Rotary workbench for fixing double-layer wafer frame

Abstract

The utility model relates to a rotary table for fixing a double-layer wafer frame. The rotary table comprises a bearing table, an annular rotary table, a vacuum chuck and a clamping mechanism. The annular rotating disc is rotatably arranged on the bearing table. And the plurality of vacuum chucks are arranged on one surface, deviating from the bearing table, of the annular turntable and are used for sucking and fixing the wafer frame on the lower layer. And the plurality of clamping mechanisms are arranged on the peripheral side of the annular turntable and are used for clamping and fixing the wafer frame positioned on the upper layer. The wafer frame on the lower layer is fixed through the vacuum chuck, the wafer frame on the upper layer is locked through the clamping mechanism, and after the double-layer wafer frame is accurately aligned to a preset position through rotation of the annular rotating disc, chips on the blue film with holes of the wafer frame on the upper layer are transferred to the blue film without holes of the wafer frame on the lower layer in batches at a time in cooperation with an external rolling mechanism. The problem of time consumption caused by one-by-one operation of a traditional mechanical arm is solved, the mechanical arm is particularly suitable for a high-density array or microminiature chip scene, the transfer efficiency is improved, meanwhile, positioning errors are reduced, and the stability of a subsequent testing process is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of chip packaging, specifically relates to a rotary worktable for double-layer wafer frame fixation. BACKGROUND

[0002] In the chip packaging process, transferring the chip from the wafer frame with a hole blue film to the frame without a hole blue film for testing is a key step to ensure the performance screening of the chip. The process usually includes: UV irradiation or heating of the blue film of the original frame to reduce adhesion, using a high-precision mechanical arm combined with a visual positioning system to pick up the chip one by one, accurately attaching it to a new frame without a hole blue film, and enhancing the adhesion of the chip to the frame without a hole blue film through a curing process.

[0003] However, the current widely used mechanical arm picking up method has the limitation of low efficiency. Since the chip transfer needs to rely on the vacuum nozzle of the mechanical arm to pick up, position and place each chip, the single operation takes a long time, especially in the high-density chip array or ultra-small chip scene, the efficiency is even lower. SUMMARY

[0004] The utility model aims at providing a rotary worktable for double-layer wafer frame fixation, which can realize the synchronous fixation and angle adjustment of double-layer wafer frame by setting the rotatable ring-shaped turntable integrated with vacuum chuck and clamping mechanism, and cooperate with the external roller pressing mechanism to transfer the chips in batches, effectively solving the problem of low efficiency of mechanical arm picking up and transferring chips one by one.

[0005] To achieve the above purpose, the utility model provides a rotary worktable for double-layer wafer frame fixation, characterized by comprising:

[0006] a bearing table;

[0007] a ring-shaped turntable rotatably arranged on the bearing table;

[0008] a plurality of vacuum chucks arranged on the side of the ring-shaped turntable away from the bearing table for holding and fixing the wafer frame located in the lower layer;

[0009] a plurality of clamping mechanisms arranged on the side of the ring-shaped turntable for clamping and fixing the wafer frame located in the upper layer.

[0010] Optionally, the rotary worktable for double-layer wafer frame fixation further comprises a driving mechanism for driving the rotation of the ring-shaped turntable, and the driving mechanism comprises:

[0011] a driving motor arranged on the bearing table;

[0012] a synchronous wheel assembly rotatably arranged on the bearing table;

[0013] A synchronous belt is fixed at both ends of the ring-shaped turntable, and the middle part of the synchronous belt is sleeved between the synchronous wheel assembly and the movable end of the driving motor.

[0014] Optionally, the synchronous belt assembly comprises:

[0015] A synchronous main wheel is arranged at the movable end of the driving motor.

[0016] A fixing frame is arranged on the bearing table, and three synchronous sub-wheels arranged in a triangular structure are rotatably arranged on the fixing frame.

[0017] Optionally, groove photoelectric sensors are arranged on both sides of the synchronous sub-wheels, and the side edges of the ring-shaped turntable are provided with two shielding pieces corresponding to the two groove photoelectric sensors.

[0018] Optionally, the two shielding pieces are located between the two groove photoelectric sensors.

[0019] Optionally, the rotation angle range of the ring-shaped turntable is between -10° and 10°.

[0020] Optionally, the clamping mechanism comprises:

[0021] A support frame;

[0022] A fixed clamping jaw is rotatably arranged on the support frame.

[0023] A rotary cylinder is arranged on the support frame and connected with the fixed clamping jaw at the movable end.

