design employs a combination of fixed and movable frames, along with multiple elastic pressing units. By moving the fixed and movable plates, one-to-one pressing of the substrate is achieved, ensuring uniform force on each substrate. The descending distance of the elastic element further compresses the substrate, achieving a flattening effect.
Ensuring the substrate is flat and free from damage or warping achieves uniform stress distribution and secondary pressing, thus improving the flattening quality of the substrate.
Smart Images
Figure CN224098095U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a pressing device, and more particularly to a substrate pressing device. Background Technology
[0002] The manufacturing process of integrated circuits primarily uses wafers as the basic material. After the formation of a surface oxide film and the coating of a photosensitive agent, exposure and development are performed using a photomask to form various types of circuits on the wafer. Following etching, removal of photoresist, and the addition of impurities, metal evaporation is carried out to form the circuitry and electrodes of each component. Finally, wafer probing is performed, followed by dicing into chips. These chips then undergo assembly processes such as bonding, interconnection, and packaging to form electronic products. However, during the manufacturing process, wafers may bend due to grinding, coating, or baking. Therefore, wafer pressing equipment is necessary to flatten the wafers and maintain optimal flatness.
[0003] Existing wafer pressing apparatuses include a fixed pressure plate and a movable pressure plate. The movable pressure plate is connected to a driving device, which drives the movable pressure plate to move relative to the fixed pressure plate, thereby flattening the wafer placed between the fixed and movable pressure plates. However, existing wafer pressing apparatuses press multiple stacked wafers at once, and the force on each wafer varies depending on its position, which may lead to wafer damage or warping. Therefore, there is room for improvement. Utility Model Content
[0004] One objective of this utility model is to provide a substrate pressing device and a substrate planarization method that can solve at least one of the above-mentioned problems.
[0005] This utility model relates to a substrate pressing device suitable for pressing multiple substrates. The substrate pressing device includes a fixed frame, which includes multiple fixed plates spaced vertically for placing the substrates; and a pressing module, which includes a movable frame that can move vertically relative to the fixed frame and multiple elastic pressing units. The movable frame includes multiple movable plates spaced vertically, and the elastic pressing units are respectively disposed on the movable plates. The fixed plates and the movable plates are staggered, and the movable plates can move toward the fixed plates, so that the elastic pressing units and the fixed plates jointly clamp and flatten the substrates.
[0006] In some embodiments, the pressing module also includes multiple pressing plates respectively disposed on the movable plate.
[0007] In some embodiments, each of the elastic pressing units has a pressing member that can move up and down relative to the pressing plate, a plurality of adsorption members that adsorb the movable plate, and elastic members disposed on the pressing plate and the pressing member.
[0008] In some embodiments, the elastic pressing unit is detachably mounted on the movable plate.
[0009] This utility model has at least the following effects: by means of the fixed plate and the movable plate being interlocked, the elastic pressing unit can work together with the fixed plate to press the substrate in a one-to-one manner, so that the substrate is subjected to consistent pressure, ensuring that the substrate is flat without being damaged or warped; and the movable plate can further compress the multiple elastic pressing units to apply pressure to the substrate by means of the descending distance of the elastic element of the multiple elastic pressing units, so as to achieve the effect of secondary pressing of the substrate. Attached Figure Description
[0010] Other features and effects of this utility model will be clearly presented in the embodiments with reference to the accompanying drawings, wherein:
[0011] Figure 1 This is a flowchart of an embodiment of the substrate planarization method of this utility model;
[0012] Figure 2 This is a schematic diagram of an embodiment of the substrate pressing device of this utility model;
[0013] Figure 3 This is a three-dimensional schematic diagram of a pressing module in this embodiment;
[0014] Figure 4 This is a schematic diagram of the embodiment, illustrating that the pressing module and a fixing frame jointly press and planarize a substrate. Detailed Implementation
[0015] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.
[0016] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0017] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0018] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0019] See Figure 1 and Figure 2 One embodiment of the substrate planarization method of this utility model is performed by a substrate pressing device, which is disposed in an oven (not shown) and is suitable for pressing multiple substrates W, such as wafers. The substrate planarization method includes steps S1 and S2. The substrate pressing device includes a fixing frame 1 and a pressing module 2.
[0020] See Figure 2 and Figure 3 The mounting frame 1 includes multiple vertically spaced mounting plates 11 for placing the substrate W. The accompanying drawings only show the uppermost portion, i.e., a single mounting plate 11 for illustration. The pressing module 2 includes a movable frame 21 capable of vertical displacement relative to the mounting frame 1, multiple elastic pressing units 22, and multiple pressing plates 23 respectively disposed on the movable plate 211. The movable frame 21 is driven by a lifting motor (not shown) to vertically displacement relative to the mounting frame 1 and includes multiple vertically spaced movable plates 211. The mounting plates 11 and the movable plates 211 are interleaved. Again, the accompanying drawings only show the uppermost portion, i.e., a single movable plate 211 for illustration. The elastic pressing units 22 are detachably mounted on the movable plate 211. Each elastic pressing unit 22 has a pressing member 221 that is movably mounted on the pressing plate 23 relative to it, multiple adsorption members 24 that adsorb the movable plate 211, and an elastic member 223 disposed between the pressing plate 23 and the pressing member 221. The adsorption member 24 may be, for example, a magnet, but is not limited thereto. The movable plate 211 has several through holes (not shown) for the adsorption members 24 to pass through and adsorb onto the pressing plate 23. The pressing plate 23 is made of a magnetic metal material, but is not limited thereto.