[0024] The beneficial effects of the utility model lie in that the wafer frame of the lower layer is fixed by the vacuum chuck, the wafer frame of the upper layer is locked by the clamping mechanism, and after the double-layer wafer frame is accurately positioned to the preset position by rotating the ring-shaped turntable, the chips on the blue film with holes of the wafer frame of the upper layer are transferred to the blue film without holes of the wafer frame of the lower layer by the external rolling mechanism, thereby avoiding the time-consuming problem of traditional mechanical arm operation, especially suitable for high-density array or micro-chip scenes, improving the transfer efficiency, reducing the positioning error, and ensuring the stability of the subsequent test process.

[0025] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, and the content of the specification can be implemented, the following preferred embodiments of the utility model are described in detail with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 The schematic structural diagram of the rotary workbench for fixing the double-layer wafer frame is shown in an embodiment of the utility model;

[0027] Figure 2 This is a schematic structural diagram of the drive mechanism for fixing a rotary table for a double-layer wafer frame, according to an embodiment of the present invention.

[0028] Figure 3 This is a schematic structural diagram of a clamping mechanism for a rotary table used to fix a double-layer wafer frame, according to an embodiment of the present invention.

[0029] In the diagram: 1. Support platform; 2. Annular turntable; 3. Vacuum suction cup; 4. Clamping mechanism; 41. Support frame; 42. Fixed gripper; 43. Rotary cylinder; 5. Drive mechanism; 51. Drive motor; 52. Synchronous pulley assembly; 521. Synchronous main pulley; 522. Fixed frame; 523. Synchronous auxiliary pulley; 524. First auxiliary pulley; 525. Second auxiliary pulley; 526. Third auxiliary pulley; 53. Synchronous belt; 6. Groove photoelectric sensor; 61. Shielding plate. Detailed Implementation

[0030] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0031] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0033] Please seeFigure 1 A preferred embodiment of this application shows a rotary table for fixing a double-layer wafer frame, comprising a support platform 1, an annular turntable 2, vacuum chucks 3, and clamping mechanisms 4. The annular turntable 2 is rotatably mounted on the support platform 1. Several vacuum chucks 3 are disposed on the side of the annular turntable 2 opposite to the support platform 1, for holding and fixing the lower wafer frame. Several clamping mechanisms 4 are disposed around the annular turntable 2, for clamping and fixing the upper wafer frame.

[0034] According to the embodiment of this utility model, the lower wafer frame is fixed by a vacuum chuck 3, the upper wafer frame is locked by a clamping mechanism 4, and the double-layer wafer frame is precisely aligned to a preset position by rotating the annular turntable 2. Then, in conjunction with an external rolling mechanism, the chips on the perforated blue film of the upper wafer frame are transferred in batches to the non-perforated blue film of the lower wafer frame in one go. This avoids the time-consuming problem of traditional robotic arms operating one chip at a time, and is especially suitable for high-density arrays or micro-chip scenarios, improving transfer efficiency and reducing positioning errors, while ensuring the stability of subsequent testing processes. It should be noted that after the vacuum chuck 3 fixes the lower wafer frame, the annular turntable 2 drives the lower wafer frame to rotate to the preset position. Then, the upper wafer frame is placed on the lower wafer frame and clamped by the clamping mechanism 4. At this time, the chip placement positions on the blue films of the upper and lower wafer frames correspond, and then the chips are transferred in batches by the rolling mechanism.

[0035] The following detailed description uses specific examples:

[0036] Specifically, the support platform 1 is provided with an installation groove, and the annular turntable 2 is set in the installation groove through a bearing.

[0037] Further, please see Figure 2The rotary worktable also includes a drive mechanism 5 for rotating the annular turntable 2. The drive mechanism 5 includes a drive motor 51, a synchronous pulley assembly 52, and a synchronous belt 53. The drive motor 51 is mounted on the support platform 1, and the synchronous pulley assembly 52 is rotatably mounted on the support platform 1. The two ends of the synchronous belt 53 are fixed to the annular turntable 2, and the middle of the synchronous belt 53 is fitted between the synchronous pulley assembly 52 and the movable end of the drive motor 51. The synchronous belt 53 assembly includes a main synchronous pulley 521 and a fixing frame 522. The main synchronous pulley 521 is located at the movable end of the drive motor 51. The fixing frame 522 is mounted on the support platform 1, and three synchronous auxiliary pulleys 523 arranged in a triangular structure are rotatably mounted on the fixing frame 522. In this embodiment, the three synchronous auxiliary pulleys 523 are divided into a first auxiliary pulley 524, a second auxiliary pulley 525, and a third auxiliary pulley 526, and the drive motor 51 is a stepper motor. The first auxiliary pulley 524 and the second auxiliary pulley 525 are located closer to the annular turntable 2. The synchronous belt 53 passes through the first auxiliary pulley 524, the main synchronous pulley 521, the third auxiliary pulley 526, and the second auxiliary pulley 525 from one end to the other. Power is output from the drive motor 51, and through the triangular arrangement of the main synchronous pulley 521 and the three auxiliary synchronous pulleys 523, the synchronous belt 53 is guided to transmit power along a fixed path, converting the rotational motion of the drive motor 51 into the circular motion of the annular turntable 2. Simultaneously, the flexible connection of the synchronous belt 53 reduces mechanical vibration and avoids the impact problems of rigid transmission. The triangular arrangement of the auxiliary synchronous pulleys 523 optimizes the tension distribution of the synchronous belt 53, preventing slippage or slackness during high-speed operation, ensuring transmission accuracy and long-term stability.

[0038] Please see Figure 2 The synchronous auxiliary wheel 523 has slotted photoelectric sensors 6 on both sides, and two shielding plates 61 corresponding to the two slotted photoelectric sensors 6 are arranged on the side of the annular turntable 2. The two shielding plates 61 are located between the two slotted photoelectric sensors 6. The slotted photoelectric sensors 6, in conjunction with the shielding plates 61, are used to limit the movement of the annular turntable 2 and to locate the origin of the annular turntable 2. When the shielding plate 61 passes through the gap of one of the slotted photoelectric sensors 6, an electrical signal is triggered to determine the origin of the turntable and eliminate manual calibration errors. When the annular turntable 2 rotates to a preset limit position, the shielding plate 61 triggers the signal of the slotted photoelectric sensor 6, at which point the drive motor 51 stops to prevent the annular turntable 2 from rotating beyond its range, which could cause frame collision or chip misalignment. Specifically, in this embodiment, the rotation angle range of the annular turntable 2 is between -10° and 10°. This rotation angle range is adapted to the wafer frame fine-tuning requirements, and high-precision alignment is achieved through small angle corrections to meet the batch transfer requirements of the chip array.

[0039] Further, please see Figure 3The clamping mechanism 4 includes a support frame 41, a fixed gripper 42, and a rotary cylinder 43. The fixed gripper 42 is rotatably mounted on the support frame 41, and the rotary cylinder 43 is mounted on the support frame 41 with its movable end connected to the fixed gripper 42. The rotary cylinder 43 pushes the fixed gripper 42 to rotate around the support frame 41, providing controllable clamping force and accommodating upper wafer frames of different thicknesses or materials. It only clamps the edges of the wafer frame, avoiding contact with the perforated blue film surface to prevent adhesive contamination or chip detachment due to pressure.

[0040] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0041] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A rotary stage for fixing a double-layer wafer frame, characterized in that, include: Support platform; An annular turntable is rotatably mounted on the support platform; Several vacuum chucks are disposed on the side of the annular turntable away from the support stage, for holding and fixing the wafer frame located on the lower layer; Several clamping mechanisms are arranged around the annular turntable to clamp and fix the wafer frame located on the upper layer.

2. The rotary table for fixing a double-layer wafer frame according to claim 1, characterized in that, It also includes a drive mechanism for rotating the annular turntable, the drive mechanism comprising: The drive motor is mounted on the support platform; The timing pulley assembly is rotatably mounted on the support platform; A timing belt, with its two ends fixed on the annular turntable, and its middle section fitted between the timing pulley assembly and the movable end of the drive motor.

3. The rotary table for fixing a double-layer wafer frame according to claim 2, characterized in that, The synchronization band component includes: The synchronous main wheel is located at the movable end of the drive motor; A fixed frame is mounted on the support platform, and three synchronous auxiliary wheels arranged in a triangular structure are rotatably mounted on the fixed frame.

4. The rotary table for fixing a double-layer wafer frame according to claim 3, characterized in that, The synchronous auxiliary wheel is provided with grooved photoelectric sensors on both sides, and the annular turntable is provided with two shielding plates on its side, which are respectively corresponding to the two grooved photoelectric sensors.

5. The rotary table for fixing a double-layer wafer frame according to claim 4, characterized in that, The two shielding plates are located between the two slotted photoelectric sensors.

6. The rotary table for fixing a double-layer wafer frame according to claim 5, characterized in that, The rotation angle of the annular turntable is between -10° and 10°.

7. The rotary table for fixing a double-layer wafer frame according to claim 1, characterized in that, The clamping mechanism includes: Support frame; The fixed gripper is rotatably mounted on the support frame; A rotary cylinder is mounted on the support frame, and its movable end is connected to the fixed gripper.

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