[0021] See Figure 1 , Figure 2 and Figure 4In step S1, multiple substrates W are placed on the fixing plate 11 of the fixing frame 1 located inside the oven (not shown).
[0022] In step S2, the multiple movable plates 211 of the pressing module 2 move toward the fixed plate 11, so that the multiple elastic pressing units 22 disposed on the movable plate 211 and the fixed plate 11 jointly press and flatten the substrate W. At this time, the movable plate 211 can further compress the multiple elastic pressing units 22 to apply pressure to the substrate W by means of the descending distance of the elastic elements 223 of the multiple elastic pressing units 22. Specifically, the mechanism by which the elastic pressing units 22 press the substrate W can be roughly divided into the following two types: The first mechanism is based on time. When the substrate W is placed in the oven for a first predetermined time, the movable plate 211 moves toward the fixed plate 11 so that the elastic pressing units 22 jointly press and flatten the substrate W, thereby making the warped area of the substrate W flat. Figure 4 As shown. When the substrate W is placed in the oven for a second predetermined time, the movable plate 211 moves away from the fixed plate 11 to release the substrate W.
[0023] The second mechanism is based on temperature. The oven has a temperature sensor (not shown). When the temperature inside the oven reaches a first default temperature, the movable plate 211 moves towards the fixed plate 11 so that the elastic pressing unit 22 jointly clamps and flattens the substrate W. Figure 4 As shown. When the temperature inside the oven reaches a second default temperature, the movable plate 211 moves away from the fixed plate 11 to release the substrate W. The temperature inside the oven can be set between 50°C and 450°C, and the downward pressure of the elastic pressing unit 22 can be set between 0.1 kgw and 100 kgw.
[0024] It should be noted that the relative relationship between the timing of pressing the substrate W and the timing of the oven temperature rise can be twofold. The first is that the temperature inside the oven rises when the movable plate 211 moves towards the fixed plate 11 to jointly press and flatten the substrate W. That is, the oven only begins to heat up after the elastic pressing unit 22 and the fixed plate 11 have pressed the substrate W. This method is applicable to the first mechanism described above. The second is that when the temperature inside the oven rises, the movable plate 211 moves towards the fixed plate 11 to jointly clamp and flatten the substrate W. That is, after the oven begins to heat up, the movable plate 211 then moves towards the fixed plate 11 so that the elastic pressing unit 22 and the fixed plate 11 press the substrate W. This method is applicable to both the first and second mechanisms described above.
[0025] The downward pressure setting for the elastic pressing unit 22 can be implemented in three ways: 1. Maintaining a fixed pressing force throughout the heating process. 2. Setting multiple pressing forces, with different pressing forces set at different times. 3. Setting the pressing force based on the oven temperature. Multiple default temperatures can be set with corresponding pressing forces, and the pressing force does not necessarily increase with the temperature inside the oven; it can also decrease. The following is an example of increasing the pressing force with the oven temperature: when the oven reaches 50°C, the pressing force decreases by 2 kgw; at 150°C, it decreases by 2.5 kgw; and at 200°C, it decreases by 2.8 kgw.
[0026] It should be noted that the substrate W is curved upwards in this embodiment, but it can also be concave in other embodiments. The structure of the fixed frame 1 and the movable frame 21 is arranged in multiple continuous layers in this embodiment, but it can also be set as a single layer in other embodiments.
[0027] In summary, the substrate W pressing device of this utility model utilizes the interlacing of the fixed plate 11 and the movable plate 211. The elastic pressing unit 22 can work together with the fixed plate 11 to press the substrate W in a one-to-one manner, ensuring that the substrate W is subjected to consistent pressure and that the substrate W remains flat without being damaged or warped. Furthermore, the movable plate 211 can further compress the multiple elastic pressing units 22 by the descending distance of their elastic elements 223, thereby achieving a secondary pressing effect on the substrate W. Therefore, this utility model effectively achieves its intended purpose.
[0028] The above description is merely an embodiment of the present utility model and should not be construed as limiting the scope of the present utility model. Any simple equivalent changes and modifications made in accordance with the claims and description of the present utility model shall still fall within the scope of the present utility model.
Claims
1. A substrate pressing device, suitable for pressing multiple substrates, characterized in that: The substrate pressing apparatus includes: The mounting bracket includes multiple mounting plates spaced vertically for placing the substrate; and The pressing module includes a movable frame that can move up and down relative to the fixed frame and a plurality of elastic pressing units. The movable frame includes a plurality of movable plates spaced vertically apart. The elastic pressing units are respectively disposed on the movable plates. The fixed plate and the movable plate are staggered. The movable plate can move toward the fixed plate so that the elastic pressing units and the fixed plate jointly press and flatten the substrate.
2. The substrate pressing apparatus according to claim 1, characterized in that: The pressing module also includes multiple pressing plates, each disposed on the movable plate.
3. The substrate pressing apparatus according to claim 2, characterized in that: Each of the elastic pressing units has a pressing member that can move up and down relative to the pressing plate, a plurality of adsorption members that adsorb the movable plate, and an elastic member disposed between the pressing plate and the pressing member.
4. The substrate pressing apparatus according to claim 2, characterized in that: The elastic pressing unit is detachably mounted on the movable plate.